KX E C SEMICONDUCTOR KIA7805AP/API ~ TECHNICAL DATA KIA7824AP/API BIPOLAR LINEAR INTEGRATED CIRCUIT THREE TERMINAL POSITIVE VOLTAGE REGULATORS 5V, 6V, 8V, OV, 10V, 12V, 15V, 18V, 20V, 24V. A R s FEATURES Le 2) ; | * Suitable for C-MOS, TTL, the Other | - Digital ICs Power Supply. | = ~ SD a * Internal Thermal Overload Protection. | B 15.30 MAX * Internal Short Circuit Current Limiting. 5 seman * Output Current in Excess of 1A. | | t| | z 3.00. * Satisfies IEC-65 Specification. | | | z $n) (International Electronical Commission). LI t 560 MAK a Ls ar ; K 0.50 a L 1.50 MAX MAXIMUM RATINGS (Ta=25) K . =a CHARACTERISTIC SYMBOL | RATING | UNIT i 2d oi J KTA7805AP/API ~ 35 1. INPUT I eacoz0 KIA7815AP/API 2. COMMON(CASE) 8 8.004: 0.20 Input Voltage VIN Vv T 2.90 MAK KIA7818AP/API ~ 40 3. OUTPUT KIA7824AP/API Power Dissipation (Tc=25T) Pp 20.8 W TO220AB Power Dissipation | KIA7805API~ . . Pp 2.0 W (Without Heatsink) | KIA7824API Operating Junction Temperature Tj -80~ 150 Cc Storage Temperature Tstg -55 ~ 150 Cc DIM| MILLIMETERS A 10.30 MAX B 15.30 MAX c 2.704 0.30 D 0.85 MAX E 93.204 0.20 F 3.004 0.30 G 12.30 MAX H 0.75 MAX J 13.604 0.50 K 3.90 MAX L 1.20 M 1.30 N 2.54 0 4.504 0.20 P 6.80 Q 2.604 0.20 T T R 10 a | s 25 a oo ao T 5 1 2 3 1, U 0.5 Vv 2.604 0.15 1. INPUT 2. COMMON 3. OUTPUT TO220IS 1999. 4. 21 Revision No : 2 KEC 1/19KIA7805AP/API ~ KIA7824AP/API EQUIVALENT CIRCUIT 1) INPUT nN x oO ZS 11 Qt1-1 at N q Q15 . . Q16 W +{arz L \ le = ais bin | ZS R14 fai? co if S Ss Bs m fe 3) OUTPUT o (ais N 96 ss ary =) Ps 5 gs & S Ro Cl ZS aro R21 Q7 Q3 Q5 Q9g [os R13 bV/V R4 VW R5 AAG R6 R8 (2) COMMON (GND) 1999. 4. 21 Revision No : 2 KEC 2/19KIA7805AP/API ~ KIA7824AP/API KIA7805AP/API ELECTRICAL CHARACTERISTICS (Viw=10V, Iour=500mA, 0 RR=20 log <1 (4B) 0.39uF O O 1999. 4. 21 Revision No : 2 KEC 13/19KIA7805AP/API ~ KIA7824AP/API APPLICATION (1) VOLTAGE BOOST REGULATOR (a) Voltage boost by use of zener diode CIRCUIT Vin O OVouT [xy KIA78xxAP /API ce i 35 +] & oD 4 | 2 oS pa S 2 Vi | ety > Your (IC) V +11 R1 Z 7 411 2 5mA 71177 71177 Vout = Vout (Ic) + Vz (b) Voltage boost by use of resistor Vin O ? OVouT tx, KIA78xxAP /API . gt LS shi e a og Ys Oo Ip 4 on BS 71177 71177 71177 R2 Vout = Vout(ic) (1+ Ri )+R2-Ig (c) Adjustable output regulator Vin O t OVouT IKTIA78xxAP / API gt 3 ats 3 -5 mms oO _ ~ oO _ KIA4558P/S X ie 71177 7177 71117 T1177 R2 Vout = Vout(ic) (1+ ) R1 1999. 4. 21 Revision No : 2 KEC 14/19KIA7805AP/API ~ KIA7824AP/API (2) CURRENT BOOST REGULATOR ViInO WA \ SJ OVour KIA78xxAP /API | |+ 0.1uF + 10uF PRECAUTIONS ON APPLICATION (1) In regard to GND, be careful not to apply a negative voltage to the input/ output terminal. Further, special care is necessary in case of a voltage boost application. (2) When a surge voltage exceeding maximum rating is applied to the input terminal or when a voltage in excess of the input terminal voltage is applied to the output terminal, the circuit may be destroyed. Specially, in the latter case, great care is necessary Further, if the input terminal shorts to GND in a state of normal operation, the output terminal voltage becomes higher than the input voltage (GND potential), and the electric charge of a chemical capacitor connected to the output terminal flows into the input side, which may cause the destruction of circuit. In these cases, take such steps as a zener diode and a general silicon diode are connected to the circuit, as shown in the following figure. Output surge and input short protecting Lo diode. 1 Vin ? IA78xxAP /API Your SERIES Vz Input surge _~ protecting Vz > Vin diode. (3) When the input voltage is too high, the power dissipation of three terminal regulator increase because of series regulator, so that the junction temperature rises. In such a case, it is recommended to reduce the power dissipation by inserting the power limiting resistor Rsp in the input terminal, and to reduce the junction temperature as a result. 1999. 4. 