User's Manual ISL81601EVAL1Z User's Manual: Evaluation Board Industrial Analog and Power Rev.1.00 Aug 2018 USER'S MANUAL ISL81601EVAL1Z UG162 Rev.1.00 Aug 6, 2018 Evaluation Board 1. Overview The ISL81601EVAL1Z evaluation board (shown in Figure 5 on page 8) features the ISL81601, a 60V high voltage synchronous buck-boost controller that offers external soft-start, independent enable functions and integrates UV/OV/OC/OT protection. A programmable switching frequency ranging from 100kHz to 600kHz helps to optimize inductor size while the strong gate driver delivers up to 20A for the buck-boost output. 1.1 Key Features * Wide input range: 9V to 60V * Bi-directional operation * High light-load efficiency in pulse skipping DEM operation * Programmable soft-start * Optional DEM/PWM operation * Optional CC/HICCUP OCP protection * Supports prebias output with soft-start * PGOOD indicator * OVP, OTP, and UVP protection * Back biased from output to improve efficiency 1.2 Specifications The ISL81601EVAL1Z evaluation board is designed for high current applications. The current rating of the ISL81601EVAL1Z is limited by the FETs and inductor selected. The ISL81601EVAL1Z electrical ratings are shown in Table 1. Table 1. Electrical Rating Parameter Rating Input Voltage 9V to 60V Switching Frequency 200kHz Output Voltage 12V Output Current 10A OCP Set Point Minimum 11A at ambient room temperature 1.3 Ordering Information Part Number ISL81601EVAL1Z 1.4 Description High Voltage Buck-Boost Controller Evaluation Board Related Literature For a full list of related documents, visit our website * ISL81601 product page UG162 Rev.1.00 Aug 6, 2018 Page 2 of 21 ISL81601EVAL1Z 1. Overview PGND CS- CS+/VINSEN VIN EN/UVLO VDD CLKEN FB_IN BSTEN VIN VDD VOUT BOOT1 UG1 VCC5V PHASE1 IMON_IN ISL81601 LG1 PWM_MODE IMON_OUT SGND LG2 OC_MODE PLL_COMP RT/SYNC PHASE2 SS/TRK UG2 ISEN+ ISEN- EXTBIAS PGOOD OV FB_OUT CLKOUT DITHER COMP BOOT2 VDD Figure 1. ISL81601EVAL1Z Block Diagram UG162 Rev.1.00 Aug 6, 2018 Page 3 of 21 ISL81601EVAL1Z 2. 2. Functional Description Functional Description The ISL81601EVAL1Z is the same test board used by Renesas application engineers and IC designers to evaluate the performance of the ISL81601 QFN IC. The board provides an easy and complete evaluation of all the IC and board functions. As shown in Figure 4 on page 6, 9V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 12V output on J4 (+) and J5 (-) can supply up to 10A to the load. Due to the high power efficiency, the evaluation board can run at 10A continuously without airflow at room temperature ambient conditions. Test points TP1 through TP28 provide easy access to the IC pin and external signal injection terminals. As shown in Table 2 on page 5, connector J8 provides selection of either Forced PWM mode (shorting Pin 1 and Pin 2) or DEM mode (shorting Pin 2 and Pin 3). Connector J9 provides selection of either constant current limit (shorting Pin 1 and Pin 2) or HICCUP OCP (shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the converter by shorting its Pin 1 and Pin 2. 