CY28346OC - Silicon Labs - Datasheet.Directory

Clock Synthesizer with Differential CPU Outputs

CY28346

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400 West Cesar Chavez, Austin, TX 78701 1+(512) 416-8500 1+(512) 416-9669 www.silabs.com

Features

• Compliant with Intel® CK 408 Mobile Clock Synthesizer

specifications

• 3.3V power su pply

• Three differential CPU clocks

• Ten copies of PCI clocks

• 5/6 copies of 3V66 clocks

• SMBus support with read-back capabilities

• Spread Spectrum electromagnetic interference (EMI)

reduction

• Dial-a-Frequency™ features

• Dial-a-dB™ features

• 56-pin TSSOP and SSOP packages

Table 1. Frequency Tab le[1]

S2 S1 S0 CPU (0:2) 3V66 66BUFF(0:2)/

3V66(0:4) 66IN/3V66–5 PCI_FPCI REF USB/

DOT

1 0 0 66M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 0 1 100M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 1 0 200M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 1 1 133M 66M 66IN 66-MHZ clock input 66IN/2 14.318M 48M

0 0 0 66M 66M 66M 66M 33 M 14.318M 48M

0 0 1 100M 66M 66M 66M 33 M 14.318M 48M

0 1 0 200M 66M 66M 66M 33 M 14.318M 48M

0 1 1 133M 66M 66M 66M 33 M 14.318M 48M

M 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z

M 0 1 TCLK/2 TCLK/4 TCLK/4 TCLK/4 TCLK/8 TCLK TCLK/2

Note:

1. TCLK is a test clock driven on the XTAL_IN input during test mode. M = driven to a level between 1.0V and 1.8V. If the S2 pin is at a M l evel durin g p ower-up, a

0 state will be latched into the device’s internal state reg i ster.

PLL1

PLL2

Logic

Power

Up Logic

XIN

XOUT

CPU_STP#

IREF

VSSIREF

S(0:2)

MULT0

VTT_PG#

PCI_STP#

PD#

SDATA

SCLK

VDDA 66B[0:2]/3V66[2:4]

48M DOT

48M USB

PCI_F(0:2)

PCI(0:6)

3V66_1/VCH

3V66_0

CPUC(0:2)

CPUT(0:2)

REF

66IN/3V66-5

I2C

Logic

VDD

XIN

XOUT

VSS

PCIF0

PCIF1

PCIF2

VDD

VSS

PCI0

PCI1

PCI2

PCI3

VDD

VSS

PCI4

PCI5

PCI6

VDD

VSS

66B0/3V66_2

66B1/3V66_3

66B2/3V66_4

66IN/3V66_5

PD#

VDDA

VSSA

VTT_PG#

REF

CPU_STP#

CPUT0

CPUC0

VDD

CPUT1

CPUC1

VSS

VDD

CPUT2

CPUC2

MULT0

IREF

VSSIREF

48MUSB

48MDOT

VDD

VSS

3V66_1/VCH

PCI_STP#

3V66_0

VDD

VSS

SCLK

SDATA

CY28346

Pin ConfigurationBlock Diagram

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Pin Description

Pin Name PWR I/O Description

2XIN IOscillator Buffer Input. Connect to a crystal or to an external clock.

3XOUTV

DD OOscillator Buffer Output. Connect to a crystal. Do not connect when an external

clock is applied at XIN.

52, 51, 49, 48,

45, 44 CPUT(0:2),

CPUC(0:2) VDD ODifferential Host Output Clock Pairs. See Table 1 for frequency/functionality.

10, 11, 12, 13,

16, 17, 18 PCI(0:6) VDDP OPCI Clock Outputs. Are synchronous to 66IN or 3V66 clock. See Table 1.

5, 6, 7 PCIF (0:2) VDD O33MHz PCI Clocks. 2 copies of 66IN or 3V66 clocks that may be free running

(not stopped when PCI_STP# is asserted LOW) or may be stoppable depending

on the programming of SMBus register Byte3,Bits (3:5).

56 REF VDD OBuffered Output Copy of the Device’s XIN Clock.

42 IREF VDD ICurrent Reference Programming Input for CPU Buffers. A resistor is

connected between this pin and VSSIREF.

28 VTT_PG# VDD IQualifying Input that Latches S(0:2) and MUL T0. When this input is at a logic

LOW, the S(0:2) and MULT0 are latched.

39 48MUSB VDD48 OFixed 48 MHz USB Clock Outputs.

38 48MDOT VDD48 OFixed 48 MHZ DOT Clock Outputs.

33 3V66_0 VDD O3.3V 66 MHz Fixed-frequency Clock.

35 3V66_1/VCH VDD O3.3V Clock Selectable with SMBus Byte0,Bit5, When Byte5,Bit5. When Byte

0,Bit 5 is at a logic 1, then this pin is a 48M output clock. When Byte0,Bit5 is a

logic 0, this is a 66M output clock (default).

25 PD# VDD I

PU Power-down Mode Pin. A logic LOW level causes the device to enter a

power-down state. All internal logic is turned off except for the SMBus logic. All

output buffers are stopped.

43 MULT0 I

PU Programming Input Selection for CPU Clock Current Multiplier.

55, 54 S(0,1) I I Frequency Select Inputs. See Table 1.

29 SDATA I I Serial Dat a Input. Conforms to the SMBus specification of a Slave

Receive/T ransmit device. It is an input when receiving data. It is an open drain

output when acknowledging or transmitting data.

