LM4861
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LM4861 1.1W Audio Power Amplifier with Shutdown Mode
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1FEATURES DESCRIPTION
The LM4861 is a bridge-connected audio power
2• No output coupling capacitors, bootstrap amplifier capable of delivering 1.1W of continuous
capacitors, or snubber circuits are necessary average power to an 8Ωload with 1% THD+N using
• Small Outline (SOIC) packaging a 5V power supply.
• Compatible with PC power supplies Boomer audio power amplifiers were designed
• Thermal shutdown protection circuitry specifically to provide high quality output power with a
minimal amount of external components using
• Unity-gain stable surface mount packaging. Since the LM4861 does
• External gain configuration capability not require output coupling capacitors, bootstrap
capacitors, or snubber networks, it is optimally suited
APPLICATIONS for low-power portable systems.
• Personal computers The LM4861 features an externally controlled, low-
• Portable consumer products power consumption shutdown mode, as well as an
internal thermal shutdown protection mechanism.
• Self-powered speakers
• Toys and games The unity-gain stable LM4861 can be configured by
external gain-setting resistors for differential gains of
up to 10 without the use of external compensation
KEY SPECIFICATIONS components. Higher gains may be achieved with
• THD+N for 1kHz at 1W continuous average suitable compensation.
output power into 8Ω1.0% (max)
• Output power at 10% THD+N at 1kHz into 8Ω
1.5 W (typ)
• Shutdown Current 0.6µA (typ)
Connection Diagram
Figure 1. 8-Lead SOIC - Top View
See D Package
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1997–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4861
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Typical Application
Figure 2. Typical Audio Amplifier Application Circuit
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings (1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD + 0.3V
Power Dissipation (3) Internally limited
ESD Susceptibility (4) 3000V
ESD Susceptibility (5) 250V
Junction Temperature 150°C
Soldering Information SOIC Package Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX −TA)/θJA or the number given in the Absolute Maximum Ratings,
whichever is lower. For the LM4861, TJMAX = 150°C, and the typical junction-to-ambient thermal resistance, when board mounted, is
140°C/W.
(4) Human body model, 100pF discharged through a 1.5kΩresistor.
(5) Machine Model, 220pF–240pF discharged through all pins.
Operating Ratings
Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤+85°C
Supply Voltage 2.0V ≤VDD ≤5.5V
Thermal Resistance θJC (typ)—M08A 35°C/W
θJA (typ)—M08A 140°C/W
θJC (typ)—N08E 37°C/W
θJA (typ)—N08E 107°C/W
Electrical Characteristics (1)(2)
The following specifications apply for VDD = 5V, unless otherwise specified. Limits apply for TA= 25°C.
LM4861 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)
VDD Supply Voltage 2.0 V (min)
5.5 V (max)
IDD Quiescent Power Supply Current VIN = 0V, IO= 0A (5) 6.5 10.0 mA (max)
ISD Shutdown Current VSHUTDOWN = VDD 0.6 10.0 μA (max)
VOS Output Offset Voltage VIN = 0V 5.0 50.0 mV (max)
POOutput Power THD = 1% (max); f = 1 kHz 1.1 1.0 W (min)
THD+N Total Harmonic Distortion + Noise PO= 1Wrms; 20 Hz ≤f≤20 kHz 0.72 %
PSRR Power Supply Rejection Ratio VDD = 4.9V to 5.1V 65 dB
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
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High Gain Application Circuit
Figure 3. Audio Ampiifier with AVD = 20
Single Ended Application Circuit
*CSand CBsize depend on specific application requirements and constraints. Typical vaiues of CSand CBare 0.1 μF.
**Pin 1 should be connected to VDD to disable the amplifier or to GND to enable the amplifier. This pin should not be
left floating.
***These components create a “dummy” load for pin 8 for stability purposes.
Figure 4. Single-Ended Amplifier with AV=−1
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External Components Description
(Figure 2 and Figure 3)
Components Functional Description
1. RiInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass
filter with Ciat fC= 1 / (2πRiCi).
