Freescale Semiconductor
Application Note
Document Number: AN3903
Rev. 0, 08/2009
Contents
© Freescale Semiconductor, Inc., 2009. All rights reserved.
1 Introduction
This document provides a summary of the significant
differences in the MPC5566 and MPC5674F devices,
and may be used as a help for planning a migration to
the MPC5674F. (The information provided in this
application note also applies to any other device in the
MPC567xF family.)
Note that the MPC5674F is available in both 416-pin and
516-pin packages and function of the device varies
according to the package chosen. Where applicable,
these differences are highlighted in the accompanying
text.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Core. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.1 Memory Protection Module (MPU) . . . . . . . . . . . . . 5
5.2 XBAR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.3 SIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.4 Windowing Software Watchdog. . . . . . . . . . . . . . . . 6
5.5 Nexus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.6 External Bus Interface (EBI) . . . . . . . . . . . . . . . . . . 7
5.7 Calibration Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.8 eDMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.9 eSCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.10 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.11 DSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.12 FlexRay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.13 FEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.14 System Timers (STM) . . . . . . . . . . . . . . . . . . . . . . . 8
5.15 eMIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.16 eTPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.17 Interrupt Controller. . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.18 eQADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.19 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . 9
5.20 Decimation Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.21 FMPLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.22 VRC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.23 Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.24 Low-Power Modes. . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Package and Ball Map. . . . . . . . . . . . . . . . . . . . . . . . . . 10
MPC5566 to MPC5674F Migration
Guide
by: Bill Terry
32-bit Automotive Applications Engineering
Microcontroller Solutions Group
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Overview
Freescale Semiconductor2
2 Overview
Table 1 provides a summary of the feature differences between the MPC5566 and MPC5674F devices.
Table 1. MPC5566/MPC5674F Feature Comparison
Feature MPC5566 MPC5674F
Process 130 nm 90 nm
Core e200z6 e200z7
SIMD Yes Yes
VLE Yes Yes
Cache 32 KB 32 KB
(16 KB I/16 KB D)
Non-maskable interrupt (NMI) No NMI & Critical Interrupt1
MMU 32-entry 64-entry
Memory Protection Unit (MPU) No Yes
XBAR 4x5 6x5
Windowing software watchdog (SWT) No Yes
Core Nexus 3+ 3+
SRAM 128 KB 256 KB
Flash 3 MB 4 MB
Flash fetch accelerator 2 × 256 bit 4 × 256 bit
External bus 32-bit Yes2
Calibration bus 16-bit 16-bit non-multiplexed
32-bit multiplexed
DMA 64-channel 96-channel
DMA Nexus Class 3 Class 3
Serial Two Three
eSCI_A Yes Yes
eSCI_B Yes Yes
eSCI_C No Yes
FlexCAN Four Four
CAN_A 64 buf 64 buf
CAN_B 64 buf 64 buf
CAN_C 64 buf 64 buf
CAN_D 64 buf 64 buf
SPI Four Four
DSPI_A Yes Yes
DSPI_B Yes Yes
DSPI_C Yes Yes
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Overview
MPC5566 to MPC5674F Migration Guide, Rev. 0
Freescale Semiconductor 3
DSPI_D Yes Yes
Microsecond bus support No Yes
FlexRay No Yes
Ethernet Yes No
System timers No Eight PIT channels
Four AutoSAR
One Watchdog
eMIOS 24-channel 32-channel
eTPU 64-channel 64-channel
eTPU_A Yes Yes (eTPU2)3
eTPU_B Yes Yes (eTPU2)3
Code
memory
20 KB 24 KB
Data
memory
4 KB 6 KB
Interrupt controller 308-channel 448
eQADC 40-channel, two ADCs 64-channel, four ADCs
eQADC_A (2 ADCs) Yes Yes
eQADC_B (2 ADCs) No Yes
Temperature sensor No Yes
Variable gain amp. No Yes
Decimation filter No Yes (four)
Sensor diagnostics No Yes
PLL FM FM
VRC Yes Yes
Supplies 5 V, 3.3 V, 1.5 V 5 V, 3.3 V, 1.2 V
Low Power Modes No Stop Mode1
Slow Mode1
1Only available on revision 2 release of device.
2External bus interface (EBI) is available on 496 and 516 PBGA.
3eTPU2 only available on revision 2 release of device.
