Features * Single 2.7V - 3.6V Supply * Dual-interface Architecture * * * * * * * * * * * * * * - RapidS Serial Interface: 66MHz Maximum Clock Frequency SPI Compatible Modes 0 and 3 - Rapid8 8-bit Interface: 50MHz Maximum Clock Frequency User Configurable Page Size - 1024-Bytes per Page - 1056-Bytes per Page - Page Size Can Be Factory Pre-configured for 1024-Bytes Page Program Operation - Intelligent Programming Operation - 8192 Pages (1024-/1056-Bytes/Page) Main Memory Flexible Erase Options - Page Erase (1-Kbyte) - Block Erase (8-Kbytes) - Sector Erase (256-Kbytes) - Chip Erase (64Mbits) Two SRAM Data Buffers (1024-/1056-Bytes) - Allows Receiving of Data while Reprogramming the Flash Array Continuous Read Capability through Entire Array - Ideal for Code Shadowing Applications Low-power Dissipation - 10mA Active Read Current Typical - Serial Interface - 10mA Active Read Current Typical - 8-bit Interface - 25A Standby Current Typical - 15A Deep Power Down Typical Hardware and Software Data Protection Features - Individual Sector Permanent Sector Lockdown for Secure Code and Data Storage - Individual Sector Security: 128-byte Security Register - 64-byte User Programmable Space - Unique 64-byte Device Identifier JEDEC Standard Manufacturer and Device ID Read 100,000 Program/Erase Cycles Per Page Minimum Data Retention - 20 Years Green (Pb/Halide-free/RoHS Compliant) Packaging Options Temperature Range - Industrial: -40C to +85C 64-megabit 2.7V Dual-interface DataFlash AT45DB642D (Not Recommended for New Designs) 3542N-DFLASH-2/2014 1. Description AT45DB642D is a 2.7V, dual-interface sequential access Flash memory ideally suited for a wide variety of digital voice-, image-, program code- and data-storage applications. AT45DB642D supports RapidSTM serial interface and Rapid8TM 8-bit interface. RapidS serial interface is SPI compatible for frequencies up to 66MHz. The dual-interface allows a dedicated serial interface to be connected to a DSP and a dedicated 8-bit interface to be connected to a microcontroller or vice versa. However, the use of either interface is purely optional. Its 69,206,016-bits of memory are organized as 8,192 pages of 1,024-bytes (binary page size) or 1,056-bytes (standard DataFlash(R) page size) each. In addition to the main memory, the AT45DB642D also contains two SRAM buffers of 1,024-(binary buffer size) bytes/1,056-bytes (standard DataFlash buffer size) each. The buffers allow receiving of data while a page in the main Memory is being reprogrammed, as well as writing a continuous data stream. EEPROM emulation (bit or byte alterability) is easily handled with a self-contained three step read-modify-write operation. Unlike conventional Flash memories that are accessed randomly with multiple address lines and a parallel interface, the DataFlash uses either a RapidS serial interface or a 8-bit Rapid8 interface to sequentially access its data. The simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system reliability, minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and industrial applications where high-density, low-pin count, low-voltage and low-power are essential. To allow for simple in-system reprogrammability, the AT45DB642D does not require high input voltages for programming. The device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. The AT45DB642D is enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK), or an 8-bit interface consisting of the input/output pins (I/O7 I/O0) and the clock pin (CLK). All programming and erase cycles are self-timed. 2 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 2. Pin Configurations and Pinouts Table 2-1. Pin Configurations Symbol Name and Function Asserted State Type CS Chip Select: Asserting the CS pin selects the device. When the CS pin is deasserted, the device will be deselected and normally be placed in the standby mode (not Deep Power-Down mode), and the output pins (SO or I/O7 - I/O0) will be in a high-impedance state. When the device is deselected, data will not be accepted on the input pins (SI or I/O7 - I/O0). A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition is required to end an operation. When ending an internally self-timed operation such as a program or erase cycle, the device will not enter the standby mode until the completion of the operation. Low Input SCK/CLK Serial Clock: This pin is used to provide a clock to the device and is used to control the flow of data to and from the device. Command, address, and input data present on the SI or I/O7 - I/O0 pins are always latched on the rising edge of SCK/CLK, while output data on the SO or I/O7 I/O0 pins are always clocked out on the falling edge of SCK/CLK. - Input SI Serial Input: The SI pin is used to shift data into the device. The SI pin is used for all data input including command and address sequences. Data on the SI pin is always latched on the rising edge of SCK. If the SER/BYTE pin is always driven low, the SI pin should be a "no connect". - Input SO Serial Output: The SO pin is used to shift data out from the device. Data on the SO pin is always clocked out on the falling edge of SCK. If the SER/BYTE pin is always driven low, the SO pin should be a "no connect". - Output I/O7 - I/O0 8-bit Input/Output: The I/O7-I/O0 pins are bidirectional and used to clock data into and out of the device. The I/O7-I/O0 pins are used for all data input, including opcodes and address sequences. The use of these pins is optional, and the pins should be treated as "no connect" if the SER/BYTE pin is not connected or if the SER/BYTE pin is always driven high externally. - Input/ Output WP Write Protect: When the WP pin is asserted, all sectors specified for protection by the Sector Protection Register will be protected against program and erase operations regardless of whether the Enable Sector Protection command has been issued or not. The WP pin functions independently of the software controlled protection method. If a program or erase command is issued to the device while the WP pin is asserted, the device will simply ignore the command and perform no operation. The device will return to the idle state once the CS pin has been deasserted. The Enable Sector Protection command and Sector Lockdown command, however, will be recognized by the device when the WP pin is asserted. The WP pin is internally pulled-high and may be left floating if hardware controlled protection will not be used. However, it is recommended that the WP pin also be externally connected to VCC whenever possible. Low Input RESET Reset: A low state on the reset pin (RESET) will terminate the operation in progress and reset the internal state machine to an idle state. The device will remain in the reset condition as long as a low level is present on the RESET pin. Normal operation can resume once the RESET pin is brought back to a high level. The device incorporates an internal power-on reset circuit, so there are no restrictions on the RESET pin during power-on sequences. If this pin and feature are not utilized it is recommended that the RESET pin be driven high externally. Low Input RDY/BUSY Ready/Busy: This open drain output pin will be driven low when the device is busy in an internally self-timed operation. This pin, which is normally in a high state (through an external pull-up resistor), will be pulled low during programming/erase operations, compare operations, and page-to-buffer transfers. The busy status indicates that the Flash memory array and one of the buffers cannot be accessed; read and write operations to the other buffer can still be performed. - Output 3 3542N-DFLASH-2/2014 Table 2-1. Symbol Pin Configurations (Continued) Name and Function SER/BYTE Asserted State Type Low Input Serial/8-bit Interface Control: The DataFlash may be configured to utilize either its serial port or 8-bit port through the use of the serial/8-bit control pin (SER/BYTE). When the SER/BYTE pin is held high, the serial port (SI and SO) of the DataFlash will be used for all data transfers, and the 8-bit port (I/O7 - I/O0) will be in a high impedance state. Any data presented on the 8-bit port while SER/BYTE is held high will be ignored. When the SER/BYTE is held low, the 8-bit port will be used for all data transfers, and the SO pin of the serial port will be in a high impedance state. While SER/BYTE is low, any data presented on the SI pin will be ignored. Switching between the serial port and 8-bit port should only be done while the CS pin is high and the device is not busy in an internally self-timed operation. The SER/BYTE pin is internally pulled high; therefore, if the 8-bit port is never to be used, then connection of the SER/BYTE pin is not necessary. In addition, if the SER/BYTE pin is not connected or if the SER/BYTE pin is always driven high externally, then the 8-bit input/output pins (I/O7-I/O0), the VCCP pin, and the GNDP pin should be treated as "no connect". VCC Device Power Supply: The VCC pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. - Power GND Ground: The ground reference for the power supply. GND should be connected to the system ground. - Ground VCCP 8-bit Port Supply Voltage: The VCCP pin is used to supply power for the 8-bit input/output pins (I/O7-I/O0). The VCCP pin needs to be used if the 8-bit port is to be utilized; however, this pin should be treated as "no connect" if the SER/BYTE pin is not connected or if the SER/BYTE pin is always driven high externally. - Power GNDP 8-bit Port Ground: The GNDP pin is used to provide ground for the 8-bit input/output pins (I/O7I/O0). The GNDP pin needs to be used if the 8-bit port is to be utilized; however, this pin should be treated as "no connect" if the SER/BYTE pin is not connected or if the SER/BYTE pin is always driven high externally. - Ground Figure 2-1. RDY/BUSY RESET WP NC NC VCC GND NC NC NC CS SCK/CLK SI SO TSOP Top View: Type 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 BGA Package Ball-Out (Top View) Figure 2-2. 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 NC NC I/O7 I/O6 I/O5 I/O4 VCCP GNDP I/O3 I/O2 I/O1 I/O0 SER/BYTE NC 2 3 4 5 NC NC NC NC NC SCK GND VCC NC NC CS RDY/BSY WP NC NC SO SI RESET NC NC NC NC NC NC A B C D E Figure 2-3. CASON Top View through Package SI SCK RESET CS 4 1 8 2 7 3 6 4 5 SO GND VCC WP AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 3. Block Diagram FLASH MEMORY ARRAY WP PAGE (1024-/1056-BYTES) BUFFER 1 (1024-/1056-BYTES) SCK/CLK CS RESET VCC GND RDY/BUSY SER/BYTE BUFFER 2 (1024-/1056-BYTES) I/O INTERFACE SI SO I/O7 - I/O0 4. Memory Array To provide optimal flexibility, the memory array of the AT45DB642D is divided into three levels of granularity comprising of sectors, blocks, and pages. The "Memory Architecture Diagram" illustrates the breakdown of each level and details the number of pages per sector and block. All program operations to the DataFlash occur on a page by page basis. The erase operations can be performed at the chip, sector, block or page level. Memory Architecture Diagram SECTOR 0b = 248 Pages 253,952/261,888 bytes SECTOR 0 SECTOR 1 SECTOR 0a = 8 Pages 8192/8,448 bytes BLOCK ARCHITECTURE SECTOR 2 = 256 Pages 262,144/270,336 bytes SECTOR 30 = 256 Pages 262,144/270,336 bytes SECTOR 31 = 256 Pages 262,144/270,336 bytes SECTOR 2 SECTOR 1 = 256 Pages 262,144/270,336 bytes BLOCK 0 BLOCK 1 BLOCK 2 BLOCK 30 BLOCK 31 BLOCK 32 BLOCK 33 BLOCK 62 BLOCK 63 BLOCK 64 BLOCK 65 BLOCK 1022 BLOCK 1023 Block = 8,192-/8,448-bytes PAGE ARCHITECTURE 8 Pages BLOCK 0 SECTOR ARCHITECTURE BLOCK 1 Figure 4-1. PAGE 0 PAGE 1 PAGE 6 PAGE 7 PAGE 8 PAGE 9 PAGE 14 PAGE 15 PAGE 16 PAGE 17 PAGE 18 PAGE 8,190 PAGE 8,190 Page = 1,024-/1,056-bytes 5 3542N-DFLASH-2/2014 5. Device Operation The device operation is controlled by instructions from the host processor. The list of instructions and their associated opcodes are contained in Table 15-1 on page 28 through Table 15-6 on page 31. A valid instruction starts with the falling edge of CS followed by the appropriate 8-bit opcode and the desired buffer or main memory address location. While the CS pin is low, toggling the SCK/CLK pin controls the loading of the opcode and the desired buffer or main memory address location through either the SI (serial input) pin or the 8-bit input pins (I/O7 - I/O0). All instructions, addresses, and data are transferred with the most significant bit (MSB) first. Buffer addressing for standard DataFlash page size (1056-bytes) is referenced in the datasheet using the terminology BFA10 - BFA0 to denote the 11 address bits required to designate a byte address within a buffer. Main memory addressing is referenced using the terminology PA12 PA0 and BA10 - BA0, where PA12 - PA0 denotes the 13 address bits required to designate a page address and BA10 - BA0 denotes the 11 address bits required to designate a byte address within the page. For "Power of 2" binary page size (1024-bytes) the Buffer addressing is referenced in the datasheet using the conventional terminology BFA9 - BFA0 to denote the 10 address bits required to designate a byte address within a buffer. Main memory addressing is referenced using the terminology A22 - A0. 