IXGH 24N170A VCES IXGT 24N170A IC25 VCE(sat) tfi(typ) High Voltage IGBT = 1700 V = 24 A = 6.0 V = 45 ns Preliminary Data Sheet Symbol Test Conditions Maximum Ratings VCES TJ = 25C to 150C 1700 V VCGR TJ = 25C to 150C; RGE = 1 M 1700 V VGES Continuous 20 V VGEM Transient 30 V IC25 TC = 25C 24 A IC90 TC = 90C 16 A ICM TC = 25C, 1 ms 75 A SSOA (RBSOA) VGE = 15 V, TVJ = 125C, RG = 5 Clamped inductive load tSC TJ = 125C, VCE = 1200 V; VGE = 15 V, RG = 22 10 PC TC = 25C 250 W -55 ... +150 C TJM 150 C Tstg -55 ... +150 C ICM = 50 @ 0.8 VCES TJ Md Mounting torque (M3) (TO-247) Weight TO-247 TO-268 Symbol Test Conditions BVCES VGE(th) IC IC ICES VCE = 0.8 * VCES VGE = 0 V VCE = 0 V, VGE = 20 V VCE(sat) IC = IC90, VGE = 15 V (c) 2004 IXYS All rights reserved g g Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. = 250 A, VGE = 0 V = 250 A, VCE = VGE IGES C 6 4 1700 3.0 Note 1 TJ = 25C TJ = 125C TJ = 25C TJ = 125C 4.5 4.8 E C (TAB) TO-247 AD (IXGH) G s 300 G A 1.13/10Nm/lb.in. Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s TO-268 (IXGT) 5.0 V V 50 1000 A A 100 nA 6.0 V V G = Gate, E = Emitter, C (TAB) C E C = Collector, TAB = Collector Features z International standard packages JEDEC TO-268 and JEDEC TO-247 AD z High current handling capability z MOS Gate turn-on - drive simplicity z Rugged NPT structure z Molding epoxies meet UL 94 V-0 flammability classification Applications z Capacitor discharge & pulser circuits z AC motor speed control z DC servo and robot drives z DC choppers z Uninterruptible power supplies (UPS) z Switched-mode and resonant-mode power supplies Advantages z High power density z Suitable for surface mounting z Easy to mount with 1 screw, (isolated mounting screw hole) DS98995B(11/04) IXGH IXGT Symbol Test Conditions gfs IC = IC25; VCE = 10 V Note 2 Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 10 Cies Coes VCE = 25 V, VGE = 0 V, f = 1 MHz 16 S 2400 pF 120 pF 30 pF 105 nC 17 nC 30 nC 38 ns Cres Qg Qge IC = IC90, VGE = 15 V, VCE = 0.5 VCES Qgc td(on) Inductive load, TJ = 25C tri IC = IC25, VGE = 15 V td(off) RG = 5 , VCE = 0.5 VCES Note 3 tfi 57 ns 200 350 ns 45 100 ns Eoff 1.1 2.2 mJ td(on) Inductive load, TJ = 125C 38 ns tri IC = IC25, VGE = 15 V 60 ns Eon RG = 5 , VCE = 0.5 VCES Note 3 2.5 mJ td(off) 220 ns tfi 55 ns Eoff 1.7 mJ 0.25 0.5 K/W K/W RthJC RthCK (TO-247) Notes: 1. 2. 3. 24N170A 24N170A TO-247 AD Outline P e Dim. Millimeter Min. Max. A 4.7 5.3 A1 2.2 2.54 A2 2.2 2.6 b 1.0 1.4 1.65 2.13 b1 b2 2.87 3.12 C .4 .8 D 20.80 21.46 E 15.75 16.26 e 5.20 5.72 L 19.81 20.32 L1 4.50 P 3.55 3.65 Q 5.89 6.40 R 4.32 5.49 S 6.15 BSC Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216 242 BSC TO-268 Outline Device must be heatsunk for high temperature leakage current measurements to avoid thermal runaway. Pulse test, t 300 s, duty cycle 2 % Switching times may increase for VCE (Clamp) > 0.8 * VCES, higher TJ or increased RG. Dim. A A1 A2 b b2 C D E E1 e H L L1 Millimeter Min. Max. 4.9 5.1 2.7 2.9 .02 .25 1.15 1.45 1.9 2.1 .4 .65 13.80 14.00 15.85 16.05 13.3 13.6 5.45 BSC 18.70 19.10 2.40 2.70 1.20 1.40 Inches Min. Max. .193 .201 .106 .114 .001 .010 .045 .057 .75 .83 .016 .026 .543 .551 .624 .632 .524 .535 .215 BSC .736 .752 .094 .106 .047 .055 L2 L3 L4 1.00 1.15 0.25 BSC 3.80 4.10 .039 .045 .010 BSC .150 .161 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or moreof the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 6,683,344 6,710,405B2 6,710,463 6,727,585 6,759,692