JANS2N2222AUB-TR - Semicoa Semiconductors

REVISIONS

LTR

DESCRIPTION

DATE

APPROVED

Add requirements for space level and

update to present DoD policy requirements.

27 JAN 2006

Michael A. Radecki

Paragraph 4.3.3; change HTE from 1000

hours to 100 hours. Add pure tin prohibition.

Editorial corrections throughout.

14 APR 2006

Michael A. Radecki

Add vendor. Extend vendors resistance

range and tolerances. Add pulse application

paragraph. Editorial corrections throughout

5 AUG 2011

Michael A. Radecki

Correct paragraph 4.4 example 2 critical

resistance value sign to “≥”. Editorial

change throughout.

14 FEB 2013

Michael A. Radecki

Add vendor to space level PIN and QR

code. Editorial changes throughout.

17 APR 2015

Michael A. Radecki

Prepared in accor d anc e wit h ASM E Y14. 100

REV STATUS

OF PAGES

REV

PAGES

PMIC N/A

PREPARED BY

Dennis L. Cross

DESIGN ACTIVITY :

DEFENSE SUPPLY CENTER, COLUMBUS

COLUMBUS, OH

Original date of

drawing

CHECKED BY

Andrew R. Ernst

TITLE

RESISTOR, CHIP, FIXED, FILM,

MOISTURE RESISTANT, MILITARY

and SPACE LEVEL, STYLE 0603

2 March 2004

APPROVED BY

Kendall A. Cottongim

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AMSC N/A 5905-2015-E16

CURRENT DESIGN ACTIVITY CAGE CODE 037Z3

HAS CHANGED NAMES TO:

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

1. SC OPE

1.1 Scope. This drawing describes the requirements for a 0.060 by 0.030 chip resistor, which is resistant to the

degrading effects of moisture under power.

1.2 Part or Identifying Numbers (PIN’s). The complete PIN’s are shown in the examples below. The first example is for

general military applications. (NOTE: This PIN is the original PIN shown in previous revisions of this drawing). The

second example is for space type applications and requires adding a code letter to the end of the original PIN.

NOTE: Example of military level PIN.

04009

****

Drawing number

Characteristic

(see 3.3.1)

Resistance

(see 3.3.2)

Tolerance

(see 3.3.3)

Termination

material

(see 3.3.4)

NOTE: Example of space level PIN (codes A & T).

04009

****

Drawing number

Characteristic

(see 3.3.1)

Resistance

(see 3.3.2)

Tolerance

(see 3.3.3)

Termination

material

(see 3.3.4)

Space levels

(see 3.3.5)

2. APPLICABLE DOCUMENTS

2.1 Government documents.

2.1.1 Specifications and standards. The following specifications and standards form a part of this document to the

extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or

contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-55342 - Resistor, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level,

General Specification for.

MIL-PRF-55342/12 - Resistor, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level,

Style 0603.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-690 - Failure Rate Sampling Plans and Procedures.

MIL-STD-790 - Standard Practice for Established Reliability and High Reliability QPL Systems.

* (Copies of these documents are available online at http://quicksearch.dla.mil.)

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2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of

this document and the references cited herein (except for related specification sheets), the text of this document takes

precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption

has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified

herein.

3.2 Interface and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in

MIL-PRF-55342 and herein (see figure 1).

3.2.1 Des ign doc umentation. The design documentation shall be in acc or dance w ith MIL-PRF-55342 and unless

otherwise specified in the contract or purchase order, shall be retained by the manufacturer and available for review by

the acquiring activity or contractor upon request.

3.3 Electrical characteristics.

3.3.1 Resistance temperature characteristic. The resistance temperature characteristic shall be identified by a single

letter as specified in MIL-PRF-55342 and herein (see 6.7).

3.3.2 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent

significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 100

ohms, or when fractional values of an ohm are required, the letter "R" shall be substituted for one of the significant figures.

The resistance value designations are shown in table I . Minimum and maximum resistance values shall be as specified in

MIL-PRF-55342. Resistance values not listed in the "10 to 100" decade table of MIL-PRF-55342 for the appropriate

resistance tolerance shall be considered as not conforming to the specification.