2.1 Recommended Testing Equipment The following materials are recommended for testing: * 0V to 60V power supply with at least 30A source current capability * Electronic loads capable of sinking current up to 20A * Digital Multimeters (DMMs) * 100MHz quad-trace oscilloscope 2.2 Operating Range The input voltage range is from 9V to 60V for an output voltage of 12V. If the output voltage is set to a lower value, the minimum VIN can be reset to a lower value by changing the ratio of R2 and R3. The minimum EN threshold that VIN can be set to is 4.5V. The rated load current is 10A with the OCP point set at minimum 11A at ambient room temperature conditions. The operating temperature range of this board is -40C to +85C. Note that airflow is needed for higher temperature ambient conditions. 2.3 Bi-Directional Operation Refer to Figure 2 for proper setup. Float the FBI pin (J7) and set the mode to CCM before powering on the board. The rated voltage of the super capacitor must be higher than 12V. (1) Adjust the input voltage higher than 9V. Switch on the input power source. (2) Switch off the input power source after the super capacitor is fully charged. VIN DC Load VOUT ISL81601EVAL1Z GND GND Figure 2. Proper Setup for Bi-Directional Operation UG162 Rev.1.00 Aug 6, 2018 Page 4 of 21 ISL81601EVAL1Z 2.4 2. Functional Description Quick Test Guide (1) Jumper J8 provides the option to select PWM or DEM. Jumper J9 provides the option to select constant current limit or HICCUP. Refer to Table 2 for the operating options. Ensure that the circuit is correctly connected to the supply and electronic loads before applying any power. Refer to Figure 4 on page 6 for proper setup. (2) Turn on the power supply. (3) Adjust input voltage VIN within the specified range and observe the output voltage. The output voltage variation should be within 3%. (4) Adjust the load current within the specified range and observe the output voltage. The output voltage variation should be within 3%. (5) Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, refer to Figure 3 for proper test setup. Table 2. Operating Options Jumper Position 3 6 Function EN-GND Disable output EN Floating Enable output IIN Floating Enable input current limit IIN-VCC5 Disable input current limit 7 FBI-GND Disable VIN limit FBI Floating Enable VIN limit 8 Pin 1-2 PWM Pin 2-3 DEM 9 Pin 1-2 Constant current limit Pin 2-3 HICCUP Output Capacitor or MOSFET Figure 3. Proper Probe Setup to Measure Output Ripple and Phase Node Ringing UG162 Rev.1.00 Aug 6, 2018 Page 5 of 21 2. Functional Description A + Vo + + + V VIN - - Load ISL81601EVAL1Z A - Figure 4. Proper Test Setup UG162 Rev.1.00 Aug 6, 2018 Page 6 of 21 ISL81601EVAL1Z 3. 3. PCB Layout Guidelines PCB Layout Guidelines Careful attention to Printed Circuit Board (PCB) layout requirements is necessary for successful implementation of an ISL81601 based DC/DC converter. The ISL81601 switches at a very high frequency; therefore the switching times are very short. At these switching frequencies, even the shortest trace has significant impedance and the peak gate drive current rises significantly in an extremely short time. The transition speed of the current