2. CiInput coupling capacitor which blocks DC voltage at the amplifier's input terminals. Also creates a high pass filter with
Riat fC= 1 / (2πRiCi).
3. RfFeedback resistance which sets closed-loop gain in conjunction with Ri.
4. CSApplication Supply bypass capacitor which provides power supply filtering. Refer to for proper placement and selection of supply
Information bypass capacitor.
5. CBBypass pin capacitor which provides half supply filtering. Refer to Application Information for proper placement and
selection of bypass capacitor.
6. Cf(1) Cfin conjunction with Rfcreates a low-pass filter which bandwidth limits the amplifier and prevents possible high
frequency oscillation bursts. fC= 1 / (2πRfCf)
(1) Optional component dependent upon specific design requirements. Refer to Application Information for more information.
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Typical Performance Characteristics
THD+N THD+N
vs vs
Frequency Frequency
Figure 5. Figure 6.
THD+N THD+N
vs vs
Frequency Output Power
Figure 7. Figure 8.
THD+N
vs Output Power vs
Output Power Load Resistance
Figure 9. Figure 10.
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Typical Performance Characteristics (continued)
Output Power vs Power Dissipation vs
Supply Voltage Output Power
Figure 11. Figure 12.
Noise Floor
vs Supply Current Distribution
Frequency vs Temperature
Figure 13. Figure 14.
Supply Current vs
Supply Voltage Power Derating Curve
Figure 15. Figure 16.
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APPLICATION INFORMATION
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 2 , the LM4861 has two operational amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in
a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of Rfto
Riwhile the second amplifier's gain is fixed by the two internal 40kΩresistors. Figure 2 shows that the output of
amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in
magnitude, but out of phase 180°. Consequently, the differential gain for the IC is:
Avd = 2 * (Rf/Ri) (1)
By driving the load differentially through outputs VO1 and VO2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over the single-ended configuration, as it provides
differential drive to the load, thus doubling output swing for a specified supply voltage. Consequently, four times
the output power is possible as compared to a single-ended amplifier under the same conditions. This increase in
attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an
amplifier's closed-loop gain without causing excessive clipping which will damage high frequency transducers
used in loudspeaker systems, please refer to AUDIO POWER AMPLIFIER DESIGN.
A bridge configuration, such as the one used in Boomer Audio Power Amplifiers, also creates a second
advantage over single-ended amplifiers. Since the differential outputs, VO1 and VO2, are biased at half-supply, no
net DC voltage exists across the load. This eliminates the need for an output coupling capacitor which is required
in a single supply, single-ended amplifier configuration. Without an output coupling capacitor in a single supply,
single-ended amplifier, the half-supply bias across the load would result in both increased internal IC power
dissipation and also permanent loudspeaker damage. An output coupling capacitor forms a high pass filter with
the load requiring that a large value such as 470μF be used with an 8Ωload to preserve low frequency response.
This combination does not produce a flat response down to 20Hz, but does offer a compromise between printed
circuit board size and system cost, versus low frequency response.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Equation 3 states the maximum power dissipation point for a bridge
amplifier operating at a given supply voltage and driving a specified output load.
PDMAX = 4*(VDD)2/ (2π2RL) (2)
Since the LM4861 has two operational amplifiers in one package, the maximum internal power dissipation is 4
times that of a single-ended amplifier. Even with this substantial increase in power dissipation, the LM4861 does
not require heatsinking. From Equation 3, assuming a 5V power supply and an 8Ωload, the maximum power
dissipation point is 625mW.The maximum power dissipation point obtained from Equation 3 must not be greater
than the power dissipation that results from Equation 3:
PDMAX = (TJMAX −TA) / θJA (3)
For the LM4861 surface mount package, θJA = 140°C/W and TJMAX = 150°C. Depending on the ambient
temperature, TA, of the system surroundings, Equation 3 can be used to find the maximum internal power
dissipation supported by the IC packaging. If the result of Equation 3 is greater than that of Equation 3, then
either the supply voltage must be decreased or the load impedance increased. For the typical application of a 5V
power supply, with an 8Ωload, the maximum ambient temperature possible without violating the maximum
junction temperature is approximately 62.5°C provided that device operation is around the maximum power
dissipation point. Power dissipation is a function of output power and thus, if typical operation is not around the
maximum power dissipation point, the ambient temperature can be increased. Refer to the Typical Performance
Characteristics curves for power dissipation information for lower output powers.