30 SCLK I I Serial Clock Input. Conforms to the SMBus specification.

40 S2 VDD I

TFrequency Select In put. See Table 1. This is a Tri-level input which is driven

HIGH, LOW or driven to a intermediate level.

34 PCI_STP# VDD I

PU PCI Clock Disable Input. When asser ted LOW, PCI (0:6) clocks are synchro-

nously disabled in a LOW state. This pin does not effect PCIF (0:2) clocks’

outputs if they are programmed to be PCIF clocks via the device’s SMBus

interface.

53 CPU_STP# VDD I

PU CPU Clock Disable Input. Whe n asserted LOW, CPUT (0:2) clocks are

synchronously disabled in a HIGH state and CPUC(0:2) clocks are synchro-

nously disabled in a LOW state.

24 66IN/3V66_5 VDD I/O Input Connection for 66CLK(0:2) Output Clock Buffers if S2 = 1, or output

clock for fixed 66-MHz clock if S2 = 0. See Table 1.

21, 22, 23 66B(0:2)/

3V66(2:4) VDD O3.3V Clock Outputs. These clocks are buffered copies of the 66IN clock or fixed

at 66 MHz. See Table 1.

1, 8, 14, 19, 32,

37, 46, 50 VDD PWR 3.3V Power Supply.

4, 9, 15, 20, 27,

31, 36, 47 VSS PWR Co mmo n Grou nd .

41 VSSIREF PWR Current Reference Programming Input for CPU Buffers. A resistor is

connected between this pin and IREF. This pin should also be returned to device

VSS.

26 VDDA –PWRAnalog Power Input. Used for phase-locked loops (PLLs) and internal analog

circuits. It is also specifically used to detect and determine when power is at an

acceptable level to enable the device to operate.

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Two-Wire SMBus Control Interface

The two-wire control interface implements a Read/Write slave

only interface according to SMBus specification.

The device will accept data written to the D2 address and data

may read back from address D3. It will not respond to any

other addresses, and previously set control registers are

retained as long as power in maintained on the device.

Serial Control Registers

Following the acknowledge of the Address Byte, two additional

bytes must be sent:

1. “Command code” byte

2. “Byte count” byte.

Although the da ta (bits) in the command is considered “don’t

care,” it must be sent and will be acknowledged. After the

Command Code and the Byte Count have been acknowl-

edged, the sequence (Byte 0, Byte 1 , and Byte 2) described

below will be valid and acknowle dged.

Byte 0: CPU Clock Register[2,3]

Bit @Pup Pin# Description

7 0 Spread Spectrum Enable. 0 = Spread Off, 1 = Spread On

This is a Read and Write control bit.

6 0 CPU Clock Power-down Mode Select. 0 = Drive CPUT(0:2) to 4 or 6 IREF and drive

CPUC(0:2) LOW when PD# is asserted LOW. 1 = Tri-state all CPU outputs. This is only

applicable when PD# is LOW. It is not applicable to CPU_STP#.

5 0 35 3V66_1/VCH Frequency Select, 0 = 66M selected, 1 = 48M selected

This is a Read and Write control bit.

4 Pin 53 44,45,48,49,5

1,52 CPU_STP#. Reflects the current value of the external CPU_STP# (pin 53) This bit is

Read-only.

3 Pin 34 10,11,12,13,16

,17,18 Reflects the current value of the internal PCI_STP# function when read. Internally PCI_STP#

is a logical AND function of the internal SMBus register bit and the external PCI_STP# pin.

2 Pin 40 Frequency Select Bit 2. Reflects the value of SEL2 (pin 40). This bit is Read-only.

1 Pin 55 Frequency Select Bit 1. Reflects the value of SEL1 (pin 55). This bit is Read-only.

0 Pin 54 Frequency Select Bit 0. Reflects the value of SEL0 (pin 54). This bit is Read-only.

Byte 1: CPU Clock Register

Bit @Pup Pin# Description

7 Pin 43 43 MULT0 (Pin 43) Value. This bit is Read-only.

6 0 53 CPUT/C(0:2) Output Functionality Control When CPU_STP# is Asserted. 0 = Drive

CPUT(0:2) to 4 or 6 IREF and drive CPUC(0:2) LOW when CPU_STP# asserted LOW.

1 = three-state all CPU outputs. This bit will override Byte0,Bit6 such that even if it is 0,

when PD# goes LOW the CPU outputs will be three-stated.

5 0 44,45 CPU2 Functionality Control When CPU_STP# is Asserted LOW. 1 = Free Running, 0 =

Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit.

4 0 48,49 CPU1 Functionality Control When CPU_STP# is Asserted LOW. 1 = Free Running, 0 =

Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit.

3 0 51,52 CPUT0 Functionality Control When CPU_STP# is Asserted LOW . 1 = Free Running, 0 =

Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit.

2 1 44,45 CPUT/C2 Output Control. 1 = enabled, 0 = disable HIGH and CPUC2 disables LOW . This

is a Read and Write control bit.

1 1 48,49 CPUT/C1 Output Control. 1 = enabled, 0 = disable HIGH and CPUC1 disables LOW . This

is a Read and Write control bit.

0 1 51,52 CPUT/C0 Output Control. 1 = enabled, 0 = disable HIGH and CPUC0 disables LOW . This

is a Read and Write control bit.