Table 1. MPC5566/MPC5674F Feature Comparison (continued)
Feature MPC5566 MPC5674F
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Memory
Freescale Semiconductor4
3Memory
This section provides details of the differences in the memory, including information that is relevant for
porting the application to the MPC5674F.
3.1 SRAM
The MPC5674F has 256 KB of SRAM, compared to the 128 KB of SRAM on the MPC5566. If the extra
SRAM is to be used, the application initialization code must be modified so that it initializes all SRAM up
to 256 KB. Additionally, any linker directive files must be updated to reflect the change in the memory
map.
The MPC5674F ECC supports single-bit error reporting for SRAM memory.
3.2 Flash
• The MPC5674F has 4 MB of flash memory,1 increased from the 3 MB of flash memory on the
MPC5566.
• The MPC5674F requires a different flash-programming algorithm that will be provided by FSL as
a software driver. Any proprietary flash-programming algorithms or drivers must be re-coded for
the MPC5674F.
• The MPC5674F ECC supports single-bit error reporting for flash memory.
• There are now two sets of control registers, one for each flash array.
• Any PC tools used for programming flash will need to be updated.
• The flash block sizes have changed as shown in Table 2.
1. The MPC5673F has 3 MB of flash memory.
Table 2. MPC5566 vs. MPC5674F Flash Partitions
MPC5566 MPC5674F
Block Size Use
Array A Array B
Block Size Use Block Size Use
2 x 16 K
2 x 48 K
2 x 64 K
Low Address
Space
8 x 16 K
2 x 64 K
Low Address
Space
2 x 128 K Mid Address
Space
256 K Low Address
Space
256 K Mid Address
Space
2 x 128 K Mid Address
Space
6 x 256 K High Address
Space
6 x 256 K High Address
Space
20 x 128 K High Address
Space
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Core
MPC5566 to MPC5674F Migration Guide, Rev. 0
Freescale Semiconductor 5
4Core
The MPC5674F employs the e200z7 core, instead of the e200z6 core used on the MPC5566. The e200z7
core is instruction-set equivalent with the e200z6 core, however some new instructions and features are
added to the e200z7. The essential differences in the two cores are described in the following bullets.
• VLE — The MPC5674F provides several new VLE instructions that are designed to maximize
performance when the core is saving and restoring context. Existing e200z6 VLE code will execute
without modifications on the e200z7 core. Not all tool partners will support these new instructions
initially.
• MMU Entries — The number of MMU entries has been increased from 32 to 64 on the MPC5674F.
The MMU entries initialized by the BAM are unchanged, and existing code that relies on the BAM
initialization will execute correctly.
• Cache — The cache size remains 32 KB, however the architecture has been changed from a unified
32K type cache to a Harvard type cache, with 16 KB for data and 16 KB for instruction storage.
Three new registers associated with the instruction cache block are added; L1CFG1, L1CSR1, and
LFINV1. Cache initialization code must be modified to include both blocks. The unified cache on
existing e200z6 cores is initialized and locked using the data cache instructions, therefore code that
puts the stack into the cache does not need to be modified.
• Non-Maskable Interrupts (NMI) — The MPC5674F provides a new NMI that can be used to
generate a non-maskable interrupt to the core. No software changes are required unless this new
feature is to be used.
• The Machine Check exception has been modified. Existing code for handling machine check must
be modified to clear the machine check cause in the MCSR register. Refer to Freescale document
e200z7RM, e200z7 PowerPC™ Core Reference Manual, for details.
• SIMD — The MPC5674F employs the new SPE2 instruction set that provides expanded signal
processing capability. SPE2 is a superset of the existing SPE library. Any existing SPE code does
not require modification.
5 Peripherals
5.1 Memory Protection Module (MPU)
The MPC5674F provides a new memory protection module (MPU). This module provides programmable
access control for most of the memory map on a bus-master permission basis. By default, the MPU is not
enabled and no changes to existing code are required.
5.2 XBAR
The XBAR on the MPC5674F supports six masters and five slaves, instead of the 4 × 5 configuration used
on the MPC5566. Table 3 and Table 4 provide a list of the XBAR port assignments and associated masters.
If existing software makes modifications to the default master priorities, the code may require changes to
support the additional masters. Note also that some Master/Slave IDs have changed.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Peripherals
Freescale Semiconductor6
5.3 SIU
The SIU for MPC5674F has several changes that may impact the application.
