佰鴻工業股份有限公司
http://www.brtled.com
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Features:
1. Emitted Color: Bluish Green.
2. Lend Appearance: Water Clear.
3. Wide range of collector current.
4. Low cost plastic package
5. This product doesn’t contain restriction
Substance, comply ROHS standard.
Applications:
1. Smoke Detector
2. Automatic Control System
Absolute Maximum Ratings(Ta=25)
Parameter Rating Unit
Power Dissipation 120 mW
Collector-Emitter Voltage (Max.) 30 V
Emitter-Collector Voltage(Min.) 100 V
Operating Temperature Range -25~80 -
Storage Temperature Range -30~85 -
Soldering Temperature See Page 4 -
Package Dimensions:
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
Ver.2.0 Page 1 of 6
佰鴻工業股份有限公司
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Electrical and optical characteristics(Ta=25)
Parameter Symbol Condition Min. Typ. Max. Unit
Forward Voltage Vf IF=20mA - 3.2 3.6 V
Luminous Intensity Iv IF=20mA 140 300 - mcd
Reverse Current IR VR=5V - - 100 µA
Peak Wave Length λp IF=20mA - 505 - nm
Dominant Wave Length λd IF=20mA 500 510 nm
Spectral Line Half-width Δλ IF=20mA - 30 - nm
Veiwing Angle 2θ1/2 I
F=20mA - 35 - deg
Typical Electro-Optical Characteristics Curves
Ver.2.0 Page 2 of 6
佰鴻工業股份有限公司
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Tapping and packaging specifications(Units: mm)
SPECIFICATION
Minimum Maximum
ITEM SYMBOL
mm inch mm inch
Tape Feed Hole Diameter (DIA) D0 1.40 0.055 1.55 0.061
Feed Hole Location E 1.65 0.065 1.85 0.072
Centers Line Dimensions Length Direction F 5.45 0.215 5.55 0.218
Compartment Depth K0 3.00 0.118 3.20 0.126
Carrier Tape Overall Thickness K 3.00 0.118 3.20 0.126
Compartment Pitch P 3.90 0.153 4.10 0.161
Sprocket Hole Diameter P0 3.90 0.153 4.10 0.161
Centers Line Dimensions Length Direction P2 1.95 0.076 2.05 0.080
Carrier Tape Thickness t 0.30 0.012
Carrier Tape Width W 12.00 0.472 12.30 0.484
Flange Diameter A 178.0 7.008 180.0 7.087
Hub Spindle Hole C 12.50 0.492 13.50 0.531
Hub Diameter D2 20.00 0.788 21.50 0.846
Fixing Tape Width W1 9.00 0.354 9.30 0.366
Flange Space Between Flanges T 16.00 0.629 17.00 0.669
Compartment Length A0 1.87 0.074 2.07 0.081
Compartment Width B0 6.30 0.248 6.50 0.256
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Ver.2.0 Page 3 of 6
佰鴻工業股份有限公司
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Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021 :B-1
Connect with a power VCE=5V
Ta=Under room temperature
Test time=1,000hrs
0/20
High
Temperature
High Humidity
Storage
MIL-STD-202:103B
JIS C 7021 :B-11
Ta=+65 ±5℃℃
RH=90%-95%
Test time=240hrs 0/20
High
Temperature
Storage
MIL-STD-883:1008
JIS C 7021 :B-10
High Ta=+85 ±5℃℃
Test time=1,000hrs 0/20
Endurance
Test
Low
Temperature
Storage
JIS-C-7021 :B-12
Low Ta=-35 ±5℃℃
Test time=1,000hrs 0/20
Temperature
Cycling
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
-35 ~ +25 ~ +85 ~ +25℃℃℃℃
60min 20min 60min 20min
Test Time=5cycle 0/20
Thermal Shock MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1011
-35 ~ +85 ℃℃ ℃℃
20min 20min
Test Time=10cycle
0/20
Environmental
Test
Solder
Resistance MIL-STD-202:201A
MIL-STD-750:2031
JIS C 7021 :A-1
Preheating
140-160, within 2 minutes.
Operation heating
260 (Max.), within 10seconds. (Max.)
0/20
Judgment criteria of failure for the reliability
Measuring items Symbol Measuring conditions Judgment criteria for failure
Collector Dark Current ICEO V
CE=20V Over Ux2
Collector Light Current IC(ON) V
CE= 5V, H=1.0 mW/cm2,λp=940nm Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2. Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.2.0 Page 4 of 6
佰鴻工業股份有限公司
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Soldering :
1. Manual of Soldering
The temperature of the iron tip should not be higher than 300(572) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140~160±5,within 2 minutes.
Operation heating : 260(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3. DIP soldering (Wave Soldering) :
Preheating : 120~150,within 120~180 sec.
Operation heating : 245℃±5 within 5 sec.260 (Max)
Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
Time
OVER 2 MIN.
4 /SEC. MAX.
4 /SEC. MAX.
10 SEC. MAX.
260 MAX.
140~160
Temperature
Time
120~180 sec.
Preheat
245 ±5 within 5 sec.
Soldering heat Max. 260
120~150
Ver.2.0 Page 5 of 6
佰鴻工業股份有限公司
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Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5-30(41)Humidity : RH 60Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60±3.
Package and Label of Products:
(1) Package: Products are packed in one bag of 1500 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx xx xx
Year Month Day
Manufacture Location
Ver.2.0 Page 6 of 6
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