Notes:

2. PU = internal pull-up. PD = internal pull-down. T = tri-level logic input with valid logic voltages of LOW = < 0.8V, T = 1.0 – 1.8V and HIGH = > 2.0V.

3. The “ Pin#” column lists the relevant pi n number where applicable. The “@Pup” column gives the default state at power-up.

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Byte 2: PCI Clock Control Register (all bits are Read and Write functional)

Bit @Pup Pin# Description

7 0 53 REF Output Control. 0 = high strength, 1 = low strength.

6 1 18 PCI6 Output Control. 1 = enabled, 0 = forced LOW.

5 1 17 PCI5 Output Control. 1 = enabled, 0 = forced LOW.

4 1 16 PCI4 Output Control. 1 = enabled, 0 = forced LOW.

3 1 13 PCI3 Output Control. 1 = enabled, 0 = forced LOW.

2 1 12 PCI2 Output Control. 1 = enabled, 0 = forced LOW.

1 1 11 PCI1 Output Control. 1 = enabled, 0 = forced LOW.

0 1 10 PCI0 Output Control. 1 = enabled, 0 = forced LOW.

Byte 3: PCI_F Clock and 48M Control Register (al l bits are Read and Write functional)

Bit @Pup Pin# Description

7 1 38 48MDOT Output Control. 1 = enabled, 0 = forced LOW.

6 1 39 48MUSB Output Control. 1 = enabled, 0 = forced LOW.

5 0 7 PCI_STP#, Control of PCI_F2. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW.

4 0 6 PCI_STP#, Control of PCI_F1. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW.

3 0 5 PCI_STP#, Control of PCI_F0. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW.

2 1 7 PCI_F2 Output Control. 1 = running, 0 = forced LOW.

1 1 6 PCI_F1 Output Control. 1 = running, 0 = forced LOW.

0 1 5 PCI_F0 Output Control. 1 = running, 0 = forced LOW.

Byte 4: DRCG Control Register (all bits are Read and Write functional)

Bit @Pup Pin# Description

7 0 SS2 Spread Spectrum Control Bit (0 = down spread, 1 = center spread).

6 0 Reserved. Set = 0.

5 1 33 3V66_0 Output Enabled. 1 = enabled, 0 = disable.

4 1 35 3V66_1/VCH Output Enable. 1 = enabled, 0 = disabled.

3 1 24 3V66_5 Output Enable. 1 = enabled, 0 = disabled.

2 1 23 66B2/3V66_4 Output Enabled. 1 = enable d, 0 = disabl ed.

1 1 22 66B1/3V66_3 Output Enabled. 1 = enable d, 0 = disabl ed.

0 1 21 66B0/3V66_2 Output Enabled. 1 = enable d, 0 = disabl ed.

Byte 5: Clock Control Register (all bits are Read and Write functional)

Bit @Pup Pin# Description

7 0 SS1 Sp read Spectrum Control Bit.

6 1 SS0 Sp read Spectrum Control Bit.

5 0 66IN to 66M delay Control MSB.

4 0 66IN to 66M delay Cont ro l LSB.

3 0 Reserved. Set = 0.

2 0 48MDOT Edge Rate Control. When set to 1, the edge is slowed by 15%.

1 0 Reserved. Set = 0.

0 0 USB edge rate control. When se t to 1, the edge is slowe d by 15%.

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Byte 6: Silicon Signature Register[4] (all bits are Read-only)

Bit @Pup Pin# Description

7 0 Revision = 0001

3 0 Vend or Code = 0011

Byte 7: Reserved Register

Bit @Pup Pin# Description

7 0 Reserved. Set = 0.

6 0 Reserved. Set = 0.

5 0 Reserved. Set = 0.

4 0 Reserved. Set = 0.

3 0 Reserved. Set = 0.

2 0 Reserved. Set = 0.

1 0 Reserved. Set = 0.

0 0 Reserved. Set = 0.

Byte 8: Dial-a-Frequency Control Regist er N

Bit @Pup Name Description

7 0 Reserved. Set = 0.

6 0 N6, MSB These bits are for programming the PLL’s internal N register. This access allows the user to

modify the CPU frequency at very high resolution (accuracy). All other synchronous clocks

(clocks that are generated from the same PLL, such as PCI) remain at their existing ratios

relative to the CPU clock.

50N5

40N4

30N3

20N2

10N3

00N0, LSB

Byte 9: Dial-a-Frequency Control Regist er R

Bit @Pup Name Description

70 Reserved. Set = 0.

6 0 R5, MSB These bits are for programming the PLL ’ s internal R register. This access allows the user to

modify the CPU frequency at very high resolution (accuracy). All other synchronous clocks

(clocks that are generated from the same PLL, such as PCI) remain at their existing ratios

relative to the CPU clock.

50R4

40R3

30R2

20R1

10R0

DAF_ENB R and N register mux selection. 0 = R and N values come from the ROM. 1 = data is loaded

from DAF (SMBus) registers.

Note:

4. Wh en writing to this register, the device will acknowledge the Write operation, but the data itself will be ignor ed.

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Dial-a-Frequency Features

SMBus Dial-a-Frequency feature is available in this device via

Byte8 and Byte9.

P is a large-value PLL constant that depends on the frequency

selection achieved through the hardware selectors (S1, S0). P

value may be determined from Table 2.

Dial-a-dB Features

SMBus Dial-a-dB feature is available in this device via Byte8

and Byte9.

