Sep. 2000
MITSUBISHI IGBT MODULES
CM10AD00-24H
MEDIUM POWER SWITCHING USE
FLAT BASE, INSULATED TYPE
CM10AD00-24H
¡IC . ................................................................... 10A
¡VCES . ....................................................... 1200V
¡Insulated Type
¡CIB Module
3φ Inverter + 3φ Converter + Brake
Thyristor + Thermistor + Current shunt
resistor
APPLICATION
AC & DC motor controls, General purpose inverters
CIRCUIT DIAGRAM
GT
(sense terminal)
PPS
PPS
LABEL
GUP
EUP
GUN
U
GVP
EVP
GVN
V
GWP
EWP
GWN
W E
R
S
T
P1 P2 P
N1 N
TH1 TH2
B
GB
t=0.6
MAIN CIRCUIT TERMINAL
t=0.6
CONTROL CIRCUIT TERMINAL
P2
GT
GWN
GVN
GUN
ETH2 GBWVU
TH1
BTSR
GWP
EWP
GVP
EVP
GUP
EUP
P
N
N1P1
(1)
0.8
1
0.6
13
53
± 0.5
12 13
10 4
90
±0.3
56
18 18
55
100
90
±0.25
2.54
2.54
2.54
2.54
8888
2.54
88887.5
2.542.54 2.54
7.627.62
8888887.5
5
φ2.5
φ6
φ2.5
φ6
2-R5
2-φ4.5
±0.25
MOUNTING HOLES
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
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Sep. 2000
MITSUBISHI IGBT MODULES
CM10AD00-24H
MEDIUM POWER SWITCHING USE
FLAT BASE, INSULATED TYPE
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
G-E Short
C-E Short
TC = 25°C
PULSE (Note. 2)
TC = 25°C
PULSE (Note. 2)
TC = 25°C
Symbol Parameter
Collector Current
Emitter Current
Conditions Unit
V
V
A
A
A
A
W
Rating
1200
±20
10
20
10
20
62
VCES
VGES
IC
ICM
IE (
Note.1
)
IEM (
Note.1
)
PC (
Note.3
)
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Repetitive peak reverse voltage
Forward current
1200
±20
10
20
59
1200
10
G-E Short
C-E Short
TC = 25°C
PULSE (Note. 2)
TC = 25°C
Clamp diode part
Clamp diode part
Symbol Parameter
Collector Current
Conditions Unit
V
V
A
A
W
V
A
Rating
VCES
VGES
IC
ICM
PC (
Note.3
)
VRRM
IFM (
Note.3
)
Repetitive peak reverse voltage
Recommended AC input voltage
DC output current
Surge (non-repetitive) forward current
I2t for fusing
1600
440
10
100
42
3φ rectifying circuit
1/2 cycle at 60Hz, peak value, Non-repetitive
Value for one cycle of surge current
Symbol Parameter Conditions UnitRating V
V
A
A
A2s
VRRM
Ea
IO
IFSM
I2t
VDRM
VRRM
IT(AV)
PGM
PG(AV)
IFGM
VFGM
VRGM
di/dt
Repetitive peak off-state voltage
Repetitive peak reverse voltage
Average on-state current
Peak gate power dissipation
Average gate power dissipation
Peak gate forward current
Peak gate forward voltage
Peak gate reverse voltage
Critical rate of rise of on-state Current
Symbol Parameter Conditions UnitRating V
V
A
W
W
A
V
V
A/µs
MAXIMUM RATINGS
(Tj = 25°C)
INVERTER PART
BRAKE PART
CONVERTER PART
THYRISTOR PART
Tj
Tj
Tstg
Viso
Junction temperature
Junction temperature
Storage temperature
Isolation voltage
Mounting torque
Weight
–40 ~ +150
–40 ~ +125
–40 ~ +125
2500
1.47 ~ 1.96
120
Inverter, brake, converter part
Thyristor part
AC 1 min.
Mounting M4 screw
Typical value
Symbol Parameter Conditions UnitRating °C
°C
°C
V
N·m
g
COMMON RATING
ITSM Surge (non-repetitive)
on-state current
Single-phase, half-wave 180° conduction
IG=100mA, VD=800V, dIG/dt=1A/µs
1600
1600
10
10
1
3
10
5
100
1/2 cycle at 60Hz, peak value Non-repetitive 100 A
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Sep. 2000
mA
µA
nF
nF
nF
nC
ns
ns
ns
ns
V
ns
µC
°C/W
°C/W
Typ.
