
S1D13L02
2
DESCRIPTION
• 1024K bytes of embedded SRAM
CPU Interface
• 16-bit Indirect Host Interface
• Supports High Speed Host Writes
• Integrated Host interface Write Controller supports:
• Rectangular Write Mode
• Rotated Write Mode
• Mirror Write Mode
Panel Support
• 9/12/16/18/24-bit RGB interface panels
Input Formats
• Host can input image data as:
• RGB 5:6:5
• Supports up to 3 layers with Overlay and Alpha Blending
functions:
• Main Layer features:
• Image can be stored as RGB 5:6:5
• Pixel Doubling which doubles the size of the display
image (independent horizontal/vertical)
• PIP1 Layer features:
• Image can be stored as RGB 5:6:5
• Bi-Cubic Scaler can resize image from 8x - 1/8x
• Edge Enhancement support
• PIP2 Layer features:
• Image can be stored as RGB 5:6:5
• Bi-Cubic Scaler can resize image from 8x - 1/8x
• Edge Enhancement support
• LUT (Look-Up Table) for independent gamma
control of PIP2 window
• LUT (Look-Up Table) for gamma control of the LCD
output
• Optional dithering for the LCD output
Miscellaneous
• Internal PLL or digital clock input (CLKI)
• Software initiated power save mode
• General Purpose IO pins
• COREVDD 1.5 volts and IOVDD 1.80, 2.80, or 3.30 volts
• Packages:
QFP22 208-pin (28 x 28 x 1.4mm) (0.5mm pitch)
MICRODEVICES OPERATIONS DIVISION
IC Sales & Marketing Depar tm en t
421-8 Hino, Hino-shi, T okyo 191-8501, JAPAN
Phone: +81-42-587-5814 FAX: +81-42-587-5117
http://www.epson.jp/device/semicon_e/
EPSON s emic onductor website
First issue February, 2014 in Japan
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