from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade efficiency, generate EMI, and increase device voltage stress and ringing. Careful component selection and proper PC board layout minimizes the magnitude of these voltage spikes. Three sets of components are critical when using the ISL81601 DC/DC converter: * Controller * Switching power components * Small signal components The switching power components are the most critical to the layout because they switch a large amount of energy, which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive nodes or those supplying critical bias currents. A multilayer PCB is recommended. Complete the following steps to optimize the PCB layout. (1) Place the input capacitors, buck FETs, inductor, boost FETs, and output capacitor first. Isolate these power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the input and output high frequency decoupling ceramic capacitors very close to the MOSFETs. (2) If signal components and the IC are placed separately from the power train, Renesas recommends us full ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND together close to the IC. DO NOT connect them together anywhere else. (3) The loop formed by the input capacitor, the buck top FET, and the buck bottom FET must be as small as possible. The loop formed by the output capacitor, the boost top FET, and the boost bottom FET must also be as small as possible. (4) Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and the output capacitor are as short as possible with maximum allowable trace widths. (5) Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be short and wide. The IC should be placed over a quiet ground area. Avoid switching ground loop currents in this area. (6) Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND pin. Connect the PGND pin to the ground plane by a via. Do not connect the PGND pin directly to the SGND EPAD. (7) Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC. (8) Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output capacitors to load to avoid inductance and resistances. (9) Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck or boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short. DO NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase nodes are subjected to very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry tends to couple switching noise. (10) Route all high speed switching nodes away from the control circuitry. (11) Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal grounding paths including feedback resistors, current monitoring resistors and capacitors, soft-starting capacitors, loop compensation capacitors and resistors, and EN pull-down resistors should be connected to this SGND plane. (12) Use a pair of traces with minimum loop for the input or output current sensing connection. (13) Ensure the feedback connection to the output capacitor is short and direct. UG162 Rev.1.00 Aug 6, 2018 Page 7 of 21 ISL81601EVAL1Z 3.1 3. PCB Layout Guidelines ISL81601VAL1Z Evaluation Board Figure 5. ISL81601VAL1Z Evaluation Board, Top View Figure 6. ISL81601VAL1Z Evaluation Board, Bottom View UG162 Rev.1.00 Aug 6, 2018 