Model Package Power @ 70°C(watts)4
SFN08 0.4
Nichrome Resistor Networks
on Silicon Substrates
SFN08A, SFN08B Series
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01. 12
Package Power And Derating Curve
Thermal Shock plus Power Conditioning ΔR 0.25%
Short Time Overload ΔR 0.1%
Terminal Strength ΔR 0.1%
Moisture Resistance ΔR 0.2%
Mechanical Shock ΔR 0.25%
Vibration ΔR 0.25%
Low Temperature Operation ΔR 0.05%
High Temperature Exposure ΔR 0.1%
Resistance to Solder Heat ΔR 0.1%
Marking Permanency Per MIL-STD-202, Method 215
Flammability UL-94V-0 Rated
Storage Temperature Range -55°C to +125°C
Environmental (MIL-R-83401)
Pad Plating 100 matte Tin (RoHS compliant)
Pad Material Copper Alloy
Pad Coplanarity 0.003” (0.08 mm)
Substrate Material Silicon
Resistor Material Passivated Nichrome
Body Material Molded Epoxy
Mechanical
4 Maximum power per resistor @ 70C is 100 mW, not to exceed package power