21 Revision No : 2 KEC 15/19KIA7805A P/API ~ KIA7824AP/API Vin' IouT VINO KIA78xxAP /API Vout SERIES 0.33uF | | Ip 71117 The power dissipation Pp of IC is expressed in the following equation. Pp = (Viw-Vour) + Tour + Vin + Is If Vin is reduced below the lowest voltage necessary for the IC, the parasitic oscillation will be caused according to circumstances. In determining the resistance value of Rsp, design with margin should be made by making reference to the following equation. VIN ~ Vin Rsp < Iovr + Is (4) Connect the input terminal and GND, and the output terminal and GND, by capacitor respectively. The capacitances should be determined experimentally because they depend on printed patterns. In particular, adequate investigation should be made so that there is no problem even at time of high or low temperature. (5) Installation of IC for power supply For obtaining high reliability on the heat sink design of the regulator IC, it is generally required to derate more than 20% of maximum junction temperature (T; MAX.) Further, full consideration should be given to the installation of IC to the heat sink. (a) Heat sink design The thermal resistance of IC itself is required from the viewpoint of the design of elements, but the thermal resistance from the IC package to the open air varies with the contact thermal resistance. Table 1 shows how much the value of the contact thermal resistance (@c + @s) is changed by insulating sheet (mica) and heat sink grease. TABLE 1. UNIT: C/W PACKAGE MODEL NO. TORQUE MICA O0-c+@s5 Not Provided 0.3~0.50.5~2.0) TO-220AB KIA78xxAP/API 6kg-cm , Provided 2.0 ~2.5(4.0 ~6.0) The figures given in parentheses denote the values at time of no grease. The package of regulator IC serves as GND, therefore, usually use the value at time of "no mica 1999. 4, 21 Revision No : 2 KEC 16/19KIA7805AP/API ~ KIA7824AP/API (b) Silicon grease When a circuit not exceeding maximum rating is designed, it is to be desired that the grease should be used if possible. If it is required that the contact thermal resistance is reduced from the view-point of the circuit design, It is recommended that the following methods be adopted. A: Use Thercon (Fuji High Polymer Kogyo K.K) B: Use SC101 (Torei Silicon) or G-640 (GE), if grease is used. (c) Torque When installing IC on a heat sink or the like, tighten the IC with the torque of less than the rated value. If it is tightened with the torque in excess of the rated value, sometimes the internal elements of the IC are adversely affected. Therefore, great care should be given to the installing operation. Further, if polycarbonate screws are used, the torque causes a change with the passage of time, which may lessen the effect of radiation. (6) IEC (International Electronical Commission)65 Specification. (a) IEC (International Electronical Commission)-65 is the standard, parts testing method, machinery and tolls (used in connecting main power directly and indirectly) Which are used at home and general building. The purpose of the above standard is not to breaking out the risk which is related to an electric shock, a heating, a fire and the damage of surrounding parts in the case of normal or abnormal operating. (b) In case temperature is limited by temperature overheating prevention device, fuse or the operation of fuse resistor One must calculate the temperature of PCB substrate in 2 minute. ATS 4 & Z g = a o Pp 2 > 2 n KIA7805API 5 KIA7805API q Ne 6.0 | 62.5 oe i A 16 C7] (KIA7800API Series) < - loyp= wn 50 2 N 5 1 _~ 5 8 N Oo -~ a, N a cj 4: WITHOUT HEAT N ro a SINK \ A 9 2 o(LDrrr ik 0 50 100 150 9 0 40 80 120 160 200 4 JUNCTION TEMPERATURE Tj (C) < AMBIENT TEMPERATURE Ta (C) Zour f = Pp Ta S o05W & 24 s FN oo A 2 THERMAL RESISTANCE B 0.3 pour=s0hm So 20 N 2 J-C | J-A |. N EB RY 6.0 | as |!" bs 16 e,+ (KIA7800AP Series) Z w \ A A 12 M & we \ = 0.1 E \ 5 0.05 mn 4 |WITHOUT HEAT N o a SINK _ \ 2 0.03 3 9 hot tN 100 1k 10k 100k 0 40 80 120 160 200 4 FREQUENCY f (Hz) < AMBIENT TEMPERATURE Ta (C) 1999, 4. 21 Revision No : 2 KEC 19/19