July 2007 Rev 4 1/7
7
MSS40, MSS50
Back to back SCR module
Description
Packaged in ISOTOP modules, the MSS40 /
MSS50 Series is based on two back-to-back SCR
configurations, providing high noise immunity.
They are suitable for high power applications such
as solid state relays, heating control systems,
welding equipment, motor control circuits...
The compactness of the ISOTOP package allows
high power density and optimized power bus
connections. Thanks to their internal ceramic pad,
they provide high voltage insulation (2500 VRMS),
complying with UL standards (File ref: E81734).
Figure 1. Pin connections
Table 1. Main features
Symbol Value Unit
IT(RMS) 55 and 70 A
VDRM/VRRM 800 and 1200 V
IGT 50 mA
Table 2. Order codes
Part numbers Marking
MSS40-1200 MSS40-1200
MSS50-800 MSS50-800
MSS50-1200 MSS50-1200
A1
A2
G2
G1
ISOTOP
1: Thyristor 2 Anode (A2)
2: Thyristor 2 Gate (G2)
3: Thyristor 1 Anode (A1)
4: Thyristor 2 Gate (G1)
4
1
3
2
G1
A2
G2
A1
www.st.com
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
Characteristics MSS40, MSS50
2/7
1 Characteristics
Table 3. Absolute ratings (limiting values)
Symbol Parameter
Value
Unit
MSS40 MSS50
VDRM/VRRM Repetitive peak off-state voltage 1200 800
1200 V
IT(RMS) RMS on-state current Tc = 80° C 55 A
Tc = 85° C 70
ITSM
Non repetitive surge peak on-state
current
tp = 16.7 ms Tj = 25° C 420 630
A
tp = 20 ms 400 600
I2tI
2t Value for fusing tp = 10 ms Tj = 25° C 800 1800 A2S
dI/dt Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125° C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125° C 4 A
PG(AV) Average gate power dissipation Tj = 125° C 1 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 ° C
VRGM Maximum peak reverse gate voltage 5 V
Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified)
Symbol Test Conditions
Value
Unit
MSS40 MSS50
IGT VD = 12 V RL = 33 Ω
MIN. 5 mA
MAX. 50
VGT MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩTj = 125° C MIN. 0.2 V
IHIT = 500 mA Gate open MAX. 80 mA
ILIG = 1.2 IGT MAX. 120 mA
dV/dt VD = 67 % VDRM Gate open Tj = 125° C MIN. 1000 V/µs
VTM
ITM = 80 A tp = 380 µs Tj = 25° C MAX. 1.7 V
ITM = 100 A tp = 380 µs 1.7
Vt0 Threshold voltage Tj = 125° C MAX. 0.85 V
RdDynamic resistance Tj = 125° C MAX. 11 7 mΩ
IDRM
IRRM
VDRM = VRRM
Tj = 25° C MAX. 20 µA
Tj = 125° C 10 mA
Table 5. Thermal reistances
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) MSS40 0.6 ° C/W
MSS50 0.45
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
MSS40, MSS50 Characteristics
3/7
Figure 2. Maximum average power
dissipation versus average on-state
current
Figure 3. Average and DC on-state current
versus case temperature
0 1020304050607080
0
10
20
30
40
50
60
70
80
90
100
P(W)
I (A)
T(RMS)
α= 180°
MSS40 MSS50
180°
α
α
0 25 50 75 100 125 150
0
10
20
30
40
50
60
70
80
I (A)
T(RMS)
T (°C)
case
α= 180°
MSS40
MSS50
Figure 4. Relative variation of thermal
impedance versus pulse duration
Figure 5. Relative variation of gate trigger
current and holding current versus
junction temperature
1E-3 1E-2 1E-1 1E+0 1E+1
0.1
0.2
0.5
1.0
K=[Z /R
th(j-c) th(j-c)]
t (s)
p
-40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I,I[T] /
GT H L j I ,I ,I [T =25°C]
GT H L j
IGT
IH& IL
Figure 6. Surge peak on-state current versus
number of cycles
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width tp < 10 ms, and
corresponding values of I2t
1 10 100 1000
0
100
200
300
400
500
600
700
I (A)
TSM
Number of cycles
Non repetitive
T initial=25°C
j
MSS40
T =80°C
Repetitive
C
MSS50
T =85°C
Repetitive
C
MSS50
MSS40
t=20ms
One cycle
5000
1000
100
0.01 0.10 1.00 10.00
I (A), I t (A s)
TSM 22
t (ms)
p
I t
2
ITSM
T initial = 25°C
j
dI/dt limitation:
50A/µs
MSS50
MSS40
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
Ordering information scheme MSS40, MSS50
4/7
2 Ordering information scheme
Figure 10. Ordering information scheme
Figure 8. On-state characteristics (maximum
values) (MSS40)
Figure 9. On-state characteristics (maximum
values) (MSS50)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
10
100
500
I (A)
TM
V (V)
TM
Tj=max
T =25°C
j
V =0.85V
R =11m
T max.:
j
t0
dΩ
0.0 1.0 2.0 3.0 4.0 5.0 6.0
10
100
1000
I (A)
TM
V (V)
TM
Tj=max
T =25°C
j
V =0.85V
R =7m
T max.:
j
t0
dΩ
MSS 40 - 800
SCR Module series
Voltage
Current
40 = 55 A
50 = 70 A
800 = 800 V
1200 = 1200 V
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
MSS40, MSS50 Package information
5/7
3 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.9 Nm (max. 1.2 Nm) for the 6 x M4 screws (2 x M4
screws recommended for mounting the package on the heatsink and the 4 provided
screws).
●The screws supplied with the package are adapted for mounting on a board (or other
types of terminals) with a thickness of 0.6 mm min. and 2.2 mm max.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 6. ISOTOP dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 11.80 12.20 0.465 0.480
A1 8.90 9.10 0.350 0.358
B 7.8 8.20 0.307 0.323
C 0.75 0.85 0.030 0.033
C2 1.95 2.05 0.077 0.081
D 37.80 38.20 1.488 1.504
D1 31.50 31.70 1.240 1.248
E 25.15 25.50 0.990 1.004
E1 23.85 24.15 0.939 0.951
E2 24.80 typ. 0.976 typ.
G 14.90 15.10 0.587 0.594
G1 12.60 12.80 0.496 0.504
G2 3.50 4.30 0.138 0.169
F 4.10 4.30 0.161 0.169
F1 4.60 5.00 0.181 0.197
P 4.00 4.30 0.157 0.69
P1 4.00 4.40 0.157 0.173
S 30.10 30.30 1.185 1.193
F1 F
D1
G
DS
B
E1
G1
ØP
P1
E
E2
G2 C
C2
A1
A
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
Ordering information MSS40, MSS50
6/7
4 Ordering information
5 Revision history
Table 7. Ordering information
Part number Marking Package Weight Base qty Delivery mode
MSS40-1200 MSS40-1200
ISOTOP 27 g
(without screws)
10
(with screws) Tube MSS50-800 MSS50-800
MSS50-1200 MSS50-1200
Table 8. Revision history
Date Revision Changes
Sep-2000 3 Last release.
11-Jul-2007 4 Reformated to current standards. Removed MSS40-800 product.
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
MSS40, MSS50
7/7
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