6. Read Commands By specifying the appropriate opcode, data can be read from the main memory or from either one of the two SRAM data buffers. The DataFlash supports RapidS and Rapid8 protocols for Mode 0 and Mode 3. Please refer to the "Detailed Bit-level Read Timing" diagrams in this datasheet for details on the clock cycle sequences for each mode. 6.1 Continuous Array Read (Legacy Command: E8H): Up to 66MHz By supplying an initial starting address for the main memory array, the Continuous Array Read command can be utilized to sequentially read a continuous stream of data from the device by simply providing a clock signal; no additional addressing information or control signals need to be provided. The DataFlash incorporates an internal address counter that will automatically increment on every clock cycle, allowing one continuous read operation without the need of additional address sequences. To perform a continuous read from the standard DataFlash page size (1056-bytes), an opcode of E8H must be clocked into the device followed by three address bytes (which comprise the 24-bit page and byte address sequence) and a series of don't care bytes (4-bytes if using the serial interface or 19-bytes if using the 8-bit interface). The first 13-bits (PA12 - PA0) of the 24-bit address sequence specify which page of the main memory array to read, and the last 11 bits (BA10 - BA0) of the 24-bit address sequence specify the starting byte address within the page. To perform a continuous read from the binary page size (1024-bytes), the opcode (E8H) must be clocked into the device followed by three address bytes and a series of don't care bytes (4-bytes if using the serial interface, or 19-bytes if using the 8-bit interface). The first 13 bits (A22 - A10) of the 24-bits sequence specify which page of the main memory array to read, and the last 10 bits (A9 - A0) of the 24-bits address sequence specify the starting byte address within the page. The don't care bytes that follow the address bytes are needed to initialize the read operation. Following the don't care bytes, additional clock pulses on the SCK/CLK pin will result in data being output on either the SO (serial output) pin or the eight output pins (I/O7- I/O0). 6 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D The CS pin must remain low during the loading of the opcode, the address bytes, the don't care bytes, and the reading of data. When the end of a page in main memory is reached during a Continuous Array Read, the device will continue reading at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from the end of one page to the beginning of the next page). When the last bit (or byte if using the 8-bit interface mode) in the main memory array has been read, the device will continue reading back at the beginning of the first page of memory. As with crossing over page boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pins (SO or I/O7-I/O0). The maximum SCK/CLK frequency allowable for the Continuous Array Read is defined by the fCAR1 specification. The Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged. 6.2 Continuous Array Read (High Frequency Mode: 0BH): Up to 66MHz This command can be used with the serial interface to read the main memory array sequentially in high speed mode for any clock frequency up to the maximum specified by fCAR1. To perform a continuous read array with the page size set to 1056-bytes, the CS must first be asserted then an opcode 0BH must be clocked into the device followed by three address bytes and a dummy byte. The first 13 bits (PA12 - PA0) of the 24-bit address sequence specify which page of the main memory array to read, and the last 11 bits (BA10 - BA0) of the 24-bit address sequence specify the starting byte address within the page. To perform a continuous read with the page size set to 1024-bytes, the opcode, 0BH, must be clocked into the device followed by three address bytes (A22 - A0) and a dummy byte. Following the dummy byte, additional clock pulses on the SCK pin will result in data being output on the SO (serial output) pin. The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from the end of one page to the beginning of the next page). When the last bit in the main memory array has been read, the device will continue reading back at the beginning of the first page of memory. As with crossing over page boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The maximum SCK frequency allowable for the Continuous Array Read is defined by the fCAR1 specification. The Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged. 6.3 Continuous Array Read (Low Frequency Mode: 03H): Up to 33MHz This command can be used with the serial interface to read the main memory array sequentially without a dummy byte up to maximum frequencies specified by fCAR2. To perform a continuous read array with the page size set to 1056-bytes, the CS must first be asserted then an opcode, 03H, must be clocked into the device followed by three address bytes (which comprise the 24-bit page and byte address sequence). The first 13 bits (PA12 - PA0) of the 24-bit address sequence specify which page of the main memory array to read, and the last 11 bits (BA10 - BA0) of the 24-bit address sequence specify the starting byte address within the page. To perform a continuous read with the page size set to 1024-bytes, the opcode, 03H, must be clocked into the device followed by three address bytes (A22 - A0). Following the address bytes, additional clock pulses on the SCK pin will result in data being output on the SO (serial output) pin. 7 3542N-DFLASH-2/2014 The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from the end of one page to the beginning of the next page). When the last bit in the main memory array has been read, the device will continue reading back at the beginning of the first page of memory. As with crossing over page boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged. 6.4 Main Memory Page Read A main memory page read allows the user to read data directly from any one of the 8,192 pages in the main memory, bypassing both of the data buffers and leaving the contents of the buffers unchanged. To start a page read from the standard DataFlash page size (1056-bytes), an opcode of D2H must be clocked into the device followed by three address bytes (which comprise the 24-bit page and byte address sequence) and a series of don't care bytes (4-bytes if using the serial interface or 19-bytes if using the 8-bit interface). The first 13 bits (PA12 - PA0) of the 24-bit address sequence specify the page in main memory to be read, and the last 11 bits (BA10 BA0) of the 24-bit address sequence specify the starting byte address within that page. To start a page read from the binary page size (1024-bytes), the opcode D2H must be clocked into the device followed by three address bytes and a series of don't care bytes (4-bytes if using the serial interface or 19-bytes if using the 8-bit interface). The first 13 bits (A22 - A10) of the 24-bits sequence specify which page of the main memory array to read, and the last 10 bits (A9 - A0) of the 24-bits address sequence specify the starting byte address within the page. The don't care bytes that follow the address bytes are sent to initialize the read operation. Following the don't care bytes, additional pulses on SCK/CLK result in data being output on either the SO (serial output) pin or the eight output pins (I/O7 - I/O0). The CS pin must remain low during the loading of the opcode, the address bytes, the don't care bytes, and the reading of data. When the end of a page in main memory is reached, the device will continue reading back at the beginning of the same page. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pins (SO or I/O7 - I/O0). The maximum SCK/CLK frequency allowable for the Main Memory Page Read is defined by the fSCK specification. The Main Memory Page Read bypasses both data buffers and leaves the contents of the buffers unchanged. 6.5 Buffer Read The SRAM data buffers can be accessed independently from the main memory array, and utilizing the Buffer Read Command allows data to be sequentially read directly from the buffers. In serial mode, four opcodes, D4H or D1H for buffer 1 and D6H or D3H for buffer 2 can be used for the Buffer Read Command. The use of each opcode depends on the maximum SCK frequency that will be used to read data from the buffer. The D4H and D6H opcode can be used at any SCK frequency up to the maximum specified by fCAR1. The D1H and D3H opcode can be used for lower frequency read operations up to the maximum specified by fCAR2. In 8-bit mode, two opcodes, 54H for buffer 1 and 56H for buffer 2 can be used for the Buffer Read Command. The two opcodes, 54H and 56H, can be used at any SCK frequency up to the maximum specified by fCAR1. To perform a buffer read from the standard DataFlash buffer (1056bytes), the opcode must be clocked into the device followed by three address bytes comprised of 13 don't care bits and 11 buffer address bits (BFA10 - BFA0). To perform a buffer read from the binary buffer (1024-bytes), the opcode must be clocked into the device followed by three address bytes comprised of 14 don't care bits and 10 buffer address bits (BFA9 - BFA0). 8 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D Following the address bytes, additional don't care bytes (one byte if using the serial interface or two bytes if using the 8-bit interface) must be clocked in to initialize the read operation. The CS pin must remain low during the loading of the opcode, the address bytes, the don't care bytes, and the reading of data. When the end of a buffer is reached, the device will continue reading back at the beginning of the buffer. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pins (SO or I/O7 - I/O0). 7. Program and Erase Commands 7.1 Buffer Write Data can be clocked in from the input pins (SI or I/O7 - I/O0) into either buffer 1 or buffer 2. To load data into the standard DataFlash buffer (1056-bytes), a 1-byte opcode, 84H for buffer 1 or 87H for buffer 2, must be clocked into the device, followed by three address bytes comprised of 13 don't care bits and 11 buffer address bits (BFA10 - BFA0). The 11 buffer address bits specify the first byte in the buffer to be written. To load data into the binary buffers (1024 bytes each), a 1-byte opcode 84H for buffer 1 or 87H for buffer 2, must be clocked into the device, followed by three address bytes comprised of 14 don't care bits and 10 buffer address bits (BFA9 - BFA0). The 10 buffer address bits specify the first byte in the buffer to be written. After the last address byte has been clocked into the device, data can then be clocked in on subsequent clock cycles. If the end of the data buffer is reached, the device will wrap around back to the beginning of the buffer. Data will continue to be loaded into the buffer until a low-to-high transition is detected on the CS pin. 7.2 Buffer to Main Memory Page Program with Built-in Erase Data written into either buffer 1 or buffer 2 can be programmed into the main memory. A 1-byte opcode, 83H for buffer 1 or 86H for buffer 2, must be clocked into the device. For the standard DataFlash page size (1056-bytes), the opcode must be followed by three address bytes consist of 13 page address bits (PA12 - PA0) that specify the page in the main memory to be written and 11 don't care bits. To perform a buffer to main memory page program with built-in erase for the binary page size (1024-bytes), the opcode 83H for buffer 1 or 86H for buffer 2, must be clocked into the device followed by three address bytes consisting of 13 page address bits (A22 - A10) that specify the page in the main memory to be written and 10 don't care bits. When a low-tohigh transition occurs on the CS pin, the part will first erase the selected page in main memory (the erased state is a logic 1) and then program the data stored in the buffer into the specified page in main memory. Both the erase and the programming of the page are internally self-timed and should take place in a maximum time of tEP. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. 7.3 Buffer to Main Memory Page Program without Built-in Erase A previously-erased page within main memory can be programmed with the contents of either buffer 1 or buffer 2. A 1-byte opcode, 88H for buffer 1 or 89H for buffer 2, must be clocked into the device. For the standard DataFlash page size (1056-bytes), the opcode must be followed by three address bytes consist of 13 page address bits (PA12 - PA0) that specify the page in the main memory to be written and 11 don't care bits. To perform a buffer to main memory page program without built-in erase for the binary page size (1024-bytes), the opcode 88H for buffer 1 or 89H for buffer 2, must be clocked into the device followed by three address bytes consist of 13-page address bits (A22 - A10) that specify the page in the main memory to be written and 10 don't care bits. When a low-to-high transition occurs on the CS pin, the part will program the data stored in the buffer into the specified page in the main memory. It is necessary that the 9 3542N-DFLASH-2/2014 page in main memory that is being programmed has been previously erased using one of the erase commands (Page Erase or Block Erase). The programming of the page is internally selftimed and should take place in a maximum time of tP. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. 