BM1Q001FJ-E2 - ROHM Semiconductor

Datasheet

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

1/25 TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

TSZ22111・14・001

www.rohm.com

AC/DC Drivers

Quasi-Resonant Control type

DC/DC Converter IC

BM1Q00XFJ Series

●General Description

The quasi-resonant controller typed AC/DC converter IC

(BM1Q00XFJ series) provides an optimum system for all

products that include an electrical outlet.

Quasi-resonant operation enables soft switching and helps

to keep EMI low.

With MOSFET for switching and current detection resistors

as external devices, a higher degree of design freedom is

achieved.

As BM1Q00XFJ series built in HV starter circuit, it

contributes to low consumption power and high speed start.

Because the built-in burst mode is reduced switching loss

and IC consumption current is low, Stand-by power is very

low.

Because BM1Q00XFJ series built-in soft-start, burst mode,

over current limiter which is cycle-by-cycle, over load

protection, over voltage protection, CS open protection and

so on, BM1Q00XFJ series are highly safety.

●Key Specifications

 Operating Power Supply Voltage Range:

: VCC：8.9V to 26.0V

VH： to 600V

 Operating Current: Normal：0.60mA (Typ.)

Burst ： 0.35mA(Typ.)

 Max frequency: 120kHz(Typ.)

 Operate temperature range: -40℃ to +85℃

●Typical A pplication Circuit

●Features

 Quasi-resonant method

 Built-in 650V tolerate start circuit

 Low power when load is light ( Burst operation)

 Maximum frequency control (120kHz)

 Frequency reduction function

 AC voltage correction function

 VCC pin : under voltage protection

 VCC pin : overvoltage protection

 Over-current protection (cycle-by-cycle)

 OUT pin : H voltage 12V clamp

 Soft start

 ZT trigger mask function

 ZT Over voltage protection

 FB Over Load protection [Auto-restart]

 CS pin open protection [Auto-restart]

●Package

SOP-J8 4.90mm × 3.90mm × 1.65mm

(Typ.) (Typ.) (Typ.)

●Applications

AC adapters and household appliances (printer, TV,

vacuum cleaners, air cleaners, air conditioners, IH

cooking heaters etc.)

●Line Up

Fig 1. Application Circuit

IC VCC OVP ZT OVP

BM1Q001FJ Auto restart None

BM1Q002FJ Latch Latch

2/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Absolute Maximum Ratings（Ta=25C）

Item Symbol Rating Unit Condition

Input voltage range 1 Vmax1 -0.3 ~ 30 V VCC

Input voltage range 2 Vmax2 -0.3 ~ 6.5 V CS, FB

Input voltage range 3 Vmax3 -0.3 ~ 7.0 V ZT

Input voltage range 4 Vmax4 -0.3 ~ 15 V OUT

Input voltage range 5 Vmax5 -0.3 ~ 650 V VH

OUT pin out peak current1 IOH -0.5 A

OUT pin out peak current2 IOL 1.0 A

ZT pin current1 ISZT1 -3.0 mA

ZT pin current2 ISZT2 3.0 mA

Allowable dissipation Pd 674.9 (Note1) mW

Operating temperature Topr -40 ～ +85 oC

Max junction temperature Tjmax 150 oC

Storage temperature range Tstr -55 ～ +150 oC

(Note1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).

Reduce to 5.4 mW/C when Ta = 25C or above.

●Operating Conditions（Ta=25C）

Parameter Symbol Rating Unit Conditions

Power supply voltage range 1 VCC 8.9～26.0 V VCC

Power supply voltage range 2 VH 80～600 V VH

●Electrical Characteristics (Unl ess otherwise noted, Ta = 25C, VCC = 15 V)

Parameter Symbol Specifications Unit Conditions

MIN TYP MAX

［Circuit current］

Circuit current (ON)1 ION1 - 600 1000 uA

FB=2.0V

(Switching operation)

Circuit current (ON)2 ION2 - 350 450 uA

FB=0.5V

(Switching OFF)

Circuit current(OFF) IOFF - - 25 uA

VCC=12V , VH:open

VCC UVLO = disable

［VH pin starter］

VH Start current1 ISTART1 0.400 0.700 1.000 mA VCC= 0V

VH Start current2 ISTART2 1.00 3.00 6.00 mA VCC=10V

VH OFF current ISTART3 - 10 20 uA

Released VCCUVLO

VH pin current

VH start current switched voltage VSC 0.400 0.800 1.400 V VCC pin

［VCC pin protection］

VCC UVLO voltage1 VUVLO1 12.50 13.50 14.50 V VCC rise

VCC UVLO voltage2 VUVLO2 7.50 8.20 8.90 V VCC fall

VCC UVLO hysteresis VUVLO3 - 5.30 - V VUVLO3= VUVLO1-VUVLO2

VCC charge start voltage VCHG1 7.70 8.70 9.70 V Starter circuit

VCC charge end voltage VCHG2 12.00 13.00 14.00 V Stop voltage from VCHG1

VCC OVP voltage1 VOVP1 26.00 27.50 29.00 V VCC rise

VCC OVP voltage2 VOVP2 - 23.50 - V VCC fall [BM1Q001]

VCC OVP hysteresis VOVP3 - 4.00 - V [BM1Q001]

［OUT pin］

OUT pin H voltage VOUTH 10.5 12.5 14.5 V IO=-20mA, VCC=15V

OUT pin L voltage VOUTL - - 0.30 V IO=+20mA

OUT pin Pull-down resistor RPDOUT 75 100 125 kΩ

3/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●IC control unit Electrical Characteristics (Unless o therwise noted, Ta = 25C, VCC = 15 V)