Spread Spectrum Clock Generation (SSCG)

Spread Spectrum is a modulation technique used to

minimizing EMI radiation generated by repetitive digital

signals. A clock presents the greatest EMI energy at the center

frequency it is generating. Spread Spectrum distributes this

energy over a specific and controlled frequency bandwidth

therefore ca using the a verage energy at a ny one po int i n thi s

band to decrease in value. This technique is achieved by

modulating the clock away from its resting frequency by a

certain percentage (which also determines the amount of EMI

reduction). In this device, Spread Spectrum is enabled by

setting specific register bits in the SMBus control bytes.

Table 3 is a listing of the modes and percentages of Spread

Spectrum modulation that this device incorporates.

Test and Measurement Set-up

For Differential CPU Output Sign al s

The following dia gram shows lumped test load configurations

for the differential Host Clock Outputs.

Table 2. P Valu e

S(1:0) P

0 0 32005333

0 1 48008000

1 0 96016000

1 1 64010667

Table 3. Spre a d Spectrum

SS2 SS1 SS0 Spread Mode Spread%

0 0 0 Down +0.00, –0.25

0 0 1 Down +0.00, –0.50

0 1 0 Down +0.00, –0.75

0 1 1 Down +0.00, –1.00

1 0 0 Center +0.13, –0.13

1 0 1 Center +0.25, –0.25

1 1 0 Center +0.37, –0.37

1 1 1 Center +0.50, –1.50

M easurem ent Point

2pF

CPUT

MULTSEL

TPCB

CPUC



 





 M easurem ent Point

2pF

Figure 1. 1.0V Test Load Termination

CPUT

MULTSEL

TPCB

CPUC



 Measurement Point



 2pF

Measurement Point

2pF



VDD

Figure 2. 0.7V Test Load Termination

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Buffer Characteristics

Current Mode CPU Clock Buffer Characteristics

The current mode output buffer detail and current reference

circuit details are contained in the previous table of th is data

sheet. The following parameters are used to specify output

buff er ch ara ct eri st ics:

1. Output impedance of the current mode buffer circuit—Ro

(see Figure 4).

2. Minimum and maximum required voltage operation range

of the circuit—Vop (see Figure 4).

3. Series resistance in the buffer circuit—Ros (see Figure 4).

4. Current accuracy at given configuration into nominal test

load for given configuration.

Iout is selectable depending on implementation. The param-

eters above appl y to all configurations. Vout is the voltage at

the pin of the devi ce .

The various output current configurations are shown in the

host swing select functions table. For all configurations, the

deviation from the expected output current is ±7% as shown in

the current accuracy table.

2.4V

0.4V

3.3V

Tr Tf

1.5V

3.3V sig nals

tDC

Probe

Out

ut un de r Tes

Load Cap

Figure 3. For Single-ended Output Signals

1.2V0V

Iout

Ros

VDD3 (3.3V +/- 5%)

Vout = 1.2V max Vout

Slope ~ 1/R

Figure 4. Buffer Characteristics

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USB and DOT 48M Phase Relationship

The 48MUSB and 48MDOT clocks are in phase. It is under-

stood that the difference in edge rate will introduce some

inherent offset. When 3V66_1/VCH clock is configured for

VCH (48-MHz) operation it is also in pha se with the USB and

DOT outputs. See Figure 5.

66IN to 66B(0:2) Buffered Prop Delay

The 66IN to 66B(0:2) output delay is shown in Figure 6.

The Tpd is the prop delay from the input pin (66IN) to the

output pins (66B[0:2]). The outputs’ variation of Tpd is

described in the AC parameters section of this data sheet. The

measurement taken at 1.5V.

66B(0:2) to PCI Buffered Clock Skew

Figure 7 shows the difference (skew) between the 3V33(0:5)

outputs when the 66M clocks are connected to 66IN. This

offset is described in the Group Timing Relationship and Toler-

ances section of this data sheet. The measurements were

taken at 1.5 V.

3V66 to PCI Un-Buffered Clock Skew

Figure 8 shows the timing relationship between 3V66(0:5) and

PCI(0:6) and PCI_F(0:2) when configured to run in the unbuf-

fered mode.

Table 4. Host Clock (HCSL) Buffer Characteristics

Characteristic Min. Max.

Ro 3000 (recommended) N/A

Ros

Vout N/A 1.2V

Table 5. CPU Clock Current Select Function

Mult0 Board Target Trace/Term Z Reference R, Iref – Vdd (3*Rr) Output Current Voh @ Z

050Rr = 221 1%, Iref = 5.00mA Ioh = 4*Iref 1.0V @ 50

150Rr = 475 1%, Iref = 2.32mA Ioh = 6*Iref 0.7V @ 50

Table 6. Group Timing Relationship and Tolerances

Description Offset Tolerance Conditions

3V66 to PCI 2.5 ns 1.0 ns 3V66 Leads PCI (unbuffered mode)

48MUSB to 48MDOT Skew 0.0 ns 1.0 ns 0 deg rees phase shift

66B(0:2) to PCI offset 2.5 ns 1.0 ns 66B Leads PCI (buffered mode)

48MUSB

48MDOT

Figure 5. 48MUSB and 48MDOT Phase Relationship

66IN

66B(0:2)

Tpd

Figure 6. 66IN to 66B(0:2) Output Delay Figure

66B(0:2)

PCI(0:6)

PCIF(0:2)

1.5-

3.5ns

Figure 7. Buffer Mode – 33V66(0:1); 66BUF(0:2) Phase Relationship

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Special Functions

PCI_F and IOAPIC Clock Outputs

The PCIF clock outputs are intended to be used, if required,

for systems IOAPIC clock functionality. Any two of the PCI_F

clock outputs can be used as IOAPIC 33 Mhz clock outputs.

