TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND 15-kV ESD PROTECTION Check for Samples: TXB0102 FEATURES * 1 * 2 * * * * * Available in the Texas Instruments NanoFreeTM Packages 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA VCCB) VCC Isolation Feature - If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 4-A Max ICC Ioff Supports Partial-Power-Down Mode Operation * Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - A Port - 2500-V Human-Body Model (A114-B) - 200-V Machine Model (A115-A) - 1500-V Charged-Device Model (C101) - B Port - 15-kV Human-Body Model (A114-B) - 200-V Machine Model (A115-A) - 1500-V Charged-Device Model (C101) DCT OR DCU PACKAGE (TOP VIEW) YZP PACKAGE (BOTTOM VIEW) 8 B1 A2 VCCA D1 4 5 D2 A1 C1 3 6 C2 GND 2 7 VCCB GND B1 2 7 B2 OE VCCB VCCA 3 6 OE B2 A1 1 8 A2 B1 A2 4 5 A1 B2 1 A. Pull up resistors are not required on both sides for Logic I/O. B. If pull up or pull down resistors are needed, the resistor value must be over 50 k. C. 50 k is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down resistor is allowed, the draft estimation is Vol = Vccout x 4.5k/(4.5k + Rpu) and Voh = Vccout x Rdw/(4.5k + Rdw). D. If pull up resistors are needed, please refer to the TXS0102 or contact TI. E. For detailed information, please refer to application note SCEA043. DESCRIPTION/ORDERING INFORMATION This 2-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2007-2012, Texas Instruments Incorporated TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE (1) (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pbfree) -40C to 85C SOT (SOT-23) - DCT SOT (SOT-70) - DCU (1) (2) (3) TOP-SIDE MARKING (3) ORDERABLE PART NUMBER Reel of 3000 TXB0102YZPR Reel of 3000 TXB0102DCTR Reel of 250 TXB0102DCTT Reel of 3000 TXB0102DCUR Reel of 250 TXB0102DCUT 2E_ NFD_ NFD_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Table 1. PIN DESCRIPTION PIN NAME FUNCTION 1 B2 2 GND Input/output B. Referenced to VCCB. Ground 3 VCCA A port supply voltage. 1.2 V VCCA 3.6 V and VCCA VCCB 4 A2 Input/output A. Referenced to VCCA. 5 A1 Input/output A. Referenced to VCCA. 6 OE 3-State output. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. 7 VCCB 8 B1 B port supply voltage. 1.65 V VCCB 5.5 V Input/output B. Referenced to VCCB. Figure 1. TYPICAL OPERATING CIRCUIT 1.8 V 0.1 F 3.3 V 1.8-V System Controller Data Data GND 2 VCCA VCCB OE 3.3-V System A1 B1 Data A2 B2 Data GND GND Submit Documentation Feedback 0.1 F Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCCA Supply voltage range -0.5 4.6 VCCB Supply voltage range -0.5 6.5 VI Input voltage range (2) A port -0.5 4.6 B port -0.5 6.5 VO Voltage range applied to any output in the high-impedance or power-off state (2) A port -0.5 4.6 B port -0.5 6.5 VO Voltage range applied to any output in the high or low state (2) A port -0.5 VCCA + 0.5 B port -0.5 VCCB + 0.5 IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA (3) Continuous current through VCCA, VCCB, or GND JA Package thermal impedance (4) Tstg Storage temperature range DCT package 220 DCU package 227 YZP package (1) (2) (3) (4) V V C/W 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. (2) VCCA VCCA VCCB VCCB Supply voltage MIN MAX 1.2 3.6 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI x 0.65 (3) VCCI OE input 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA x 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI x 0.35 (3) OE input 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA x 0.35 0 3.6 1.2 V to 3.6 V 1.65 V to 5.5 V 0 5.5 A port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40 B port inputs 1.2 V to 3.6 V 1.65 V to 1.95 V 40 4.5 V to 5.5 V 30 VIH High-level input voltage VIL Low-level input voltage VO Voltage range applied to any A port output in the high-impedance B port or power-off state t/v Input transition rise or fall rate (1) (2) (3) V 102 -65 Recommended Operating Conditions (1) TA V Operating free-air temperature -40 85 UNIT V V V V ns/V C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 3 TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 Electrical Characteristics (1) www.ti.com (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA TA = 25C VCCB MIN 1.2 V IOH = -20 A VOLA IOL = 20 A VOHB IOH = -20 A 1.65 V to 5.5 V VOLB IOL = 20 A 1.65 V to 5.5 V V 0.9 1.4 V to 3.6 V VCCB - 0.4 V 0.4 V A 1.65 V to 5.5 V 1 2 A port 0V 0 V to 5.5 V 1 2 B port VI or VO = 0 to 5.5 V 0 V to 3.6 V 0V 1 2 A or B port OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V 1 2 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 3 3.6 V 0V 2 0V 5.5 V -2 VI = VCCI or GND, IO = 0 VI = VCCI or GND, IO = 0 ICCZA VI = VCCI or GND, IO = 0, OE = GND ICCZB VI = VCCI or GND, IO = 0, OE = GND OE A port A 1.2 V 1.65 V to 5.5 V 1.65 V to 5.5 V 5 3.6 V 0V -2 0V 5.5 V 2 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V A 0.06 1.4 V to 3.6 V 1.2 V to 3.6 V B port V 0.4 1.2 V to 3.6 V VI = VCCI or GND, IO = 0 UNIT VCCA - 0.4 1.2 V ICCA + ICCB (1) (2) 1.4 V to 3.6 V VI or VO = 0 to 3.6 V ICCB Cio MAX VI = VCCI or GND ICCA Ci MIN OE Ioff IOZ MAX 1.1 VOHA II TYP -40C to 85C A 3.4 3.5 8 A A 0.05 3 A 3.3 5 1.65 V to 5.5 V 2.5 3 5 6 11 14 A pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Timing Requirements TA = 25C, VCCA = 1.2 V Data rate tw Pulse duration Data inputs VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns UNIT Timing Requirements over recommended operating free-air temperature range, VCCA = 1.5 V 0.1 V (unless otherwise noted) VCCB = 1.8 V 0.15 V MIN Data rate tw 4 Pulse duration MAX VCCB = 2.5 V 0.2 V MIN 40 Data inputs 25 Submit Documentation Feedback MAX VCCB = 3.3 V 0.3 V MIN 40 25 MAX VCCB = 5 V 0.5 V MIN 40 25 40 25 UNIT MAX Mbps ns Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V 0.15 V (unless otherwise noted) VCCB = 1.8 V 0.15 V MIN MAX Data rate tw VCCB = 2.5 V 0.2 V MIN MAX 60 Pulse duration Data inputs VCCB = 3.3 V 0.3 V MIN MAX 60 17 VCCB = 5 V 0.5 V MIN 60 17 UNIT MAX 60 17 Mbps 17 ns Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V 0.2 V (unless otherwise noted) VCCB = 2.5 V 0.2 V MIN Data rate tw VCCB = 3.3 V 0.3 V MAX MIN MAX 100 Pulse duration Data inputs VCCB = 5 V 0.5 V MIN 100 10 UNIT MAX 100 10 Mbps 10 ns Timing Requirements over recommended operating free-air temperature range, VCCA = 3.3 V 0.3 V (unless otherwise noted) VCCB = 3.3 V 0.3 V MIN Data rate tw VCCB = 5 V 0.5 V MAX MIN 100 Pulse duration Data inputs 10 UNIT MAX 100 Mbps 10 ns Switching Characteristics TA = 25C, VCCA = 1.2 V PARAMETER tpd FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP A B 6.9 5.7 5.3 5.5 B A 7.4 6.4 6 5.8 A 1 1 1 1 B 1 1 1 1 A 18 15 14 14 B 20 17 16 16 ten OE tdis OE UNIT ns s ns trA A port rise time 4.2 4.2 4.2 4.2 ns tfA A port fall times 4.2 4.2 4.2 4.2 ns trB B port rise times 2.1 1.5 1.2 1.1 ns tfB B port fall times 2.1 1.5 1.2 1.1 ns tsk(o) Channel-to-channel 0.5 0.5 0.5 1.4 ns 20 20 20 20 Mbps Max data rate Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 5 TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.5 V 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V 0.15 V VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.7 A 1 1 1 1 B 1 1 1 1 A 5.9 31 5.7 25.9 5.6 23 5.7 22.4 B 5.4 30.3 4.9 22.8 4.8 20 4.9 19.5 ns s ns trA A port rise times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns tfA A port fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns trB B port rise times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns tfB B port fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns tsk(o) Channel-to-channel 0.5 Max data rate 0.5 40 40 0.5 40 0.5 40 ns Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.8 V 0.15 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 A 1.5 12 1.3 8.4 1 7.6 0.9 7.1 A 1 1 1 1 B 1 1 1 1 A 5.9 31 5.1 21.3 5 19.3 5 17.4 B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3 ns s ns trA A port rise times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns tfA A port fall times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns trB B port rise times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns tfB B port fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns tsk(o) Channel-to-channel 0.5 ns Max data rate 6 VCCB = 1.8 V 0.15 V 0.5 60 Submit Documentation Feedback 0.5 60 0.5 60 60 Mbps Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V 0.2 V VCCB = 3.3 V 0.3 V MIN MAX B 1.1 A 1.2 VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX 6.3 1 5.2 0.9 4.7 6.6 1.1 5.1 0.9 4.4 A 1 1 1 B 1 1 1 A 5.1 21.3 4.6 15.2 4.6 13.2 B 4.4 20.8 3.8 16 3.9 13.9 ns s ns trA A port rise times 0.8 3 0.8 3 0.8 3 ns tfA A port fall times 0.8 3 0.8 3 0.8 3 ns trB B port rise times 0.7 3 0.5 2.8 0.4 2.7 ns tfB B port fall times 0.7 3 0.5 2.8 0.4 2.7 ns tsk(o) Channel-to-channel 0.5 Max data rate 0.5 100 0.5 100 ns 100 Mbps Switching Characteristics over recommended operating free-air temperature range, VCCA = 3.3 V 0.3 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 3.3 V 0.3 V VCCB = 5 V 0.5 V UNIT MIN MAX MIN MAX B 0.9 4.7 0.8 4 A 1 4.9 0.9 4.5 A 1 1 B 1 1 A 4.6 15.2 4.3 12.1 B 3.8 16 3.4 13.2 ns s ns trA A port rise times 0.7 2.5 0.7 2.5 ns tfA A port fall times 0.7 2.5 0.7 2.5 ns trB B port rise times 0.5 2.3 0.4 2.7 ns tfB B port fall times 0.5 2.3 0.4 2.7 ns tsk(o) Channel-to-channel 0.5 ns Max data rate 0.5 100 100 Mbps Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 