Parameter Symbol Specifications Unit Conditions

MIN TYP MAX

[ DC/DC converter unit （Turn-off）]

Pull-up resistor of FB pin RFB 22.5 30.0 37.5 kΩ FB=0V

CS over current voltage 1A Vlim1A 0.475 0.500 0.525 V FB=2.2V (ACSNS＝L)

CS over current voltage 1B Vlim1B 0.310 0.350 0.390 V FB=2.2V (ACSNS＝H)

CS over current voltage 2A Vlim2A 0.100 0.125 0.150 V

FB=0.5V (ACSNS＝L)

CS over current voltage 2B Vlim2B 0.062 0.088 0.113 V FB=0.5V (ACSNS＝H)

Voltage gain1

（ΔVFB/ΔVCS） AVCS1 3.40 4.00 4.60 V/V ACSNS＝L

Voltage gain 2

（ΔVFB/ΔVCS） AVCS2 4.86 5.71 6.57 V/V ACSNS＝H

ZT current switched CS 1 IZT1 0.93 1.00 1.07 mA

ZT current switched CS 2 IZT2 0.82 0.90 0.98 mA

ZT current hysteresis

switched CS voltage IZTHYS - 0.10 - mA

CS Leading Edge Blanking TLEB - 0.250 - us

Turn-off time TOFF - 0.150 - us

Minimum ON width Tmin - 0.400 - us

TLEB＋TOFF

Maximum ON width Tma

30.0 39.0 50.7 us

[ DC/DC converter unit （Turn-on）]

ZT input current 1 IZT1 4 14 24 uA OUT=L, ZT=4.65V

ZT input current 2 IZT2 6 16 26 uA OUT=L, ZT=5.00V

ZT input current 3 IZT3 8 18 28 uA OUT=L, ZT=5.35V

Max frequency 1 FSW1 108 120 132 kHz FB=2.0V

Max frequency 2 FSW2 21 30 39 kHz FB=0.5V

Frequency reduction start

voltage VFBSW1 1.10 1.25 1.40 V

Frequency reduction end voltage VFBSW2 0.42 0.50 0.58 V

ZT comparator voltage1 VZT1 60 100 140 mV ZT fall

ZT comparator voltage2 VZT2 120 200 280 mV ZT rise

ZT trigger mask time TZTMASK - 0.6 - us

In OUT H ->L,

prevent noise

ZT trigger Timeout1 TZTOUT1 10.5 15.0 19.5 us

ZT trigger Timeout2 TZTOUT2 3.5 5.0 6.5 us From final ZT trigger

[DC/DC protection ]

Soft start time1 TSS1 0.35 0.50 0.65 ms

Soft start time 2 TSS2 0.70 1.00 1.30 ms

Soft start time 3 TSS3 1.40 2.00 2.60 ms

Soft start time 4 TSS4 2.80 4.00 5.20 ms

FB Burst voltage VBURST1 0.42 0.50 0.58 V Burst ON

FB OLP voltage a VFOLP1A 2.6 2.8 3.0 V FBOLP detect（FB rise）

FB OLP voltage b VFOLP1B - 2.6 - V

FBOLP detect（FB fall）

FB OLP delay timer TFOLP 44.8 64 83.2 ms

FBOLP stop timer TOLPST 358 512 666 ms

Latch released voltage

（VCC pin voltage） VLATCH -

VUVLO2 –

0.50 - V

Latch mask time TLATCH 50 100 200 ms

ZT OVP voltage VZTL 4.65 5.00 5.35 V [BM1Q002FJ]

* Definition of ACSNS (L : ZT current＜IZT1 、H : ZT current > IZT1)

4/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Pin Configuratio n

Table 1 Input-Output PIN Function

NO. Pin Name I/O Function ESD Diode

VCC GND

1 ZT I Zero current detect pin - ○

2 FB I Feedback signal input pin ○ ○

3 CS I Primary current sensing pin ○ ○

4 GND I/O GND pin ○ -

5 OUT O External MOS drive pin ○ ○

6 VCC I/O Power supply pin - ○

7 N.C. - Non Connection - -

8 VH I Starter circuit pin - ○

● External Dimensions

Fig-2 External Dimensions

●I/O Equivalent Circuit Diagram

Fig-3 I/O Equivalent Circuit Diagram

0.45MIN

0.2±0.1

1.27

1.375±0.1

0.175

0.42±0.1

4.9±0.2

8 7 6 5

6.0±0.3

3.9±0.2

MAX 5.25 ( include BURR)

(Unit:mm)

1.27

1Q00X

Lot No.

5/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Block Diagram

NOUT

85-265Vac

FUSE

Filter Diode

Bridge

Leading Edge

Blanking

Internal

Supply

13.5V/

8.2V

27.5V

delay Timer

(64ms)

FBOLP_OH

100mV

/200mV

1 shot

OSC

ERROR

AMP

OSC

AND

ZT Blanking

OUT(H->L)

0.60us NOUT

TimeOut

(15us)

AND

AND PRE

Driver

POUT

FB/4

0.50V

CURRENT SENSE (V-V Change)

Normal : ×1.0

FBOLP_OH

0.50V.

300kΩ

100kΩ

4.0V Regulator

Soft Start

30k

1ms SS

4ms

NOUT

Starter

1MΩ

Max frequency

control

12V Clamp

Circuit

BURST_OH

2ms

0.5ms

Stop Timer

(512ms)

13.0V/

8.7V

Fig-4 Block Diagram

6/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Description of Blocks

( 1-1 ) Starter Circuit VH pin（8pin）

IC builds in starter circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed starting.