They are 3.3V outputs will be divided down via a simple

resistive voltage divider to meet specific system IOAPIC clock

voltage requirements. In the event that these clocks are not

required, they can be used as general PCI clocks or disab led

via the assertion of the PCI_STP# pin.

3V66_1/VCH Clock Output

The 3V66_1/VCH pin has a dual functionality that is selectable

via SMBus.

Configured as DRCG (66M), SMBus Byte0, Bit 5 = “0”

The default condition for this pin is to power-up in a 66M

operation. In 66M operati on th is output is SSCG-capable and

when spreading is turned on, this clock will be modulated.

Configured as VCH (48M), SMBus Byte0, Bit 5 = “1”

In this mode, output is configured as a 48-Mhz non-spread

spectrum output that is phase-aligned with other 48M outputs

(USB and DOT) to within 1 ns pin-to-pin skew. The switching

of 3V66_1/VCH into VCH mode occurs at system power-on.

When the SMBus Bit 5 of Byte 0 is programmed from a “0” to

a “1,” the 3V66_1/VCH output may glitch while transitioning to

48M output mode .

CPU_STP# Clarification

The CPU_STP# signal is an active LOW input used to

synchronously stop and start the CPU output clocks while the

rest of the clock generator continues to function.

CPU_STP# – Assertion

When CPU_STP# pin is asserted, all CPUT/C outputs that are

set with the SMBus configuration to be stoppable via assertion

of CPU_STP# will be stopped after being sampled by two

falling CPUT/C clock edges. The final state of the stopped

CPU signals is CPUT = HIGH and CPU0C = LOW . There is no

change to the output drive current values duri ng the stopped

state. The CPUT is driven HIGH with a current value equal to

(Mult 0 “select”) × (Iref), and the CPUC signal will not be

driven. Due to external pull-down circuitry CPUC will be LOW

during this stopped state.

CPU_STP# Deassertion

The deassertion of the CPU_STP# signal will cause all

CPUT/C outputs that were stopped to resume normal

operation in a synchronous manner (meaning that no short or

stretched clock pulses will be produces when the clock

resumes). The maximum latency from the deassertion to

active outputs is no more than two CPUC clock cycles.

Three-state Control of CPU Clocks Clarification

During CPU_STP# an d PD# modes, CPU clock outpu ts may

be set to driven or undriven (tri-state) by setting the corre-

sponding SMBus entry in Bit6 of Byte0 and Bit6 of Byte1.

PCI(0:6)

PCI_F(0:2)

Tpci

3V66(0:5)

Figure 8. Unbuffered Mode – 3V66(0:5) to PCI (0:6) and PCI_F(0:2) Phase Relationship

CPU_STP#

CPUT

CPUC

CPUT

CPUC

Figure 9. CPU_STP# Assertion W aveform

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PCI_STP# Assertion

The PCI_STP# signal is an active LOW input used for

synchronous stopping and starting the PCI outputs while the

rest of the clock generator continues to function. The set-up

time for capturing PCI_STP# going LOW is 10 ns (tsetup) (see

Figure 14.) The PCI_F (0:2) clocks will not be affected by this

pin if their control bits in the SMBus register are set to allow

them to be free running.

Table 7. Cypress Clock Power Management Truth Table

B0b6 B1b6 PD# CPU_STP# Stoppable CPUT Stop pable

CPUC Non-Stop CPUT Non-Stop CPUC

0 0 1 1 Running Running Running Running

0 0 1 0 Iref x6 Iref x6 Running Running

0 0 0 1 Iref x2 LOW Iref x2 LOW

0 0 0 0 Iref x2 LOW Iref x2 LOW

0 1 1 1 Running Running Running Running

0 1 1 0 Hi-Z Hi-Z Running Running

0 1 0 1 Hi-Z Hi-Z Hi-Z Hi-Z

0 1 0 0 Hi-Z Hi-Z Hi-Z Hi-Z

1 0 1 1 Running Running Running Running

1 0 1 0 Iref x6 Iref x6 Running Running

1 0 0 1 Hi-Z Hi-Z Hi-Z Hi-Z

1 0 0 0 Hi-Z Hi-Z Hi-Z Hi-Z

1 1 1 1 Running Running Running Running

1 1 1 0 Hi-Z Hi-Z Running Running

1 1 0 1 Hi-Z Hi-Z Hi-Z Hi-Z

1 1 0 0 Hi-Z Hi-Z Hi-Z Hi-Z

CPU_STP#

CPUT

CPUC

CPUT

CPUC

Figure 10. CPU_STP# Deassertion W aveform

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PCI_STP# – Deassertion (transition from logic “0”

to logic “1”)

The deassertion of the PCI_STP# signal will cause all PCI(0:6)

and stoppable PCI_F(0:2) clocks to resume running in a

synchronous manner within two PCI clock periods after

PCI_STP# transitions to a HIGH level.