TABLE I. Resistance value designations.

Designation Resis tance ohms

1R00 to 9R88 incl.

10R0 to 98R8 incl.

1000 to 9880 incl.

1001 to 9881 incl.

1002 to 9882 incl.

1003 to 9883 incl.

1004 to 9884 incl.

1005 to 2205 incl.

1.00 to 9.88 incl.

10.0 to 98.8 incl.

100.0 to 988.0 incl.

1,000.0 to 9,880.0 incl.

10,000.0 to 98,800.0 incl.

100,000.0 to 988,000.0 incl.

1,000,000.0 to 9,880,000.0 incl.

10,000,000.0 to 22,000,000.0 incl.

3.3.2.1 Resistance range. The resistance range shall be as specified in MIL-PRF-55342/12 and herein (see 6.7).

3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II and herein (see

6.7).

3.3.4 Termination material. Termination material shall be identified by a single letter as specified in

MIL-PRF-55342 and herein (see 6.7).

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TABLE II. Res is tanc e tol eranc e.

Symbol R esis tanc e tol eranc e

percent

+0.1

+1.0

+2.0

+5.0

+10.0

3.3.4.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin

content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3

percent lead, by mass (see 6.3).

3.3.5 Product level testing. The product level testing shall be designated by the military and space level PIN’s (see

1.2, 4.3.2, and 4.3.3).

3.3.6 Power rating. The power rating for this chip resistor shall be as specified in MIL-PRF-55342/12.

3.3.7 Voltage rating. The maximum continuo us work ing vol tag e shall be as specif ied in MIL-PRF-55342/12.

3.3.8 Power moisture resistance. When resistors are tested as specified in 4.4, there shall be no evidence of

mechanical damage; the change in resistance between the initial and final measurements shall not exceed the limits as

specified in the moisture resistance requirements of MIL-PRF-55342. Samples subjected to this test shall not be

delivered on the contract or order.

3.3.9 Outgassing (space levels A and T). Outgassing shall be performed as specified in MIL-PRF-55342.

3.4 Marking. Marking is not required on the resistor; however, each unit package shall be marked with the PIN

assigned herein (see 1.2), vendor CAGE code, and date and lot codes.

3.5 Man uf ac turer s ' eligibi lit y (m ilitar y applic ati ons) . The approved sources of supply listed on this drawing shall be

qualified to at least one product on the Qualified Products List for MIL-PRF-55342. They shall have successfully passed

the power moisture resistance test as witnessed and certified by an official company representative with 30 samples (10

low, 10 critical, 10 high) with zero defects. If the manufacturer has already performed the power moisture resistance test

to any of the following drawings (94012, 94013, 94014, 94015, 94016, 94017, 94018, 94019, 94025, 94026, 04007,

04008, or 07010) then performance of the power moisture resistance test as a prerequisite for being a source of supply is

not required.

3.5.1 Manufacturers eligibility (space levels A and T). Only approved sources of supply qualified to “T” failure rate level

of MIL-PRF-55342 and approved to the general military level of this drawing may supply to space level codes A and T.

Furthermore all testing for these levels shall be done on a production lot basis as defined in MIL-PRF-55342. Test

deletion or reduction, which may be granted for ER level product, is not allowed for space level codes A and T of this

document.

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Configuration A

Configuration B

Configuration Dimension A

Inches Dimension B

Inches Dimension C

Inches Dimension D

Inches Dimension E

Inches

A 0.060 ±0.005 0.032 ±0.005 0.010/0.033 0.010 ±0.005 N/A

B 0.064 ±0.006 0.032 ±0.005 0.010/0.033 0.012 ±0.005 0.015 ±0.005

NOTES:

1. Dimensions are in Inches.

2. Millimeter equivalents are given for general information only.

3. The pictorial view of the styles above are given as representative of the envelope of the item. Slight deviations

from the outline shown, which are contained within the envelope, and do not alter the functional aspects of the

device are acceptable.

FIGURE 1. Chip resistor.