The operating current is shown in Fig-6.After starting IC, consumption power is decided by multiplied idling current ISTART3

（typ=10uA） with VH voltage. The loss by the idling current is below.

ex) power consumption of starter circuit only

Vac=100V Power＝100V*√2*10uA=1.41mW

Vac=240V Power＝240V*√2*10uA=3.38mW

Start time is decided by VH current and VCC pin capacitor.

The reference value of start time is shown in Fig7. For example, VCC capacitor is charged within 0.1s in CVCC=10uF

When VCC pin is shorted to GND, current of “ISTART1” flows. (Fig-6)

When VH pin is shorted to GND, large current flows from VH line to GND. To prevent it, need to insert

resistor (5kΩ~60kΩ) of “RVH” to limit current between VH line and VH pin.

When VH pin is shorted to GND, the power of VH2/RVH is applied. For that, please decide resistor size to confirm power

dissipation. When it does not satisfy power dissipation by one resistor, please use more than two resistors.

Fig-5 Starter Block Diagram

Fig-6 Start-up Current vs VCC Voltage Fig-7 Start-up Time（example）

*The start up current is flown from VH pin(8Pin).

VCC Capacitor value [uF]

VCC Capacitor value – startup time

Start time

[

]

7/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

It shows operation waveform of start-up in Fig-8.

Secondary

output

Switing

Voltage

VCC(5pin)

VH input

current

ABC

VUVLO1

ISTART1

ISTART3

ISTART2

Set voltage

VSC

Fig-8 Start-up Waveform

A: By inserting to outlet, VH voltage applies. From the time, charging to VCC pin starts from VH pin through starter circuit.

At the time, due to VCC < VSC (typ=0.8V), VH input current is limited to ISTART1 by VCC pin short protection.

B: Because of VCC voltage > VSC (typ=0.8V), VCC short protection is released, the current flows from VH pin.

C: Because of VCC voltage > VUVLO1 (typ=13.5V), the start-up stops, and VH input current is limited to ISTART3

(typ=10uA)

Furthermore, because switching operation starts, Secondary output rises. However, because Secondary output is low,

VCC pin voltage is decreased. The falling rate of VCC is determined by VCC pin capacitance, the consumption current

of IC and the load current that flows from the VCC pin. ( V/t = Cvcc/Icc )

D: Because secondary output has risen to specific voltage, VCC pin voltage is applied from the auxiliary winding and VCC

voltage is stabilized.

8/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

( 1-2 ) In Case of Useless VH pin (8pi n)

This IC is also possible to start by connecting the start-up resistor to the VCC pin in the open the start-up circuit (650V

breakdown voltage) of the VH pin. The structure that do not use the recharge function is shown in Fig- 9.

At start-up (before VCC VULO releasing) , please be careful to set the start-up resistor shown in blue because the

consumption current IOFF（Max=25uA） flows from VCC pin(6pin). Also, in case of not to use recharge function, the same

circuit is used.

Fig-9 Application Circuit not to use VH Pin (8pin)

・How to set the start-up resistance

Start-up resistor Rstart shown in Fig-9 in blue, is necessary for the IC to start if you do not use the VH pin.

If you reduce Rstart value, standby power is increased, start-up time is shorter.

If you increase Rstart on the contrary, standby power is reduced, start-up time will be longer.

When the voltage VCC=12V, standby current IOFF is 25μA (max), VCC UVLO voltage VUVLO1 is 14.5V (max).

ex） The example of start-up resistor Rstart setting

Rstart = (Vmin- VUVLO1（max）) / IOFF（max）

In Vac=100V, if margin is -30% , VHmin=100×√2×0.7=99V

VUVLO1（max）=14.5V ,so

Rstart ＝(99-14.5) / 25μA＝3.38MΩ

For an example, with a sufficient margin to 3.38MΩ, and the Rstart is 2.0MΩ..

For AC100V, Power consumption in Rstart is below.

Pd (Rstart) = (VH-VCC)2/Rstart = (141V-14.5V) 2/2.0M = 8.00mW

Pd in using start-up resistor is more than in using VH pin,

However for VCC pin capacitance value and VCC start-up resistor, please confirm by performing the evaluation of the actual

application.

9/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

(2 ) Start Sequence (Soft start, Light load operation, Auto recovery in over load protection)

The start sequence of IC is shown in Fig-10. About each detail, explain in each section.

Vout

Switing

VH(8pin)

VCC(6pin) 13.5V

FB(2pin)

Soft

Start

Iout

Normal Load

Light LOAD

64msec

VCC=8.7V

Over Load

Internal REF

Pull Up

Burst mode

2.8V

ABCDEFGHIJK

64msec

13.0V

512msec

Fig-10 Start Sequence Time Chart

A: Input voltage from AC line is supplied to VH pin(8Pin).

B : VCC pin（6pin） voltage is rise, when VCC＞VUVLO1（typ=13.5V）, IC starts operating.

In case of protection function is no active, IC starts to switching operation.

Then VCC pin voltage is dropped in cause of VCC (6pin) consumption current.

In case of VCC< VCHG1 （typ=8.7V）, starter circuit is operated, IC starts to charge VCC pin. After starting of charge, IC

continues to charge until VCC> VCHG1 （typ=13.0V）.

C: There is a soft start function which regulates the voltage level at the CS pin to prevent a rise in voltage and current.

D: When the switching operation starts, VOUT rises.

Once the output voltage starts-up, set to stable the output voltage to within the TFOLP (typ=64ms) period

E: When it is light load, burst operation is used to keep power consumption down.

F: When it is heavy load, FB pin voltage (2pin) is larger than VFOLP1A (typ=2.8V), because output voltage is down.