Note. The PCI ST OP function is controlled by two inputs. One

is the device PCI_STP# pin number 34 and the other is SMBus

Byte 0,Bit 3. These two inputs to the function are logically

AND’ed. If either the external pin or the internal SMBus

stopped in a logic LOW state. Reading SMBus Byte 0,Bit 3 will

return a 0 value if either of these control bits are set LOW

(which indicates that the devices stoppable PCI clocks are not

running).

PD# (Power-down) Clarification

The PD# (power-down) pin is used to shut off all clocks prior

to shutting off power to the device. PD# is an asynchronous

active LOW input. This signal is synchronized internally to the

device powering down the clock synthesizer. PD# is an

asynchronous function for powering up the system. When PD#

is LOW, all clocks are driven to a LOW value and held there

and the VCO and PLLs are also powered down. All clocks are

shut down in a synchronous manner so has not to cause

glitches while transitioning to the LOW “stopped” state.

PD# – Assertion

When PD# is sampled LOW by two consecutive rising edges

of the CPUC clock, then on the next HIGH-to-LOW transition

of PCIF, the PCIF clock is stopped LOW. On the next

HIGH-to-LOW transition of 66Buff, the 66Buff clock is stopped

LOW. From this time, each clock will stop LOW on its next

HIGH-to-LOW transition, except the CPUT clock. The CPU

clocks are held with the CPUT clock pin driven HIGH with a

value of 2 × Iref, and CPUC undriven. After the last clock has

stopped, the rest of the gene rator will be shut down.

PD# – Deassertion

The power-up latency between PD# rising to a valid logic ‘1’

level and the starting of all clocks is less than 3.0 ms.

PCI_STP#

PCI_F(0:2) 33M

PCI(0:6) 33M

setup

Figure 11. PCI_STP# Assertion Waveform

PCI_STP#

PCI_F(0:2)

PCI(0:6)

setup

Figure 12. PCI_STP# Deassertion Waveform

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......................Document #: 38-07331 Rev . *C Page 12 of 19

66Buff[0..2]

PCIF

PWRDWN#

C PU 133M Hz

C PU# 133M Hz

3V66

66In

R EF 14.318MH z

USB 48MHz

Figure 13. Power-down Assertion Timing Waveforms Figure—Buffered Mode

PCI 33M H z

PWRDWN#

CP U T (0:2) 133MH z

C PU C(0:2) 133MH z

RE F 14.318MH z

USB 48MH z

3V66

Figure 14. Power-down Assertion Timing Waveforms—Unbuffered Mode

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......................Document #: 38-07331 Rev . *C Page 13 of 19

Table 8. PD# Functionality

PD# DRCG 66CLK (0:2) PCI_F/PCI PCI USB/DOT

1 66M 66Input 66Input/2 66Input/2 48M

0 LOW LOW LOW LOW LOW

CPU 133M Hz

3V66

CPU# 133MHz

REF 14.318M Hz

USB 48M Hz

PCIF / A P IC

33MHz

66In

66Buff[0,2]

PWRDWN#

66Buff1 / GMC H

400uS max<1.8mS

PCI 33MHz

30uS min

Figure 15. Power-down Deassertion Timing Waveforms—Buffered Mode

CY28346

......................Document #: 38-07331 Rev . *C Page 14 of 19

Absolute Maximum Ratings[5]

Input Voltage Relative to VSS:.............................. VSS – 0.3V

Input Voltage Relative to VDDQ or AVDD: .............VDD + 0.3V

Storage Temperature:................................–65C to + 150C

Operating Temperature:.................................... 0C to +85C

Maximum Power Supply:.................................... ... ... ......3.5V

Current Accuracy[6]

Parameter Conditions Configuration Load Min. Max.

Iout VDD = nominal (3.30V) M0 = 0 or 1 and Rr (see Table 1) Nominal test load for given

configuration –7%

Inom + 7%

Inom

Iout VDD = 3.30 ± 5% All combinations of M0 or 1 and Rr

(see Table 1)Nominal test load for given

configuration –12%

Inom + 12%

Inom

DC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C)

Parameter Description Conditions Min. Typ. Max. Unit

IDD3.3V Dynamic Supply Current All frequencies at maximum values[7] 280 mA

IPD3.3V Power-down Supply Current PD# asserted Note 8 mA

CIN Input Pin Capacitance 5pF

COUT Output Pin Capacitance 6pF

LPIN Pin Inductance 7nH

CXTAL Crystal Pin Capacitance Measured from the XIN or XOUT pin to ground 30 36 42 pF

AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

Crystal

TDC XIN Duty Cycle 47.5 52.5 47.5 52.5 47.5 52.5 47.5 52 .5 % 9, 10, 11

TPERIOD XIN period 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 9, 12,

13, 10

VHIGH XIN HIGH Voltage 0.7VDD VDD 0.7VDD VDD 0.7VDD VDD 0.7VDD VDD V

VLOW XIN LOW Voltage 0 0.3VDD 00.3V

DD 00.3V

DD V

TR / TFXIN Rise and Fall T imes 10.0 10.0 10.0 10.0 ns 14

TCCJ XIN Cycle to Cycle Jitter 500 500 500 500 ps 12, 15,

CPU at 0.7V Timing

TDC CPUT and CPUC Duty

Cycle 45 55 45 55 45 55 45 55 % 15, 16,

TPERIOD CPUT and CPUC

Period 14.85 15.3 9.85 10.2 7.35 7.65 4.85 5.1 ns 15, 16,

TSKEW Any CPU to CPU Clock

Skew 100 100 100 100 ps 12, 15,

Notes:

5. Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.

