ES52K1F05N-16.367667M TR RoHS Pb ES52K1 F 05 N -16.367667M TR Series RoHS Compliant (Pb-free) 3.0V 2.5mm x 3.2mm Ceramic SMD Clipped Sinewave TC(VC)XO Packaging Options Tape & Reel Operating Temperature Range -30C to +85C Frequency Stability 0.5ppm Maximum Nominal Frequency 16.367667MHz Control Voltage None (No Connect on Pad 1) ELECTRICAL SPECIFICATIONS Nominal Frequency 16.367667MHz Frequency Stability vs. Frequency Tolerance 0.5ppm Maximum (at 25C 2C, at Vdd=3.0Vdc, and Vc=1.5Vdc) Frequency Stability 0.5ppm Maximum (Inclusive of Operating Temperature Range, At Vdd=3.0Vdc and Vc=1.5Vdc) Frequency Stability vs. Input Voltage 0.2ppm Maximum (5%) Frequency Stability vs. Aging 1ppm/year Maximum (at 25C) Frequency Stability vs. Load 0.2ppm Maximum (1kOhm//1pF) Operating Temperature Range -30C to +85C Supply Voltage +3.0Vdc 5% Input Current 2.0mA Maximum Output Voltage 0.8Vp-p Clipped Sinewave Minimum (External DC-Cut capacitor required, 1000pF recommended) Load Drive Capability 10kOhms//10pF Output Logic Type Clipped Sinewave Control Voltage None (No Connect on Pad 1) Phase Noise -80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset (Typical Values at 16.368MHz) Start Up Time 5mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 1 of 5 ES52K1F05N-16.367667M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.90 0.10 2.50 0.20 2 MARKING ORIENTATION 3.20 0.20 0.70 0.10 (X4) 3 1.60 0.10 1 1.10 0.10 4 PIN CONNECTION 1 No Connect 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 0.80 0.10 (X4) 1 EXX.XXX E=Ecliptek XX.XXX=Nominal Frequency in MHz (5 Digits Maximum + Decimal) 2 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year Suggested Solder Pad Layout All Dimensions in Millimeters 0.9 (X4) 0.9 (X4) Solder Land (X4) 1.6 0.9 All Tolerances are 0.1 CLOCK OUTPUT OUTPUT WAVEFORM 0VDC VP-P www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 2 of 5 ES52K1F05N-16.367667M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.55 0.05 0.25 0.05 5.5 0.1 12.0 0.2 B0* 6.5 0.1 4.0 0.1 A0* K0* *Compliant to EIA 481A 1.5 MIN 18.4 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 12.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 3 of 5 ES52K1F05N-16.367667M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 4 of 5 ES52K1F05N-16.367667M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 5 of 5