(0,635 mm) .025"
MEC6-RA SERIES
Mates with
(1,60 mm) .062"
thick card
Variety of
lead counts
(0,635 mm)
.025" pitch Standard
Alignment Pins
MEC6–130–02–L–D–RA1
MEC6–150–02–L–D–RA1
MEC6–120–02–L–D–RA1
WWW.SAMTEC.COM
MEC6 POSITIONS
PER ROW
PLATING
OPTION
1
10, 20, 30, 40, 50
TAIL
OPTION
–RA1
= Right
Angle
D
F-213 (Rev 31JUL13)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC6-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,22 mm) .166" to
(5,66 mm) .223"
Current Rating:
Testing Now!
Voltage Rating:
Testing Now!
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (10-30)
(0,15 mm) .006" max (40-50)
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
Mates with:
(1,60 mm) .062" thick cards
02 OPTION
–TR
= Tape &
Reel
(0,635)
.025
01
02
(1,40) .055 DIA
No. of Positions x (0,635) .025 + (1,57) .062
(7,40)
.291
(0,90) .035
(1,78)
.070
No. of Positions x (0,635) .025 + (3,17) .125
(9,10)
.358
(1,05)
.041
(3,53)
.139
(0,95)
.037
(0,85)
.033
(2,65)
.104
(5,78)
.227
(38,09) 1.50
(21,06) .829 (13,44) .529
(36,49) 1.44
(3,81) .150
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
RIGHT ANGLE MICRO EDGE CARD SOCKET
10, 20, 30 & 40 POSITIONS
50 POSITIONS
Note: While optimized for
50Ω applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75Ω applications. Contact
Samtec for further information.
MEC6-RA Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling 7.0 GHz / 14 Gbps 10.0 GHz / 20 Gbps
Differential Pair Signaling 7.0 GHz / 14 Gbps 11.0 GHz / 22 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?MEC6-RA
or contact sig@samtec.com