6. Inom refers to the expected current based on the configuration of the device.

7. All outputs loaded as per maximum capacitive load table.

8. Absolute value = ((Programmed CPU Iref) × (2)) + 10 mA.

9. This parameter is measured as an average over 1 s duration, with a crystal center frequency of 14.31818 MHz.

10.When Xin is driven from an external cl ock source.

11. This is required for the duty cycle on the REF clock out to be as specified. The device will operate reliably with input duty cycles up to 30/70 but the REF clock

duty cycle will not be within data sheet specifications.

12.All outputs loaded as perTable 9 below.

13.Probes are placed on the pins and measurements are acquired at 1.5V for 3.3V signals (see test and measurement set-up section of this data sheet).

14.Measured between 0.2VDD and 0.7VDD.

15.This measurement is applicable with Spread ON or Spread OFF.

16.Measured at crossing point (Vx) or where subtraction of CLK–CLK# crosses 0V Measured from VOL = 0.175V to VOH = 0.525V.

17.Measured from VOL = 0.175V to VOH = 0.525V.

18.Determined as a fraction of 2*(Trise–Tfall)/ (Trise+Tfall).

19.Test load is Rta = 33.2, Rd = 49.9.

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......................Document #: 38-07331 Rev . *C Page 15 of 19

TCCJ CPU Cycle to Cycle

Jitter 150 150 150 150 ps 15, 16,

TR/TFCPUT and CPUC Rise

and Fall Times 175 700 175 700 175 700 175 700 ps 15, 17,

Rise/Fall Matching 20% 20% 20% 20% 17, 18,

DeltaTRRise Time Variation 125 125 125 125 ps 17, 19

DeltaTFFall Time Variation 125 125 125 125 ps 17, 19

VCROSS Crossing Point Voltage

at 0.7V Swing 280 430 280 430 280 43 0 280 430 mV 15, 19

CPU at 1.0V Timing

TDC CPUT and CPUC Duty

Cycle 45 55 45 55 45 55 45 55 % 15, 16

TPERIOD CPUT and CPUC

Period 14.85 15.3 9.85 10.2 7.35 7.65 4.85 5.1 nS 15, 16

TSKEW Any CPU to Any CPU

Clock Skew 100 100 100 100 pS 12, 15,

TCCJ CPU Cycle to Cycle

Jitter 150 150 150 150 pS 12, 16

Differential

TR/TFCPUT and CPUC Rise

and Fall Times 175 467 175 467 1 75 46 7 175 467 ps 15, 20

SE–

DeltaSlew Absolute Single- ended

Rise/Fall Waveform

Symmetry

325 325 325 325 ps 21, 22

VCROSS Cross Point at 1.0V

swing 510 760 510 760 510 760 510 760 mV 22

3V66

TDC 3V66 Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13

TPERIOD 3V66 Period 15.0 15.3 15.0 15.3 15.0 15.3 15.0 15.3 ns 9, 12, 13

THIGH 3V66 HIGH Time 4.95 4.95 4.95 4.95 ns 23

TLOW 3V66 LOW Time 4.55 4.55 4.55 4.55 ns 24

TR/TF3V66 Rise and Fall

Times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 ns 25

TSKEW

Unbuffered 3V66 to 3V66 Clock

Skew 500 500 500 500 ps 12, 13

TSKEW

Buffered 3V66 to 3V66 Clock

Skew 250 250 250 250 ps 12, 13

TCCJ DRCG Cycle to Cycle

Jitter 250 250 250 250 ps 12, 13

Notes:

20.Measurement taken from differential waveform, from –0.35 V to +0.35V.

21.Measurements taken from common mode waveforms, measure rise/fall time from 0.41 to 0.86V . Rise/fall time matching is defined as “the instantaneous differ ence

between maximum CLK rise (fall) and minimum CLK# fall (rise) time or minimum CLK rise (f all) and maximum CLK # fall (rise) time .” This p arameter is design ed

form waveform symmetry.

22.Measured in absolute voltage, i.e., single-ended measurement.

23.THIGH is measured at 2.4V for non-host output s.

24.TLOW is measured at 0.4V for all outputs.

25.Probes are placed on the pins, and measure ment s are acquired betwee n 0.4V and 2. 4V for 3.3V sign als (se e test and measur ement set-up section of th i s d ata

sheet).

AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

CY28346

......................Document #: 38-07331 Rev . *C Page 16 of 19

66B

TDC 66B(0:2) Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13

TR/TF66B(0:2) Rise and Fall

Times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 ns 12, 25

TSKEW Any 66B to Any 66B

Skew 175 175 175 175 ps 12, 13

TPD 66IN to 66B(0:2) Propa-

gation Delay 2.5 4.5 2.5 4.5 2.5 4.5 2.5 4.5 ns 12, 13

TCCJ 66B(0:2) Cycle to Cycle

Jitter 100 100 100 100 ps 12, 13,

PCI

TDC PCI_F(0:2) PCI (0:6)

Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13

TPERIOD PCI_F(0:2) PCI (0:6)

Period 30.0 30.0 3 0.0 30 nS 9, 12, 13

THIGH PCI_F(0:2) PCI (0:6)

HIGH Time 12.0 12.0 12.0 12.0 nS 23

TLOW PCI_F(0:2) PCI (0:6)