Page 8 of 21 ISL81601EVAL1Z UG162 Rev.1.00 Aug 6, 2018 3.2 ISL81601VAL1Z Circuit Schematic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igure 7. Schematic '13 Page 9 of 21 3. PCB Layout Guidelines IER LLQ 73 &21 ISL81601EVAL1Z 3.3 3. PCB Layout Guidelines Bill of Materials Qty Reference Designator 1 Description Manufacturer Manufacturer Part PWB-PCB, ISL81601EVAL1Z, REVA, ROHS Imagineering INC ISL81601EVAL1ZREVAPCB 1 C33 CAP-AEC-Q200, SMD, 0603, 0.01F, 50V, 10%, X7R, ROHS TDK CGA3E2X7R1H103K080AE 10 C1, C2, C5, C6, C7, C8, C9, C10, C52, C53 CAP-AEC-Q200, SMD, 1210, 4.7F, 100V, 10%, X7S, ROHS TDK CGA6M3X7S2A475K200AE 1 C39 CAP-AEC-Q200, SMD, 0603, 0.022F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E223K080AA 1 C36 CAP-AEC-Q200, SMD, 0603, 0.033F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E333K080AA 2 C14, C45 CAP-AEC-Q200, SMD, 0603, 0.047F, 25V, 10%, X7R, ROHS TDK CGJ3E2X7R1E473K080AA 2 C16, C46 CAP-BOARDFLEX, SMD, 0603, 0.1F, 100V, 10%, X7R, ROHS Murata GRJ188R72A104KE11D 3 C17, C31, C32 CAP, SMD, 0805, 10F, 16V, 10%, X7S, ROHS Murata GRM21BC71C106KE11L 10 C18, C19, C20, C21, C22, C23, C24, C25, C54, C55 CAP, SMD, 1210, 22F, 25V, 10%, X7R, ROHS Murata GRM32ER71E226KE15L 3 C11, C15, C43 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R, ROHS AVX 06035C102KAT2A 4 C12, C13, C41, C42 CAP, SMD, 0603, 0.01F, 100V, 10%, X7R, ROHS Kemet C0603C103J1RACTU 1 C29 CAP, SMD, 0603, 220pF, 100V, 5%, X7R, ROHS Panasonic ECJ-1VB2A221K 1 C40 CAP, SMD, 0603, 220pF, 50V, 10%, X7R, ROHS Murata GRM188R71H221KA01D 2 C30, C37 CAP, SMD, 0603, 0.47F, 25V, 10%, X7R, ROHS Murata GRM188R71E474KA12D 1 C34 CAP, SMD, 0603, 820pF, 50V, 10%, X7R, ROHS Kemet C0603C821K5RACTU 0 C28, C35, C38, C44, C47, C48, C49, C50, C51 CAP, SMD, 0603, DNP-PLACE HOLDER, ROHS 2 C26, C27 CAP-OSCON, SMD, 10mm, Sanyo 1000F, 16V, 20%, 12m, ROHS 16SVPF1000M 4 C3, C4 CAP, RADIAL, 12.5x26.5, 220F, United Chemi-Con 100V, 20%, ALUM.ELEC., 5mm, ROHS EKZN101ELL221MK25S 1 L1 COIL-PWR INDUCTOR, SMD, 17.15mm, 5.6H, 20%, 28A, 4.23m, ROHS Vishay IHLP6767GZER5R6M11 27 TP1, TP2, TP4-TP28 CONN-COMPACT TEST PT, VERTICAL, WHT, ROHS Keystone 5007 2 J3, J6 CONN-HEADER, 1x2, BRKAWY 1x36, 2.54mm, ROHS BERG/FCI 68000-236HLF 3 J7, J8, J9 CONN-HEADER, 1x3, BREAKAWY 1x36, 2.54mm, ROHS BERG/FCI 68000-236HLF 3 D1, D2, D6 DIODE-RECTIFIER, SMD, 2P, S0D-123FL, 100V, 1A, ROHS On Semiconductor MBR1H100SFT3G UG162 Rev.1.00 Aug 6, 2018 Page 10 of 21 ISL81601EVAL1Z Qty Reference Designator 3. PCB Layout Guidelines Description Manufacturer Manufacturer Part 2 D4, D5 DIODE-ZENER, SMD, SOD-323, Diodes, INC. 4.7V, 6%, 300mW, ROHS 1 U1 IC-60V 4-SWITCH PWM CONTROLLER, 32P, QFN, 5x5, ROHS Renesas Electronics ISL81601FRZ America 2 Q3, Q8 TRANSIST-MOS, N-CHANNEL, SMD, 8P, PG-TDSON, 25V, 25A, ROHS Infineon Technology BSC024NE2LSATMA1 2 Q2, Q5 Vishay/Siliconix TRANSISTOR-MOS, N-CHANNEL,SMD, 8P, PPK SO8, 80V, 60A, ROHS SIR826DP-T1-GE3 4 R8, R10, R23, R35, R37 RES, SMD, 0603, 1, 1/10W, 1%, TF, ROHS Panasonic ERJ-3RQF1R0V 2 R9, R46 RES, SMD, 0603, 20, 1/10W, 1%, TF, ROHS Panasonic ERJ-3EKF20R0V 2 R4, R28 RES, SMD, 0603, 2.2, 1/10W, 1%, TF, ROHS Panasonic ERJ-3RQF2R2V 4 