7.4 Page Erase The Page Erase command can be used to individually erase any page in the main memory array allowing the Buffer to Main Memory Page Program to be utilized at a later time. To perform a page erase in the standard DataFlash page size (1056-bytes), an opcode of 81H must be loaded into the device, followed by three address bytes comprised of 13 page address bits (PA12 - PA0) that specify the page in the main memory to be erased and 11 don't care bits. To perform a page erase in the binary page size (1024-bytes), the opcode 81H must be loaded into the device, followed by three address bytes consist of 13 page address bits (A22 - A10) that specify the page in the main memory to be erased and 10 don't care bits. When a low-to-high transition occurs on the CS pin, the part will erase the selected page (the erased state is a logical 1). The erase operation is internally self-timed and should take place in a maximum time of tPE. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. 7.5 Block Erase A block of eight pages can be erased at one time. This command is useful when large amounts of data has to be written into the device. This will avoid using multiple Page Erase Commands. To perform a block erase for the standard DataFlash page size (1056 bytes), an opcode of 50H must be loaded into the device, followed by three address bytes comprised of 10 page address bits (PA12 -PA3) and 14 don't care bits. The 10 page address bits are used to specify which block of eight pages is to be erased. To perform a block erase for the binary page size (1024bytes), the opcode 50H must be loaded into the device, followed by three address bytes consisting of 10 page address bits (A22 - A13) and 13 don't care bits. The 10 page address bits are used to specify which block of eight pages is to be erased. When a low-to-high transition occurs on the CS pin, the part will erase the selected block of eight pages. The erase operation is internally self-timed and should take place in a maximum time of t BE. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. Block Erase Addressing Table 7-1. PA12/ A22 PA11/ A21 PA10/ A20 PA9/ A19 PA8/ A18 PA7/ A17 PA6/ A16 PA5/ A15 PA4/ A14 PA3/ A13 PA2/ A12 PA1/ A11 PA0/ A10 Block 0 0 0 0 0 0 0 0 0 0 X X X 0 0 0 0 0 0 0 0 0 0 1 X X X 1 0 0 0 0 0 0 0 0 1 0 X X X 2 0 0 0 0 0 0 0 0 1 1 X X X 3 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * 1 1 1 1 1 1 1 1 0 0 X X X 1020 1 1 1 1 1 1 1 1 0 1 X X X 1021 1 1 1 1 1 1 1 1 1 0 X X X 1022 1 1 1 1 1 1 1 1 1 1 X X X 1023 10 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 7.6 Sector Erase The Sector Erase command can be used to individually erase any sector in the main memory. There are 32 sectors and only one sector can be erased at one time. To perform sector 0a or sector 0b erase for the standard DataFlash page size (1056-bytes), an opcode of 7CH must be loaded into the device, followed by three address bytes comprised of 10 page address bits (PA12 - PA3) and 14 don't care bits. To perform a sector 1-31 erase, the opcode 7CH must be loaded into the device, followed by three address bytes comprised of five page address bits (PA12 - PA8) and 19 don't care bits. To perform sector 0a or sector 0b erase for the binary page size (1024-bytes), an opcode of 7CH must be loaded into the device, followed by three address bytes comprised of one don't care bit and 10 page address bits (A22 - A13) and 13 don't care bits. To perform a sector 1-31 erase, the opcode 7CH must be loaded into the device, followed by three address bytes comprised of one don't care bit and five page address bits (PA12 - PA8) and 18 don't care bits. The page address bits are used to specify any valid address location within the sector which is to be erased. When a low-to-high transition occurs on the CS pin, the part will erase the selected sector. The erase operation is internally self-timed and should take place in a maximum time of tSE. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. Sector Erase Addressing Table 7-2. PA12/ A22 PA11/ A21 PA10/ A20 PA9/ A19 PA8/ A18 PA7/ A17 PA6/ A16 PA5/ A15 PA4/ A14 PA3/ A13 PA2/ A12 PA1/ A11 PA0/ A10 Sector 0 0 0 0 0 0 0 0 0 0 X X X 0a 0 0 0 0 0 0 0 0 0 1 X X X 0b 0 0 0 0 1 X X X X X X X X 1 0 0 0 1 0 X X X X X X X X 2 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * 1 1 1 0 0 X X X X X X X X 28 1 1 1 0 1 X X X X X X X X 29 1 1 1 1 0 X X X X X X X X 30 1 1 1 1 1 X X X X X X X X 31 7.7 Chip Erase(1) The entire main memory can be erased at one time by using the Chip Erase command. To execute the Chip Erase command, a 4-byte command sequence C7H, 94H, 80H and 9AH must be clocked into the device. Since the entire memory array is to be erased, no address bytes need to be clocked into the device, and any data clocked in after the opcode will be ignored. After the last bit of the opcode sequence has been clocked in, the CS pin can be deasserted to start the erase process. The erase operation is internally self-timed and should take place in a time of tCE. During this time, the Status Register will indicate that the device is busy. The Chip Erase command will not affect sectors that are protected or locked down; the contents of those sectors will remain unchanged. Only those sectors that are not protected or locked down will be erased. 11 3542N-DFLASH-2/2014 The WP pin can be asserted while the device is erasing, but protection will not be activated until the internal erase cycle completes. Table 7-3. Chip Erase Command Command Byte 1 Byte 2 Byte 3 Byte 4 Chip Erase C7H 94H 80H 9AH Figure 7-1. Chip Erase CS SI Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Each transition represents 8 bits Note: 7.8 1. Refer to the errata regarding Chip Erase on page 56 Main Memory Page Program Through Buffer This operation is a combination of the Buffer Write and Buffer to Main Memory Page Program with Built-in Erase operations. Data is first clocked into buffer 1 or buffer 2 from the input pins (SI or I/O7-I/O0) and then programmed into a specified page in the main memory. To perform the main memory page program through buffer for the standard DataFlash page size (1056-bytes), a 1-byte opcode, 82H for buffer 1 or 85H for buffer 2, must first be clocked into the device, followed by three address bytes. The address bytes are comprised of 13 page address bits, (PA12-PA0) that select the page in the main memory where data is to be written, and 11 buffer address bits (BFA10-BFA0) that select the first byte in the buffer to be written. To perform a main memory page program through buffer for the binary page size (1024-bytes), the opcode 82H for buffer 1 or 85H for buffer 2, must be clocked into the device followed by three address bytes consisting of 13 page address bits (A22 - A10) that specify the page in the main memory to be written, and 10 buffer address bits (BFA9 - BFA0) that selects the first byte in the buffer to be written. After all address bytes are clocked in, the part will take data from the input pins and store it in the specified data buffer. If the end of the buffer is reached, the device will wrap around back to the beginning of the buffer. When there is a low-to-high transition on the CS pin, the part will first erase the selected page in main memory to all 1s and then program the data stored in the buffer into that memory page. Both the erase and the programming of the page are internally self-timed and should take place in a maximum time of tEP. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. 8. Sector Protection Two protection methods, hardware and software controlled, are provided for protection against inadvertent or erroneous program and erase cycles. The software controlled method relies on the use of software commands to enable and disable sector protection while the hardware controlled method employs the use of the Write Protect (WP) pin. The selection of which sectors that are to be protected or unprotected against program and erase operations is specified in the nonvolatile Sector Protection Register. The status of whether or not sector protection has been enabled or disabled by either the software or the hardware controlled methods can be determined by checking the Status Register. 12 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 8.1 8.1.1 Software Sector Protection Enable Sector Protection Command Sectors specified for protection in the Sector Protection Register can be protected from program and erase operations by issuing the Enable Sector Protection command. To enable the sector protection using the software controlled method, the CS pin must first be asserted as it would be with any other command. Once the CS pin has been asserted, the appropriate 4-byte command sequence must be clocked in via the input pins (SI or I/O7-I/O0). After the last bit of the command sequence has been clocked in, the CS pin must be deasserted after which the sector protection will be enabled. Table 8-1. Enable Sector Protection Command Command Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 7FH A9H Enable Sector Protection Figure 8-1. Enable Sector Protection CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Each transition represents 8 bits 8.1.2 Disable Sector Protection Command To disable the sector protection using the software controlled method, the CS pin must first be asserted as it would be with any other command. Once the CS pin has been asserted, the appropriate 4-byte sequence for the Disable Sector Protection command must be clocked in via the input pins (SI or I/O7-I/O0). After the last bit of the command sequence has been clocked in, the CS pin must be deasserted after which the sector protection will be disabled. The WP pin must be in the deasserted state; otherwise, the Disable Sector Protection command will be ignored. Table 8-2. Disenable Sector Protection Command Command Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 7FH 9AH Disable Sector Protection Figure 8-2. Disable Sector Protection CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Each transition represents 8 bits 13 3542N-DFLASH-2/2014 8.1.3 Various Aspects About Software Controlled Protection Software controlled protection is useful in applications in which the WP pin is not or cannot be controlled by a host processor. In such instances, the WP pin may be left floating (the WP pin is internally pulled high) and sector protection can be controlled using the Enable Sector Protection and Disable Sector Protection commands. If the device is power cycled, then the software controlled protection will be disabled. Once the device is powered up, the Enable Sector Protection command should be reissued if sector protection is desired and if the WP pin is not used. 9. Hardware Controlled Protection Sectors specified for protection in the Sector Protection Register can be protected from program and erase operations by asserting the WP pin and keeping the pin in its asserted state. Any sector specified for protection cannot be erased or reprogrammed as long as the WP pin is asserted. The WP pin will override the software controlled protection method but only for protecting the sectors. For example, if the sectors were not previously protected by the Enable Sector Protection command, then simply asserting the WP pin would enable the sector protection within the maximum specified tWPE time. When the WP pin is deasserted; however, the sector protection would no longer be enabled (after the maximum specified tWPD time) as long as the Enable Sector Protection command was not issued while the WP pin was asserted. If the Enable Sector Protection command was issued before or while the WP pin was asserted, then simply deasserting the WP pin would not disable the sector protection. In this case, the Disable Sector Protection command would need to be issued while the WP pin is deasserted to disable the sector protection. The Disable Sector Protection command is also ignored whenever the WP pin is asserted. A noise filter is incorporated to help protect against spurious noise that may inadvertently assert or deassert the WP pin. The table below details the sector protection status for various scenarios of the WP pin, the Enable Sector Protection command, and the Disable Sector Protection command. Figure 9-1. WP Pin and Protection Status 1 3 2 WP Table 9-1. WP Pin and Protection Status Time Period WP Pin Enable Sector Protection Command Disable Sector Protection Command Sector Protection Status 1 High Command Not Issued Previously - Issue Command X Issue Command - Disabled Disabled Enabled 2 Low X X Enabled High Command Issued During Period 1 or 2 - Issue Command Not Issued Yet Issue Command - Enabled Disabled Enabled 3 14 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 9.1 Sector Protection Register The nonvolatile Sector Protection Register specifies which sectors are to be protected or unprotected with either the software or hardware controlled protection methods. The Sector Protection Register contains 32-bytes of data, of which byte locations 0 through 31 contain values that specify whether sectors 0 through 31 will be protected or unprotected. The Sector Protection Register is user modifiable and must first be erased before it can be reprogrammed. Table 9-3 illustrates the format of the Sector Protection Register.: Table 9-2. Sector Protection Register Sector Number 0 (0a, 0b) Protected 00H Sector 0 (0a, 0b) 0a 0b (Page 0-7) (Page 8-255) Bit 7, 6 Bit 5, 4 Bit 3, 2 Bit 1, 0 Data Value Sectors 0a, 0b Unprotected 00 00 xx xx 0xH Protect Sector 0a 11 00 xx xx CxH Protect Sector 0b (Page 8-255) 00 11 xx xx 3xH Protect Sectors 0a (Page 0-7), 0b (Page 8-255)(1) 11 11 xx xx FxH Note: 9.1.1 FFH See Table 9-3 Unprotected Table 9-3. 1 to 31 1. The default value for bytes 0 through 31 when shipped from Adesto(R) is 00H x = don't care Erase Sector Protection Register Command In order to modify and change the values of the Sector Protection Register, it must first be erased using the Erase Sector Protection Register command. To erase the Sector Protection Register, the CS pin must first be asserted as it would be with any other command. Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device via the SI or I/O7 - I/O0 pin. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and CFH. After the last bit of the opcode sequence has been clocked in, the CS pin must be deasserted to initiate the internally self-timed erase cycle. The erasing of the Sector Protection Register should take place in a time of tPE, during which time the Status Register will indicate that the device is busy. If the device is powered-down before the completion of the erase cycle, then the contents of the Sector Protection Register cannot be guaranteed. The Sector Protection Register can be erased with the sector protection enabled or disabled. Since the erased state (FFH) of each byte in the Sector Protection Register is used to indicate that a sector is specified for protection, leaving the sector protection enabled during the erasing of the register allows the protection scheme to be more effective in the prevention of accidental programming or erasing of the device. If for some reason an erroneous program or erase command is sent to the device immediately after erasing the Sector Protection Register and before the register can be reprogrammed, then the erroneous program or erase command will not be processed because all sectors would be protected. 15 3542N-DFLASH-2/2014 Table 9-4. Erase Sector Protection Register Command Command Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 7FH CFH Erase Sector Protection Register Figure 9-2. Erase Sector Protection Register CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Each transition represents 8 bits 9.1.2 Program Sector Protection Register Command Once the Sector Protection Register has been erased, it can be reprogrammed using the Program Sector Protection Register command. To program the Sector Protection Register, the CS pin must first be asserted and the appropriate 4-byte opcode sequence must be clocked into the device via the SI or I/O7 - I/O0 pin. The 4byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and FCH. After the last bit of the opcode sequence has been clocked into the device, the data for the contents of the Sector Protection Register must be clocked in. As described in Section 9.1, the Sector Protection Register contains 32-bytes of data, so 32-bytes must be clocked into the device. The first byte of data corresponds to sector 0, the second byte corresponds to sector 1, and so on with the last byte of data corresponding to sector 31. After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed program cycle. The programming of the Sector Protection Register should take place in a time of tP, during which time the Status Register will indicate that the device is busy. If the device is powered-down during the program cycle, then the contents of the Sector Protection Register cannot be guaranteed. If the proper number of data bytes is not clocked in before the CS pin is deasserted, then the protection status of the sectors corresponding to the bytes not clocked in can not be guaranteed. For example, if only the first two bytes are clocked in instead of the complete 32-bytes, then the protection status of the last 30 sectors cannot be guaranteed. Furthermore, if more than 32bytes of data is clocked into the device, then the data will wrap back around to the beginning of the register. For instance, if 33-bytes of data are clocked in, then the 33rd byte will be stored at byte location 0 of the Sector Protection Register. If a value other than 00H or FFH is clocked into a byte location of the Sector Protection Register, then the protection status of the sector corresponding to that byte location cannot be guaranteed. For example, if a value of 17H is clocked into byte location 2 of the Sector Protection Register, then the protection status of sector 2 cannot be guaranteed. The Sector Protection Register can be reprogrammed while the sector protection enabled or disabled. Being able to reprogram the Sector Protection Register with the sector protection enabled allows the user to temporarily disable the sector protection to an individual sector rather than disabling sector protection completely. The Program Sector Protection Register command utilizes the internal SRAM buffer for processing. Therefore, the contents of the buffer will be altered from its previous state when this command is issued. 16 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D Table 9-5. Program Sector Protection Register Command Command Program Sector Protection Register Figure 9-3. Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 7FH FCH Program Sector Protection Register CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Data Byte n Data Byte n+1 Data Byte n + 31 Each transition represents 8 bits 9.1.3 Read Sector Protection Register Command To read the Sector Protection Register, the CS pin must first be asserted. Once the CS pin has been asserted, an opcode of 32H and a series of dummy bytes (three dummy bytes if using the serial interface or seven dummy bytes if using the 8-bit interface) must be clocked in via the SI or I/O7 or I/O0 pins. After the last bit of the opcode and dummy bytes have been clocked in, any additional clock pulses on the SCK/CLK pins will result in data for the content of the Sector Protection Register being output on the SO or I/O7-I/O0 pins. The first byte corresponds to sector 0 (0a, 0b), the second byte corresponds to sector 1 and the last byte (byte 32) corresponds to sector 31. Once the last byte of the Sector Protection Register has been clocked out, any additional clock pulses will result in undefined data being output on the SO or I/O pins. The CS must be deasserted to terminate the Read Sector Protection Register operation and put the output into a high-impedance state. Table 9-6. Read Sector Protection Register Command Command Read Sector Protection Register Note: Figure 9-4. xx = Dummy Byte Byte 1 Byte 2 Byte 3 Byte 4 32H xxH xxH xxH Serial Interface = 3 Dummy Bytes 8-bit Interface = 7 Dummy Bytes Read Sector Protection Register CS SI or IO7 - IO0 Opcode X X X Data Byte n SO or IO7 - IO0 Data Byte n+1 Data Byte n + 31 Each transition represents 8 bits 17 3542N-DFLASH-2/2014 9.1.4 Various Aspects About the Sector Protection Register The Sector Protection Register is subject to a limit of 10,000 erase/program cycles. Users are encouraged to carefully evaluate the number of times the Sector Protection Register will be modified during the course of the applications' life cycle. If the application requires that the Sector Protection Register be modified more than the specified limit of 10,000 cycles because the application needs to temporarily unprotect individual sectors (sector protection remains enabled while the Sector Protection Register is reprogrammed), then the application will need to limit this practice. Instead, a combination of temporarily unprotecting individual sectors along with disabling sector protection completely will need to be implemented by the application to ensure that the limit of 10,000 cycles is not exceeded. 10. Security Features 10.1 Sector Lockdown The device incorporates a Sector Lockdown mechanism that allows each individual sector to be permanently locked so that it becomes read only. This is useful for applications that require the ability to permanently protect a number of sectors against malicious attempts at altering program code or security information. Once a sector is locked down, it can never be erased or programmed, and it can never be unlocked. To issue the Sector Lockdown command, the CS pin must first be asserted as it would be for any other command. Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device in the correct order. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and 30H. After the last byte of the command sequence has been clocked in, then three address bytes specifying any address within the sector to be locked down must be clocked into the device. After the last address bit has been clocked in, the CS pin must then be deasserted to initiate the internally self-timed lockdown sequence. The lockdown sequence should take place in a maximum time of tP, during which time the Status Register will indicate that the device is busy. If the device is powered-down before the completion of the lockdown sequence, then the lockdown status of the sector cannot be guaranteed. In this case, it is recommended that the user read the Sector Lockdown Register to determine the status of the appropriate sector lockdown bits or bytes and reissue the Sector Lockdown command if necessary. Table 10-1. Sector Lockdown Command Sector Lockdown Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 7FH 30H Figure 10-1. Sector Lockdown CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Address Bytes Address Bytes Address Bytes Each transition represents 8 bits 18 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 10.1.1 Sector Lockdown Register Sector Lockdown Register is a nonvolatile register that contains 32-bytes of data, as shown below: Table 10-2. Sector Lockdown Register Sector Number 0 (0a, 0b) Locked 10.1.2 FFH See Below Unlocked Table 10-3. 1 to 31 00H Sector 0 (0a, 0b) 0a 0b (Page 0-7) (Page 8-255) Bit 7, 6 Bit 5, 4 Bit 3, 2 Bit 1, 0 Data Value Sectors 0a, 0b Unlocked 00 00 00 00 00H Sector 0a Locked 11 00 00 00 C0H Sector 0b Locked (Page 8-255) 00 11 00 00 30H Sectors 0a, 0b Locked (Page 0-255) 11 11 00 00 F0H Reading the Sector Lockdown Register The Sector Lockdown Register can be read to determine which sectors in the memory array are permanently locked down. To read the Sector Lockdown Register, the CS pin must first be asserted. Once the CS pin has been asserted, an opcode of 35H and a series of dummy bytes (three dummy bytes if using the serial interface or seven dummy bytes if using the 8-bit interface) must be clocked into the device via the SI or I/O7-O0 pins. After the last bit of the opcode and dummy bytes have been clocked in, the data for the contents of the Sector Lockdown Register will be clocked out on the SO pin or the I/O7-O0 pins. The first byte corresponds to sector 0 (0a, 0b) the second byte corresponds to sector 1 and the las byte (byte 32) corresponds to sector 31. After the last byte of the Sector Lockdown Register has been read, additional pulses on the SCK pin will simply result in undefined data being output on the SO pin. Deasserting the CS pin will terminate the Read Sector Lockdown Register operation and put the SO pin or I/O7-O0 pins into a high-impedance state. Table 10-4 details the values read from the Sector Lockdown Register. Table 10-4. Sector Lockdown Register Command Read Sector Lockdown Register Note: xx = Dummy Byte Byte 1 Byte 2 Byte 3 Byte 4 35H xxH xxH xxH Serial Interface = 3 Dummy Bytes 8-bit Interface = 7 Dummy Bytes Figure 10-2. Read Sector Lockdown Register CS SI or IO7 - IO0 Opcode X X X Data Byte n SO or IO7 - IO0 Data Byte n+1 Data Byte n + 31 Each transition represents 8 bits 19 3542N-DFLASH-2/2014 10.2 Security Register The device contains a specialized Security Register that can be used for purposes such as unique device serialization or locked key storage. The register is comprised of a total of 128bytes that is divided into two portions. The first 64-bytes (byte locations 0 through 63) of the Security Register are allocated as a one-time user programmable space. Once these 64-bytes have been programmed, they cannot be reprogrammed. The remaining 64-bytes of the register (byte locations 64 through 127) are factory programmed by Adesto and will contain a unique value for each device. The factory programmed data is fixed and cannot be changed. Table 10-5. Security Register Security Register Byte Number 0 Data Type 10.2.1 1 62 63 64 One-time User Programmable 65 126 127 Factory Programmed By Adesto Programming the Security Register The user programmable portion of the Security Register does not need to be erased before it is programmed. To program the Security Register, the CS pin must first be asserted and the appropriate 4-byte opcode sequence must be clocked into the device in the correct order. The 4-byte opcode sequence must start with 9BH and be followed by 00H, 00H, and 00H. After the last bit of the opcode sequence has been clocked into the device, the data for the contents of the 64-byte user programmable portion of the Security Register must be clocked in. After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed program cycle. The programming of the Security Register should take place in a time of tP, during which time the Status Register will indicate that the device is busy. If the device is powered-down during the program cycle, then the contents of the 64-byte user programmable portion of the Security Register cannot be guaranteed. If the full 64-bytes of data is not clocked in before the CS pin is deasserted, then the values of the byte locations not clocked in cannot be guaranteed. For example, if only the first two bytes are clocked in instead of the complete 64-bytes, then the remaining 62-bytes of the user programmable portion of the Security Register cannot be guaranteed. Furthermore, if more than 64bytes of data is clocked into the device, then the data will wrap back around to the beginning of the register. For instance, if 65-bytes of data are clocked in, then the 65th byte will be stored at byte location zero of the Security Register. The user