LOW Time 12.0 12.0 12.0 12.0 nS 24

TR/TFPCI_F(0:2) PCI (0:6)

Rise and Fall Times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 nS 25

TSKEW Any PCI Clock to Any

PCI Clock Skew 500 500 500 500 pS 12, 13

TCCJ PCI_F(0:2) PCI (0:6)

Cycle to Cycle Jitter 250 25 0 25 0 250 ps 12, 13

48MUSB

TDC 48MUSB Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13

TPERIOD 48MUSB Period 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 ns 12, 13

TR/TF48MUSB Rise and Fall

Times 1.0 2.0 1.0 2.0 1.0 2.0 1.0 2.10 ns 12, 25

TCCJ 48MUSB Cycle to Cycle

Jitter 350 350 350 350 ps 9, 12, 13

48MDOT

TDC 48MDOT Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13

TPERIOD 48MDOT Period 20.837 20.837 20.837 20.837 ns 12, 13

TR/TF48MDOT Rise and Fall

Times 0.5 1.0 0.5 1.0 0.5 1.0 0.5 1.0 ns 12, 13

TCCJ 48MDOT Cycle to Cy-

cle Jitter 350 350 350 350 ps 12, 13

REF

TDC REF Duty Cycle 4555455545554555%12, 13

TPERIOD REF Period 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 12, 13

TR/TFREF Rise and Fall

Times 1.0 4.0 1.0 4.0 1.0 4.0 1.0 4.0 ns 12, 25

TCCJ REF Cycle to Cycle

Jitter 1000 1000 1000 1000 ps 12, 13

Note:

26.This figure is in addition to any jitter already present when the 66IN pin is being used as an input. Oth erwise a 500-ps jitter figure is specified.

AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

CY28346

......................Document #: 38-07331 Rev . *C Page 17 of 19

TPZL/TPZH Output Enable Delay

(All Outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 10

TPZL/TPZH Output disable delay (all

outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 10

TSTABLE All Clock Stabilization

from Power-up 3333ms10

TSS Stop clock Set-up Time 10.0 10.0 10.0 10.0 ns 27

TSH Stopclock Hold Time 0 0 0 0 ns 27

TSU Oscillator Start-up Time X X X X ms 28

AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

Table 9. Maximum Lumped Capacitive Output Loads

Clock Max. Load Units

PCI Clocks 30 pF

3V66 (0,1) 30 pF

66B(0:2) 30 pF

48MUSB Clock 20 pF

48MDOT 10 pF

REF Clock 50 pF

Notes:

27.CPU_STP# and PCI _STP# set-up time with respect to any PCI_F clo ck to guarantee that the effected clock will stop or start a t the next PCI_F clock’ s rising edge

28.When crystal meets minimum 40 device series resistance specification.

29.Device is not affected, VTT_PWRGD# is ignored.

VID (0 :3 ),

SEL (0,1)

VTT_PWRGD#

PWRGD

VDD Clock Gen

Clock State

Clock Outputs

Clock VCO

0.2-0.3mS

Delay

State 0 State 2 State 3

Wait for

VTT_GD# Sample Sels

Off

State 1

(No te A )

Figure 16. VTT_PWRGD# Timing Diagram29[29]

CY28346

......................Document #: 38-07331 Rev . *C Page 18 of 19

Ordering Information

Part Number Package Type Product Flow

CY28346OC 56-pin SSOP – Tube Commercial, 0 to 70C

CY28346OCT 56-pin SSOP – Tape and Reel Commercial, 0 to 70C

CY28346ZC 56-pin TSSOP – Tube Commercial, 0 to 70C

CY28346ZCT 56-pin TSSOP – Tape and Reel Commercial, 0 to 70C

Lead-free

CY28346OXC 56-pin SSOP – Tube Commercial, 0 to 70C

CY28346OXCT 56-pin SSOP – Tape and Reel Commercial, 0 to 70C

CY28346ZXC 56-pin TSSOP – Tube Commercial, 0 to 70C

CY28346ZXCT 56-pin TSSOP – Tape and Reel Commercial, 0 to 70C

VTTPWRGD#

= Low

Delay 0.25mS

Power Off

VDDA = 2.0V

Sample

Inputs (pins

54,55)

VDD3.3 = Off Normal

Operation

Enable Outputs

Figure 17. Clock Generator Po wer-up/Run State Diagram

CY28346

......................Document #: 38-07331 Rev . *C Page 19 of 19

The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Sil-

icon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the

use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or

parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, repre-

sentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-

quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to

support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-

sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized appli-

cation, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.

Package Drawing and Dimensions

56-lead Shrunk Small Outline Package O56

SEATING

PLANE

BSC

0°-8°

MAX.

GAUGE PLANE

29 56

1.100[0.043]

0.051[0.002]

0.851[0.033]

0.508[0.020]

0.249[0.009]

7.950[0.313]

0.25[0.010]

6.198[0.244]

13.894[0.547]

8.255[0.325]

5.994[0.236]

0.950[0.037]

0.500[0.020]

14.097[0.555]

0.152[0.006]

0.762[0.030]

DIMENSIONS IN MM[INCHES] MIN.

MAX.

0.170[0.006]

0.279[0.011]

0.20[0.008]

0.100[0.003]

0.200[0.008]

REFERENCE JEDEC MO-153

PACKAGE WEIGHT 0.42gms

PART #

Z5624 STANDARD PKG.

ZZ5624 LEAD FREE PKG.

56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56