REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 06-11-08 Raymond Monnin Boilerplate update, part of 5 year review. ksr THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV A A A A A A SHEET 15 16 17 18 19 20 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Charles Reusing APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, MEMORY, DIGITAL, CMOS, PARALLEL 512 X 9 FIFO , MONOLITHIC SILICON 90-09-17 AMSC N/A REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 . 1 OF 5962-89863 20 5962-E011-07 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89863 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ 01 02 03 04 05 06 Circuit function Acess time 512 X 9 FIFO 512 X 9 FIFO 512 X 9 FIFO 512 X 9 FIFO 512 X 9 FIFO 512 X 9 FIFO 80 ns 65 ns 50 ns 40 ns 30 ns 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z U Descriptive designator Terminals GDIP1-T28 or CDIP2-T28 CDIP3-T28 or GDIP4-T28 CQCC1-N32 GDFP2-F28 Package style 28 28 32 28 dual-in-line package dual-in-line package rectangular chip carrier package flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage to ground potential -----------------------------DC voltage applied to outputs in high Z state ---------------DC input voltage ----------------------------------------------------DC output current ---------------------------------------------------Maximum power dissipation 2/ ----------------------------------Lead temperature (soldering, 10 seconds) -------------------Thermal resistance, junction-to-case (JC) -------------------Junction temperature (TJ) 3/ ------------------------------------Storage temperature range --------------------------------------Temperature under bias ------------------------------------------- -0.5 V dc to +7.0 V dc -0.5 V dc to +7.0 V dc -0.3 V dc to +7.0 V dc 20 mA 1.0 W +260C See MIL-STD-1835 +150C -65C to +150C -55C to +125C 1.4 Recommended operating conditions. Supply voltage (VCC) ------------------------------------------------Ground voltage (GND) ---------------------------------------------Input high voltage (VIH) -------------------------------------------Input low voltage (VIL) ---------------------------------------------Case operating temperature range (TC) -----------------------1/ +4.5 V dc to +5.5 V dc 0 V dc 2.2 V dc minimum 0.8 V dc maximum -55C to +125C Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Must withstand the added PD due to short circuit test (e.g., IOS). 3/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 3 TABLE I. Electrical performance characteristics. Symbol Test Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Output high voltage VOH VCC = 4.5 V, IOH = -2.0 mA VIN = VIH, VIL 1, 2, 3 All Output low voltage VOL VCC = 4.5 V, IOH = 8.0 mA VIN = VIH, VIL 1, 2, 3 All Input high voltage VIH 2/ 1, 2, 3 All Input low voltage VIL 2/ 1, 2, 3 All Input leakage current IIX VIN = 5.5 V to GND 1, 2, 3 All Output leakage current IOZ VCC = 5.5 V, VOUT = 5.5 V to GND 1, 2, 3 All Operating supply current ICC1 VCC = 5.5 V, IOUT = 0 mA f = 1/tRC 1, 2, 3 Max 2.4 V 0.4 V 2.2 V 0.8 V -10 +10 A -10 +10 A 01, 02 115 mA 03 130 04, 05 140 06 147 1, 2, 3 All 30 mA 1, 2, 3 All 25 mA W , R , D0 - D8 pins are toggling between 0 V and 3 V FF , XO / HF = 0 mA Q0 - Q8 = 0 mA MR , FL / RT = 3.0 V Standby current ICC2 VCC = 5.5 V, IOUT = 0 mA All inputs = VIH FF , XO / HF = 0 mA Q0 - Q8 = 0 mA Power down current ICC3 VCC = 5.5 V, IOUT = 0 mA All inputs = VCC -0.2 V FF , XO / HF = 0 mA Q0 - Q8 = 0 mA Input capacitance CIN 3/ VCC = 5.0 V TA = +25C, f = 1 MHz See 4.3.1c 4 All 8 pF Output capacitance COUT 3/ VCC = 5.0 V TA = +25C, f = 1 MHz See 4.3.1c 4 All 8 pF 7,8 All Functional tests See 4.3.1d See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Device type Limits Min Unit Max 01 02 03 04 05 06 01 02 03 04 05 06 01 02, 03 04,05,06 01 02 03 04 05 06 100 80 65 50 40 35 20 15 10 80 65 50 40 30 25 ns 9, 10, 11 All 3 ns tDVR 9, 10, 11 All 3 ns Read high to high Z tHZR 3/ 4/ 9, 10, 11 Write cycle time tWC 9, 10, 11 Write pulse width tPW 9, 10, 11 See figure 3 Read cycle time tRC Access time tA 9, 10, 11 Read recovery time tRR 9, 10, 11 Read pulse width tPR 9, 10, 11 Read low to low Z tLZR 3/ 4/ Read high to data valid 9, 10, 11 01,02,03 04 05 06 01 02 03 04 05 06 01 02 03 04 05 06 ns 80 65 50 40 30 25 ns ns 30 25 20 18 ns 100 80 65 50 40 35 80 65 50 40 30 25 ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 5 TABLE I. Electrical performance characteristics - Continued. Symbol Test Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups See figure 3 tHWZ 3/ 4/ 9, 10, 11 Write recovery time tWR 9, 10, 11 Data setup time tSD 9, 10, 11 Data hold time tHD 9, 10, 11 Master reset cycle time tMRSC 9, 10, 11 Master reset pulse width tPMR 9, 10, 11 tRMR 9, 10, 11 Read high to master reset high tRPW 3/ 9, 10, 11 Write high to master reset high tWPW 3/ 9, 10, 11 All 01 02, 03 04,05,06 01 02,03 04 05 06 01,02 03 04,05,06 01 02 03 04 05 06 01 02 03 04 05 06 01 02,03 04,05,06 01 02 03 04 05 06 01 02 03 04 05 06 Unit Limits Min Write high to low Z Master reset recovery time Device type Max 10 20 15 10 40 30 20 18 15 10 5 0 100 80 65 50 40 35 80 65 50 40 30 25 20 15 10 80 65 50 40 30 25 80 65 50 40 30 25 ns ns ns ns ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 6 TABLE I. Electrical performance characteristics - Continued. Symbol Test Retransmit cycle time Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Min 9, 10, 11 tRTC See figure 3 Retransmit pulse width tPRT 9, 10, 11 Retransmit recovery time tRTR 9, 10, 11 Master reset to empty flag low tEFL 9, 10, 11 Master reset to halffull flag high tHFH 9, 10, 11 Master reset to full flag high tFFH 9, 10, 11 Read low to empty flag low tREF 9, 10, 11 Read high to full flag high tRFF 9, 10, 11 01 02 03 04 05 06 01 02 03 04 05 06 01 02,03 04,05,06 01 02 03 04 05 06 01 02 03 04 05 06 01 02 03 04 05 06 01,02 03 04 05 06 01,02 03 04 05 06 Unit Limits Max 100 80 65 50 40 35 80 65 50 40 30 25 20 15 10 ns ns ns 100 80 65 50 40 35 100 80 65 50 40 35 100 80 65 50 40 35 60 45 35 30 25 60 45 35 30 25 ns ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 7 TABLE I. Electrical performance characteristics - Continued. Symbol Test Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Min Write high to empty flag high tWEF Write low to full flag low tWFF 9, 10, 11 Write low to half-full flag low tWHF 9, 10, 11 Read high to half-full flag high tRHF 9, 10, 11 Effective read from write high tRAE 3/ 9, 10, 11 Effective read pulse width after empty flag high tRPE 9, 10, 11 Effective write from read high tWAF 3/ 9, 10, 11 Effective write pulse width after full flag high tWPF 9, 10, 11 See figure 3 9, 10, 11 01,02 03 04 05 06 01,02 03 04 05 06 01 02 03 04 05 06 01 02 03 04 05 06 01,02 03 04 05 06 01 02 03 04 05 06 01,02 03 04 05 06 01 02 03 04 05 06 Unit Limits Max 60 45 35 30 25 60 45 35 30 25 100 80 65 50 40 35 100 80 65 50 40 35 60 45 35 30 25 ns ns ns ns ns 80 65 50 40 30 25 ns 60 45 35 30 25 ns 80 65 50 40 30 25 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 8 TABLE I. Electrical performance characteristics - Continued. Symbol Test Expansion out low Group A subgroups Device type 9, 10, 11 See figure 3 tXOH 9, 10, 11 delay from clock Unit Limits Min tXOL delay from clock Expansion out high Conditions 1/ -55C TA +125C 4.5 V VCC 5.5 V unless otherwise specified Max 01 80 02 65 03 50 04 40 05 30 06 25 01 80 02 65 03 50 04 05 40 30 06 25 ns ns 1/ AC tests are performed with input rise and fall times of 5ns or less, timing reference levels of 1.5 V, input pulse levels of 0 V to 3.0 V, and the output load on figure 4. 2/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 3/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table1. 4/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from the 1.5 V level on the input. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 9 Device types All Case outlines U, X, Y Terminal number 1 2 3 4 5 Z Terminal symbol W NC D8 D3 D2 D1 D8 D3 D2 W D1 D0 6 7 8 9 10 D0 11 12 13 14 15 Q2 Q3 Q8 GND 16 17 18 19 20 Q4 Q5 Q6 Q7 21 22 23 24 25 EF MR FL / RT D7 D6 XO / HF EF MR 26 27 28 29 30 D5 D4 VCC - NC D7 D6 D5 31 32 - D4 VCC XI FF Q0 Q1 R XO / HF XI FF Q0 Q1 NC Q2 Q3 Q8 GND NC R Q4 Q5 Q6 Q7 FL / RT FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 10 Reset and retransmit Single device configuration/width expansion mode Inputs Mode Reset Retransmit Read/Write Internal status Outputs MR RT XI Read pointer Write pointer EF FF HF 0 1 1 X 0 1 0 0 0 Location zero Location zero Increment 1/ Location zero Unchanged Increment 1/ 0 X X 1 X X 1 X X 1/ Pointer will increment if flag is high. Reset and first load truth table Depth expansion/compound expansion mode Inputs Mode Reset first device Reset all other devices Read/Write Internal status Outputs MR FL XI Read pointer Write pointer EF FF 0 0 1 0 1 X 1/ 1/ 1/ Location zero Location zero X Location zero Location zero X 0 0 X 1 1 X 1/ XI is connected to XO of previous device. NOTE: MR = Reset input, FL / RT = First load/retransmit EF = Empty flag output, FF = Full flag output, XI = Expansion input, and HF = Half-full flag output FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 11 FIGURE 3. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 12 NOTES: 1. tRTC = tPRT + tRTR. 2. E _F _, H _F _ , and F _F _ may change state during retransmit as a result of the offset of the read write pointer, but flags will be valid at tRTC. FIGURE 3. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 13 NOTES: 1. 2. tMRSC = tPMR + tRMR. W and R = VIH around the rising edge of MR FIGURE 3. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 14 FIGURE 3. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 15 FIGURE 3. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 16 NOTE: Expansion Out of device 1 ( XO 1) is connected to Expansion In of device 2 ( XI 2). FIGURE 3. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 17 AC test conditions GND to 3.0 V 5 ns 1.5 V 1,5 V Input pulse levels Input rise and fall times Input timing reference levels Output reference levels FIGURE 4. Output load circuit and test conditions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 18 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MILSTD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is fifteen devices with no failures and all input and output terminals tested. d. Subgroups 7 and 8 tests shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 19 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (per method 5005, table I) Interim electrical parameters (method 5004) --- Final electrical test parameters (method 5004) Group A test requirements (method 5005) 1/ 2/ 3/ 1*, 2, 3, 7*, 8A, 8B, 9, 10,11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 2, 3, 7, 8A, 8B 1/ * indicates PDA applies to subgroups 1 and 7. 2/ ** see 4.3.1c. 3/ see 4.3.1d. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89863 A REVISION LEVEL A SHEET 20 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-11-08 Approved sources of supply for SMD 5962-89863 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Vendor CAGE number Vendor similar PIN 2/ 5962-8986301UA 0C7V7 3/ CY7C421-80KMB IDT7201SA80XEB 5962-8986301XA 0C7V7 3/ CY7C420-80DMB IDT7201SA80DB 5962-8986301YA 0C7V7 3/ 3/ CY7C421-80DMB IDT7201SA80TDB MM1P-67201-55MB 5962-8986301ZA 0C7V7 3/ 3/ CY7C421-80LMB IDT7201SA80LB MM4J-67201-55MB 5962-8986302UA 0C7V7 3/ CY7C421-65KMB IDT7201SA65XEB 5962-8986302XA 0C7V7 3/ CY7C420-65DMB IDT7201SA65DB 5962-8986302YA 0C7V7 3/ 3/ CY7C421-65DMB IDT7201SA65TDB MM1P-67201-55MB 5962-8986302ZA 0C7V7 3/ 3/ CY7C421-65LMB IDT7201SA65LB MM4J-67201-55MB 5962-8986303UA 0C7V7 3/ CY7C421-50KMB IDT7201SA50XEB 5962-8986303XA 0C7V7 3/ CY7C420-50DMB IDT7201SA50DB 5962-8986303YA 0C7V7 61772 3/ CY7C421-50DMB IDT7201SA50TDB MM1P-67201-45MB 5962-8986303ZA 0C7V7 3/ 3/ CY7C421-50LMB IDT7201SA50LB MM4J-67201-45MB 5962-8986304UA 0C7V7 3/ CY7C421-40KMB IDT7201SA40XEB 5962-8986304XA 0C7V7 3/ CY7C421-40DMB IDT7201SA40DB Standard microcircuit drawing PIN 1/ See footnotes at end of table. Page 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor similar PIN 1/ Vendor CAGE number 5962-8986304YA 0C7V7 3/ 3/ CY7C421-40DMB IDT7201SA40TDB MM1P-67201-35MB 5962-8986304ZA 0C7V7 3/ 3/ CY7C421-40LMB IDT7201SA40LB MM4J-67201-35MB 5962-8986305UA 0C7V7 3/ CY7C421-30KMB IDT7201SA30XEB 5962-8986305XA 0C7V7 3/ CY7C420-30DMB IDT7201SA30DB 5962-8986305YA 0C7V7 61772 CY7C421-30DMB IDT7201SA30TDB 5962-8986305ZA 0C7V7 3/ CY7C421-30LMB IDT7201SA30LB 5962-8986306UA 0C7V7 CY7C421-25KMB 5962-8986306XA 0C7V7 CY7C420-25DMB 5962-8986306YA 0C7V7 CY7C421-25DMB 5962-8986306ZA 0C7V7 CY7C421-25LMB 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the Vendor to determine its availability. 2/ Caution: Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source. Vendor CAGE number Vendor name and address 0C7V7 QP Semiconductor 2945 Oakmead Village Court Santa Clara, CA 95051 61772 Integrated Device Technology, Inc. 2975 Stender Way Santa Clara, CA 95054 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Page 2 of 2