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TLP621, TLP621-2, TLP621-4
ISOCOM
COMPONENTS
DESCRIPTION
The TLP621, TLP621-2 and TLP621-4 series of
optically coupled isolator consist of an infrared light
emitting diode and an NPN silicon photo transistor in
a space efficient Dual In Line Plastic Package.
FEATURES
• AC Isolation Voltage 5300VRMS
• CTR Selections Available
• Wide Operating Temperature Range
-30°C to +100°C
• Lead Free and RoHS Compliant
• UL File E91231 Package Code “EE”
• VDE Approval Certificate No. 40028086
APPLICATIONS
• Computer Terminals
• Industrial System Controllers
• Measuring Instruments
• Signal Transmission between Systems of
Different Potentials and Impedances
ORDER INFORMATION
• Add X after PN for VDE Approval
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
(Available for TLP621SM and TLP621-2SM)
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
TLP621
TLP621-2
TLP621-4
Input
Forward Current 50mA
Reverse Voltage 6V
Power dissipation 70mW
Output
Collector to Emitter Voltage BVCEO 55V
Emitter to Collector Voltage BVECO 6V
Power Dissipation 150mW
Collector Current 50mA
Isolation Voltage 5300VRMS
Total Power Dissipation 200mW
Operating Temperature -30 to 100 °C
Storage Temperature -55 to 125 °C
Lead Soldering Temperature
(10s)
260°C
Total Package
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ISOCOM
COMPONENTS
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 10mA 1.0 1.15 1.3 V
Reverse Voltage VR I
R = 10μA 5.0 V
Reverse Leakage IR V
R = 5V 10 µA
Terminal Capacitance Ct V = 0V, f = 1KHz 30 250 pF
INPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Collector—Emitter
breakdown Voltage
BVCEO IC = 0.5mA, IF = 0mA 55 V
Emitter—Collector
breakdown Voltage
BVECO I
E = 100µA, IF = 0mA 6 V
Collector-Emitter Dark
Current
ICEO V
CE = 24V, IF = 0mA 100 nA
OUTPUT
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TLP621, TLP621-2, TLP621-4
ISOCOM
COMPONENTS
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
Note 1 : Measure with input leads shorted together and output leads shorted together.
COUPLED
Parameter Symbol Test Condition Min Typ. Max Unit
Current Transfer Ratio CTR IF = 5mA, VCE = 5V
Optional CTR Grades
GR
BL
GB
GB (IF = 1mA, VCE = 0.4V)
50
100
200
100
30
600
300
600
600
%
Collector—Emitter
Saturation Voltage
VCE(sat) I
F = 8mA, IC = 2.4mA
GB (IF = 1mA, IC = 0.2mA)
0.4
0.4
V
Output Rise Time tr V
CE = 10V,
Ic = 2mA,
RL = 100Ω
2 µs
Output Fall Time tf 3
Turn-on Time ton 3
Turn-off Time toff 3
ISOLATION
Parameter Symbol Test Condition Min Typ. Max Unit
Input to Output
Isolation Voltage
VISO AC 1 minute, RH = 40 to 60%
Note 1
5300 VRMS
Input to Output
Isolation Resistance
RISO V
IO= 500V
Note 1
5x1010 Ω
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ISOCOM
COMPONENTS
Fig 1 Forward Current vs TA Fig 2 Collector Power Di ssipation vs TA
Fig 3 Collector-emitter Saturation Voltage vs
Forward Current Fig 4 Collector Current vs
Collector-emitter Voltage
Fig 5 Current Transfer Ratio vs Forward Current Fig 6 Forward Current vs Forward Voltage
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ISOCOM
COMPONENTS
Fig 7 Relative CTR vs TA Fig 8 Frequency Response
Response Time Test Circuit
Fig 9 Response Time vs Load Resistance
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ISOCOM
COMPONENTS
ORDER INFORMATION
After PN Description Packing quantity
None Standard DIP4 100 pcs per tube
G 10mm Lead Spacing 100 pcs per tube
SM Surface Mount 100 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
