ES52K1F05N-16.367667M TR - Ecliptek Corporation

RoHS

ES52K1F05N-16.367667M TR

ES52K1 F 05 N -16.367667M TR

Series

RoHS Compliant (Pb-free) 3.0V 2.5mm x 3.2mm

Ceramic SMD Clipped Sinewave TC(VC)XO

Operating Temperature Range

-30°C to +85°C

Frequency Stability

±0.5ppm Maximum

Packaging Options

Tape & Reel

Nominal Frequency

16.367667MHz

Control Voltage

None (No Connect on Pad 1)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 16.367667MHz

Frequency Stability vs. Frequency

Tolerance ±0.5ppm Maximum (at 25°C ±2°C, at Vdd=3.0Vdc, and Vc=1.5Vdc)

Frequency Stability ±0.5ppm Maximum (Inclusive of Operating Temperature Range, At Vdd=3.0Vdc and Vc=1.5Vdc)

Frequency Stability vs. Input Voltage ±0.2ppm Maximum (±5%)

Frequency Stability vs. Aging ±1ppm/year Maximum (at 25°C)

Frequency Stability vs. Load ±0.2ppm Maximum (±1kOhm//±1pF)

Operating Temperature Range -30°C to +85°C

Supply Voltage +3.0Vdc ±5%

Input Current 2.0mA Maximum

Output Voltage 0.8Vp-p Clipped Sinewave Minimum (External DC-Cut capacitor required, 1000pF recommended)

Load Drive Capability 10kOhms//10pF

Output Logic Type Clipped Sinewave

Control Voltage None (No Connect on Pad 1)

Phase Noise -80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at

10kHz Offset (Typical Values at 16.368MHz)

Start Up Time 5mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014 Condition A

Gross Leak Test MIL-STD-883, Method 1014 Condition C

Mechanical Shock MIL-STD-202, Method 213 Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 1 of 5

ES52K1F05N-16.367667M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

2.50

±0.20

3.20

±0.20

0.90

±0.10 0.70 ±0.10 (X4)

1.60

±0.10

1.10

±0.10

0.80

±0.10

(X4)

MARKING

ORIENTATION

PIN CONNECTION

1 No Connect

2 Case/Ground

3 Output

4 Supply Voltage

LINE MARKING

1EXX.XXX

E=Ecliptek

XX.XXX=Nominal

Frequency in MHz (5 Digits

Maximum + Decimal)

2XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

1.6

0.9

0.9 (X4)

OUTPUT WAVEFORM

0VDC

CLOCK OUTPUT

VP-P

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 2 of 5

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

ES52K1F05N-16.367667M TR

12.0 ±0.2

5.5 ±0.1

6.5 ±0.1

4.0 ±0.1

2.0 ±0.1

4.0 ±0.1 A0*

DIA 1.55 ±0.05

B0*

0.25 ±0.05

K0*

18.4 MAX

180 MAX

Quantity Per Reel: 1,000 units

12.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 3 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

ES52K1F05N-16.367667M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 4 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

ES52K1F05N-16.367667M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/20/2010 | Page 5 of 5