G: When the FB pin(2pin) voltage keeps VFOLP1A (typ=2.8V) at or above T FOLP (64ms typ), switching is stopped by the over load

protection for TOLPST(typ=512ms).

When the FB pin(2pin) voltage does not keep VFOLP1B (typ=2.6V) at T FOLP (64ms typ), the timer of TFOLP(typ=64ms) is reset.

H : When VCC voltage（6pin） is VCHG1 （typ=8.7V） or less, starter circuit starts to charge VCC pin(6pin) to operate starter

circuit.

I : When VCC voltage (6pin) is over than VCHG2 （typ =13.0V）,starter circuit stops to charge VCC pin(6pin).

J: The same as F.

K: The same as G.

10/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

(3) VCC pin(6pin) Protection Function

IC built in VCC UVLO（Under Voltage Lock Out） function and VCC OVP (Over Voltage Protection) function and VCC charge

function.

VCC UVLO function is the protection for VCC (pin) voltage is low. VCC OVP function is the protection for VCC (6pin) voltage is

high. They are for preventing MOSFET from destroying for switching in VCC voltage low or high.

VCC charge function is stable for output voltage in VCC pin voltage low, because starter circuit charge VCC pin from VH line.

(3-1) VCC UVLO / VCC OVP Function

VCCUVLO is an auto recovery type that has voltage hysteresis. VCCOVP is able to select an auto recovery type

(BM1Q001FJ) and VCCOVP is a latch type (BM1Q002FJ).

VCC< VLATCH（typ=7.7V） is condition of latch release (reset) after detection of latch operation by VCCOVP.

Refer to the operation figure-11.

VCCOVP built in mask time for TLATCH（typ=100us）. This function operates to successful detection at

VCC pin voltage > VOVP （typ=27.5V）. By this mask time, this IC masks surge etc.

In case of BM1Q001FJ (Auto recovery), When IC detects VCCOVP function, IC stops switching until VCC pin voltage is smaller

than VOVP2 (typ=23.5V).

Fig-11 VCC UVLO / OVP Timing Chart

A: VH (8pin) voltage input, VCC (6pin) voltage starts rising.

B: VCC pin voltage >Vuvlo1, releases the VCC UVLO function and DC/DC operation starts.

C: VCC pin voltage <Vuvlo2, VCCOVP detects the over-voltage.

D: When the VCC (6pin) voltage > VOVP continues TLATCH(typ =100us), switching is stopped by the VCCOVP function.

(LATCH mode)

E: VCC (6pin) voltage < VCHG1, VCC charge function operates and the VCC pin (6pin) voltage rises.

F: VCC (6pin) voltage > VCHG2, VCC charge function stops.

G: The same as E.

H: The same as F.

I: VH line voltage is down.

J: VCC < VUVLO2、VCC UVLO function starts to operate.

K: VCC < VLATCH,, latch function is released.

11/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

・For Capacitor Value of VCC pin

For stable operation of the IC, please set the 1uF or higher capacitor value of VCC pin. When the VCC capacitor

terminal is too large, response of the VCC pin to the Secondary output is slows down. Please be careful.

If the degree of the transformer coupling is low, since a large surge occurs to the VCC pin, the IC may be destroyed. In

this case, please attach a resistor which is from 10Ω to 100Ω to the path between the capacitor and diode at the back of

the auxiliary winding. Please set the resistance value in order that surge of VCC pin does not exceed the absolute

maximum rating of the VCC pin by performing the waveform evaluation of VCC pin.

・For settings VCC OVP voltage protection when Vout (Secondary output) is increased

VCC pin voltage is determined by the transformer ratio and Vout ( Secondary output ).Therefore, when the Secondary

output is large, it is possible to protect IC by VCCOVP. Setting VCCOVP protection is below.

Vout

Fig-12 How to Set VCCOVP

VCC voltage = Vout×Nb/Ns -VF (Vout:Secondary output, Nb:Number of auxiliary winding, Ns:Number of secondary

winding)

If you wish to apply protection when it becomes Secondary output × 1.3, please set the number of turns so that

1.3×(Vout×(Nb/Ns)-VF) > VOVP1

Because there is a blanking time of TLATCH (typ = 100us) to VCCOVP protection, VCCOVP protection is not detected to

momentary surge noise of the VCC pin, However, VCCOVP is detected when VCC voltage is higher than the VOVP1 at

the period of more than VTLATCH, due to low degree of transformer coupling or other influences

In addition, as a protection of Secondary output, ZTOVP is also available. ZTOVP is described in (6).

12/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

（3-2）VCC Recharge Function

After VCC (6pin) voltage > VUVLO1, IC start to operate. After that, when VCC pin voltage < VCHG, VCC charge function is active.

Then starter circuit operates charge VCC (6pin) from VH line. By these, IC does not occur.

The operation is shown to Figure-13.

Fig-13 VCC pin Charge Operation

A :As VH pin voltage（8pin）is rising, VCC pin(6pin) is started to charge by VCC charge function.

B: VCC pin （6pin） voltage > VUVLO1、VCC UVLO function is released, VCC charge function is stopped, DC/DC operation start.

C: VCC pin (6pin) voltage is dropped for starting operation because OUTPUT voltage is low.

D: VCC pin （6pin） voltage < VCHG1 、VCC pin(6pin) voltage rises to operate charge function.

E: VCC pin （6pin） voltage > VCHG2 、VCC charge function stops.

F: VCC pin （6pin） voltage < VCHG1 、VCC pin (6pin) voltage rises to re-operate charge function.

G: VCC pin （6pin） voltage > VCHG2 、VCC charge function stops.

