POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a suc-
cessful design. When operating in capacitor-coupled mode,
Equation 1 states the maximum power dissipation point for a
single-ended amplifier operating at a given supply voltage
and driving a specified output load.
PDMAX = (VDD) 2 / (2π2RL) (1)
Since the LM4911/LM4911Q has two operational amplifiers
in one package, the maximum internal power dissipation point
is twice that of the number which results from Equation 1.
From Equation 1, assuming a 3V power supply and an 32Ω
load, the maximum power dissipation point is 14mW per am-
plifier. Thus the maximum package dissipation point is 28mW.
When operating in OCL mode, the maximum power dissipa-
tion increases due to the use of the third amplifier as a buffer
and is given in Equation 2:
PDMAX = 4(VDD) 2 / (π2RL) (2)
The maximum power dissipation point obtained from either
Equation 1 or 2 must not be greater than the power dissipation
that results from Equation 3:
PDMAX = (TJMAX - TA) / θJA (3)
For package MUB10A, θJA = 190°C/W; for package LDA10A,
θJA = 63°C/W. TJMAX = 150°C for the LM4911/LM4911Q. De-
pending on the ambient temperature, TA, of the system sur-
roundings, Equation 3 can be used to find the maximum
internal power dissipation supported by the IC packaging. If
the result of Equation 1 or 2 is greater than that of Equation
3, then either the supply voltage must be decreased, the load
impedance increased or TA reduced. For the typical applica-
tion of a 3V power supply, with a 32Ω load, the maximum
ambient temperature possible without violating the maximum
junction temperature is approximately 144°C provided that
device operation is around the maximum power dissipation
point. Thus, for typical applications, power dissipation is not
an issue. Power dissipation is a function of output power and
thus, if typical operation is not around the maximum power
dissipation point, the ambient temperature may be increased
accordingly. Refer to the Typical Performance Characteristics
curves for power dissipation information for lower output pow-
ers.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4911/LM4911Q's exposed-DAP (die attach paddle)
package (LD) provides a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP's PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
Further detailed and specific information concerning PCB lay-
out, fabrication, and mounting an LD (LLP) package is avail-
able from National Semiconductor's Package Engineering
Group under application note AN1187.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is important
for low noise performance and high power supply rejection.
The capacitor location on the power supply pins should be as
close to the device as possible.
Typical applications employ a 3V regulator with 10mF tanta-
lum or electrolytic capacitor and a ceramic bypass capacitor
which aid in supply stability. This does not eliminate the need
for bypassing the supply nodes of the LM4911/LM4911Q. A
bypass capacitor value in the range of 0.1µF to 1µF is rec-
ommended for CS.
MICRO POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4911/LM4911Q's shutdown function. Activate micro-pow-
er shutdown by applying a logic-low voltage to the SHUT-
DOWN pin. When active, the LM4911/LM4911Q's micro-
power shutdown feature turns off the amplifier's bias circuitry,
reducing the supply current. The trigger point varies depend-
ing on supply voltage and is shown in the Shutdown Hystere-
sis Voltage graphs in the Typical Performance Characteristics
section. The low 0.1µA(typ) shutdown current is achieved by
applying a voltage that is as near as ground as possible to the
SHUTDOWN pin. A voltage that is higher than ground may
increase the shutdown current. There are a few ways to con-
trol the micro-power shutdown. These include using a single-
pole, single-throw switch, a microprocessor, or a microcon-
troller. When using a switch, connect an external 100kΩ pull-
up resistor between the SHUTDOWN pin and VDD. Connect
the switch between the SHUTDOWN pin and ground. Select
normal amplifier operation by opening the switch. Closing the
switch connects the SHUTDOWN pin to ground, activating
micro-power shutdown.
The switch and resistor guarantee that the SHUTDOWN pin
will not float. This prevents unwanted state changes. In a sys-
tem with a microprocessor or microcontroller, use a digital
output to apply the control voltage to the SHUTDOWN pin.
Driving the SHUTDOWN pin with active circuitry eliminates
the pull-up resistor.
Shutdown enable/disable times are controlled by a combina-
tion of CB and VDD. Larger values of CB results in longer turn
on/off times from Shutdown. Smaller VDD values also increase
turn on/off time for a given value of CB. Longer shutdown
times also improve the LM4911/LM4911Q's resistance to
click and pop upon entering or returning from shutdown. For
a 2.4V supply and CB = 4.7µF, the LM4911/LM4911Q re-
quires about 2 seconds to enter or return from shutdown. This
longer shutdown time enables the LM4911/LM4911Q to have
virtually zero pop and click transients upon entering or release
from shutdown.
Smaller values of CB will decrease turn-on time, but at the cost
of increased pop and click and reduced PSRR. Since shut-
down enable/disable times increase dramatically as supply
voltage gets below 2.2V, this reduced turn-on time may be
desirable if extreme low supply voltage levels are used as this
would offset increases in turn-on time caused by the lower
supply voltage. This technique is not recommended for OCL
mode since shutdown enable/disable times are very fast
(0.5s) independent of supply voltage.
When in cap-coupled mode, some restrictions on the usage
of Mute are in effect when entering or returning from shut-
down. These restrictions require Mute not be toggled imme-
diately following a return or entrance to shutdown for a brief
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LM4911/LM4911Q