• The SIU for the MPC5674F supports many additional pin functions, and the associated pad
configuration registers may have changed for many pads due to a completely new ball map.
• The PCR[PA] bit definitions have changed. All existing PCR configurations should be verified for
correct functioning.
• There is a new IMUX. Existing DSP and eQADC configurations have changed.
• Support has been added for a new NMI and critical interrupt.
5.4 Windowing Software Watchdog
The MPC5674F provides a new watchdog module. Also, a new bit is available in the Reset Config
Halfword (RCHW) that will disable this watchdog if the BAM is executed. However, debuggers do not
normally run the BAM so debuggers must also disable the software timer. If not disabled by the RCHW
and if booting from flash, software must disable the software early in the initialization sequence.
Legacy watchdog operation from previous e200z6 core using the core TCR and TSR registers is still
supported. If this core-provided watchdog is used, the code needs modification to adjust time out values
due to the higher operating frequencies of the MPC5674F.
Table 3. MPC5566 XBAR Master/Slave Detail
Module XBAR port Master ID
e200z6 Instruction/data Master 0 0
e200z6 Nexus 1
DMA Master 1 2
EBI Master 2 3
FEC Master 3 4
Table 4. MPC5674F XBAR Master/Slave Detail
Module XBAR port Master ID
e200z7 Instruction Master 0 0
e200z7 Data Master 1 0
e200z7 Nexus 8
DMA_A Master 4 4
DMA_B Master 5 5
FlexRay Master 6 6
EBI Master 7 7
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from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
Peripherals
MPC5566 to MPC5674F Migration Guide, Rev. 0
Freescale Semiconductor 7
5.5 Nexus
The MPC5566 supports Nexus 3+ 2003 standard and the MPC5674F supports Nexus 3+ 2008 standard.
Some messages and message formats may have changed. The MPC5566 may use either four or twelve
MDO pins. The MPC5674F may use either twelve or sixteen MDO pins.
5.6 External Bus Interface (EBI)
The MPC5566 provides a 32-bit data, 26-bit address, non-multiplexed external bus interface. The 516
PBGA package provides a configurable external bus intended for calibration use. It supports either 32-bit
muxed mode or 16-bit non-muxed mode.
5.7 Calibration Bus
The MPC5566 provides a 16-bit non-muxed calibration bus. The MPC5674F does not provide a
calibration bus in the 416 PBGA package. The 516 PBGA package provides the EBI described
in Section 5.6 that may be used for calibration, or the calibration bus is available in the 416 VertiCal
package.
5.8 eDMA
The MPC5566 provides a 64-channel DMA engine. The MPC5674F provides 96 channels of DMA.
The first 64 channels are identical to the MPC5566 and the additional 32 channels support the new
Decimation Filters and the second ADC. No software modifications are required unless the new
Decimation Filters or ADC are to be used. The MPC5674F supports misaligned accesses by the DMA.
5.9 eSCI
The MPC5566 provides two eSCI ports, eSCI A, and eSCI B. The MPC5674F provides an additional eSCI
port, eSCI C. The programming model for the eSCI registers has changed slightly.
The ESCI_LCR[LDBG] bit has been removed and this function no longer exists. Existing eSCI code
should be inspected to ensure correct operation.
5.10 FlexCAN
The MPC5566 and MPC5674F both provide four FlexCAN modules with 64 message buffers in
each module. No software modification is required.
5.11 DSPI
Both the MPC5566 and the MPC5674F provide four DSPI modules. However, the MPC5674F also
provides support for the Microsecond Bus downlink. Normal DSPI operation does not require
modification to software.
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from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Peripherals
Freescale Semiconductor8
5.12 FlexRay
The MPC5674F provides a FlexRay module with two FlexRay TX/RX units. Note that the FlexRay
module requires the external oscillator or crystal frequency to be 40 MHz. See also Section 5.21.
5.13 FEC
The MPC5566 provides a Fast Ethernet Controller (FEC). The MPC5674F does not provide the FEC.
5.14 System Timers (STM)
The MPC5566 does not provide a system timer module (STM). This new module has been added to the
MPC5674F to provide support for certain OS timing requirements. The STM is inactive from reset, and
there is no software change required if the STM is not needed.
5.15 eMIOS
The MPC5566 has 24 orthogonal eMIOS channels. The MPC5674F provides an additional eight channels
that are fully orthogonal. Existing configuration and channel servicing code will operate unmodified.