V
V
MITSUBISHI IGBT MODULES
CM10AD00-24H
MEDIUM POWER SWITCHING USE
FLAT B ASE, INSULATED TYPE
1
0.5
3.4
2.0
1.5
0.4
100
200
150
350
3.5
250
2.0
3.1
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
Tj = 25°C
Tj = 150°C
VCC = 600V , IC = 10A, VGE = 15V
VCC = 600V, IC = 10A
VGE1 = VGE2 = 15V
RG = 31
Resistive load
IE = 10A, VGE = 0V
IE = 10A, VGE = 0V
diE / dt = – 20A / µs
IGBT part, Per 1/6 module
FWDi part, Per 1/6 module
IC = 1.0mA, VCE = 10V
IC = 10A, VGE = 15V (Note.4)
VCE = 10V
VGE = 0V
2.7
2.45
50
0.08
ICES
IGES
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
VEC(
Note.1
)
trr (
Note.1
)
Qrr (
Note.1
)
Rth(j-c)Q
Rth(j-c)R
Symbol Parameter Test conditions
VGE(th)
VCE(sat)
Collector cutoff current
Gate-emitter cutoff current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Emitter-collector voltage
Reverse recovery time
Reverse recovery charge
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
Limits
Min. Max. Unit
64.5 7.5
Collector cutoff current
Gate-emitter cutoff current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Forward voltage drop
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
V
V
1
0.5
3.4
2.0
1.5
0.4
3.5
2.1
3.2
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
Tj = 25°C
Tj = 150°C
VCC = 600V, IC = 10A, VGE = 15V
IF = 10A, Clamp diode part
IGBT part
Clamp diode part
mA
µA
nF
nF
nF
nC
V
°C/W
°C/W
2.7
2.45
50
ICES
IGES
Cies
Coes
Cres
QG
VFM
Rth(j-c)Q
Rth(j-c)R
Symbol Parameter Test conditions
VGE(th)
VCE(sat)
Unit
64.5 7.5IC = 1.0mA, VCE = 10V
IC = 10A, VGE = 15V (Note.4)
VCE = 10V
VGE = 0V
Repetitive reverse current
Forward voltage drop
Thermal resistance
VR = VRRM, Tj = 150°C
IF = 10A
Per 1/6 module
mA
V
°C/W
IRRM
VFM
Rth(j-c)
Symbol Parameter Test conditions
8
1.7
2.6
Typ.
Limits
Min. Max.
Unit
Typ.
Limits
Min. Max.
ELECTRICAL CHARACTERISTICS
(Tj = 25°C)
INVERTER PART
BRAKE PART
CONVERTER PART
http://store.iiic.cc/
Sep. 2000
MITSUBISHI IGBT MODULES
CM10AD00-24H
MEDIUM POWER SWITCHING USE
FLAT BASE, INSULATED TYPE
IDRM
IRRM
ITM
IGT
VGT
IH
Rth(j-c)
Repetitive peak off-state current
Repetitive peak reverse current
On-state voltage
Gate trigger current
Gate trigger voltage
Holding current
Thermal resistance
THYRISTOR PART
dv/dt
VD=1600V
VR=1600V
IT=10A, instantaneous means
VD=6V, IT=1A
VD=6V, IT=1A
Tj=125°C, VD=1070V, exp. wavef orm
Critical rate of rise of off-state
Voltage
1
1
1.45
50
3
1.75
mA
mA
V
mA
V
mA
°C/W
50
Symbol Parameter Test conditions Unit
Typ.
Limits
Min. Max.
500 V/µs
Resistance
Temperature coefficient Measured between N-N1 m
%/°C
5.9
0.048
R
Symbol Parameter Test conditions Unit
Typ.
Limits
Min. Max.
RESISTOR PART
Resistance
B Constant TC = 25°C
Resistance at 25°C, 50°C (Note.5) k
K
100
4000
RTH
B
Symbol Parameter Test conditions Unit
Typ.
Limits
Min. Max.
THERMISTOR PART
Note.1 IE, VEC, t rr, Q rr, di E/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode.
2 Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
3 Junction temperature (Tj) should not increase beyond 150°C.
4 Pulse width and repetition rate should be such as to cause negligible temperature rise.
5 B = (InR1-InR2)/(1/T1-1/T2) R1 : Resistance at T1(K)
R2 : Resistance at T2(K)
*1 : Typical value is measured by using Shin-etsu Silicone “G-746”.
Contact thermal resistance Case to fin, Thermal compound applied*1 (1 module) °C/W0.05
Rth(c-f)
Symbol Parameter Test conditions Unit
Typ.
Limits
Min. Max.
COMMON RATING
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