SFH 4258
1Version 1.8 | 2020-12-22
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
SFH 4258
Power TOPLED® Lens
High Power Infrared Emitter (850 nm)
—CCTV Surveillance
—Gaming, Amusement, Gambling
—Gesture Recognition
—Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
—Safety and Security, CCTV
—White Goods
Features:
—Package: Epoxy, diuse
—Qualications: The product qualication test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualication for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—High Power Infrared LED
—Half angle: ± 15°
—High forward current allowed at high temperature
—Short switching times
Ordering Information
Type Radiant intensity 1)2) Radiant intensity 1) Ordering Code
typ.
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms
IeIe
SFH 4258-Z 56 ... 224 mW/sr 110 mW/sr Q65110A2975
SFH 4258-VAW-Z 71 ... 180 mW/sr 110 mW/sr Q65110A7277
SFH 4258
2Version 1.8 | 2020-12-22
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Forward current IFmax. 100 mA
Surge current
tp ≤ 100 µs; D = 0
IFSM max. 1 A
Reverse voltage 3) VRmax. 5 V
Power consumption Ptot max. 180 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 4258
3Version 1.8 | 2020-12-22
Characteristics
IF = 100 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 860 nm
Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φtyp. 15 °
Dimensions of active chip area L x W typ. 0.3 x 0.3
mm x mm
Rise time (10% / 90%)
IF = 100 mA; RL = 50 Ω
trtyp. 12 ns
Fall time (10% / 90%)
IF = 100 mA; RL = 50 Ω
tftyp. 12 ns
Forward voltage 4) VFtyp.
max.
1.5 V
1.7 V
Forward voltage 4)
IF = 1 A; tp = 100 µs
VFtyp.
max.
2.4 V
2.9 V
Reverse current 3)
VR = 5 V
IRmax. 10 µA
Radiant intensity 1)
IF = 1 A; tp = 25 µs
Ietyp. 875 mW/sr
Total radiant ux 5) Φetyp. 70 mW
Temperature coecient of voltage TCVtyp. -0.7 mV / K
Temperature coecient of brightness TCItyp. -0.5 % / K
Temperature coecient of wavelength TCλtyp. 0.3 nm / K
Thermal resistance junction solder point real 6) RthJS real max. 140 K / W
Thermal resistance junction ambient real 7) RthJA max. 300 K / W
SFH 4258
4Version 1.8 | 2020-12-22
Brightness Groups
TA = 25 °C
Group Radiant intensity 1)2) Radiant intensity 1)2)
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms
min. max.
IeIe
U2 56 mW/sr 71 mW/sr
V 71 mW/sr 112 mW/sr
AW 112 mW/sr 180 mW/sr
BW1 180 mW/sr 224 mW/sr
Only one group in one packing unit (variation lower 2:1).
Relative Spectral Emission 8), 9)
Ie,rel = f (λ); IF = 100 mA; tp = 20 ms
700
0nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
SFH 4258
5Version 1.8 | 2020-12-22
Radiation Characteristics 8), 9)
Ie,rel = f (φ)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL00021
50˚
60˚
70˚
80˚
90˚
100˚
0 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Forward current 8), 9)
IF = f (VF); single pulse; tp = 100 µs
OHL01713
F
I
10-4
0.511.522.5
V3
100
A
0
F
V
-1
10
5
5
10-2
-3
5
10
Relative Radiant Intensity 8), 9)
Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs
OHL01715
10
-3
mA
10
1
0
10
5
5
10
-1
-2
5
10
e
e (100 mA)
I
I
I
F
0
10
1
10
2
10
3
1055
SFH 4258
6Version 1.8 | 2020-12-22
Max. Permissible Forward Current
IF,max = f (TA); Rthja = 300K / W
0
0˚C
T
I
F
mA
OHL01716
A
20
40
60
80
100
120
20 40 60 80 120
Permissible Pulse Handling Capability
IF = f (tp); D = parameter; TA = 25°C
0.05
210-1-2-3-4-5 1010 1010 10
t
p
10 10s10
0
0.1
0.005
0.02
0.01
D
=
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF05438
0.2
0.5
1
0.033
0.2
0.4
0.6
0.8
1.0
1.2
Permissible Pulse Handling Capability
IF = f (tp); D = parameter; TA = 85°C
t
p
0
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF05708
-5
10
-3-4
10 10
-1-2
10 10
10
10 10 s
2
10
0.5
1
0.2
0.1
0.01
0.05
0.02
=
0.005
D
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
SFH 4258
7Version 1.8 | 2020-12-22
Dimensional Drawing 10)
3.8 (0.150) max.
ø2.55 (0.100)
0.13 (0.005)
0.18 (0.007)
0.1 (0.004) typ
1.1 (0.043)
0.5 (0.020)
2.6 (0.102)
3.4 (0.134)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
3.7 (0.146)
3.3 (0.130)
4˚±1
GPLY6127
0.4 (0.016)
0.6 (0.024)
0.9 (0.035)
0.7 (0.028)
1.7 (0.067)
2.1 (0.083)
0.6 (0.024)
0.8 (0.031)
34
12
ø2.60 (0.102)
Package marking
(2.4) (0.095)
Further Information:
Approximate Weight: 37.0 mg
Package marking: Cathode
Pin Description
1 Cathode
2 Anode
3 Anode
4 Anode
SFH 4258
9Version 1.8 | 2020-12-22
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Prole Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 250 °C
Time within 5 °C of the specied peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 4 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulllment for the whole T-range
SFH 4258
12 Version 1.8 | 2020-12-22
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 10)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
SFH 4258
13 Version 1.8 | 2020-12-22
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specied in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding eect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
SFH 4258
14 Version 1.8 | 2020-12-22
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualied at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and buyer and/or customer.
SFH 4258
15 Version 1.8 | 2020-12-22
Glossary
1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr
2) Brightness: The brightness values are measured with a tolerance of ±11%.
3) Reverse Operation: This product is intended to be operated applying a forward current within the
specied range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
4) Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V.
5) Total radiant ux: Measured with integrating sphere.
6) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
7) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each
8) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reect statistical gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
9) Testing temperature: TA = 25°C (unless otherwise specied)
10) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and
dimensions are specied in mm.
11) Tape and Reel: All dimensions and tolerances are specied acc. IEC 60286-3 and specied in mm.
SFH 4258
16 Version 1.8 | 2020-12-22
Revision History
Version Date Change
1.6 2019-01-11 Tape and Reel
1.7 2020-08-26 Schematic Transportation Box
Dimensions of Transportation Box
1.8 2020-12-22 Reow Soldering Prole
SFH 4258
17 Version 1.8 | 2020-12-22
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
