AO3400A
Symbol Min Typ Max Units
BVDSS 30 V
VDS=30V, VGS=0V 1
TJ=125°C 5
IGSS 100 nA
VGS(th) Gate Threshold Voltage 0.7 1 1.5 V
ID(ON) 25 A
22 26.5
TJ=125°C 31 38
25.4 32
34 48
gFS 26 S
VSD 0.72 1.0 V
IS2.0 A
Ciss 900 1100 pF
Coss 88 pF
Crss 65 pF
Rg0.95 1.5 Ω
Qg10 13 nC
Qgs 1.8 nC
Qgd 3.75 nC
tD(on) 3.2 ns
tr3.5 ns
tD(off) 21.5 ns
tf2.7 ns
trr 16.8 20 ns
Qrr 8nC
8.5
0.0
40 A
#DIV/0!
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
VGS=4.5V, ID=5A
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=5.7A, dI/dt=100A/us
Drain-Source Breakdown Voltage
On state drain current
ID=250uA, VGS=0V
VGS=4.5V, VDS=5V
VGS=10V, ID=5.7A
Reverse Transfer Capacitance
IF=5.7A, dI/dt=100A/us
VDS=VGS ID=250µA
Electrical Characteristics (TJ=25°C unless otherwise noted)
STATIC PARAMETERS Parameter Conditions
IDSS Zero Gate Voltage Drain Current uA
VDS=0V, VGS= ±12VGate-Body leakage current
mΩ
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
DYNAMIC PARAMETERS
RDS(ON) Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage IS=1A,VGS=0V
VDS=5V, ID=5.7A
VGS=2.5V, ID=3A
Turn-On Rise Time
Total Gate Charge
VGS=4.5V, VDS=15V, ID=5.7A
Gate Drain Charge
VGS=0V, VDS=15V, f=1MHz
SWITCHING PARAMETERS
Gate Source Charge
Gate resistance VGS=0V, VDS=0V, f=1MHz
Turn-Off DelayTime
VGS=10V, VDS=15V, RL=2.6Ω,
RGEN=3Ω
Turn-Off Fall Time
Turn-On DelayTime
A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C.
C. The RθJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 us pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating.
F: The current rating is based on the t ≤ 10s thermal resistance rating.
Rev0: Apr. 2007
Alpha & Omega Semiconductor, Ltd. www.aosmd.com