CCR*.* W Ceramic Chip Resonator Series
for 105C Temp
2009.10.21 TDK-EPC Piezo Grp
TDK Parts Name
*
CCR*.**MUC8WT CCR*.**MXC8WT
Shape
Chip Size
(mm)
4.0×2.0 3.2×1.3
Nominal OSC Frequency
** (MHz)
4.00～7.99 8.00～11.0
Operating Temperature Range (℃)
-40～+105℃ -40～+105℃
Initial Tolerance
*** (%)
±0.5/0.3 ±0.5/0.3
Resonant Impedance
(Ω)
40 Max 40 Max
Shape & Dimensions
Shape & Dimensions
MUC8WT MXC8WT
Oscil l ati ng frequency Res o nant i m ped ance Initi al F osc t ol erance ∗Capac i tance CL1/ CL2
P a rt No. F osc (MHz) Ro(Ω)(%) (pF)
CCR∗∗.∗M UC8WT [Fo sc=4. 00 to 7.99M Hz ]
CCR4.0MUC8WT 4.000 40 ±0.5/0.3 27pF
CCR4.19MUC8WT 4.194 40 ±0.5/0.3 27pF
CCR4.91MUC8WT 4.915 40 ±0.5/0.3 27pF
CCR5.0MUC8WT 5.000 40 ±0.5/0.3 27pF
CCR6.0MUC8WT 6.000 40 ±0.5/0.3 27pF
CCR∗∗.∗M X C8WT [Fo sc=8. 00 to 11.00M Hz ]
CCR8.0MXC8WT 8.000 40 ±0.5/0.3 18pF
CCR8.38MXC8WT 8.380 40 ±0.5/0.3 18pF
CCR10.0MXC8WT 10.000 40 ±0.5/0.3 18pF
CCR11.0MXC8WT 11.000 40 ±0.5/0.3 18
p
F
Electrical Characteristics
Electrical Characteristics
Typical Electrical Characteristics
Typical Electrical Characteristics
Reliability specification
Reliability specification
（
（
CCR**.*MUC8WT / MXC8WT)
CCR**.*MUC8WT / MXC8WT)
Conforms to lead free solderSolder ability
Conforms to lead free solderSoldering Test
-40℃ / 1,000hLow Temp. Storage
102G, 6ms for 3 times in each direction of 3 planes.Mechanical shock test
1mm, 5secBoard Bending
105℃ / 1,000hHigh Temp.Storage
10-500Hz 10G X,Y,Z 48hVibration test
Concrete 1.0m for 3timesDrop test
-40 ～105℃ / 500cycAir Thermal Shock Test
85%R.H. at 85℃ 1000hHumidity Test
General specificationItem
