RELIABILITY REPORT
FOR
MAX3679CTJ+
PLASTIC ENCAPSULATED DEVICES
February 6, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
MAX3679CTJ+
App roved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved. Page 1/5
Conclusion
MAX3679CTJ+
The MAX3679CTJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim" s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Conte n ts
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3679 is a low-jitter precision clock generator with the integration of three LVPECL and one LVCMOS outputs optimized for Ethernet
applications. The device integrates a crystal oscillator and a phase-locked loop (PLL) clock multiplier to generate high-frequency clock outputs for
Ethernet applications. Maxim's proprietary PLL design features ultra-low jitter (0.36psRMS) and excellent power-supply noise rejection, minimizing
design risk for network equipment.
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II. Manufacturing Information
A. Description/Function: +3.3V, Low-Jitter Crystal to LVPECL Clock Generator
B. Process: MB3
C. Number of Device Transistors:
D. Fabri cation Location: California
E. Assembly Location: ASAT China, Hana Thailand, UTL Thailand
F. Date of Initial Production: Pre 1997
III. Packaging Information
A. Package Type: 32-pin TQFN 5x5
B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Au (1.3 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #
H. Flammability Rating: Class UL94-V0
MAX3679CTJ+
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Singl e Layer Theta Ja: 47°C/W
K. Single Layer Theta Jc: 1.7°C/W
L. Multi Layer Theta Ja: 29°C/W
M. Multi Layer Theta Jc: 2.7°C/W
IV. Die Information
A. Dimensions: 82 X 82 mils
B. Passivation: BCB
C. Interconnect: 2 x Aluminum/Cu (Cu = 0.5%), top layer 100% Cu
D. Backside Metallization: None
E. Minimum Metal Width: 0.35 um
F. Minimum Metal Spacing: 0.35 um
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Di electric: SiO2
I. Die Separation Method: Saw
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V. Quality Assurance Information
A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Directo r of QA )
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
MAX3679CTJ+
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4340 x 47 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.8 x 10-9
= 22.8 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the MB3HT Process results in a FIT Rate of 0.7 @ 25C and 11.5 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The HD86 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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Table 1
Reliability Evaluation Test Results
MAX3679CTJ+
MAX3679CTJ+
TEST ITEM TEST CONDITION FAILURE
IDENTIFICATION
SAMPLE SIZE NUMBER OF
FAILURES
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
DC Parameters 47 0
& functionality
Moisture Testing (Note 2)
85/85 Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77 0
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77 0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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