HA17324/A Series
Quad Operational Amplifier
ADE-204-031A (Z)
Rev.1
Mar. 2001
Description
HA17324 series and HA17324A series are quad operational amplifier that provide high gain and internal
phase compensation, with single power supply. They can be widely used to control equipments.
Features
• Wide range of supply voltage, and single power supply used
• Internal phase compensation
• Wide range of common mode voltage, and possible to operate with an input about 0 V
Features only for “A” series
• Low electro-magnetic susceptibility level
Output Offset Voltage vs. Input InterferenceMeasurement Condition
Output offset voltage (arb. unit)
5.0
4.0
3.0
2.0
1.0
0
−1.0
100E+3 1E+6 10E+6 100E+6 1E+9 10E+9
Input RF frequency (Hz)
HA17324A series
HA17324 series
Rs −
+
Rs
0.01 µ
Vin
−10 dBm
RF signal source
(for quasi-RF noise)
Vcc = +7.5 V
Vee = −7.5 V
Rf
Rf
Vout
(= 100∗Vio)
V
_
Improve-
ment
HA17324/A Series
2
Ordering Information
Type No. Application Package
HA17324 Commercial use DP-14
HA17324F FP-14DA
HA17324P Industrial use DP-14
HA17324FP FP-14DA
HA17324AP Industrial use DP-14
HA17324ARP Commercial use FP-14DN
HA17324AFP FP-14DA
Pin Arrangement
Vout1
Vin(−)1
Vin(+)1
VCC
Vin(+)2
Vin(−)2
Vout2
Vout4
Vin(−)4
Vin(+)4
VEE
Vin(+)3
Vin(−)3
Vout3
−1+
2
(Top view)
1
3
2
3
4
5
6
7
14
13
12
11
10
9
8
+4−
−++−
Circuit Schematic (1/4)
Q1Q4
Q2Q3
Q5
Q6
Q7
Q13
Q12
Q11
Q10
Q8Q9
Vout
R1
Vin(+)
Vin(−)C
HA17324/A Series
3
Absolute Maximum Ratings (Ta = 25°C)
Ratings
Item Symbol HA17324/P/F/FP HA17324AP/ARP/AFP Unit
Supply voltage VCC 32 32 V
Sink current Isink 50 50 mA
Power dissipation PT625 *1625 *2mW
Common mode input voltage VCM −0.3 to VCC −0.3 to VCC V
Differential input voltage Vin (diff) ±VCC ±VCC V
Operating temperature Topr −20 to +75 −40 to +85 °C
Storage temperature Tstg −55 to +125 −55 to +125 °C
Notes: 1. This is the allowable values up to Ta = 50°C. Derate by 8.3 mW/°C.
2. Tjmax = θj-a · PCmax + Ta (θj-a; Thermal resistor between junction and ambient at set board
use).
The wiring density and the material of the set board must be chosen for thermal conductance of
efficacy board.
And PCmax cannot be over the value of PT.
240
220
200
180
160
140
120
100
80
Thermal resistor θj-a (°C)
0.5 1 2 5 10 20
Thermal conductance of efficacy board (W/m °C)
ab
SOP14 − with compound
SOP14 − no compound
40 mm
a. Class epoxy board of 10% wiring density
b. Class epoxy board of 30% wiring density
1.5 t epoxy
HA17324/A Series
4
Electrical Characteristics (VCC = +15 V, Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Input offset voltage VIO 27mVV
CM = 7.5 V, RS = 50 Ω, Rf = 50 kΩ
Input offset current IIO 550nAV
CM = 7.5 V, IIO = | II (–) – II (+) |
Input bias current IIB 30 500 nA VCM = 7.5 V
Power source rejection
ratio PSRR 93 dB f = 100 Hz, RS = 1 kΩ, Rj = 100 kΩ
Voltage gain AVD 75 90 dB RS = 1 kΩ, Rf = 100 kΩ, RL = ∞
Common mode rejection
ratio CMR 80 dB RS = 50 Ω, Rf = 5 kΩ
Common mode input
voltage range VCM −0.3 13.5 V RS = 1 kΩ, Rf = 100 kΩ, f = 100 Hz
Maximum output voltage Vop-p 13.6 V f = 100 Hz, R
S
= 1 kΩ, Rf = 100 kΩ,
RL = 20 kΩ
Output source current Iosource 20 40 mA VIN+ = 1 V, VIN– = 0 V, VOH = 10 V
Output sink current Iosink 10 20 mA VIN = 0 V, VIN = 1 V, VOL = 2.5 V