H: OUTPUT voltage is stable. Then, VCC pin (6pin) voltage is also stable for charging from the auxiliary winding to VCC

pin(6pin).

13/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

( 4 ) DC/DC Driver

The IC operates PFM (Pulse Frequency Modulation) mode method.

By monitoring FB pin(2pin) and ZT pin (1pin), CS pin(3pin), the IC supply optimum system for DC/DC operation.

The IC controls ON width (Turn Off) of external MOSFET by FB pin (2pin) and CS pin (3pin). The IC controls OFF width (Turn

ON) of external MOSFET by ZT pin（1pin）. The detail is shown below.

(4-1) For QR-basic Operations

The QR basic block diagram and the basic operation are shown in Fig-14,15.

NOUT

Leading Edge

Blanking

Timer

(64ms)

FBOLP_OH

100mV

/200mV

1 shot

AND

ZT Blanking

OUT(H->L)

0.60us NOUT

AND

AND PRE

Driver

POUT

FB/4

0.50V

CURRENT SENSE (V-V Change)

Normal : ×1.0

FBOLP_OH

Max frequency

control

0.5V

OSC

300kΩ

100kΩ

Soft Start

30k

1ms

4ms

NOUT

TimeOut

15 usec

5 usec

12V Clamp

Circuit

1MΩ

2ms

0.5ms

AND

SET

RESET

Fig-14 DC/DC Operation Block

Fig-15 QR Basic Operation

14/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

For Fig-15

A: The internal oscillator outputs the SET signal, and turns ON the MOSFET.

At this time, the Drain - source capacitance of the MOSFET is discharged, so noise is generated to the CS pin.

This noise is called Leading Edge.

The filter for this noise is built in this IC. (It refer to (4-3))

Minimum pulse width of the IC is a 400ns (typ) by this filter and the delay time.

After that, current flows through the MOSFET, and Voltage Vcs = Rs * Ip is applied to the CS pin.

B: If CS pin voltage rises than FB pin voltage/Gain (typ = 4) or the overcurrent detection voltage Vcs,

RESET signal is output, OUT turns OFF

C: There is a delay time Tondelay from the point of B to turn OFF actually. Because of Tondelay the difference occurs in

the maximum power by the AC voltage. This IC has a built-in function to reduce this difference. (It refer to (4-4))

D: The energy stored in the transformer during Ton is discharged to the secondary side, and Free vibration of the Drain

voltage caused by the Cds (Drain - source capacitance) of MOSFET and Lp(transformer value) begins.

E: Since the switching frequency is determined by the IC.

SET signal is output from the internal oscillator and turn ON the MOSFET by process of certain time from A.

(4 -2) Determination of ON Width（Turn OFF）

ON width is controlled by FB (2pin), CS (3pin).

By comparison between FB pin voltage divided by AVcs (typ=4) and CS pin voltage, the IC decides ON width.

Besides, by comparison with Vlim1（typ =0.5V）voltage which is generated in IC, CS comparator level is changed lineally to be

shown in Fig-16(bottom). Maximum frequency also changes at this time.

CS (3pin) is shared with over current limiter circuit by pulse.

IC is changed over current limiter level and max frequency by FB (2pin) voltage.

・mode1 : Burst operation

・mode2 : Frequency reduction operation（reduce max frequency）

・mode3 : Max frequency operation (120kHz)

・mode4 : Over load operation（To detect over load state, IC is stopped switching）

Fig-16 FB pin Voltage - Over Current Limiter, Max Frequency Characteristics

FB [V]

MAX Fsw[kHz]

0.5V 1.25V

30kHz

120kHz

0.0V 2.0V

mode1 mode2 mode3

2.8V

mode4

FB [V]

0.5V0.0V 2.0V

mode1 mode2 mode3

2.8V

mode4CS 　Limiter[V]

Vlim1

Vlim2

1.25V

15/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

The ON width of ”Ton” is decided by CS Limiter level “VCS”

Ton = (Lp*Vcs)/(Vin*RS)

Lp: primary inductance value、Vin :VH voltage in Fig-14, RS: Sense resistor in Fig-14

To adjust over current limiter level, CS over current protection voltage is switched in soft-start, AC voltage.

Vlim1 and Vlim2 is changed below.

Table2 Over current protection voltage Detail

Soft start AC=100V AC=230V

Vlim1 Vlim2 Vlim1 Vlim2

start～0.5ms 0.063V ( 12%) 0.016V ( 3%) 0.044V (10%) 0.011V ( 2%)

0.5ms～1ms 0.125V ( 25%) 0.032V (6%) 0.088V (20%) 0.022V ( 4%)

1ms～2ms 0.250V ( 50%) 0.063V (12%) 0.175V (40%) 0.044V ( 9%)

2ms～4ms 0.375V ( 75%) 0.094V (19%) 0.263V (60%) 0.066V ( 13%)

4ms～ 0.500V (100%) 0.125V (25%) 0.350V (70%) 0.088V (18%)

* ( percent) is shown comparative value with Vlim1（typ =0.5V）in normal operation.

The reason that distinguish between AC100V and AC230V is by CS over current protection voltage switch function which

is shown to（4-4）.

(4-3) LEB（Leading Edge Blanking） Function

When a MOSFET for switching is turned ON, surge current occurs in cause of capacitance or rush current.

Therefore, when CS (3pin) voltage rises temporarily, over current limiter circuit may miss detections.

To prevent miss detections, the IC build-in blanking function which mask for TLEB （typ=250ns） from switching OUT pin(5pin)

from L to H. This blanking function enables to reduce noise filter of CS pin(3pin).

However, when CS pin noise does not converge less than 250ns, need to attach RC filter to CS pin shown in Fig-17.