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POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in the Typical Performance Characteristics, the effect of a larger half supply bypass
capacitor is improved low frequency THD+N due to increased half-supply stability. Typical applications employ a
5V regulator with 10μF and a 0.1μF bypass capacitors which aid in supply stability, but do not eliminate the need
for bypassing the supply nodes of the LM4861. The selection of bypass capacitors, especially CB, is thus
dependant upon desired low frequency THD+N, system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4861 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. The shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. Upon going into shutdown, the output is immediately disconnected from the speaker. A typical
quiescent current of 0.6μA results when the supply voltage is applied to the shutdown pin. In many applications,
a microcontroller or microprocessor output is used to control the shutdown circuitry which provides a quick,
smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch that when closed, is
connected to ground and enables the amplifier. If the switch is open, then a soft pull-up resistor of 47kΩwill
disable the LM4861. There are no soft pull-down resistors inside the LM4861, so a definite shutdown pin voltage
must be applied externally, or the internal logic gate will be left floating which could disable the amplifier
unexpectedly.
HIGHER GAIN AUDIO AMPLIFIER
The LM4861 is unity-gain stable and requires no external components besides gain-setting resistors, an input
coupling capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential
gain of greater than 10 is required, a feedback capacitor may be needed, as shown in Figure 3, to bandwidth
limit the amplifier. This feedback capacitor creates a low pass filter that eliminates possible high frequency
oscillations. Care should be taken when calculating the −3dB frequency in that an incorrect combination of Rfand
Cfwill cause rolloff before 20kHz. A typical combination of feedback resistor and capacitor that will not produce
audio band high frequency rolloff is Rf= 100kΩand Cf= 5pF. These components result in a −3dB point of
approximately 320kHz. Once the differential gain of the amplifier has been calculated, a choice of Rfwill result,
and Cfcan then be calculated from the formula stated in External Components Description .
VOICE-BAND AUDIO AMPLIFIER
Many applications, such as telephony, only require a voice-band frequency response. Such an application
usually requires a flat frequency response from 300Hz to 3.5kHz. By adjusting the component values of Figure 3,
this common application requirement can be implemented. The combination of Riand Ciform a highpass filter
while Rfand Cfform a lowpass filter. Using the typical voice-band frequency range, with a passband differential
gain of approximately 100, the following values of Ri, Ci, Rf, and Cffollow from the equations stated in External
Components Description .
Ri= 10kΩ, Rf= 510k ,Ci= 0.22μF, and Cf= 15pF (4)
Five times away from a −3dB point is 0.17dB down from the flatband response. With this selection of
components, the resulting −3dB points, fLand fH, are 72Hz and 20kHz, respectively, resulting in a flatband
frequency response of better than ±0.25dB with a rolloff of 6dB/octave outside of the passband. If a steeper
rolloff is required, other common bandpass filtering techniques can be used to achieve higher order filters.
SINGLE-ENDED AUDIO AMPLIFIER
Although the typical application for the LM4861 is a bridged monoaural amp, it can also be used to drive a load
single-endedly in applications, such as PC cards, which require that one side of the load is tied to ground.
Figure 4 shows a common single-ended application, where VO1 is used to drive the speaker. This output is
coupled through a 470μF capacitor, which blocks the half-supply DC bias that exists in all single-supply amplifier
configurations. This capacitor, designated COin Figure 4, in conjunction with RL, forms a highpass filter. The
−3dB point of this high pass filter is 1/(2πRLCO), so care should be taken to make sure that the product of RLand
COis large enough to pass low frequencies to the load. When driving an 8Ωload, and if a full audio spectrum
reproduction is required, COshould be at least 470μF. VO2, the output that is not used, is connected through a
0.1 μF capacitor to a 2kΩload to prevent instability. While such an instability will not affect the waveform of VO1,
it is good design practice to load the second output.