TLP621 (UL Approval)
PN
TLP621, TLP621GR,
TLP621BL, TLP621GB
TLP621G, TLP621GRG,
TLP621BLG, TLP621GBG
TLP621SM, TLP621GRSM,
TLP621BLSM, TLP621GBSM
TLP621SMT&R,
TLP621GRSMT&R,
TLP621BLSMT&R,
TLP621GBSMT&R
After PN Description Packing quantity
None Standard DIP8 50 pcs per tube
G 10mm Lead Spacing 50 pcs per tube
SM Surface Mount 50 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
TLP621-2 (UL Approval)
PN
TLP621-2, TLP621-2GR,
TLP621-2BL, TLP621-2GB
TLP621-2G, TLP621-2GRG,
TLP621-2BLG, TLP621-2GBG
TLP621-2SM, TLP621-2GRSM,
TLP621-2BLSM,
TLP621-2GBSM
TLP621-2SMT&R,
TLP621-2GRSMT&R,
TLP621-2BLSMT&R,
TLP621-2GBSMT&R
TLP621-4 (UL Approval)
After PN Description Packing quantity
None Standard DIP16 25 pcs per tube
G 10mm Lead Spacing 25 pcs per tube
SM Surface Mount 25 pcs per tube
PN
TLP621-4,TLP621-4GR,
TLP621-4BL, TLP621-4GB
TLP621-4G, TLP621-4GRG,
TLP621-4BLG, TLP621-4GBG
TLP621-4SM,
TLP621-4GRSM,
TLP621-4BLSM,
TLP621-4GBSM
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ISOCOM
COMPONENTS
ORDER INFORMATION
After PN Description Packing quantity
None Standard DIP4 100 pcs per tube
G 10mm Lead Spacing 100 pcs per tube
SM Surface Mount 100 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
TLP621X (UL and VDE Approvals)
PN
TLP621X, TLP621XGR,
TLP621XBL, TLP621XGB
TLP621XG, TLP621XGRG,
TLP621XBLG, TLP621XGBG
TLP621XSM, TLP621XGRSM,
TLP621XBLSM, TLP621XGBSM
TLP621XSMT&R,
TLP621XGRSMT&R,
TLP621XBLSMT&R,
TLP621XGBXSMT&R
After PN Description Packing quantity
None Standard DIP8 50 pcs per tube
G 10mm Lead Spacing 50 pcs per tube
SM Surface Mount 50 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
TLP621-2X (UL and VDE Approvals)
PN
TLP621-2X, TLP621-2XGR,
TLP621-2XBL, TLP621-2XGB
TLP621-2XG, TLP621-2XGRG,
TLP621-2XBLG, TLP621-2XGBG
TLP621-2XSM,
TLP621-2XGRSM,
TLP621-2XBLSM,
TLP621-2XGBSM
TLP621-2XSMT&R,
TLP621-2XGRSMT&R,
TLP621-2XBLSMT&R,
TLP621-2XGBSMT&R
TLP621-4X (UL and VDE Approvals)
After PN Description Packing quantity
None Standard DIP16 25 pcs per tube
G 10mm Lead Spacing 25 pcs per tube
SM Surface Mount 25 pcs per tube
PN
TLP621-4X, TLP621-4XGR,
TLP621-4XBL, TLP621-4XGB
TLP621-4XG, TLP621-4XGRG,
TLP621-4XBLG, TLP621-4XGBG
TLP621-4XSM,
TLP621-4XGRSM,
TLP621-4XBLSM,
TLP621-4XGBSM
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ISOCOM
COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
DIP
TLP621
TLP621-2
TLP621-4
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COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
G Form
TLP621G
TLP621-2G
TLP621-4G
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ISOCOM
COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
SMD
TLP621SM
TLP621-2SM
TLP621-4SM
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COMPONENTS
RECOMMENDED PAD LAYOUT FOR SMD (mm)
TLP621SM
TLP621-2SM
TLP621-4SM
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COMPONENTS
TAPE AND REEL PACKAGING
TLP621SMT&R
TLP621-2SMT&R
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COMPONENTS
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
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ISOCOM
COMPONENTS
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves
the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visual
equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact our
sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
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DISCLAIMER
ISOCOM
COMPONENTS
__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