Then, delay time occurs to CS pin detection by RC filter.

Also, even if the filter in not attached, it is recommended that it is attached an Rcs resistor to CS pin as surge provision.

Rcs recommended resistor value is about 1kΩ.

Fig-17. CS pin surrounding circuit

16/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

(4-4) CS Over Current Protection Switching Function

When input voltage（VH） is higher, ON time is short, and the operating frequency increases. As a result, maximum capable

power increases for constant over current limiter. For that, monitoring input voltage (VH), IC switches over current detection of

IC.

In case of high voltage（AC230V）, IC changes over current comparator level to ×0.7 multiple of normal level.

The detection method is that IC monitors ZT input current, then, IC switches it.

When MOSFET turns on, the voltage of “Va” has negative voltage to be affected input voltage (VH）.

Then, ZT (1pin) voltage is clamped near 0V by IC, ZT pin flows current to bias coil.

The calculation is below. And show block figure to Fig-18, show graph to Fig-19, Fig-20.

Izt ＝（Va－Vzt）/Rzｔ1 ≒ Va/Rzｔ1 ＝ VH * Na/Np /Rzｔ1

Rzt1 ＝ Va/Izt

Please set ZT current” Izt” to select the resistor Rzt1. And set bottom detection timing to select Czt.

About ZT current, IC builds in ZT current hysteresis IZTHYS(typ=0.1mA) to prevent VH detection changing by input voltage.

Fig-18 CS Over Current Detection Switched ZT current block diagram

17/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

Izt[mA]

1.0mA

Limiter[V]

Vlim1

Vlim1*0.7

0.9mA

Fig-19 FB pin Voltage vs CS pin Voltage Characteristics Fig-20 Izt Current vs Switched CS Voltage Characteristics

ex) setting method （Switching between AC100V and AC220V ）

AC100V: 141V±42V（±30% margin）

AC220V: 308V±62V（±20% margin）

In above case, need to switch CS over current detection voltage from 182V to 246V.

For that, switching VH voltage from AC100V to AC220V may be selected in VH＝214V.

Setting Np=100, Na=15

Va=Vin*Na/Np = 214V*15/100 *(-1) = -32.1V

Rzc = Va/ IZT = -32.1V/-1mA = 32.1kΩ

Therefore, set to Rzt=32KΩ

Then, switching from AC220V to AC100V is : Va=RZC*IZT=32kΩ×-0.9mA=-28.8V.

In the case, Vin = Va*Np/ Na=-28.8*(100/15)*(-1) = 192V

VH[V]

214V

Limiter[V]

Vlim1

Vlim1*0.7

192V

Fig-21 CS switching example VH voltage – CS voltage characteristics

(4-5) Determination of OFF Width（Turn on）

OFF width is controlled at the ZT pin. When OUT is Low, the power stored in the coil is supplied to the secondary-side output

capacitor. When this power supply ends, there is no more current flowing to the secondary side, so the drain voltage of

switching MOSFET drops. Consequently, the voltage on the auxiliary winding side also drops. A voltage that was

resistance-divided by Rzt1 and Rzt2 is applied to ZT pin. When this voltage level drops to VZT1 (100 mV typ) or below, MOSFET

is turned ON by the ZT comparator. Since zero current status is detected at the ZT pin, time constants are generated using Czt,

Rzt1, and Rzt2.

However, since Rzt1 and Rzt2 setting is required in AC voltage compensation function and ZTOVP function, bottom time

adjustment is set in Czt capacitor.

OFF time is calculated below equation:

Toff1=Ls/(Vout+VF)*Is (Toff1 : transformer discharge time、Ls : secondary inductance 、Vout : Secondary output、

VF：secondary diode forward voltage、Is：secondary peak current）

For that, switching frequency is calculated below:

switching frequency = 1 / {transformer charge and discharge time(Ton+Toff1) + (bottom-1/2) × resonant time }

resonant time = 1 / (2×π×Lp×Cds)

＊Lp: primary inductance , MOSFET D-S capacitor : Cds

Because frequency reduction range in light load restricts shown Fig-16, bottom detection operates by the frequency which is

lower than max frequency function in Fig-16.

Additionally, a ZT trigger mask function (described in section 4-6) and a ZT timeout function (described in section 4-7) are built in

IC.

18/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

(4-6) ZT Trigger Mask Function（Fig-22）

When switching is set from ON to OFF, superposition of noise may occur at the ZT pin.

Then, the ZT comparator and ZTOVP comparator are masked for the TZTMASK time to prevent ZT comparator operation errors.

Fig-22 ZT Trigger Mask Function

A: DC/DC OFF=>ON

B: DC/DC ON=>OFF then the surge noise occurs to ZT pin.

C: Since a noise occurs to ZT pin at B, IC masks ZT comparator and ZTOVP comparator detection for TZTMASK time.

(4-7-1) ZT Timeout Function1 （Fig-23）

When ZT pin voltage is not higher than VZT2(typ=200mV) for TZTOUT1(typ=15us) such as start or low output voltage, ZT pin short,

IC turns on MOSFET by force.

(4-7-2) ZT Timeout Function2 （Fig-23）

After ZT comparator detects bottom, when IC does not detect next bottom within TZTOUT2（typ =5us）, IC turns on MOSFET

by force. After ZT comparator detects bottom at once, the function operates. For that, it does not operate at start or at low output

voltage. When IC is not able to detect bottom by decreasing auxiliary winding voltage, the function operates.

OUT

Bottom

detection

ZT VZT2

VZT1

ZT pin GND

short

5us

timeout

15us15us15us

timeout

ABC DEFGH

5us 5us

Fig-23 ZT Timeout Function

A: When starting, IC starts to operate by ZT timeout function1 for ZT=0V.