R19, R20, R22, R29 RES, SMD, 0603, 0, 1/10W, TF, Venkel ROHS CR0603-10W-000T 1 R54 RES, SMD, 0603, 100, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-1000FT 1 R53 RES, SMD, 0603, 1k, 1/10W, 1%, TF, ROHS Panasonic ERJ-3EKF1001V 1 R36 RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-1002FT 1 R33 RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-1003FT 3 R21, R40, R42 RES, SMD, 0603, 15k, 1/10W, 1%, TF, ROHS Panasonic ERJ-3EKF1502V 1 R25 RES, SMD, 0603, 169k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-1693FT 1 R53 RES, SMD, 0603, 200k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-2003FT 1 R26 RES, SMD, 0603, 2.7k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-2701FT 1 R44 RES, SMD, 0603, 3.48k, 1/10W, 1%, TF, ROHS Panasonic ERJ-3EKF3481V 1 R7 RES, SMD, 0603, 37.4k, 1/10W, 1%, TF, ROHS Yageo RC0603FR-0737K4L 2 R12, R18 RES, SMD, 0603, 40.2k, 1/10W, 1%, TF, ROHS Yageo RC0603FR-0740K2L 1 R39 RES, SMD, 0603, 44.2k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-4422FT 2 R5, R38 RES, SMD, 0603, 5.1k, 1/10W, 1%, TF, ROHS Venkel CR0603-10W-5101FT 2 R41, R43 RES, SMD, 0603, 51k, 1/10W, 1%, TF, ROHS Yageo RC0603FR-0751KL 0 R14, R15, R16, R24, R27, R30, RES, SMD, 0603, DNP-PLACE R31, R32, R47, R48, R49, R50, R55 HOLDER, ROHS 1 R17 Yageo RC1206FR-07154KL UG162 Rev.1.00 Aug 6, 2018 RES, SMD, 1206, 154k, 1/4W, 1%, TF, ROHS MM3Z4V7T1G Page 11 of 21 ISL81601EVAL1Z Qty Reference Designator 3. PCB Layout Guidelines Description Manufacturer Manufacturer Part 1 R45 RES, SMD, 1206, 48.7k, 1/4W, 1%, TF, ROHS Yageo RC1206FR-0748K7L 1 R2 RES, SMD, 1206, 820k, 1/4W, 1%, TF, ROHS Yageo AC1206FR-07820KL 0 R51, R52 RES, SMD, 1206, DNP, DNP, DNP, TF, ROHS 2 R6, R57 RES, SMD, 1206, 0.006, 1W, 1%, TF, ROHS Rohm PMR18EZPFU6L00 2 R1, R56 RES, SMD, 1206, 0.008, 1W,1%, TF, ROHS Rohm PMR18EZPFU8L00 4 Four corners SCREW, 4-40X1/4in, PHILLIPS, PANHEAD, STAINLESS, ROHS Building Fasteners PMSSS 440 0025 PH 4 Four corners STANDOFF, 4-40X3/4in, F/F, HEX, ALUMINUM, 0.25 OD, ROHS Keystone 2204 4 J1, J2, J4, J5 HDWARE, TERMINAL, M4 METRIC SCREW, TH, 4P, SNAP-FIT, ROHS Keystone 7795 1 Place assy in bag BAG, STATIC, 6X8, ZIPLOC, ROHS Uline S-2262 0 Q1, Q4, Q6, Q7 DO NOT POPULATE OR PURCHASE 0 TP3 DO NOT POPULATE OR PURCHASE 1 AFFIX TO BACK OF PCB LABEL-DATE CODE_LINE 1: YRWK/REV#, LINE 2: BOM NAME UG162 Rev.1.00 Aug 6, 2018 Renesas Electronics LABEL-DATE CODE America Page 12 of 21 ISL81601EVAL1Z 3.4 3. PCB Layout Guidelines Board Layout Figure 8. Silkscreen Top Figure 9. Top Layer UG162 Rev.1.00 Aug 6, 2018 Page 13 of 21 ISL81601EVAL1Z 3. PCB Layout Guidelines Figure 10. Second Layer (Solid Ground) Figure 11. Third Layer UG162 Rev.1.00 Aug 6, 2018 Page 14 of 21 ISL81601EVAL1Z 3. PCB Layout Guidelines Figure 12. Bottom Layer Figure 13. Silkscreen Bottom UG162 Rev.1.00 Aug 6, 2018 Page 15 of 21 ISL81601EVAL1Z 4. 4. Typical Performance Curves Typical Performance Curves VIN = 12V, unless otherwise noted. 