LOC110 Single Linear Optocoupler INTEGRATED CIRCUITS DIVISION Parameter LED Operating Range K3, Transfer Gain Isolation, Input to Output Rating 2 - 10 0.668 - 1.179 3750 Description Units mA - Vrms Features * * * * * * * * 0.01% Servo Linearity THD -87dB Typical Wide Bandwidth (>200kHz) Couples Analog and Digital Signals High Gain Stability Low Input/Output Capacitance Low Power Consumption 8-Pin Flatpack or DIP Package (PCMCIA Compatible) * Machine Insertable, Wave Solderable * Surface Mount and Tape & Reel Versions Available Applications * Modem Transformer Replacement With No Insertion Loss * Digital Telephone Isolation * Power Supply Feedback Voltage/Current * Medical Sensor Isolation * Audio Signal Interfacing * Isolation of Process Control Transducers The LOC110 Single Linear Optocoupler features an infrared LED optically coupled with two photodiodes. One feedback (input) photodiode is used to generate a control signal that provides a servomechanism to the LED drive current, thus compensating for the LED's nonlinear time and temperature characteristics. The other (output) photodiode provides an output signal that is linear with respect to the servo LED current. The product features wide bandwidth, high input to output isolation, and excellent servo linearity. Approvals * UL Recognized Component: File # E76270 * CSA Certified Component: Certificate # 1175739 * Certified to: IEC 60950-1: 2005 EN 60950-1: 2006 TUV Certificate # B 09 07 49410 006 Ordering Information Part Number LOC110 LOC110P LOC110PTR LOC110S LOC110STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/tube) 8-Pin Surface Mount (1000/Reel) K3 Sorted Bins Bin C = 0.668 - 0.732 Bin D = 0.733 - 0.805 Bin E = 0.806 - 0.886 Bin F = 0.887 - 0.974 Bin G = 0.975 - 1.072 Bin H = 1.073 - 1.179 * The LOC110 will be shipped using bins available at date of order. Any bin (C - H) can be shipped. Each tube or reel will contain one K3-sorted bin. Each device will be marked with the designated bin. Pin Configuration - LED + LED C1 Pb DS-LOC110-R09 e3 A1 www.ixysic.com 1 8 2 7 3 6 4 5 N/C N/C C2 A2 1 INTEGRATED CIRCUITS DIVISION LOC110 Absolute Maximum Ratings @ 25C Parameter Reverse LED Voltage Input Control Current Peak (10ms) Input Power Dissipation1 Total Package Dissipation2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 5 100 1 150 500 3750 -40 to +85 -40 to +125 Units V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25C Parameter Input Characteristics LED Voltage Drop Reverse LED Current Coupler/Detector Characteristics Dark Current K1, Servo Gain (IC1/IF) K2, Forward Gain (IC2/IF) K3, Transfer Gain (K2/K1=IC2/IC1) K3, Transfer Gain Linearity (non-servoed) K3 Temperature Coefficient Common-Mode Rejection Ratio Total Harmonic Distortion Frequency Response 1 Input/Output Capacitance 1 Refer 2 Conditions Symbol Min Typ Max Units IF = 2 - 10mA VR = 5V VF IR 0.9 - 1.2 - 1.4 10 V A IF=0mA, VC1-A1=VC2-A2=15V ID K1 K2 K3 K3 K3/T CMRR THD 0.004 0.004 0.668 -96 25 0.030 0.030 1.179 1 -80 nA % % / C dB dB f-3dB - - kHz CI/O - 1 0.007 0.007 1 0.005 130 -87 200 40 3 - pF IF=2 - 10mA, VC1-A1=VC2-A2=15V IF=2 - 10mA IF=2 - 10mA, VC1-A1=VC2-A2= 5V V=20VP-P , RL=2k, f=100Hz f0=350Hz, 0dBm Photoconductive Configuration Photovoltaic Configuration - to Application Note, AN-107, for LOC110 Configurations. www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LOC110 PERFORMANCE DATA @25C (Unless Otherwise Noted)* LED Forward Current vs. LED Forward Voltage LED Current (mA) 50 40 30 20 LED Forward Voltage Drop (V) 100 60 LED Current (mA) Typical LED Forward Voltage Drop vs. Temperature LED Forward Current vs. LED Forward Voltage 10 1 0.1 10 0.01 1.0 1.1 1.2 1.3 1.4 1.5 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) LED Forward Voltage (V) Servo Gain vs. LED Current & Temperature Servo-Photocurrent vs. LED Current & Temperature Servo-Photocurrent (PA) 0C 25C 50C 70C 85C 0.012 0.008 0.004 0.000 0C 25C 120 50C 70C 85C 100 80 60 40 20 0 0 2 4 6 8 LED Current (mA) 10 12 0 2 4 6 8 LED Current (mA) 10 IF=50mA IF=20mA IF=10mA 1.5 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.1 1.0 -40 -20 0 20 40 60 Temperature (C) 80 100 Normalized Servo-Photocurrent vs. LED Current & Temperature 140 0.016 Servo Gain 1.0 Normalized Servo-Photocurrent 0 1.6 12 4.0 0C 25C 50C 70C 85C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 LED Current (mA) 10 12 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LOC110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LOC110 / LOC110P / LOC110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LOC110 / LOC110S 250C for 30 seconds LOC110P 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 4 e3 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LOC110 Mechanical Dimensions LOC110 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LOC110P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 7.620 0.254 (0.300 0.010) 9.398 0.127 (0.370 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 0.013 (0.008 0.0005) 9.652 0.381 (0.380 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) Dimensions mm (inches) LOC110S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LOC110 LOC110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) Dimensions mm (inches) User Direction of Feed NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 LOC110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-LOC110-R09 (c)Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012