B: MOSFET turns ON

C: MOSFET turns OFF

D: ZT voltage is lower than VZT2(typ=200mV) by ZT dump decreasing.

E: MOSFET turns ON by ZT timeout fucntion2 after TZT2(typ=5us) from D point.

F: ZT voltage is lower than VZT2(typ=200mV) by ZT dump decreasing.

G: MOSFET turns ON by ZT timeout fucntion2 after TZT2(typ=5us) from F point.

H: ZT pin is short to GND.

I : MOSFET turns ON by ZT timeout function1 after TZTOUT1(typ=15us)

19/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

（5）Soft Start Sequence

Normally, when AC voltage is applied, a large current flows. Then secondary output voltage and current is occurred overshoot.

For preventing it, IC built in soft-start function.

When VCC pin(6pin) voltage is lower than VUVLO2 （typ =8.2V）, IC is reset. After that, when AC voltage is applied, IC operates

soft-start.

The soft start function is below: （ Please refer to (4-1) turn off item about CS limiter.）

・start ～ 0.5ms => Set CS limiter to 12.5% of normal operation.

・0.5ms～1ms => Set CS limiter to 25% of normal operation.

・1ms～2ms => Set CS limiter to 50% of normal operation.

・2ms～4ms => Set CS limiter to 75% of normal operation.

・4ms～ => normal operation

（6）ZT pin (1pin) OVP (Over Voltage Protection)

IC build-in OVP function to ZT (1pin). It is latch type in BM1Q002, and none in BM1Q001.

ZTOVP operates by DC voltage detection and pulse detection for ZT pin.

[BM1Q002]

When ZT pin(1pin) voltage is over VZTL (typ=5.0V), IC starts to detect ZTOVP function.

For DC voltage detection, when the state which ZT voltage is larger than VZTL (typ=5.0V) continues for 100us, IC carries out

latch stop.

To prevent ZT (1pin) OVP from miss-detecting by surge noise, IC builds in 3count and TLATCH（typ=100us） timer.

ZT (1pin) OVP function operates in all states (normal state and over load state and burst state).

For pulse detection, ZT (1pin) OVP operation starts detection after TZTMASK delay time from OUT:H→L.

When the pulse of ZT (1pin) voltage larger than VZTL(typ=5.0V) is applied 3 count and for TLATCH（typ=100us）time, IC carries out

latch stop.

Fig-24 ZTOVP and Latch Blanking Function

A: When OUT (5pin) voltage is changed from H to L, ZT (1pin) voltage is up. Then, surge pulse occurs to ZT (1pin). For that,

because IC builds in Tztmask time (typ=0.6us), IC does not detect ZTOVP for Tztmask time.

B: After Tztmask time (typ=0.6us), ZT OVP detects over voltage.

C: When ZTOVP comparator counts 3 pulse, TLATCH timer (typ=100us) operates.

D: When it takes for 100us from C, IC detects ZT OVP and IC carries out latch stop.

[BM1Q001]

BM1Q001 does not carry out latch stop.

It shows ZT OVP voltage setting method below. (auxiliary winding voltage : Va、ZT upper resistor : Rzt1、ZT lower resistor : Rzt2)

Secondary voltage : Vo、 transformer winding ratio(secondary / auxiliary) : Ns/Na、 ZT input current : IZT

The voltage which detects over voltage protection in secondary side : VOVP

VOVP = (Na/Ns)*Va = (Na/Ns) *{VZT*(Rzt1+Rzt2)/Rzt2+Rzt1*IZT}

When ZT voltage = 5.35V, ZT input current is calculated to IZT(max)=28uA、OVP maximum voltage is set below:

VOVP(max)=(Na/Ns)/｛5.35*(Rzt1+Rzt2)/Rzt2+Rzt2*28uA｝

Rzt1 setting is decided by AC voltage compensation function of (4-3).

Rzt2 setting is calculated below

Rzt2= Vztovp×Rzt1/{Vovp×(Na/Ns)-Izt×Rzt1-Vztovp}

When ZT voltage=5.35V, IZT(max)=28uA. Then OVP voltage Max value is calculated below :

VOVP=(Na/Ns)/｛5.35*(Rzt1+Rzt2)/Rzt2+Rzt2*28uA｝

20/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

(7) CS (3pin) Open Protection

When CS （3pin） is OPEN, to prevent OUT pin from changing to H by noise, IC builds in CS(3pin) open protection.

When CS (3pin) is open, OUT (5pin) switching is stopped by the function. （This is auto-recovery）

NOUT

Leading

Edge

Blanking

OUT

PRE

Driver

POUT

CURRENT SENSE

(V-V Change)

Normal : ×1.0

FBOLP_OH

VREF(4V)

1MΩ

VCCOVP

AND

Timeout

Bottom det

Fig-25 CS Open Protection

(8) OUTPUT Over Load Protection（FB OLP comparator ）

When secondary output is over load, IC detects it by FB (2pin), IC stops switching.

In OLP state, because secondary photo-coupler is not flown current, FB (2pin) voltage is up.

When the condition continues for TFOLP （typ =64ms）, IC judges over load state, OUT (5pin) is L fixed. After FB（2pin） voltage is

over VFOLP1A （typ =2.8V）, when FB (2pin) voltage is lower than VFOLP1B （typ =2.6V） within TFOLP （typ =64ms）, over load

protection timer is reset.

In starting, because FB (2pin) is pull-up by a resistor to internal voltage, FB (2pin) voltage starts to operate in the state which is

more than VFOLP1A （typ =2.8V）.

For that, please set stable time of secondary output voltage within TFOLP （typ =64ms）.

