ICS664-01
DIGITAL VIDEO CLOCK SOURCE CLOCK SYNTHESIZER
IDT™ / ICS™
DIGITAL VIDEO CLOCK SOURCE 3
ICS664-01 REV C 082307
Application Information
Series Termination Resistor
Clock output traces should use series termination. To series
terminate a 50Ω trace (a commonly u sed trace impedance),
place a 33Ω resistor in series with the cloc k line, as close to
the clock outpu t pin as possible. The nom inal impedance of
the clock output is 20Ω.
Decoupling Capacitors
As with any high-perf ormance mixed-signal IC, the
ICS664-01 must be isolated from system power supply
noise to perform optimally.
Decoupling capacitors of 0.01µF must be connect ed
between each VDD and the PCB ground plane. To fur ther
guard against interfering system supply noise, the
ICS664-01 should u se one common connection t o the PCB
pow er plane as sho wn in the diag ram on the ne xt page . The
f errite bead and bulk cap acitor help reduce low er frequency
noise in the supply that can lead to output clock ph ase
modulation.
Recommended Power Supply Connection for
Optimal Devi ce Performance
All power supply pins must be connected to th e sa me
v olta ge, e xcept VDDO, which may be connecte d to a lower
voltage in order to chan ge the output lev el.
To achieve the absolute minimum jitter, pow e r the part with
a dedicated LDO regulator , which will provide high isolation
from power supply noise. Many companies produce very
small, inexpensive regulators; an example is the National
Semiconductor LP2985.
Crystal Load Capacitors
If a crystal is used, the device crystal connections should
include pads for capacitors from X1 to ground and from X2
to ground. These capacitors are used to adjust the stray
capacitance of the board to match the nominally required
crystal load capacitance. To reduce possible noise pickup,
use very short PCB traces (and no vias) been the crystal
and device.
The v alue of the load capacito rs can be roughly determined
by the formula C = 2(CL - 6) where C is the load capacitor
connected to X1 and X2, and CL is the specified value of the
load capacitance for the crystal. A typical crystal CL is 18 pF,
so C = 2(18 - 6) = 24 pF. Because these capacitors adjust
the stray capacitance of the PCB, check the output
frequency using your final layout to see if the value of C
should be changed.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1) Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be k ept as short as possible , as should the PCB trace to the
ground via . Distance of the f errite bead and b ulk decoupling
from the device is less critical.
2) The external crystal should be mounted next to the device
with short traces. The X1 and X2 traces should not be
routed next to each other with minimum spaces, instead
they should be separated and away from other traces.
3) To minimize EMI and obtain the best signal integrity, the
33Ω series termination resistor should be placed close to
the clock output.
4) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (the ferrite bead and bulk decoupling capacitor can be
mounted on the b ack). Other signa l traces should be routed
away from the ICS664-01. This includes signal traces just
underneath the device, or on layers adjacent to the ground
plane layer used by the device.
C onnection to 3.3V
Power Plane
Ferrite
Bead
Bulk D ec oupling C apacitor
(such as 1 F T antalum )
VDD Pin
VDD Pin
VDD Pin
0.01 F D ecoupling C apac itors