HV809 Offline High-Voltage EL Lamp Driver Features General Description * Up to 200V DC Input Voltage * 400V Peak-to-Peak Output Voltage * Up to 350 nF Output Load (100 in2 for 3.5 nF/in2 Lamp) * Adjustable Output Lamp Frequency * Adjustable On/Off Pulsing Frequency The HV809 is an offline high-voltage EL lamp driver integrated circuit designed for driving EL lamps of up to 350 nF at 400 Hz. The input supply voltage can be a rectified nominal 120V AC source or any other DC source up to 200V. The HV809 supplies the EL lamp with an AC square wave with a peak-to-peak voltage of twice the input DC voltage. The HV809 has two internal oscillators, a low-voltage output linear regulator, and a high-voltage output H-bridge. The high-voltage output H-bridge frequency is set by an external resistor connected between the REL-Osc and GND pins. The EL lamp is connected between the VA and VB pins. For the HV809 in the 8-pin package, an external RC network can be connected between the oscillator's Osc1 and Osc2 pins to pulse the EL lamp on and off. Applications * * * * Electronic Organizers Handheld Portable Computers Display Signs Portable Instrumentation Equipment For detailed circuit and application information, please refer to Application Note, AN-H36. Package Types 8-lead SOIC (Narrow Body) (Top view) 8-lead SOIC (with Heat Slug) (Top view) HVIN 1 8 VA HVIN 1 8 VA VDD 2 7 VB VDD 2 7 VB Osc2 3 6 GND Osc2 3 6 GND Osc1 4 5 REL-Osc Osc1 4 5 REL-Osc Heat Slug See Table 2-1 for pin information. 2018 Microchip Technology Inc. DS20005630A-page 1 HV809 Functional Block Diagram HVIN Linear Regulator Q VA Q VDD Osc1 Osc2 REL-Osc Q Logic and Osc VB Q GND DS20005630A-page 2 2018 Microchip Technology Inc. HV809 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings High-Voltage Input, HVIN ..................................................................................................................................... +210V Internal Supply Voltage, VDD .................................................................................................................................. +15V Maximum Junction Temperature, TJMAX ............................................................................................................. +125C Storage Temperature, TS ..................................................................................................................... -55C to +150C Power Dissipation: 8-lead SOIC ........................................................................................................................................... 500 mW 8-lead SOIC (with Heat Slug) ................................................................................................................1.5 Watts Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit Conditions High-Voltage Input HVIN 50 -- 200 V Load Capacitance CL -- -- 350 nF REL = 1 M, HVIN = 170V -- -- 150 nF REL = 390 k, HVIN = 170V Operating Temperature TA -25 -- +85 C DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions unless otherwise indicated; TA = 25C Parameter Sym. -- 70 mA HVIN = 170V, REL = 1 M, CL = 350 nF -- -- 9 mA HVIN = 170V, REL = 1 M, CL = 50 nF -- -- 400 A HVIN = 170V, REL = 1 M, Osc1 = GND, No load -- -- 100 A HVIN = 170V, REL = 1 M, Osc1 = VDD, No load ISINK -- 300 -- A VOsc2 = 1V ISOURCE -- 100 -- A VOsc2 = VDD-1V IOsc1 -- 10 -- A VOsc1 = GND and VDD IIN Quiescent Supply Current IINQ Osc2 Sink Current Osc1 Logic Input Leakage Current Osc1 Hysteresis Voltage Conditions -- High-Voltage Supply Current Osc2 Source Current Min. Typ. Max. Unit VOsc1(HYST) -- 2.5 -- V Minimum Differential Output Voltage across Lamp VA-B -- -- 400 V HVIN = 200V Internal Supply Voltage VDD 8 10 12 V No load on VDD AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions unless otherwise indicated; TA = 25C Parameter VA-B Output Drive Frequency Sym. fEL Min. Typ. Max. Unit Conditions 320 400 480 Hz REL = 1 M, Osc1 = GND, CL = 350 nF 0.8 1 1.2 kHz REL = 390 k, Osc1 = GND, CL = 150 nF Output Rise Time tr -- 180 250 s CL = 150 nF, HVIN = 170V Output Fall Time tf -- 50 100 s CL = 150 nF, HVIN = 170V 2018 Microchip Technology Inc. DS20005630A-page 3 HV809 TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Operating Ambient Temperature TA -25 -- +85 C Maximum Junction Temperature TJMAX -- -- +125 C TS -55 -- +150 C 8-lead SOIC JA -- 101 -- C/W 8-lead SOIC (with Heat Slug) JA -- 84 -- C/W Conditions TEMPERATURE RANGE Storage Temperature PACKAGE THERMAL RESISTANCE DS20005630A-page 4 2018 