After detecting over load, IC is stopped for TOLPST （typ =512ms）,IC is auto-recovery operation.

In stopping switching, though VCC (6pin) voltage falls, but IC operates re-charge function by starter circuit, VCC (6pin) voltage

keeps VCC pin voltage > VUVLO2.

VCC

VUVLO1

VUVLO2

VCHG1

Switching

FB VFOLP1A

64ms 64ms

512ms

VH charge

chargecharge

512ms

VCHG2

ABC

DEFGH

Fg-26 Over Load Protection : Auto-recovery

A: When FB voltage is over VFOLP1A(typ=2.8V), FBOLP comparator detects over load.

B: When the state A continues for TFOLP（typ=64ms）, IC stops switching by over load protection.

C: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than VCHG,

VCC re-charge function operate, VCC (6pin) voltage is up.

D: When VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.

E: From B, it takes for TOLPST （typ =512ms）, IC starts switching with soft-start.

F: When over load state continues, FB (2pin) voltage is over VFOLP1A. When it takes for TFOLP（typ=64ms） from E, IC stops

switching.

G: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than VCHG,

VCC re-charge function operate, VCC (6pin) voltage is up.

H: When VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.

21/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

項目 BM1Q001FJ BM1Q002FJ

VCC Under Voltage Locked Out Self-restart Self-restart

VCC Over Voltage Protection Self-restart (100us　with timer) Latch (100us　with timer)

FB Over Load Protection Self-restart(64ms delay, 512ms stop) Self-restart(64ms delay, 512ms stop)

CS Open Protection Self-restart Self-restart

ZT Over Voltage Protection None Latch (100us　with timer)

VCC Charge Protection Self-restart Self-restart

Protection Mode

(9) OUT（5pin）Voltage Clamp Function

By the purpose which protects external MOSFET, H level of OUT （5pin） is clamped to VOUTH（typ=12.5V）

It prevents gate destruction of MOSFET by rising VCC （6pin） voltage. （It refers to Fig-23）

OUT （5pin） is pull-down RPDOUT(typ=100kΩ).

NOUT

PRE

Driver

POUT

12V Clamp

Circuit

Fig-27 OUT（5pin）Construction

●Operation Mode of Protection Circuit

Operation mode of protection functions are shown in table3.

Table3 Operation Mode of Protection Circuit

22/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

● Power Dissipation

The thermal design should set operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature Ta must be 85℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)

Fig-28 SOP-J8 Thermal Abatement Characteristics

100

200

300

400

500

600

700

800

900

1000

0 25 50 75 100 125 150

Ta[℃]

Pd[mW]

23/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Operational Notes

(1) Absolute maximum ratings

Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are

exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular

mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a

fuse should be investigated.

(2) Power supply and ground lines

In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there

are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in

the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes

and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in

addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be

problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems

with the characteristics of the capacitor to be used before determining constants.

(3) Ground potential

The ground pin’s potential should be set to the minimum potential in relation to the operation mode.

(4) Pin shorting and attachment errors

When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment

errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin

and a power supply line, or between ground lines.

(5) Operation in strong magnetic fields

Note with caution that these products may become damaged when used in a strong magnetic field.

(6) Input pins

In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic

elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.

Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage

that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no

power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied

to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical

characteristics.

(7) External capacitors

When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal

capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining

constants.

(8) Thermal design

The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.

Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.

(9) Rush current

In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,

so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern

wires, and how they are laid out.

(10) Handling of test pins and unused pins

Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the

descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.

(11) Document contents

Documents such as application notes are design documents used when designing applications, and as such their

contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for

external parts.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

24/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

Product (BM1Q00XFJ)

BM1Q001FJ

BM1Q002FJ

●Ordering Information

B M 1 Q 0 0 X F J - E 2

Product name

Package

Packaging and

forming specification

E2: Embossed tape and reel

●Physical Dimension Tape and Reel Information

●Marking Diagram ●Line Up

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP-J8

4°+6°

−4°

0.2±0.1

0.45MIN

234

5678

4.9±0.2

0.545

3.9±0.2

6.0±0.3

(MAX 5.25 include BURR)

0.42±0.1

1.27

0.175

1.375±0.1

0.1 S

1Q00X

LOT No.

1PIN MARK

25/25

Datasheet

BM1Q00XFJ Series

TSZ02201-0F2F0A200110-1-2

17.JUN.2015 Rev.003

www.rohm.com

TSZ22111・15・001

●Revision History

Date Revision Changes

2013.04.05 001 New Release

2014.03.07 002 Datasheet Format modified

2014.03.07 002 P-17 calculation change：Resonant time = 1 / (2×π×(Lp×Cds) ) Add “√”

2014.03.07 002 P-17 Delete Figure-27

2014.03.07 002 Change Operational Notes

2015.06.17 003 P-1,P-8,P-13 Modify transformer polarity in figure

Datasheet

Notice-PGA-E Rev.001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufacture d for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliabili ty, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Po wer Dissipation (P d) depe nding on Ambient temper ature (Ta). When us ed in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the prod uct specification.

9. ROHM shall not be in any way responsible or liable for fai lure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halog enous (chlor ine, bromine, etc.) flux is used, the residue of flux may negatively affect prod uct

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM represe ntative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice-PGA-E Rev.001

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportati on

1. Product performance a nd soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products ar e exposed to sea winds or corrosive gases, includin g Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderabil ity of products out of recommended storage time perio d

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive s t ress applied when dropping o f a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before us ing Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressl y or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

ROHM Semiconductor:

BM1Q001FJ-E2 BM1Q002FJ-E2