Supply current ICC 0.8 2 mA VIN = GND, RL = ∞
Slew rate SR 0.19 V/µs f = 1.5 kHz, VCM = 7.5 V, RL = ∞
Channel separation CS 120 dB f = 1 kHz
Output sink current Iosink 15 50 µAV
IN+ = 0 V, VIN– = 1 V, VOL = 200 mV
Iosink 3 9 mA VIN+ = 0 V, VIN– = 1 V, VOL = 1 V
Output voltage VOH 13.2 13.6 VI
OH = –1 mA
VOH 12.0 13.3 VI
OH = –10 mA
Output voltage VOL 0.8 1.0 V IOL = 1 mA
VOL 1.1 1.8 V IOL = 10 mA
HA17324/A Series
5
Characteristic Curves
Output Source Current vs. Ambient Temperature
80
Output source current Iosource (mA)
Ambeint temperature Ta (°C)
70
60
50
40
30
20
10
0
−200 20406080
VCC = 15 V
VOH = 10 V
Input Bias Current vs. Ambient Temperature
80
Input bias current IIB (nA)
Ambeint temperature Ta (°C)
70
60
50
40
30
20
10
0
−200 20406080
VCC = 15 V
VCM = 7.5 V
Supply Current vs. Supply Voltage
4
Supply current ICC (mA)
Supply voltage VCC (V)
3
2
1
08 16243240
Ta = 25°C80
Input bias current IIB (nA)
Supply voltage VCC (V)
60
40
20
08 16243240
Ta = 25°C
Voltage Gain vs. Supply Voltage
160
Voltage gain AVD (dB)
Supply voltage VCC (V)
120
80
40
08 16243240
Ta = 25°C
RL = ∞
Maxlmum Output Voltage vs. Frequency
Input Bias Current vs. Supply Voltage
20
Maximum output voltage VOP-P (V)
Frequency f (Hz)
1 k 3 k 10 k 30 k 100 k 300 k
16
12
8
4
0
VCC = 15 V
Ta = 25°C
RL = 20 kΩ
1 M
HA17324/A Series
6
Voltage Gain vs. Frequency
VCC = 15V
Ta = 25°C
RL = ∞
Voltage gain AVD (dB)
120
100
80
60
40
20
01 3 10 30 100 300 1 k 3 k 10 k 30 k 100 k 300 k 1 M
Frequency f (Hz)
VCC = 15V
Ta = 25°C
RS = 50 Ω
120
100
80
60
40
20
0
100 300 1 k 3 k 10 k 30 k 100 k 300 k 1M
Frequency f (Hz)
Common Mode Rejection Ratio vs. Frequency
Common mode rejection ratio CMR (dB)
HA17324/A Series
7
Solder Mounting Method
1. Small and light surface-mount packages require spicial attentions on solder mounting.
On solder mounting, pre-heating before soldering is needed.
The following figure show an example of infrared rays refow.
2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a
failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.
Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic
substrates.
Temperature
140 to 160°C
1 to 5°C/s
235°C Max 10 s Max
1 to 4°C/s
Time (s)
≅ 60 s
Figure 1 An Example of Infrared Rays Reflow Conditions
HA17324/A Series
8
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
DP-14
Conforms
Conforms
0.97 g
Unit: mm
7.62
0.25
0° – 15°
19.20
20.32 Max
1
814
7
1.30
2.54 ± 0.25 0.48 ± 0.10
6.30
7.40 Max
0.51 Min
2.54 Min 5.06 Max
+ 0.10
– 0.05
2.39 Max
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-14DA
—
Conforms
0.23 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.22 ± 0.05
*0.42 ± 0.08
0.70 ± 0.20
0.12
0.15
0° – 8°
M
0.10 ± 0.10
2.20 Max
5.5
10.06
1.42 Max
14 8
17
10.5 Max
+ 0.20
– 0.30
7.80
1.15
1.27
0.40 ± 0.06
0.20 ± 0.04
HA17324/A Series
9
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-14DN
Conforms
Conforms
0.13 g
Unit: mm
0° – 8°
1.27
14 8
17
0.15
0.25 M
1.75 Max 3.95
*0.20 ± 0.05
8.65
9.05 Max
*0.40 ± 0.06
0.14+ 0.11
– 0.04
0.635 Max 6.10+ 0.10
– 0.30
0.60+ 0.67
– 0.20
1.08
*Pd plating
HA17324/A Series
10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
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