programmable portion of the Security Register can only be programmed one time. Therefore, it is not possible to only program the first two bytes of the register and then program the remaining 62-bytes at a later time. The Program Security Register command utilizes the internal SRAM buffer for processing. Therefore, the contents of the buffer will be altered from its previous state when this command is issued. Figure 10-3. Program Security Register CS SI or IO7 - IO0 Opcode Byte 1 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Data Byte n Data Byte n+1 Data Byte n+x Each transition represents 8 bits 20 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 10.2.2 Reading the Security Register The Security Register can be read by first asserting the CS pin and then clocking in an opcode of 77H followed by three dummy bytes if using the serial interface and seven dummy bytes if using the 8-bit interface. After the last don't care bit has been clocked in, the content of the Security Register can be clocked out on the SO or I/O7 - I/O0 pins. After the last byte of the Security Register has been read, additional pulses on the SCK/CLK pin will simply result in undefined data being output on the SO or I/O7 - I/O0 pins. Deasserting the CS pin will terminate the Read Security Register operation and put the SO or I/O7 - I/O0 pins into a high-impedance state. Figure 10-4. Read Security Register CS SI or IO7 - IO0 Opcode X X X Data Byte n SO or IO7 - IO0 Data Byte n+1 Data Byte n+x Each transition represents 8 bits 11. Additional Commands 11.1 Main Memory Page to Buffer Transfer A page of data can be transferred from the main memory to either buffer 1 or buffer 2. To start the operation for the standard DataFlash page size (1056-bytes), a 1-byte opcode, 53H for buffer 1 and 55H for buffer 2, must be clocked into the device, followed by three address bytes comprised of 13 page address bits (PA12 - PA0), which specify the page in main memory that is to be transferred, and 11 don't care bits. To perform a main memory page to buffer transfer for the binary page size (1024-bytes), the opcode 53H for buffer 1 or 55H for buffer 2, must be clocked into the device followed by three address bytes consisting of 13 page address bits (A22 - A10) which specify the page in the main memory that is to be transferred, and 10 don't care bits. The CS pin must be low while toggling the SCK/CLK pin to load the opcode and the address bytes from the input pins (SI or I/O7 - I/O0). The transfer of the page of data from the main memory to the buffer will begin when the CS pin transitions from a low to a high state. During the transfer of a page of data (tXFR), the status register can be read or the RDY/BUSY can be monitored to determine whether the transfer has been completed. 11.2 Main Memory Page to Buffer Compare A page of data in main memory can be compared to the data in buffer 1 or buffer 2. To initiate the operation for standard DataFlash page size, a 1-byte opcode, 60H for buffer 1 and 61H for buffer 2, must be clocked into the device, followed by three address bytes consisting of 13 page address bits (PA12 - PA0) that specify the page in the main memory that is to be compared to the buffer, and 11 don't care bits. To start a main memory page to buffer compare for a binary page size, the opcode 60H for buffer 1 or 61H for buffer 2, must be clocked into the device followed by three address bytes consisting of 13 page address bits (A22 - A10) that specify the page in the main memory that is to be compared to the buffer, and 10 don't care bits. The CS pin must be low while toggling the SCK/CLK pin to load the opcode and the address bytes from the 21 3542N-DFLASH-2/2014 input pins (SI or I/O7 - I/O0). On the low-to-high transition of the CS pin, the data bytes in the selected main memory page will be compared with the data bytes in buffer 1 or buffer 2. During this time (tCOMP), the status register and the RDY/BUSY pin will indicate that the part is busy. On completion of the compare operation, bit 6 of the status register is updated with the result of the compare. 11.3 Auto Page Rewrite This mode is only needed if multiple bytes within a page or multiple pages of data are modified in a random fashion within a sector. This mode is a combination of two operations: Main Memory Page to Buffer Transfer and Buffer to Main Memory Page Program with Built-in Erase. A page of data is first transferred from the main memory to buffer 1 or buffer 2, and then the same data (from buffer 1 or buffer 2) is programmed back into its original page of main memory. To start the rewrite operation for standard DataFlash page size (1056-bytes), a 1-byte opcode, 58H for buffer 1 or 59H for buffer 2, must be clocked into the device, followed by three address bytes comprised of 13 page address bits (PA12-PA0) that specify the page in main memory to be rewritten and 11 don't care bits. To initiate an auto page rewrite for a binary page size (1024bytes), the opcode 58H for buffer 1 or 59H for buffer 2, must be clocked into the device followed by three address bytes consisting of 13 page address bits (A22 - A10) that specify the page in the main memory that is to be written and 10 don't care bits. When a low-to-high transition occurs on the CS pin, the part will first transfer data from the page in main memory to a buffer and then program the data from the buffer back into same page of main memory. The operation is internally self-timed and should take place in a maximum time of tEP. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy. If a sector is programmed or reprogrammed sequentially page by page, then the programming algorithm shown in Figure 26-1 (page 49) is recommended. Otherwise, if multiple bytes in a page or several pages are programmed randomly in a sector, then the programming algorithm shown in Figure 26-2 (page 50) is recommended. Each page within a sector must be updated/rewritten at least once within every 20,000 cumulative page erase/program operations in that sector. Please contact Adesto for availability of devices that are specified to exceed the 20K cycle cumulative limit. 11.4 Status Register Read The status register can be used to determine the device's ready/busy status, page size, a Main Memory Page to Buffer Compare operation result, the Sector Protection status or the device density. To read the status register, an opcode of D7H must be loaded into the device. After the opcode is clocked in, the 1-byte status register will be clocked out on the output pins (SO or I/O7 - I/O0), starting with the next clock cycle. In case of applications with 8-bit interface, opcode D7H and two dummy clock cycles should be used. When using the serial interface, the data in the status register, starting with the MSB (bit 7), will be clocked out on the SO pin during the next eight clock cycles. After the one byte of the status register has been clocked out, the sequence will repeat itself (as long as CS remains low and SCK/CLK is being toggled). The data in the status register is constantly updated, so each repeating sequence will output new data. Ready/busy status is indicated using bit seven of the status register. If bit seven is a one, then the device is not busy and is ready to accept the next command. If bit seven is a zero, then the device is in a busy state. Since the data in the status register is constantly updated, the user must toggle SCK/CLK pin to check the ready/busy status. There are several operations that can cause the device to be in a busy state: Main Memory Page to Buffer Transfer, Main Memory Page to Buffer Compare, Buffer to Main Memory Page Program, Main Memory Page Program through Buffer, Page Erase, Block Erase, Sector Erase, Chip Erase and Auto Page Rewrite. 22 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D The result of the most recent Main Memory Page to Buffer Compare operation is indicated using bit 6 of the status register. If bit six is a zero, then the data in the main memory page matches the data in the buffer. If bit six is a one, then at least one bit of the data in the main memory page does not match the data in the buffer. Bit one in the Status Register is used to provide information to the user whether or not the sector protection has been enabled or disabled, either by software-controlled method or hardware-controlled method. A logic 1 indicates that sector protection has been enabled and logic 0 indicates that sector protection has been disabled. Bit zero in the Status Register indicates whether the page size of the main memory array is configured for "power of 2" binary page size (1024-bytes) or standard DataFlash page size (1056bytes). If bit zero is a one, then the page size is set to 1024-bytes. If bit zero is a zero, then the page size is set to 1056-bytes. The device density is indicated using bits five, four, three, and two of the status register. For the AT45DB642D, the four bits are 1111 The decimal value of these four binary bits does not equate to the device density; the four bits represent a combinational code relating to differing densities of DataFlash devices. The device density is not the same as the density code indicated in the JEDEC device ID information. The device density is provided only for backward compatibility. Table 11-1. Status Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RDY/BUSY COMP 1 1 1 1 PROTECT PAGE SIZE 12. Deep Power-down After initial power-up, the device will default in standby mode. The Deep Power-down command allows the device to enter into the lowest power consumption mode. To enter the Deep Powerdown mode, the CS pin must first be asserted. Once the CS pin has been asserted, an opcode of B9H command must be clocked in via input pins (SI or IO7-IO0). After the last bit of the command has been clocked in, the CS pin must be de-asserted to initiate the Deep Power-down operation. After the CS pin is de-asserted, the will device enter the Deep Power-down mode within the maximum tEDPD time. Once the device has entered the Deep Power-down mode, all instructions are ignored except for the Resume from Deep Power-down command. Table 12-1. Deep Power-down Command Deep Power-down Serial/8-bit Opcode Both B9H Figure 12-1. Deep Power-down CS SI or IO7 - IO0 Opcode Each transition represents 8 bits 23 3542N-DFLASH-2/2014 12.1 Resume from Deep Power-down The Resume from Deep Power-down command takes the device out of the Deep Power-down mode and returns it to the normal standby mode. To Resume from Deep Power-down mode, the CS pin must first be asserted and an opcode of ABH command must be clocked in via input pins (SI or IO7-IO0). After the last bit of the command has been clocked in, the CS pin must be deasserted to terminate the Deep Power-down mode. After the CS pin is de-asserted, the device will return to the normal standby mode within the maximum tRDPD time. The CS pin must remain high during the tRDPD time before the device can receive any commands. After resuming form Deep Power-down, the device will return to the normal standby mode. Table 12-2. Resume from Deep Power-down Command Resume from Deep Power-down Serial/8-bit Opcode Both ABH Figure 12-2. Resume from Deep Power-Down CS SI or IO7 - IO0 Opcode Each transition represents 8 bits 13. "Power of 2" Binary Page Size Option "Power of 2" binary page size Configuration Register is a user-programmable nonvolatile register that allows the page size of the main memory to be configured for binary page size (1024bytes) or standard DataFlash page size (1056-bytes). The "power of 2" page size is a onetime programmable configuration register and once the device is configured for "power of 2" page size, it cannot be reconfigured again. The devices are initially shipped with the page size set to 1056-bytes. The user has the option of ordering binary page size (1024bytes) devices from the factory. For details, please refer to Section 27. "Ordering Information" on page 51. For the binary "power of 2" page size to become effective, the following steps must be followed: 1. Program the one-time programmable configuration resister using opcode sequence 3DH, 2AH, 80H and A6H (please see Section 13.1). 2. Power cycle the device (i.e. power down and power up again). 3. User can now program the page for the binary page size. If the above steps are not followed in setting the the page size prior to page programming, user may expect incorrect data during a read operation. 24 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 13.1 Programming the Configuration Register To program the Configuration Register for "power of 2" binary page size, the CS pin must first be asserted as it would be with any other command. Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device in the correct order. The 4byte opcode sequence must start with 3DH and be followed by 2AH, 80H, and A6H. After the last bit of the opcode sequence has been clocked in, the CS pin must be deasserted to initiate the internally self-timed program cycle. The programming of the Configuration Register should take place in a time of tP, during which time the Status Register will indicate that the device is busy. The device must be power-cycled after the completion of the program cycle to set the "power of 2" page size. If the device is powered-down before the completion of the program cycle, then setting the Configuration Register cannot be guaranteed. However, the user should check bit 0 of the status register to see whether the page size was configured for binary page size. If not, the command can be re-issued again. Table 13-1. Programming the Configuration Register Command Power of Two Page Size Byte 1 Byte 2 Byte 3 Byte 4 3DH 2AH 80H A6H Figure 13-1. Erase Sector Protection Register CS Opcode Byte 1 SI or IO7 - IO0 Opcode Byte 2 Opcode Byte 3 Opcode Byte 4 Each transition represents 8 bits 14. Manufacturer and Device ID Read Identification information can be read from the device to enable systems to electronically query and identify the device while it is in system. The identification method and the command opcode comply with the JEDEC standard for "Manufacturer and Device ID Read Methodology for SPI Compatible Serial Interface Memory Devices". The type of information that can be read from the device includes the JEDEC defined Manufacturer ID, the vendor specific Device ID, and the vendor specific Extended Device Information. To read the identification information, the CS pin must first be asserted and the opcode of 9FH must be clocked into the device. After the opcode has been clocked in, the device will begin outputting the identification data on the SO pin during the subsequent clock cycles. The first byte that will be output will be the Manufacturer ID followed by two bytes of Device ID information. The fourth byte output will be the Extended Device Information String Length, which will be 00H indicating that no Extended Device Information follows. As indicated in the JEDEC standard, reading the Extended Device Information String Length and any subsequent data is optional. Deasserting the CS pin will terminate the Manufacturer and Device ID Read operation and put the SO pin into a high-impedance state. The CS pin can be deasserted at any time and does not require that a full byte of data be read. 25 3542N-DFLASH-2/2014 14.1 14.1.1 Manufacturer and Device ID Information Byte 1 - Manufacturer ID JEDEC Assigned Code Hex Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1FH 0 0 0 1 1 1 1 1 14.1.2 Manufacturer ID Byte 2 - Device ID (Part 1) Family Code Density Code Hex Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Family Code 28H 0 0 1 0 1 0 0 0 Density Code 14.1.3 001 = DataFlash 01000 = 64-Mbit Byte 3 - Device ID (Part 2) MLC Code Product Version Code Hex Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 00H 0 0 0 0 0 0 0 0 14.1.4 1FH = Adesto SLC Code 000 = 1-bit/Cell Technology Product Version 00000 = Initial Version Byte Count 00H = 0 Bytes of Information Byte 4 - Extended Device Information String Length Byte Count Hex Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 00H 0 0 0 0 0 0 0 0 CS SI 9FH Opcode SO Each transition represents 8 bits Note: 26 1FH 28H 00H 00H Data Data Manufacturer ID Byte n Device ID Byte 1 Device ID Byte 2 Extended Device Information String Length Extended Device Information Byte x Extended Device Information Byte x + 1 This information would only be output if the Extended Device Information String Length value was something other than 00H. Based on JEDEC publication 106 (JEP106), Manufacturer ID data can be comprised of any number of bytes. Some manufacturers may have Manufacturer ID codes that are two, three or even four bytes long with the first byte(s) in the sequence being 7FH. A system should detect code 7FH as a "Continuation Code" and continue to read Manufacturer ID bytes. The first non-7FH byte would signify the last byte of Manufacturer ID data. For Adesto (and some other manufacturers), the Manufacturer ID data is comprised of only one byte. AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 14.2 Operation Mode Summary The commands described previously can be grouped into four different categories to better describe which commands can be executed at what times. Group A commands consist of: 1. Main Memory Page Read 2. Continuous Array Read 3. Read Sector Protection Register 4. Read Sector Lockdown Register 5. Read Security Register Group B commands consist of: 1. Page Erase 2. Block Erase 3. Sector Erase 4. Chip Erase 5. Main Memory Page to Buffer 1 (or 2) Transfer 6. Main Memory Page to Buffer 1 (or 2) Compare 7. Buffer 1 (or 2) to Main Memory Page Program with Built-in Erase 8. Buffer 1 (or 2) to Main Memory Page Program without Built-in Erase 9. Main Memory Page Program through Buffer 1 (or 2) 10. Auto Page Rewrite Group C commands consist of: 1. Buffer 1 (or 2) Read 2. Buffer 1 (or 2) Write 3. Status Register Read 4. Manufacturer and Device ID Read Group D commands consist of: 1. Erase Sector Protection Register 2. Program Sector Protection Register 3. Sector Lockdown 4. Program Security Register If a Group A command is in progress (not fully completed), then another command in Group A, B, C, or D should not be started. However, during the internally self-timed portion of Group B commands, any command in Group C can be executed. The Group B commands using buffer 1 should use Group C commands using buffer 2 and vice versa. Finally, during the internally selftimed portion of a Group D command, only the Status Register Read command should be executed. 27 3542N-DFLASH-2/2014 15. Command Tables Table 15-1. Read Commands Command Serial/8-bit Opcode Main Memory Page Read Both D2H Continuous Array Read (Legacy Command) Both E8H Continuous Array Read (Low Frequency) Serial 03H Continuous Array Read Serial 0BH Buffer 1 Read (Low Frequency) Serial D1H Buffer 2 Read (Low Frequency) Serial D3H Buffer 1 Read Serial D4H Buffer 2 Read Serial D6H Buffer 1 Read 8-bit 54H Buffer 2 Read 8-bit 56H Serial/8-bit Opcode Buffer 1 Write Both 84H Buffer 2 Write Both 87H Buffer 1 to Main Memory Page Program with Built-in Erase Both 83H Buffer 2 to Main Memory Page Program with Built-in Erase Both 86H Buffer 1 to Main Memory Page Program without Built-in Erase Both 88H Buffer 2 to Main Memory Page Program without Built-in Erase Both 89H Page Erase Both 81H Block Erase Both 50H Sector Erase Both 7CH Chip Erase Both C7H, 94H, 80H, 9AH Main Memory Page Program Through Buffer 1 Both 82H Main Memory Page Program Through Buffer 2 Both 85H Table 15-2. Program and Erase Commands Command 28 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D Table 15-3. Protection and Security Commands Command Serial/8-Bit Opcode Enable Sector Protection Both 3DH + 2AH + 7FH + A9H Disable Sector Protection Both 3DH + 2AH + 7FH + 9AH Erase Sector Protection Register Both Program Sector Protection Register 3DH + 2AH + 7FH + CFH 3DH + 2AH + 7FH + FCH Read Sector Protection Register Both 32H Sector Lockdown Both 3DH + 2AH + 7FH + 30H Read Sector Lockdown Register Both 35H Program Security Register Both 9BH + 00H + 00H + 00H Read Security Register Both 77H Serial/8-bit Opcode Main Memory Page to Buffer 1 Transfer Both 53H Main Memory Page to Buffer 2 Transfer Both 55H Main Memory Page to Buffer 1 Compare Both 60H Main Memory Page to Buffer 2 Compare Both 61H Auto Page Rewrite through Buffer 1 Both 58H Auto Page Rewrite through Buffer 2 Both 59H Deep Power-down Both B9H Resume from Deep Power-down Both ABH Status Register Read Both D7H Manufacturer and Device ID Read Serial 9FH Table 15-4. Additional Commands Command 29 3542N-DFLASH-2/2014 Detailed Bit-level Addressing Sequence for Binary Page Size (1024-Bytes) A0 A2 A1 A3 A4 A5 A6 A7 A8 Address Byte A9 A10 A12 A11 A14 A13 A15 A16 A18 Address Byte A17 A19 Opcode A20 A23 Opcode Address Byte A22 Page Size = 1024-bytes A21 Table 15-5. Additional Don't Care Bytes* 03h 0 0 0 0 0 0 1 1 x A A A A A A A A A A A A A A A A A A A A A A A N/A 0Bh 0 0 0 0 1 0 1 1 x A A A A A A A A A A A A A A A A A A A A A A A 1 50h 0 1 0 1 0 0 0 0 x A A A A A A A A A A x x x x x x x x x x x x x N/A 53h 0 1 0 1 0 0 1 1 x A A A A A A A A A A A A A x x x x x x x x x x N/A 54h 0 1 0 1 0 1 0 0 x x x x x x x x x x x x x x A A A A A A A A A A 2* 55h 0 1 0 1 0 1 0 1 x A A A A A A A A A A A A A x x x x x x x x x x N/A 56h 0 1 0 1 0 1 1 0 x x x x x x x x x x x x x x A A A A A A A A A A 2* 58h 0 1 0 1 1 0 0 0 x A A A A A A A A A A A A A x x x x x x x x x x N/A 59h 0 1 0 1 1 0 0 1 x A A A A A A A A A A A A A x x x x x x x x x x N/A 60h 0 1 1 0 0 0 0 0 x A A A A A A A A A A A A A x x x x x x x x x x N/A 61h 0 1 1 0 0 0 0 1 x A A A A A A A A A A A A A x x x x x x x x x x N/A 77h 0 1 1 1 0 1 1 1 x x x x x x x x x x x x x x x x x x x x x x x x 0 or 4* 7Ch 0 1 1 1 1 1 0 0 x A A A A A x x x x x x x x x x x x x x x x x x N/A 81h 1 0 0 0 0 0 0 1 x A A A A A A A A A A A A A x X x x x x x x x x N/A 82h 1 0 0 0 0 0 1 0 x A A A A A A A A A A A A A A A A A A A A A A A N/A 83h 1 0 0 0 0 0 1 1 x A A A A A A A A A A A A A x X x x x x x x x x N/A 84h 1 0 0 0 0 1 0 0 x x x x x x x x x x x x x x A A A A A A A A A A N/A 85h 1 0 0 0 0 1 0 1 x A A A A A A A A A A A A A A A A A A A A A A A N/A 86h 1 0 0 0 0 1 1 0 x A A A A A A A A A A A A A x x x x x x x x x x N/A 87h 1 0 0 0 0 1 1 1 x x x x x x x x x x x x x x A A A A A A A A A A N/A 88h 1 0 0 0 1 0 0 0 x A A A A A A A A A A A A A x x x x x x x x x x N/A 89h 1 0 0 0 1 0 0 1 x A A A A A A A A A A A A A x x x x x x x x x x N/A 9Fh 1 0 0 1 1 1 1 1 N/A N/A N/A N/A B9h 1 0 1 1 1 0 0 1 N/A N/A N/A N/A ABh 1 0 1 0 1 0 1 1 N/A N/A N/A N/A D1h 1 1 0 1 0 0 0 1 x x x x x x x x x x x x x x A A A A A A A A A A N/A D2h 1 1 0 1 0 0 1 0 x A A A A A A A A A A A A A A A A A A A A A A A 4 or 19* D3h 1 1 0 1 0 0 1 1 x x x x x x x x x x x x x x A A A A A A A A A A N/A D4h 1 1 0 1 0 1 0 0 x x x x x x x x x x x x x x A A A A A A A A A A 1 D6h 1 1 0 1 0 1 1 0 x x x x x x x x x x x x x x A A A A A A A A A A 1 D7h 1 1 0 1 0 1 1 1 E8h 1 1 1 0 1 0 0 0 Notes: 30 N/A x A N/A A A A A A A A A N/A A A A A A A A A 2* A A A A A A 4 or 19* x = Don't Care A = Address Bit *The number with (*) is for 8-bit interface AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D Detailed Bit-level Addressing Sequence for Standard DataFlash Page Size (1056-Bytes) BA0 BA1 BA2 BA3 BA4 BA6 BA5 BA7 BA8 Address Byte BA9 BA10 PA1 PA0 PA3 PA2 PA4 PA5 Address Byte PA6 PA7 PA8 Opcode PA9 PA12 Opcode Address Byte PA11 Page Size = 1056-bytes PA10 Table 15-6. Additional Don't Care Bytes* 03h 0 0 0 0 0 0 1 1 P P P P P P P P P P P P P B B B B B B B B B B B N/A 0Bh 0 0 0 0 1 0 1 1 P P P P P P P P P P P P P B B B B B B B B B B B 1 50h 0 1 0 1 0 0 0 0 P P P P P P P P P P x x x x x x x x x x x x N/A 53h 0 1 0 1 0 0 1 1 P P P P P P P P P P P P P x x x x x x x x x x x N/A 54h 0 1 0 1 0 1 0 0 x x B B B B B B B B 2* 55h 0 1 0 1 0 1 0 1 P P P P P P P P P P P P P x 56h 0 1 0 1 0 1 1 0 x x 58h 0 1 0 1 1 0 0 0 P P P P P P P P P P P P P x x 59h 0 1 0 1 1 0 0 1 P P P P P P P P P P P P P x x 60h 0 1 1 0 0 0 0 0 P P P P P P P P P P P P P x 61h 0 1 1 0 0 0 0 1 P P P P P P P P P P P P P x 77h 0 1 1 1 0 1 1 1 x x x x x x x x x 7Ch 0 1 1 1 1 1 0 0 P P P P P x x x x x x x x 81h 1 0 0 0 0 0 0 1 82h 1 0 0 0 0 0 1 0 83h 1 0 0 0 0 0 1 84h 1 0 0 0 0 1 0 85h 1 0 0 0 0 1 86h 1 0 0 0 0 1 87h 1 0 0 0 0 88h 1 0 0 0 1 89h 1 0 0 0 1 0 9Fh 1 0 0 1 1 1 B9h 1 0 1 1 1 0 ABh 1 0 1 0 1 0 D1h 1 1 0 1 0 D2h 1 1 0 1 0 D3h 1 1 0 1 D4h 1 1 0 1 D6h 1 1 0 D7h 1 1 0 E8h 1 1 1 Note: x x x x x x x x x x x x x B B B x x N/A B B B B B B B B 2* x x x x x x x x x N/A x x x x x x x x x N/A x x x x x x x x x x N/A x x x x x x x x x x N/A x x x x x x x x x x x 0 or 4* x x x x x x x x x x x N/A P P P P P P P P P P P P P x x x x x x x x x x x N/A P P P P P P P P P P P P P B B B B B B B B B B B N/A 1 P P P P P P P P P P P P P x x 0 x x 0 1 1 0 1 1 0 0 x x x x x x x x x x x x x x x x x B B B N/A N/A P P P P P P P P P P P P P B B B B B B B B B B B N/A P P P P P P P P P P P P P x x x x N/A 1 x x B B B B B B B 0 P P P P P P P P P P P P P x x x x 0 1 P P P P P P P P P P P P P x x x x 1 1 N/A N/A N/A N/A 0 1 N/A N/A N/A N/A 1 1 N/A N/A N/A N/A 0 0 1 x B B B B B B B B B B B N/A 0 1 0 P P P P P P P P P P P P P B B B B B B B B B B B 4 or 19* 0 0 0 1 x x x x x x x x x x x x x B B B B B B B B B B B N/A 0 1 0 0 x x x x x x x x x x x x x B B B B B B B B B B B 1 1 0 1 1 0 x x x x x x x x x x x x x B B B B B B B B B B B 1 1 0 1 1 1 0 1 0 0 0 x x x x x x x x x x x x x x x x N/A P P P P P P P P x x x x x x x x x x x x x x x B B B N/A P P P P P B B B x x x x x x x x x B x x x x x x x B B B B B B B x x x B B B x x x x x x B N/A x x x x x x x N/A x x x x x x x N/A N/A B B B B B B B 2* B 4 or 19* P = Page Address Bit B = Byte/Buffer Address Bitx = Don't Care *The number with (*) is for 8-bit interface 31 3542N-DFLASH-2/2014 16. Power-on/Reset State When power is first applied to the device, or when recovering from a reset condition, the device will default to Mode 3. In addition, the output pins (SO or I/O7 - I/O0) will be in a high impedance state, and a high-to-low transition on the CS pin will be required to start a valid instruction. The mode (Mode 3 or Mode 0) will be automatically selected on every falling edge of CS by sampling the inactive clock state. 