7 TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 www.ti.com Operating Characteristics TA = 25C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.3 V to 5V VCCB PARAMETER TEST CONDITIONS 5V CpdA CpdB CpdA CpdB 8 A port input, B port output B port input, A port output A port input, B port output B port input, A port output A port input, B port output B port input, A port output A port input, B port output B port input, A port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 1.8 V 1.8 V 1.8 V UNIT TYP TYP TYP TYP TYP TYP TYP 7.8 8 8 7 7 8 8 12 11 11 11 11 11 11 38.1 29 29 29 29 30 30 25.4 19 18 18 18 21 21 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.01 0.01 0.01 0.01 0.01 0.02 0.03 Submit Documentation Feedback pF pF Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 PRINCIPLES OF OPERATION Applications The TXB0102 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0102 architecture (see Figure 2) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0101 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 at VCCO = 1.2 V to 1.8 V, 50 at VCCO = 1.8 V to 3.3 V, and 40 at VCCO = 3.3 V to 5 V. VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 2. Architecture of TXB0102 I/O Cell Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0102 are shown in Figure 3. For proper operation, the device driving the data I/Os of the TXB0102 must have drive strength of at least 2 mA. Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 9 TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 www.ti.com IIN VT/4 k VIN -(VD - VT)/4 k A. VT is the input threshold voltage of the TXB0102 (typically VCCI/2. B. VD is the supply voltage of the external driver. Figure 3. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA VCCB at all times. During power-up sequencing, VCCA VCCB does not damage the device, so any power supply can be ramped up first. The TXB0102 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). Enable and Disable The TXB0102 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs are disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the oneshot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines The TXB0102 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0102 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 k to ensure that they do not contend with the output drivers of the TXB0102. For the same reason, the TXB0102 should not be used in applications such as I2C or 1-Wire where an opendrain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. 10 Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 TXB0102 www.ti.com SCES641B - MAY 2007 - REVISED MAY 2012 PARAMETER MEASUREMENT INFORMATION 2 x VCCO From Output Under Test 50 kW From Output Under Test 15 pF 15 pF 1 MW Open 50 kW TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 S1 2 x VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.1 y VCCO VOH tf tr VCCI VCCO/2 VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuits and Voltage Waveforms Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 11 TXB0102 SCES641B - MAY 2007 - REVISED MAY 2012 www.ti.com REVISION HISTORY Changes from Original (May 2007) to Revision A * Added ball labels to the YZP Package. ................................................................................................................................ 1 Changes from Revision A (January 2011) to Revision B * 12 Page Page Added notes to pin out graphics. .......................................................................................................................................... 1 Submit Documentation Feedback Copyright (c) 2007-2012, Texas Instruments Incorporated Product Folder Link(s): TXB0102 D: Max = 1.918 mm, Min = 1.858 mm E: Max = 0.918 mm, Min = 0.858 mm PACKAGE OPTION ADDENDUM www.ti.com 7-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TXB0102DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0102DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0102DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0102DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0102YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2012 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TXB0102DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 TXB0102YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 TXB0102YZPR DSBGA YZP 8 3000 180.0 8.4 1.02 2.02 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0102DCUR US8 DCU 8 3000 202.0 201.0 28.0 TXB0102YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 TXB0102YZPR DSBGA YZP 8 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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