5.16 eTPU
• Both the MPC5566 and the MPC5674F devices provide two eTPUs with 64 channels total.
The MPC5674F incorporates the eTPU2 module. The code memory size has been increased from
20 KB to 24 KB, and the parameter RAM increased from 4 KB to 6 KB on the MPC5674F.
• Error checking has been added to the parameter RAM on the MPC5674F so an error handler should
be added.
• Existing eTPU microcode will execute on the eTPU2 used in the MPC5674F without modification.
5.17 Interrupt Controller
The MPC5566 interrupt controller has 308 interrupt request sources. The MPC5674F interrupt controller
has 448 request sources to accommodate interrupt requests from new modules and features.
The pre-existing channel assignments for the MPC5566 are preserved in the MPC5674F for software
compatibility.
5.18 eQADC
• The MPC5566 has one eQADC with two ADCs. An additional eQADC has been added to the
MPC5674F providing a total of four on-chip ADCs.
• The total number of channels has been increased, from 40 to 64.
• Some channel assignments have changed to accommodate the extra eQADC module. Software
management of the command and result queues may require modification.
• New channels have been added to access many internal voltages, including bandgap reference,
3.3 V rails, 1.2 V core voltage, LVIs.
• External muxes have been moved to digital pins allowing increased accuracy on muxed channels.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
Peripherals
MPC5566 to MPC5674F Migration Guide, Rev. 0
Freescale Semiconductor 9
5.19 Temperature Sensor
A new temperature sensor feature has been added to the MPC5674F. The temperature sensor is read via a
new channel in the eQADC.
5.20 Decimation Filter
Four decimation filters have been added to the MPC5674F. Additional interrupt request sources and DMA
channels have been added to support the decimation filters — however, the filter is disabled at reset and
no software changes are required.
5.21 FMPLL
The MPC5674F employs an enhanced FMPLL module that is not completely register-compatible with
the FMPLL module used on the MPC5566. While the configuration operation is similar, the configuration
control has now been placed in two registers instead of one. Software must be modified to address the new
addresses of the configuration registers. Additionally, due to the change in recommended crystal frequency
and bit definitions of the dividers in the configuration registers, the desired system frequency must be
recalculated using a new algorithm, which has been provided.
5.22 VRC
The MPC5674F employs a VRC circuit similar to the VRC control used on the MPC5566. Some minor
component changes may be required for the VRC decoupling scheme. The MPC5674F also provides a
switch mode power supply (SMPS) that may provide a lower-current power supply/regulation solution.
If the SMPS is to be used, an additional FET pass transistor, an inductor, and several resistors and
capacitors are required. The layout may be designed so that either the normal VRC or the SMPS may be
used depending on how the PCB is populated.
5.23 Power Supplies
Both the MPC5566 and the MPC5674 require +5 V and +3.3 V supplies — however, the MPC5566
requires a +1.5 V supply for internal logic, and the MPC5674F requires +1.2 V. An internal regulation
controller is provided on the MPC5674F to create the 3.3 V and 1.2 V supplies.
The MPC5674F does not require power sequencing at reset, and any supply may be removed and restored
without affecting other supplies. However, pin states may be different during power-up depending on the
supply power-up sequence.
5.24 Low-Power Modes
Two new low-power modes are added for the MPC5674F; slow mode and stop mode. Both of these modes
are disabled at reset. No software modification is required.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Package and Ball Map
Freescale Semiconductor10
6 Package and Ball Map
The MPC5674F shares several packages with the MPC5566 — however, the ball maps are not
pin-compatible. The PCB must be re-routed to support any MPC5674F package.
The MPC5674F rev. 1 device and the MPC5674F rev. 2 device have a minor difference in the ball map to
support a new REFBYPC feature. The PCB layout should be implemented in a manner that allows support
of both versions on the same PCB with a minor component population change. See Freescale document
EB716, “MPC5674F Revision 1 to Revision 2 ADC (REFBYPC) PCB Modification Requirements,” for
the details of this PCB design requirement.
The data sheets for each device should be used to compare the thermal data for any differences that would
impact hardware design.
Power supply bypassing design/strategy may need to be modified for the MPC5674F.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5566 and MPC567xF products in 496CSP packages
MPC5566 to MPC5674F Migration Guide, Rev. 0
Freescale Semiconductor 11
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Document Number: AN3903
Rev. 0
08/2009
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