90 90 80 80 Efficiency (%) 100 Efficiency (%) 100 70 Vin=9V Vin=24V Vin=48V 60 Vin=12V Vin=36V Vin=60V 70 Vin=9V Vin=24V Vin=48V 60 50 50 40 40 30 30 0 2 4 IOUT (A) 6 8 0 10 2 12.10 Vin=9V Vin=24V Vin=48V 12.08 12.06 4 IOUT (A) 6 8 10 8 10 Figure 15. Efficiency, DEM Figure 14. Efficiency, CCM 12.10 Vin=12V Vin=36V Vin=60V Vin=9V Vin=24V Vin=48V 12.08 12.06 12.04 12.04 12.02 12.02 VOUT (V) VOUT (V) Vin=12V Vin=36V Vin=60V 12.00 11.98 12.00 11.98 11.96 11.96 11.94 11.94 11.92 11.92 11.90 Vin=12V Vin=36V Vin=60V 11.90 0 2 4 IOUT (A) 6 8 10 Figure 16. Load Regulation, CCM 0 2 4 IOUT (A) 6 Figure 17. Load Regulation, DEM Phase 1 10V/Div Phase 1 10V/Div Phase 2 20V/Div Phase 2 20V/Div VOUT 100mV/Div VOUT 50mV/Div IL 10A/Div IL 10A/Div 4s/Div 4s/Div Figure 18. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 9V, IOUT = 10A Figure 19. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 12V, IOUT = 10A UG162 Rev.1.00 Aug 6, 2018 Page 16 of 21 ISL81601EVAL1Z 4. Typical Performance Curves VIN = 12V, unless otherwise noted. (Continued) Phase 1 50V/Div VOUT 200mV/Div Phase 2 20V/Div VOUT 50mV/Div IOUT 5A/Div IL 10A/Div 4s/Div 2ms/Div Figure 20. Phase 1, Phase 2, VOUT and Inductor Current, VIN = 60V, IOUT = 10A Figure 21. Load Transient, VIN = 9V, IOUT = 0A to 10A, 2.5A/s, CCM VOUT 200mV/Div VOUT 200mV/Div IOUT 5A/Div IOUT 5A/Div 2ms/Div 2ms/Div Figure 22. Load Transient, VIN = 12V, IOUT = 0A to 10A, 2.5A/s, CCM Figure 23. Load Transient, VIN = 60V, IOUT = 0A to 10A, 2.5A/s, CCM Phase 1 10V/Div Phase 1 10V/Div Phase 2 10V/Div Phase 2 10V/Div VOUT 5V/Div VOUT 5V/Div IL 10A/Div IL 10A/Div 4ms/Div Figure 24. Start-Up Waveform, VIN = 9V, IOUT = 10A, CCM UG162 Rev.1.00 Aug 6, 2018 4ms/Div Figure 25. Start-Up Waveform, VIN = 12V, IOUT = 10A, CCM Page 17 of 21 ISL81601EVAL1Z 4. Typical Performance Curves VIN = 12V, unless otherwise noted. (Continued) Phase 1 10V/Div Phase 1 50V/Div Phase 2 10V/Div Phase 2 10V/Div VOUT 10V/Div VOUT 5V/Div IL 10A/Div IL 20A/Div 4ms/Div 40ms/Div Figure 26. Start-Up Waveform, VIN = 60V, IOUT = 10A, CCM Figure 27. Short-Circuit Waveform VIN 5V/Div VIN 20V/Div VOUT 5V/Div VOUT 200mV/Div IL 10A/Div IL 10A/Div 10ms/Div 4ms/Div Figure 29. Line Transient, VIN = 9V to 60V, 1V/ms, IOUT = 0A Figure 28. Bi-Directional Operation, VIN = 18V, Vin_limit = 9V, IIN = 1A VIN 20V/Div VOUT 200mV/Div IL 10A/Div 10ms/Div Figure 30. Line Transient, VIN = 60V to 9V, 1V/ms, IOUT = 0A UG162 Rev.1.00 Aug 6, 2018 Page 18 of 21 ISL81601EVAL1Z 5. 5. Revision History Revision History Rev. Date 1.00 Aug 6, 2018 Corrected BOM for components C12, C13, C41, C42, and C29 on page 10. Updated board pictures and layout files. 0.00 Mar 26, 2018 Initial release UG162 Rev.1.00 Aug 6, 2018 Description Page 19 of 21 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. 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Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. (Rev.4.0-1 November 2017) http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. California Eastern Laboratories, Inc. 4590 Patrick Henry Drive, Santa Clara, California 95054-1817, U.S.A. Tel: +1-408-919-2500, Fax: +1-408-988-0279 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Dusseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82-2-558-5338 (c) 2018 Renesas Electronics Corporation. All rights reserved. Colophon 7.1 ISL81601EVAL1Z UG162