BBY51... Silicon Tuning Diode * High Q hyperabrupt tuning diode * Designed for low tuning voltage operation * For VCO's in mobile communications equipment * Pb-free (RoHS compliant) package BBY51 BBY51-02L BBY51-02W BBY51-03W ! , , Type BBY51 BBY51-02L BBY51-02W BBY51-03W Package SOT23 TSLP-2-1 SCD80 SOD323 Configuration common cathode single, leadless single single LS(nH) 2 0.4 0.6 1.8 Marking S3s II II white H Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 7 Forward current IF 20 mA Operating temperature range Top -55 ... 125 C Storage temperature Tstg -55 ... 150 1 Value Unit V 2011-06-14 BBY51... Electrical Characteristics at T A = 25C, unless otherwise specified Symbol Parameter Values min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 6 V - - 10 VR = 6 V, TA = 85 C - - 200 AC Characteristics Diode capacitance pF CT VR = 1 V, f = 1 MHz 5.05 5.4 5.75 VR = 2 V, f = 1 MHz 3.4 4.2 5.2 VR = 3 V, f = 1 MHz 2.7 3.5 4.6 VR = 4 V, f = 1 MHz 2.5 3.1 3.7 CT1/C T4 1.55 1.75 2.2 C1V-C3V 1.4 1.78 2.2 C3V-C4V 0.3 0.5 0.7 - 0.37 - Capacitance ratio VR = 1 V, VR = 4 V, f = 1 MHz Capacitance difference pF VR = 1 V, VR = 3 V, f = 1 MHZ Capacitance difference VR = 3 V, VR = 4 V, f = 1 MHZ Series resistance rS VR = 1 V, f = 1 GHz 2 2011-06-14 BBY51... Diode capacitance CT = (VR ) Temperature coefficient of the diode f = 1MHz capacitance TCc = (VR) pF 1/C 8 TCc CT 10 -3 EHD07128 10 6 10 -4 4 2 0 0 2 4 V VR 10 -5 1 6 2 3 4 5 6 V 8 VR 3 2011-06-14 Package SCD80 BBY51... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.7 0.1 1 0.3 0.05 Cathode marking 7 1.5 1.3 0.1 A 2 0.7 0.1 0.35 1.45 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Reel with 2 mm Pitch 2 0.2 2.5 8 1.45 Standard 4 Cathode marking 0.4 0.9 Cathode marking 4 0.7 2011-06-14 BBY51... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 5 2011-06-14 Package SOD323 6 BBY51... 2011-06-14 Package SOT23 BBY51... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 0.1 1 2.4 0.15 3 0.1 MAX. 10 MAX. B 1 0.1 10 MAX. 2.9 0.1 0.15 MIN. Package Outline A 5 0...8 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 7 2011-06-14 Package TSLP-2-1 8 BBY51... 2011-06-14 BBY51... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2011-06-14