16.1 Initial Power-up/Reset Timing Restrictions At power up, the device must not be selected until the supply voltage reaches the VCC (min.) and further delay of tVCSL. During power-up, the internal Power-on Reset circuitry keeps the device in reset mode until the VCC rises above the Power-on Reset threshold value (VPOR). At this time, all operations are disabled and the device does not respond to any commands. After power up is applied and the VCC is at the minimum operating voltage VCC (min.), the tVCSL delay is required before the device can be selected in order to perform a read operation. Similarly, the tPUW delay is required after the VCC rises above the Power-on Reset threshold value (VPOR) before the device can perform a write (Program or Erase) operation. After initial power-up, the device will default in Standby mode. Initial Power-up/Reset Timing Restrictions Table 16-1. Symbol Parameter tVCSL VCC (min.) to Chip Select low tPUW Power-Up Device Delay before Write allowed VPOR Power-ON Reset Voltage Min Typ Max 50 1.5 Units s 20 ms 2.5 V 17. System Considerations The RapidS serial interface is controlled by the clock SCK, serial input SI and chip select CS pins. The sequential 8-bit Rapid8 is controlled by the clock CLK, eight I/Os and chip select CS pins. These signals must rise and fall monotonically and be free from noise. Excessive noise or ringing on these pins can be misinterpreted as multiple edges and cause improper operation of the device. The PC board traces must be kept to a minimum distance or appropriately terminated to ensure proper operation. If necessary, decoupling capacitors can be added on these pins to provide filtering against noise glitches. As system complexity continues to increase, voltage regulation is becoming more important. A key element of any voltage regulation scheme is its current sourcing capability. Like all Flash memories, the peak current for DataFlash occur during the programming and erase operation. The regulator needs to supply this peak current requirement. An under specified regulator can cause current starvation. Besides increasing system noise, current starvation during programming or erase can lead to improper operation and possible data corruption. The device uses an adaptive algorithm during program and erase operations. In order to optimize the erase and program time, use the RDY/BUSY bit of the status register or the RDY/BUSY pin to determine whether the program or erase operation was completed. Fixed timing is not recommended. 32 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 18. Electrical Specifications Table 18-1. Absolute Maximum Ratings* Temperature under Bias ................................ -55C to +125C *NOTICE: Storage Temperature .................................... -65C to +150C All Input Voltages (except VCC but including NC pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V Table 18-2. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. The "Absolute Maximum Ratings" are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage Extremes referenced in the "Absolute Maximum Ratings" are intended to accommodate short duration undershoot/overshoot conditions and does not imply or guarantee functional device operation at these levels for any extended period of time DC and AC Operating Range AT45DB642D Operating Temperature (Case) VCC Power Supply Ind. -40C to 85C 2.7V to 3.6V 33 3542N-DFLASH-2/2014 Table 18-3. DC Characteristics Symbol Parameter Condition IDP Deep Power-down Current ISB Typ Max Units CS, RESET, WP = VIH, all inputs at CMOS levels 15 25 A Standby Current CS, RESET, WP = VIH, all inputs at CMOS levels 25 50 A ICC1(1) Active Current, Read Operation, Serial Interface f = 33MHz; IOUT = 0mA; VCC = 3.6V 10 15 mA ICC2(1) Active Current, Read Operation, Rapid8 Interface f = 33MHz; IOUT = 0mA; VCC = 3.6V 10 15 mA ICC3 Active Current, Program Operation, Page Program VCC = 3.6V 25 mA ICC4 Active Current, Page Erase, Block Erase, Sector Erase Operation VCC = 3.6V 25 mA ILI Input Load Current VIN = CMOS levels 1 A ILO Output Leakage Current VI/O = CMOS levels 1 A VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage IOL = 1.6mA; VCC = 2.7V Output High Voltage IOH = -100A VOH Notes: Min VCC x 0.3 VCC x 0.7 0.4 VCC - 0.2V V V V V 1. AICC1 and ICC2 during a buffer read is 25mA maximum 2. All inputs (SI, SCK, CS#, WP#, and RESET#) are guaranteed by design to be 5-Volt tolerant 34 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D Table 18-4. AC Characteristics - RapidS/Serial Interface Symbol Parameter fSCK Min Typ Max Units SCK Frequency 66 MHz fCAR1 SCK Frequency for Continuous Array Read 66 MHz fCAR2 SCK Frequency for Continuous Array Read (Low Frequency) 33 MHz tWH SCK High Time 6.8 ns tWL SCK Low Time 6.8 ns tSCKR(1) SCK Rise Time, Peak-to-Peak (Slew Rate) 0.1 V/ns tSCKF(1) SCK Fall Time, Peak-to-Peak (Slew Rate) 0.1 V/ns tCS Minimum CS High Time 50 ns tCSS CS Setup Time 5 ns tCSH CS Hold Time 5 ns tCSB CS High to RDY/BUSY Low tSU Data In Setup Time 2 ns tH Data In Hold Time 3 ns tHO Output Hold Time 0 ns tDIS Output Disable Time tV 100 35 ns Output Valid 6 ns tWPE WP Low to Protection Enabled 1 s tWPD WP High to Protection Disabled 1 s tEDPD CS High to Deep Power-down Mode 3 s tRDPD CS High to Standby Mode 35 s tXFR Page to Buffer Transfer Time 400 s tcomp Page to Buffer Compare Time 400 s tEP Page Erase and Programming Time (1,024-/1,056-bytes) 17 40 ms tP Page Programming Time (1,024-/1,056-bytes) 3 6 ms tPE Page Erase Time (1,024-/1,056-bytes) 15 35 ms tBE Block Erase Time (8,192-/8,448-bytes) 45 100 ms tSE Sector Erase Time (262,144-/270,336-bytes) 0.7 1.3 s tCE Chip Erase Time TBD TBD s tRST RESET Pulse Width tREC RESET Recovery Time Note: 27 ns 10 s 1 s 1. Values are based on device characterization, not 100% tested in production 35 3542N-DFLASH-2/2014 Table 18-5. AC Characteristics - Rapid8 8-bit Interface Symbol Parameter fSCK1 Max Units CLK Frequency 50 MHz fCAR1 CLK Frequency for Continuous Array Read 50 MHz tWH CLK High Time 9 ns CLK Low Time 9 ns tWL (1) Min Typ CLK Rise Time, Peak-to-Peak (Slew Rate) 0.1 V/ns tCLKF(1) CLK Fall Time, Peak-to-Peak (Slew Rate) 0.1 V/ns tCS Minimum CS High Time 50 ns tCSS CS Setup Time 5 ns tCSH CS Hold Time 5 ns tCSB CS High to RDY/BUSY Low tSU Data In Setup Time 2 ns tH Data In Hold Time 5 ns tHO Output Hold Time 0 ns tDIS Output Disable Time 12 ns tV Output Valid 12 ns tWPE WP Low to Protection Enabled 1 s tWPD WP High to Protection Disabled 1 s tEDPD CS High to Deep Power-down Mode 3 s tRDPD CS High to Standby Mode 35 s tXFR Page to Buffer Transfer Time 400 s tcomp Page to Buffer Compare Time 400 s tEP Page Erase and Programming Time (1,024-/1,056-bytes) 17 40 ms tP Page Programming Time (1,024-/1,056-bytes) 3 6 ms tPE Page Erase Time (1,024-/1,056-bytes) 15 35 ms tBE Block Erase Time (8,192-/8,448-bytes) 45 100 ms tSE Sector Erase Time (262,144-/270,336-bytes) 1.6 5 s tRST RESET Pulse Width tCLKR tREC Note: 36 100 10 RESET Recovery Time ns s 1 s Values are based on device characterization, not 100% tested in production AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 19. Input Test Waveforms and Measurement Levels AC DRIVING LEVELS 2.4V 1.5V 0.45V AC MEASUREMENT LEVEL tR, tF < 2ns (10% to 90%) 20. Output Test Load DEVICE UNDER TEST 30pF 21. AC Waveforms Six different timing waveforms are shown below. Waveform 1 shows the SCK/CLK signal being low when CS makes a high-to-low transition, and waveform 2 shows the SCK/CLK signal being high when CS makes a high-to-low transition. In both cases, output SO becomes valid while the SCK/CLK signal is still low (SCK/CLK low time is specified as tWL). Timing waveforms 1 and 2 conform to RapidS serial interface but for frequencies up to 66MHz. Waveforms 1 and 2 are compatible with SPI Mode 0 and SPI Mode 3, respectively. Waveform 3 and waveform 4 illustrate general timing diagram for RapidS serial interface. These are similar to waveform 1 and waveform 2, except that output SO is not restricted to become valid during the tWL period. These timing waveforms are valid over the full frequency range (maximum frequency = 66MHz) of the RapidS serial case. Waveform 5 and waveform 6 are for 8-bit Rapid8 interface over the full frequency range of operation (maximum frequency = 50MHz). 21.1 Waveform 1 - SPI Mode 0 Compatible (for Frequencies up to 66MHz) tCS CS tWH tCSS tWL tCSH SCK/CLK tHO tV SO HIGH IMPEDANCE tSU SI VALID OUT tDIS HIGH IMPEDANCE tH VALID IN 37 3542N-DFLASH-2/2014 21.2 Waveform 2 - SPI Mode 3 Compatible (for Frequencies up to 66MHz) tCS CS tCSS tWL tWH tCSH SCK/CLK tV SO tHO HIGH Z tDIS HIGH IMPEDANCE VALID OUT tSU tH VALID IN SI Note: To operate the device at 50MHz in SPI mode, the combined CPU setup time and rise/fall time should be less than 2ns 21.3 Waveform 3 - RapidS Mode 0 (FMAX = 66MHz) tCS CS tWH tCSS tWL tCSH SCK/CLK tHO tV SO HIGH IMPEDANCE 21.4 HIGH IMPEDANCE VALID OUT tSU SI tDIS tH VALID IN Waveform 4 - RapidS Mode 3 (FMAX = 66MHz) tCS CS tCSS tWL tWH tCSH SCK/CLK tV SO tHO HIGH Z HIGH IMPEDANCE VALID OUT tSU tH VALID IN SI 21.5 tDIS Waveform 5 - Rapid8 Mode 0 (FMAX = 50MHz) tCS CS tWH tCSS tWL tCSH SCK/CLK tHO tV I/O7 - I/O0 (OUTPUT) HIGH IMPEDANCE I/O7 - I/O0 (INPUT) 38 tSU VALID OUT tDIS HIGH IMPEDANCE tH VALID IN AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 21.6 Waveform 6 - Rapid8 Mode 3 (FMAX = 50MHz) tCS CS tCSS tWL tWH tCSH SCK/CLK tV I/O7 - I/O0 (OUTPUT) tHO HIGH Z VALID OUT tSU tH VALID IN I/O7 - I/O0 (INPUT) 21.7 tDIS HIGH IMPEDANCE Utilizing the RapidS Function To take advantage of the RapidS function's ability to operate at higher clock frequencies, a full clock cycle must be used to transmit data back and forth across the serial bus. The DataFlash is designed to always clock its data out on the falling edge of the SCK signal and clock data in on the rising edge of SCK. For full clock cycle operation to be achieved, when the DataFlash is clocking data out on the falling edge of SCK, the host controller should wait until the next falling edge of SCK to latch the data in. Similarly, the host controller should clock its data out on the rising edge of SCK in order to give the DataFlash a full clock cycle to latch the incoming data in on the next rising edge of SCK. Figure 21-1. RapidS Mode Slave CS 1 8 2 3 4 5 6 1 8 7 2 3 4 5 6 1 7 SCK B A MOSI E C D MSB LSB BYTE-MOSI H G I F MISO MSB LSB BYTE-SO MOSI = Master Out, Slave In MISO = Master In, Slave Out The Master is the host controller and the Slave is the DataFlash The Master always clocks data out on the rising edge of SCK and always clocks data in on the falling edge of SCK. The Slave always clocks data out on the falling edge of SCK and always clocks data in on the rising edge of SCK. A. B. C. D. E. F. G. H. I. Master clocks out first bit of BYTE-MOSI on the rising edge of SCK Slave clocks in first bit of BYTE-MOSI on the next rising edge of SCK Master clocks out second bit of BYTE-MOSI on the same rising edge of SCK Last bit of BYTE-MOSI is clocked out from the Master Last bit of BYTE-MOSI is clocked into the slave Slave clocks out first bit of BYTE-SO Master clocks in first bit of BYTE-SO Slave clocks out second bit of BYTE-SO Master clocks in last bit of BYTE-SO 39 3542N-DFLASH-2/2014 21.8 Utilizing the Rapid8 Function The Rapid8 functions like RapidS but with 8-bits of data instead of 1-bit. A full clock cycle must be used to transmit data back and forth across the 8-bit bus. The DataFlash is designed to always clock its data out on the falling edge of the SCK signal and clock data in on the rising edge of SCK. For full clock cycle operation to be achieved, when the DataFlash is clocking data out on the falling edge of SCK, the host controller should wait until the next falling edge of SCK to latch the data in. Similarly, the host controller should clock its data out on the rising edge of SCK in order to give the DataFlash a full clock cycle to latch the incoming data in on the next rising edge of SCK. Figure 21-2. Rapid8 Mode Slave CS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK tV B A I/O7-0 C BYTE 1 BYTE 2 BYTE 3 BYTE 4 D BYTE 5 BYTE 6 E F BYTE a G BYTE b BYTE c BYTE d BYTE e BYTE f BYTE g BYTE h MOSI = Master Out, Slave In MISO = Master In, Slave Out The Master would be the ASIC/MCU and the Slave would be the memory device. The Master always clocks data out on the rising edge of SCK and always clocks data in on the falling edge of SCK. The Slave always clocks data out on the falling edge of SCK and always clocks data in on the rising edge of SCK. A. B. C. D. E. F. G. 21.9 Master clocks out BYTE 1 on the rising edge of SCK Slave clocks in BYTE 1 on the next rising edge of SCK Master clocks out BYTE 2 on the same rising edge of SCK Slave clocks in BYTE 6 (last input byte) Slave clocks out BYTE a (first output byte) Master clocks in BYTE a Master clocks in BYTE h (last output byte) Reset Timing CS tREC tCSS SCK/CLK tRST RESET HIGH IMPEDANCE HIGH IMPEDANCE SO or I/O7 - I/O0 (OUTPUT) SI or I/O7 - I/O0 (INPUT) Note: 40 The CS signal should be in the high state before the RESET signal is deasserted AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 21.10 Command Sequence for Read/Write Operations for Page Size 1024-Bytes (Except Status Register Read, Manufacturer and Device ID Read) SI or I/O7 - I/O0 (INPUT)? CMD 8 bits XXX XXXX MSB 8 bits 8 bits XXXX XXXX Page Address (A22 - A10) XXXX XXXX LSB Byte/Buffer Address (A9 - A0/BFA9 - BFA0) 21.11 Command Sequence for Read/Write Operations for Page Size 1056-Bytes (Except Status Register Read, Manufacturer and Device ID Read) SI or I/O7 - I/O0 (INPUT)? MSB CMD XXXX XXXX 8 bits 8 bits XXXX XXXX XXXX XXXX Page Address (PA12 - PA0) 8 bits LSB Byte/Buffer Address (BA10 - BA0/BFA10 - BFA0) 22. Write Operations The following block diagram and waveforms illustrate the various write sequences available. FLASH MEMORY ARRAY PAGE (1024-/1056-BYTES) BUFFER 1 TO MAIN MEMORY PAGE PROGRAM BUFFER 2 TO MAIN MEMORY PAGE PROGRAM BUFFER 1 (1024-/1056-BYTES) BUFFER 2 (1024-/1056-BYTES) BUFFER 2 WRITE BUFFER 1 WRITE I/O INTERFACE SI I/O7 - I/O0 41 3542N-DFLASH-2/2014 22.1 Buffer Write Completes writing into selected buffer CS BINARY PAGE SIZE 14 DON'T CARE + BFA9-BFA0 SI or I/O7 - I/O0 (INPUT) 22.2 CMD X X***X, BFA10-8 n BFA7-0 n+1 Last Byte Buffer to Main Memory Page Program (Data from Buffer Programmed into Flash Page) Starts self-timed erase/program