Microchip Technology Inc. HV809 2.0 PIN DESCRIPTION The details on the pins of HV809 8-lead SOIC (narrow body) and 8-lead SOIC (narrow body with heat slug) are listed on Table 2-1. See Package Types for the location of pins. TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name 1 HVIN High-voltage input supply pin 2 VDD Internal supply voltage 3 Osc2 The RC network can be connected between the oscillator's Osc1 and Osc2 pins to pulse the EL lamp on and off. 4 Osc1 The Output H-bridge can be enabled and disabled by connecting the Osc1 pin to the GND and VDD pins. The output can be left enabled by connecting the Osc1 pin to GND. 5 REL-Osc EL lamp frequency is controlled via an external REL resistor connected between the REL-Osc and GND pins of the device. 6 GND 7 VB VB side of the EL lamp driver H-bridge. Connection for one of the EL lamp terminals. 8 VA VA side of the EL lamp driver H-bridge. Connection for one of the EL lamp terminals. Note 1: Description Ground pin Heat slug is at ground potential. 2018 Microchip Technology Inc. DS20005630A-page 5 HV809 3.0 FUNCTIONAL DESCRIPTION 3.0 to 12VDC DC-DC Converter 50 to 200VDC R CIN VBATT CDD 1 HVIN VA 8 2 VDD VB 7 3 Osc2 GND 6 4 Osc1 REL-Osc 5 C FIGURE 3-1: 3.0 to 12VDC EL Lamp REL HV809 Pulsing EL Lamp. DC-DC Converter VBATT 50 to 200VDC CIN Push Button DS20005630A-page 6 HVIN VA 8 2 VDD VB 7 3 Osc2 GND 6 4 Osc1 REL-Osc 5 EL Lamp R CDD FIGURE 3-2: 1 C HV809 REL Push-button, Delayed Turn-off. 2018 Microchip Technology Inc. HV809 VA VB VA - VB HVIN = 170V, REL = 1 M and CL = 350 nF FIGURE 3-3: TABLE 3-1: Typical Waveform on VA and VB and Differential Waveform VA-VB. FUNCTION TABLE Inputs Osc1 Outputs VA VB GND Enabled Enabled VDD Disabled Disabled 2018 Microchip Technology Inc. DS20005630A-page 7 HV809 4.0 PACKAGING INFORMATION 4.1 Package Marking Information Legend: XX...X Y YY WW NNN e3 * Note: DS20005630A-page 8 8-lead SOIC Example XXXXXXX e3 YYWW NNN HV809LG e3 1814 772 8-lead SOIC Example XXXXXXX e3 YYWW NNN HV809SG e3 1818 117 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 2018 Microchip Technology Inc. HV809 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. 2018 Microchip Technology Inc. DS20005630A-page 9 HV809 8-Lead SOIC (Narrow Body w/Heat Slug) Package Outline (SG) 4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch D1 D 8 8 Exposed Thermal Pad Zone E2 E E1 Note 1 (Index Area D/2 x E1/2) 1 1 Top View Bottom View 1 A View B h h A A2 Note 1 Seating Plane e A1 L b L1 L2 Gauge Plane Seating Plane A Side View View A - A View B Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. ,IRSWLRQDOFKDPIHUIHDWXUHLVQRWSUHVHQWD3LQLGHQWLHUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWLHUFDQEHDPROGHGPDUN LGHQWLHUDQHPEHGGHGPHWDOPDUNHURUDSULQWHGLQGLFDWRU Symbol MIN Dimension NOM (mm) MAX A A1 A2 b 1.25* 0.00 1.25 0.31 - - - - 1.70 0.15 1.55* 0.51 D D1 E E1 E2 e 4.80* 3.30 5.80* 3.80* 2.29 4.90 - 6.00 3.90 - 5.00* 3.81 6.20* 4.00* 2.79 1.27 BSC h L 0.25 0.40 - - 0.50 1.27 L1 1.04 REF L2 0.25 BSC 0O 5O - - 8O 15O JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005. 7KLVGLPHQVLRQLVQRWVSHFLHGLQWKH-('(&GUDZLQJ 7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ Drawings not to scale. DS20005630A-page 10 2018 Microchip Technology Inc. HV809 APPENDIX A: REVISION HISTORY Revision A (August 2018) * Converted Supertex Doc# DSFP-HV908 to Microchip DS20005630A * Removed "Processed with HVCMOS(R) Technology" from the Features section * Removed the "Output VDD Current" parameter from the DC Electrical Characteristics table * Removed the 7-lead TO-220 package option * Changed the quantity of the LG and SG packages from 2500/Reel to 3300/Reel * Made minor text changes throughout the document 2018 Microchip Technology Inc. DS20005630A-page 11 HV809 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device Device: Packages: Environmental: Media Type: XX - Package Options HV809 X - Environmental = X Media Type Offline High-Voltage EL Lamp Driver LG = 8-lead SOIC SG = 8-lead SOIC (with Heat Slug) G = Lead (Pb)-free/RoHS-compliant Package (blank) = 3300/Reel for an LG Package (blank) = 3300/Reel for an SG Package DS20005630A-page 12 Examples: a) HV809LG-G: Offline High-Voltage EL Lamp Driver, 8-lead SOICPackage, 3300/Reel b) HV809SG-G: Offline High-Voltage EL Lamp Driver, 8-lead SOIC Package (with Heat Slug), 3300/Reel 2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3381-1 == ISO/TS 16949 == 2018 Microchip Technology Inc. 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