Inches mm

0.005 0.13

0.006 0.15

0.010 0.25

0.012 0.31

0.015 0.38

0.032 0.81

0.033 0.84

0.060 1.52

0.064 1.63

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* 3.6 Recycled, recovered, e nv ironmentall y prefer abl e or biobased materials. Recycled, recovered, environmentally

preferable or biobased materials should be used to the maximum extent possible provided that the material meets or

exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs.

3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or

appearance.

4. VERIFICATION

4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintai ned in

accordanc e with MIL-STD-790 is not applicable to this document.

4.2 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not

applicable to this document.

4.3 Conformance inspection.

4.3.1 Inspection of product for delivery (military level). Inspection of product for delivery for each PIN ordered shall

consist of group A inspection and group B inspection of MIL-PRF-55342, ER level. Additionally 5 samples of each PIN

ordered shall be subjected to the power moisture resistance test specified herein with 0 defects allowed.

4.3.1.1 C er tif icati on (military level on ly). The procuring activity may accept a certificate of compliance in lieu of

performing group B inspection and the power moisture resistance test (see 6.2d).

4.3.2 Inspection of product for delivery (space level code A). Inspection of product for delivery for each PIN ordered

shall consist of group A inspection and group B inspection of MIL-PRF-55342, space level. Additionally 10 samples of

each PIN ordered shall be subjected to the power moisture resistance test specified herein (see 4.4) with 0 defects

allowed. The group C life test shall be performed as specified in MIL-PRF-55342 except the test shall be from each

production lot for 1000 hours, 22 samples for each value ordered with 0 defects. NOTE: Test samples subjected to

Group B, Group C, and the power moisture resistance test herein shall not be delivered on the contract or order.

4.3.3 Inspection of product for delivery (space level code T). Inspection of product for delivery for each PIN ordered

(each production lot) shall consist of group A, group B, and group C inspection of MIL-PRF-55342, space level.

Resistance to soldering heat and resistance to bonding exposure shall be as specified in MIL-PRF-55342 except 10

samples for each PIN ordered, followed by power moisture resistance as specified herein (see 4.4) performed on the

same set of samples with 0 defects for the subgroup. The group C life test shall be performed as specified in

MIL-PRF-55342 except the test shall be for 1000 hours, 22 samples for each value ordered with 0 defects. Thermal

shock and low temperature operation shall be as specified in MIL-PRF-55342 except 10 samples for each PIN ordered

with 0 defects. High temperature exposure shall be as specified in MIL-PRF-55342 except the test shall be for 100 hours,

10 samples with 0 defects. NOTE: Test samples subjected to Group B, Group C, and the power moisture resistance test

herein shall not be del i vere d on the contrac t or order .

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4.4 Power moisture resistance. Power moisture resistance test shall be performed as specified in MIL-PRF-55342

except the loading voltage shall be as follows:

Loading voltage: The loading voltage shall be equal to 10 percent rated power for resistance values less than or

equal to the critical resistance value as shown in example number 1. For values greater than or equal to the critical

resistance value the loading voltage shall be as shown in example number 2.

EXAMPLE 1 EXAMPLE 2

Characteristic: "K" Characteristic: "K"

Rated wattage: 0.070 watts (P) Voltage rating: 50 volts (V)

Value: 2000 ohms (R)

PRV1.=

(for “R” ≤ critical res.)

1.=V

x V (for “R” ≥ critical res.)

( )( )

200007.1.

= .316 x 50

= 15.8 volts

= 3.74 volts

4.5 Visu al and m ec hanical examination . Resistors shall be examined to verify that the materials, design, construction,

physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342.

4.6 Data retention (codes A & T). Data retention for space level products shall be per the requirements of

MIL-PRF-55342.

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see

6.2). When packaging of materiel is to be performed by DoD or in-house personnel, these personnel need to contact the

responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by

the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or within the military

service’s system Commands. Packaging data retrieval is available from the managing Military Department's or Defense

Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Chip

resistors can also be used in surface mount applications.