operation CS BINARY PAGE SIZE A22-A10 + 10 DON'T CARE BITS SI or I/O7 - I/O0 (INPUT) CMD PA12-5 PA4-0, XXX XXXX XX Each transition represents 8 bits n = 1st byte read n+1 = 2nd byte read 23. Read Operations The following block diagram and waveforms illustrate the various read sequences available. FLASH MEMORY ARRAY PAGE (1024-/1056-BYTES) MAIN MEMORY PAGE TO BUFFER 2 MAIN MEMORY PAGE TO BUFFER 1 BUFFER 1 (1024-/1056-BYTES) BUFFER 1 READ BUFFER 2 (1024-/1056-BYTES) MAIN MEMORY PAGE READ BUFFER 2 READ I/O INTERFACE SO 42 I/O7 - I/O0 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 23.1 Main Memory Page Read CS ADDRESS FOR BINARY PAGE SIZE A15-A8 A22-A16 A7-A0 SI or I/O7 - I/O0 (INPUT) CMD PA12-5, PA4-0 BA10-8 BA7-0 X X 4 Dummy Bytes for Serial 19 Dummy Bytes for Parallel SO or I/O7 - I/O0 (OUTPUT) 23.2 n n+1 Main Memory Page to Buffer Transfer (Data from Flash Page Read into Buffer) Starts reading page data into buffer CS BINARY PAGE SIZE A22-A10 + 10 DON'T CARE BITS SI or I/O7 - I/O0 (INPUT) CMD PA12-5 PA4-0, XXX XXXX XXXX SO or I/O7 - I/O0 (OUTPUT) 23.3 Buffer Read CS BINARY PAGE SIZE 14 DON'T CARE + BFA9-BFA0 SI or IO7 - IO0 CMD X X..X, BFA10-8 BFA7- 0 X No Dummy Byte (Serial, opcodes D1H and D3H) 1 Dummy Byte (Serial, opcodes D4H and D6H) 2 Dummy Bytes (Parallel) SO or IO7 - IO0 n n+1 Each transition represents 8 bits 43 3542N-DFLASH-2/2014 24. Detailed Bit-level Read Waveform - RapidS Serial Interface Mode 0/Mode 3 24.1 Continuous Array Read (Legacy Opcode E8H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 62 63 64 65 66 67 68 69 70 71 72 SCK OPCODE SI 1 1 1 0 1 ADDRESS BITS 0 0 A 0 MSB A A A A A 32 DON'T CARE BITS A A A MSB X X X X X X MSB DATA BYTE 1 SO HIGH-IMPEDANCE D D D D D D D D MSB D BIT 0 OF PAGE n+1 BIT 8191/8447 OF PAGE n 24.2 D MSB Continuous Array Read (Opcode 0BH) CS 0 1 2 3 4 5 6 7 8 9 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 10 11 12 SCK OPCODE SI 0 0 0 0 1 ADDRESS BITS A23 - A0 0 1 1 A MSB A A A A A A DON'T CARE A A MSB X X X X X X X X MSB DATA BYTE 1 SO HIGH-IMPEDANCE D D D D D D MSB 24.3 D D D D MSB Continuous Array Read (Low Frequency: Opcode 03H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 SCK OPCODE SI 0 0 0 0 0 ADDRESS BITS A23-A0 0 MSB 1 1 A A A A A A A A A MSB DATA BYTE 1 SO HIGH-IMPEDANCE D MSB 44 D D D D D D D D D MSB AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 24.4 Main Memory Page Read (Opcode: D2H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 62 63 64 65 66 67 68 69 70 71 72 SCK OPCODE SI 1 1 0 1 0 ADDRESS BITS 0 1 0 A MSB A A A A A 32 DON'T CARE BITS A A A MSB X X X X X X MSB DATA BYTE 1 HIGH-IMPEDANCE SO D D D D D D D D MSB 24.5 D D MSB Buffer Read (Opcode D4H or D6H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 SCK ADDRESS BITS BINARY PAGE SIZE = 14 DON'T CARE + BFA9-BFA0 STANDARD DATAFLASH PAGE SIZE = 13 DON'T CARE + BFA10-BFA0 OPCODE SI 1 1 0 1 0 1 0 0 MSB X X X X X X A A A MSB X DON'T CARE X X X X X X X MSB DATA BYTE 1 HIGH-IMPEDANCE SO D D D D D D MSB 24.6 D D D D MSB Buffer Read (Low Frequency: Opcode D1H or D3H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 SCK ADDRESS BITS BINARY PAGE SIZE = 14 DON'T CARE + BFA9-BFA0 STANDARD DATAFLASH PAGE SIZE = 13 DON'T CARE + BFA10-BFA0 OPCODE SI 1 1 0 1 0 0 MSB 0 1 X X X X X X A A A MSB DATA BYTE 1 SO HIGH-IMPEDANCE D MSB D D D D D D D D D MSB 45 3542N-DFLASH-2/2014 24.7 Read Sector Protection Register (Opcode 32H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 SCK OPCODE SI 0 0 1 1 0 DON'T CARE 0 1 0 MSB X X X X X X X X X MSB DATA BYTE 1 SO HIGH-IMPEDANCE D D D D D D D D MSB 24.8 D MSB Read Sector Lockdown Register (Opcode 35H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 SCK OPCODE SI 0 0 1 1 0 DON'T CARE 1 0 1 MSB X X X X X X X X X MSB DATA BYTE 1 SO HIGH-IMPEDANCE D D D D D D D D MSB 24.9 D MSB Read Security Register (Opcode 77H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 29 30 31 32 33 34 35 36 37 38 39 40 SCK OPCODE SI 0 1 1 1 0 DON'T CARE 1 MSB 1 1 X X X X X X X X X MSB DATA BYTE 1 SO HIGH-IMPEDANCE D MSB 46 D D D D D D D D MSB AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 24.10 Status Register Read (Opcode D7H) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SCK OPCODE SI 1 1 0 1 0 1 1 1 MSB STATUS REGISTER DATA SO HIGH-IMPEDANCE D D D D D D D MSB STATUS REGISTER DATA D D D D D D D D D MSB D D MSB 24.11 Manufacturer and Device Read (Opcode 9FH) CS 0 6 7 8 14 15 16 22 23 24 30 31 32 38 SCK OPCODE SI SO 9FH HIGH-IMPEDANCE Note: Each transition 1FH DEVICE ID BYTE 1 DEVICE ID BYTE 2 00H shown for SI and SO represents one byte (8 bits) 47 3542N-DFLASH-2/2014 25. Detailed 8-bit Read Waveforms - Rapid8 Mode 0/Mode 3 25.1 Continuous Array Read (Opcode: E8H) CS 0 CLK 1 tSU I/O7-I/O0 (INPUT) 2 3 21 BINARY & STANDARD DATAFLASH PAGE SIZE CMD ADDR ADDR 22 23 24 19 DUMMY BYTES ADDR X X X tV I/O7-I/O0 (OUTPUT) 26 25 DATA OUT HIGH IMPEDANCE DATA DATA DATA DATA DATA DATA BYTE 1023/1055 OF PAGE n 25.2 DATA DATA DATA BYTE 0 OF PAGE n+1 Main Memory Page Read (Opcode: D2H) CS CLK 0 tSU I/07-I/O0 (INPUT) 1 2 19 3 20 BINARY & STANDARD DATAFLASH PAGE SIZE CMD ADDR ADDR 21 22 23 24 X X X X X tV 25.3 26 19 DUMMY BYTES ADDR DATA OUT HIGH IMPEDANCE I/07-I/O0 (OUTPUT) 25 DATA DATA DATA DATA Buffer Read (Opcode: 54H or 56H) CS CLK 0 2 3 ADDRESS BYTES BINARY & STANDARD DATAFLASH PAGE SIZE tSU I/O7-I/O0 (INPUT) 1 CMD X ADDR ADDR 4 5 6 DUMMY BYTES X X tV I/O7-I/O0 (OUTPUT) 48 7 DATA OUT HIGH IMPEDANCE DATA DATA DATA AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 25.4 Status Register Read (Opcode: D7H) CS CLK 0 1 2 3 X DATA tSU I/O7-I/O0 (INPUT) CMD tV I/O7-I/O0 (OUTPUT) HIGH IMPEDANCE X DATA STATUS REGISTER OUTPUT 26. Auto Page Rewrite Flowchart Figure 26-1. Algorithm for Programming or Reprogramming of the Entire Array Sequentially START provide address and data BUFFER WRITE (84H, 87H) MAIN MEMORY PAGE PROGRAM THROUGH BUFFER (82H, 85H) BUFFER TO MAIN MEMORY PAGE PROGRAM (83H, 86H) END Notes: 1. This type of algorithm is used for applications in which the entire array is programmed sequentially, filling the array page-bypage. 2. A page can be written using either a Main Memory Page Program operation or a Buffer Write operation followed by a Buffer to Main Memory Page Program operation. 3. The algorithm above shows the programming of a single page. The algorithm will be repeated sequentially for each page within the entire array. 49 3542N-DFLASH-2/2014 Figure 26-2. Algorithm for Randomly Modifying Data START provide address of page to modify MAIN MEMORY PAGE TO BUFFER TRANSFER (53H, 55H) If planning to modify multiple bytes currently stored within a page of the Flash array BUFFER WRITE (84H, 87H) MAIN MEMORY PAGE PROGRAM THROUGH BUFFER (82H, 85H) BUFFER TO MAIN MEMORY PAGE PROGRAM (83H, 86H) (2) AUTO PAGE REWRITE (58H, 59H) INCREMENT PAGE (2) ADDRESS POINTER END Notes: 1. To preserve data integrity, each page of an DataFlash sector must be updated/rewritten at least once within every 10,000 cumulative page erase and program operations. 2. A Page Address Pointer must be maintained to indicate which page is to be rewritten. The Auto Page Rewrite command must use the address specified by the Page Address Pointer. 3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 10,000 cumulative page erase and program operations have accumulated before rewriting all pages of the sector. See application note AN-4 ("Using Adesto Serial DataFlash") for more details. 50 AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 27. Ordering Information 27.1 Ordering Code Detail AT 4 5 DB 6 4 2 D - CNU Designator Product Family Device Grade U = Matte Sn lead finish, industrial temperature range (-40C to +85C) Package Option Device Density CN = 8-lead, 6 x 8mm CASON T = 28-lead, 8 x 13.4mm TSOP C = 24 Ball BGA 64 = 64-megabit Interface 2 = Dual Device Revision 27.2 Green Package Options (Pb/Halide-free/RoHS Compliant) Ordering Code(1)(2) Package AT45DB642D-CNU AT45DB642D-CNU-SL954(3) AT45DB642D-CNU-SL955(4) 8CN3 AT45DB642D-TU 28T AT45DB642D-CU 24C1 Notes: Lead Finish Operating Voltage fSCK (MHz) Matte Sn 2.7V to 3.6V 66 Matte Sn 2.7V to 3.6V 66 Operation Range Industrial (-40C to 85C) 2.7V to 3.6V 1. The shipping carrier option is not marked on the devices 2. Standard parts are shipped with the page size set to 1056-bytes. The user is able to configure these parts to a 1024-byte page size if desired 3. Parts ordered with suffix SL954 are shipped in bulk with the page size set to 1024-bytes. Parts will have a 954 or SL954 marked on them 4. Parts ordered with suffix SL955 are shipped in tape and reel with the page size set to 1024-bytes. Parts will have a 954 or SL954 marked on them Package Type 28T 28-lead, (8 x 13.4mm) Plastic Thin Small Outline Package, Type I (TSOP) 8CN3 8-pad (6mm x 8mm) Chip Array Small Outline No Lead Package (CASON) 24C1 24-Ball, 6mm x 8mm x 1,4mm Ball Grid Array with a 1mm pitch 5 x 5 Ball Matrix 51 3542N-DFLASH-2/2014 28. Packaging Information 28.1 28T - TSOP, Type 1 PIN 1 0 ~ 5 c Pin 1 Identifier Area D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-183. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15mm per side and on D1 is 0.25mm per side. 3. Lead coplanarity is 0.10mm maximum. NOTE A2 0.90 1.00 1.05 D 13.20 13.40 13.60 D1 11.70 11.80 11.90 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 - 0.21 e 0.55 BASIC 12/06/02 Package Drawing Contact: contact@adestotech.com 52 TITLE 28T, 28-lead (8 x 13.4mm) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 28T C AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 28.2 8CN3 - CASON Marked Pin1 Indentifier E A A1 D Top View Side View Pin1 Pad Corner L1 0.10 mm TYP 8 1 e 7 2 6 3 COMMON DIMENSIONS (Unit of Measure = mm) b SYMBOL MIN NOM MAX 0.17 0.21 0.25 A 5 4 e1 L Bottom View A1 1.0 b 0.41 TYP 7.90 8.00 8.10 E 5.90 6.00 6.10 e 1.27 BSC e1 1.095 REF L Notes: 1. 2. 3. 4. All dimensions and tolerance conform to ASME Y 14.5M, 1994 The surface finish of the package shall be EDM Charmille #24-27 o Unless otherwise specified tolerance: Decimal 0.05, Angular 2 Metal Pad Dimensions 4 D L1 NOTE 0.67 TYP 0.92 0.97 4 1.02 4 7/10/03 TITLE Package Drawing Contact: 8CN3, 8-pad (6 x 8 x 1.0mm Body), Lead Pitch 1.27mm, Chip Array Small Outline No Lead Package (CASON) contact@adestotech.com DRAWING NO. 8CN3 REV. B 53 3542N-DFLASH-2/2014 28.3 24C1 - Ball Grid Array Dimensions in Millimeters and (Inches). Controlling dimension: Millimeters. 6.10(0.240) 5.90(0.232) A1 ID 8.10(0.319) 7.90(0.311) SIDE VIEW 0.30 (0.012)MIN TOP VIEW 1.40 (0.055) MAX 1.00 (0.039) REF 4.0 (0.157) 5 4 3 2 1 2.00 (0.079) REF A B 1.00 (0.0394) BSC NON-ACCUMULATIVE 4.0 (0.157) C D E 0.46 (0.018) DIA BALL TYP 1.00 (0.0394) BSC NON-ACCUMULATIVE BOTTOM VIEW 04/11/01 Package Drawing Contact: contact@adestotech.com 54 TITLE 24C1, 24-ball (5 x 5 Array), 6 x 8 x 1.4 mm Body, 1.0 mm Ball Pitch Chip-scale Ball Grid Array Package (CBGA) DRAWING NO. 24C1 REV. A AT45DB642D 3542N-DFLASH-2/2014 AT45DB642D 29. Revision History Revision Level - Release Date History A - September 2005 Initial release B - November 2005 Changed tVCSL from 30s to 50s min. Changed tPUW from 10ms to 20ms max. Changed tDIS from 8ns to 6ns max. Changed tV from 8ns to 6ns max. C - March 2006 Added text, in "Programming the Configuration Register", to indicate that power cycling is required to switch to "power of 2" page size after the opcode has been executed. D - July 2006 Corrected typographical errors. E - August 2006 Added errata regarding Chip Erase. F - August 2006 Added tSCKR and tSCKF parameters to Table 18-4. G - August 2007 Added additional text for "power of 2" binary page size option. Changed tRDPD from 30s to 35s. Added tCLKR and tCLKF parameters to Table 18-5. H - April 2008 Added part number ordering code details for suffixes SL954/955. Added ordering code details. I - February 2009 Changed tDIS (Typ and Max) to 27ns and 35ns, respectively, for RapidS interface. J - March 2009 Changed Deep Power-Down Current values - Increased typical value from 9A to 15A. - Increased maximum value from 18A to 25A. K - April 2009 Updated Absolute Maximum Ratings Added 24C1 24 Ball BGA package Option Deleted DataFlash Card Package Option L - May 2010 Changed tSE (Typ) 1.6 to 0.7 and (Max) 5 to 1.3 Changed from 10,000 to 20,000 cumulative page erase/program operations and added the please contact Adesto statement in section 11.3. M-November 2012 Update all Adesto Logos. N- February 2014 Not Recommended for New Designs. 55 3542N-DFLASH-2/2014 30. Errata 30.1 30.1.1 Chip Erase Issue In a certain percentage of units, the Chip Erase feature may not function correctly and may adversely affect device operation. Therefore, it is recommended that the Chip Erase commands (opcodes C7H, 94H, 80H, and 9AH) not be used. 30.1.2 Workaround Use Block Erase (opcode 50H) as an alternative. The Block Erase function is not affected by the Chip Erase issue. 30.1.3 Resolution The Chip Erase feature may be fixed with a new revision of the device. Please contact Adesto(R) for the estimated availability of devices with the fix. 56 AT45DB642D 3542N-DFLASH-2/2014 Corporate Office California | USA Adesto Headquarters 1250 Borregas Avenue Sunnyvale, CA 94089 Phone: (+1) 408.400.0578 Email: contact@adestotech.com (c) 2014 Adesto Technologies. All rights reserved. / Rev.: 3542N-DFLASH-2/2014 Adesto(R), the Adesto logo, CBRAM(R), and DataFlash(R) are registered trademarks or trademarks of Adesto Technologies. All other marks are the property of their respective owners. Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.