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AUDIO POWER AMPLIFIER DESIGN
Design a 1W / 8ΩAudio Amplifier
Given:
Power Output 1 Wrms
Load Impedance 8Ω
Input Level 1 Vrms
Input Impedance 20 kΩ
Bandwidth 100 Hz–20 kHz ± 0.25 dB
A designer must first determine the needed supply rail to obtain the specified output power. By extrapolating from
Figure 11 in Typical Performance Characteristics, the supply rail can be easily found. A second way to determine
the minimum supply rail is to calculate the required Vopeak using Equation 5 and add the dropout voltage. Using
this method, the minimum supply voltage would be (Vopeak + VOD , where VOD is typically 0.6V.
(5)
For 1W of output power into an 8Ωload, the required Vopeak is 4.0V. A minumum supply rail of 4.6V results from
adding Vopeak and Vod. But 4.6V is not a standard voltage that exists in many applications and for this reason, a
supply rail of 5V is designated. Extra supply voltage creates dynamic headroom that allows the LM4861 to
reproduce peaks in excess of 1Wwithout clipping the signal. At this time, the designer must make sure that the
power supply choice along with the output impedance does not violate the conditions explained in the POWER
DISSIPATION.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 6.
(6)
Rf/Ri= AVD / 2 (7)
From Equation 6, the minimum Avd is 2.83: Avd = 3
Since the desired input impedance was 20kΩ, and with a Avd of 3, a ratio of 1:1.5 of Rfto Riresults in an
allocation of Ri= 20kΩ, Rf= 30kΩ. The final design step is to address the bandwidth requirements which must
be stated as a pair of −3dB frequency points. Five times away from a −3db point is 0.17dB down from passband
response which is better than the required ±0.25dB specified. This fact results in a low and high frequency pole
of 20Hz and 100kHz respectively. As stated in External Components Description , Riin conjunction with Cicreate
a highpass filter.
Ci≥1 / (2π*20kΩ*20Hz) = 0.397μF; use 0.39μF. (8)
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the differential
gain, Avd. With a Avd = 2 and fH= 100kHz, the resulting GBWP = 100kHz which is much smaller than the LM4861
GBWP of 4MHz. This figure displays that if a designer has a need to design an amplifier with a higher differential
gain, the LM4861 can still be used without running into bandwidth problems.
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LM4861 MDA MWA
1.1W Audio Power Amplifier with Shutdown Mode
Figure 19. Die Layout (B - Step)
Table 1. DIE/WAFER CHARACTERISTICS
Fabrication Attributes General Die Information
Physical Die Identification LM4861B Bond Pad Opening Size (min) 83µm x 83µm
Die Step B Bond Pad Metalization ALUMINUM
Physical Attributes Passivation VOM NITRIDE
Wafer Diameter 150mm Back Side Metal BARE BACK
Dise Size (Drawn) 1372µm x 2032µm Back Side Connection GND
54.0mils x 80.0mils
Thickness 406µm Nominal
Min Pitch 108µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
X/Y COORDINATES PAD SIZE
SIGNAL NAME PAD# NUMBER X Y X Y
SHUTDOWN 1 -425 710 83 x 83
BYPASS 2 -445 499 83 x 83
NC 3 -445 -34 83 x 170
NC 4 -445 -383 83 x 83
INPUT + 5 -445 -492 83 x 83
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INPUT - 6 -352 -710 83 x 83
GND 7 -243 -710 83 x 83
Vo1 8 -91 -710 170 x 83
GND 9 445 -574 83 x 170
VDD 10 445 -2 83 x 170
NC 11 445 387 83 x 83
GND 12 445 633 83 x 170
Vo2 13 -63 710 170 x 83
GND 14 -215 710 83 x 83
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REVISION HISTORY
Changes from Revision B (May 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4861M ACTIVE SOIC D 8 95 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 LM
4861M
LM4861M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM
4861M
LM4861MX ACTIVE SOIC D 8 2500 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 LM
4861M
LM4861MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM
4861M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4861MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM4861MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4861MX SOIC D 8 2500 367.0 367.0 35.0
LM4861MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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