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6.2 Ordering data. The contract or purchase order should specify the following:

a. Complete PIN (see 1.2).

b. Requirements for delivery: One copy of the conformance inspection variables and attributes data that parts have

passed conformance inspection, with each shipment of parts by the manufacturer.

c. Packaging requirements (see 5.1).

d. Whether the manufacturer performs the group B inspection and the moisture resistance test or provides a

certificate of compliance (see 4.3.2, military level only ).

6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker

growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can

develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a

whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to

inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification

for Electrodeposited Coatings of Tin).

6.4 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by

electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping

resistors. Direct shipment to the Government is controlled by MIL-DTL-39032, which specifies a preventive packaging

procedure.

6.5 Pulse applications. Designers are CAUTIONED on using the above resistors in high power pulse applications.

Since they have not been qualified nor tested for such applications, damage and premature failure are possible. These

resistors only see a onetime pulse (Short-time overload) as part of the group B inspection of MIL-PRF-55342.

6.6 User of record. Coordination of this document for future revisions is coordinated only with the approved source of

supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be

achieved online at resistor@dla.mil or in writing to: DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH

43218-3990 or b y telep hon e (614) 692-0552 or DSN 850-0552.

* 6.7 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they

become available. Assistance in the use of this drawing may be obtained online at resistor@dla.mil or contact

DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN

850-0552.

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DLA Land and Maritime

Drawing PIN’s

04009-*******

04009-********

Vendor similar

designation or type

number 1/

Vendor

CAGE Vendor name

and address

Char. E, H, K, & M; res. values 10

ohms thru 100 kohms; res. tol. 0.1,

1.0, 2.0, 5.0, & 10.0 pct.; term. B,

original PIN only (see 1.2).

W0603RX

57027

TT IRC, Inc

4222 S. Staples St.

Corpus Christi, TX 78411-2702

Char. E and H; res. values 100 ohms

to 332 kohms; res. tol. 0.1 pct.; res.

values 5.62 ohms to 332 kohms; res.

tol. 1 pct.; res. values 5.6 ohms to

330 kohms; res. tol. 2, 5, and 10 pct.;

term. B and W, all PIN’s (see 1.2).

Char. K and M; res. values 100 ohms

to 332 kohms, res. tol. 0.1 pct.; res.

values 1.0 ohm to 22.0 Megohms,

res. tol. 1, 2, 5, and 10 pct.; term. B,

C, G, U, and W, all PIN’s (see 1.2).

H0603**********(D04009)

56235

State of the Art, Inc.

2470 fox Hill Road

State college, PA 16803-1097

Char. E, H, K, & M; res. values 10

ohms to 130K ohms; res. tol. 0.1, 1.0,

2.0, 5.0, and 10.0 pct.; term. B, all

PIN’s (see 1.2).

PTN0603

57498

VISHAY Thin Film

2160 Liberty Drive

Niagara Falls, NY 14304-3676

Char. K and M; res. values 1 ohm

thru 200 kohms, res. tol. 1 pct.; term.

B, G, U, C and W, all PIN’s (see 1.2).

Char. K and M; res. values 1 ohm

thru 180 kohms, res. tol. 2, 5, and 10

pct.; term. B, G, U, C and W, all PIN’s

(see 1.2).

WA93SM-*****-NS62C

WA93SM-*****-NUC

WA93PG-*****-UC

WA93PS-*****-UC

MSR93G-*****-UC

50316

Mini-Systems, Inc.

Thick Film Division

PO Box 69

20 David Road

North Attleboro, MA 02761-

0069

Char. M, res. values 1 ohm thru 5.6

ohms, res. tol. 2, 5, and 10 pct., term.

B, all PIN’s (see 1.2)

Char. K and M, res. values 5.62 ohms

thru 22 megohms, res. tol. 1, 2. 5, and

10 pct., term. B, all PIN’s (see 1.2).

RCWP-0603-69

RCWP-0603-81

RCWP-0603-82

SH903

Vishay Dale Electronics

PO Box 609

Columbus, NE 68602-0609

Plant:

Vishay Israel, Ltd.

Emek-Sara “B” Industrial Park

Beer Sheva, Israel 84874

1/ Caution: Parts must be purchased to the D LA Lan d and Mari time PIN to assure that all performance

requirements and tests are met.

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