(R) SP3222EU/3232EU 3.3V, 1000 Kbps RS-232 Transceivers Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply Interoperable with EIA/TIA - 232 and adheres to EIA/TIA - 562 down to a +2.7V power source 1A Low-Power Shutdown with Receivers Active (SP3222EU) Enhanced ESD Specifications: 15kV Human Body Model 15kV IEC1000-4-2 Air Discharge 8kV IEC1000-4-2 Contact Discharge 1000 kbps Minimum Transmission Rate Ideal for Handheld, Battery Operated Applications DESCRIPTION The SP3222EU and the SP3232EU are 2 driver, 2 receiver RS-232 transceiver solutions intended for portable or hand-held applications such as notebook or palmtop computers. Their data transmission rate of 1000 kbps meets the demands of high speed RS-232 applications. Both ICs have a high-efficiency, charge-pump power supply that requires only 0.1F capacitors in 3.3V operation. This charge pump allows the SP3222EU and the 3232EU to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The ESD tolerance of the SP3222EU/3232EU devices are over 15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222EU device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1uA. SELECTION TABLE MODEL Power Supplies RS-232 Drivers RS-232 Receivers External Components Shutdown TTL 3-State No. of Pins SP3222EU +3.0V to +5.5V 2 2 4 Yes Yes 18, 20 SP3232EU +3.0V to +5.5V 2 2 4 No No 16 Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 1 (c) Copyright 2003 Sipex Corporation ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Output Voltages TxOUT.......................................................13.2V RxOUT............. ..................-0.3V to (VCC + 0.3V) Short-Circuit Duration TxOUT.................................................Continuous Storage Temperature.................-65C to +150C Power Dissipation Per Package VCC ...................................................... -0.3V to +6.0V V+ (NOTE 1) ...................................... -0.3V to +7.0V V- (NOTE 1) ....................................... +0.3V to -7.0V V+ + |V-| (NOTE 1) ........................................... +13V 20-pin SSOP (derate 9.25mW/oC above +70oC) ........ 750mW 18-pin PDIP (derate 15.2mW/oC above +70oC) ....... 1220mW 18-pin SOIC (derate 15.7mW/oC above +70oC) ....... 1260mW 20-pin TSSOP (derate 11.1mW/oC above +70oC) ...... 890mW 16-pin SSOP (derate 9.69mW/oC above +70oC) ........ 775mW 16-pin PDIP (derate 14.3mW/oC above +70oC) ....... 1150mW 16-pin Wide SOIC (derate 11.2mW/oC above +70oC) .... 900mW 16-pin TSSOP (derate 10.5mW/oC above +70oC) ...... 850mW 16-pin nSOIC (derate 13.57mW/C above +70C) ...... 1086mW ICC (DC VCC or GND current) ......................... 100mA Input Voltages TxIN, EN ............................................ -0.3V to +6.0V RxIN .................................................................. 25V NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. SPECIFICATIONS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to C4=0.1F PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DC CHARACTERISTICS Supply Current 0.3 1.0 mA no load, TAMB = +25C, VCC = 3.3V, TxIN = GND or VCC Shutdown Supply Current 1.0 10 A SHDN = GND,TAMB = +25C, VCC= +3.3V, TxIN = GND or VCC 0.8 V TxIN, EN, SHDN, Note 2 V VCC = 3.3V, Note2 VCC = 5.0V, Note 2 TxIN, EN, SHDN, TAMB = +25C, VIN= 0V to VCC LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW GND Input Logic Threshold HIGH 2.0 2.4 VCC Input Leakage Current 0.01 1.0 A Output Leakage Current 0.05 10 A receivers disabled, VOUT = 0V to VCC 0.4 V IOUT = 1.6mA Output Voltage LOW Output Voltage HIGH VCC-0.6 VCC-0.1 V IOUT = -1.0mA Output Voltage Swing 5.0 5.4 V 3k load to ground at all driver outputs,TAMB = +25C Output Resistance 300 DRIVER OUTPUTS Output Short-Circuit Current Output Leakage Current Rev. A Date:12/11/03 35 VCC = V+ = V- = 0V, TOUT = +2V 60 mA VOUT = 0V 25 A VOUT = +12V,VCC= 0V to 5.5V,drivers disabled SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 2 (c) Copyright 2003 Sipex Corporation SPECIFICATIONS (continued) Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX , C1 to C4=0.1F. Typical Values apply at VCC = +3.3V or +5.5V and TAMB = 25oC. PARAMETER MIN. TYP. MAX. UNITS +25 V CONDITIONS RECEIVER INPUTS Input Voltage Range -25 Input Threshold LOW 0.6 0.8 Input Threshold HIGH 1.5 1.8 Input Hysteresis Input Resistance 1.2 1.5 V V VCC=3.3V VCC=5.0V 2.4 2.4 V V VCC=3.3V VCC=5.0V 7 k 0.3 3 5 V TIMING CHARACTERISTICS Maximum Data Rate 1000 kbps RL=3k, CL=250pF, one driver switching Receiver Propagation Delay 0.15 0.15 s tPHL, RxIN to RxOUT, CL=150pF tPLH, RxIN to RxOUT, CL=150pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Driver Skew 100 ns | tPHL - tPLH |, TAMB = 25C Receiver Skew 50 ns | tPHL - tPLH | Transition-Region Slew Rate 90 V/s VCC = 3.3V, RL = 3K, TAMB = 25C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V NOTE 2: Driver input hysteresis is typically 250mV. Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 3 (c) Copyright 2003 Sipex Corporation TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 1000kbps data rates, all drivers loaded with 3k, 0.1F charge pump capacitors, and TAMB = +25C. 120 4 Slew Rate (V / s) Transmitter Output Voltage (V) 6 T1 at 1Mbps T2 at 62.5Kbps 2 0 -2 -4 -6 250 500 1000 Load Capacitance (pF) 1500 60 40 20 0 Figure 1. Transmitter Output Voltage vs Load Capacitance for the SP3222EU and the SP3232EU 250 500 1000 1500 Load Capacitance (pF) 2000 Figure 2. Slew Rate vs Load Capacitance for the SP3222EU and the SP3232EU 35 20 Supply Current (mA) Supply Current (mA) 80 0 0 30 20 15 10 T1 at 1Mbps T2 at 62.5Kbps 5 0 0 250 500 1000 Load Capacitance (pF) 15 T1 at Mbps T2 at 62.5Kbps 10 5 0 1500 2.7 3 3.5 4 Supply Voltage (V) 4.5 5 Figure 4. Supply Current vs Supply Voltage for the SP3222EU and the SP3232EU Figure 3. Supply Current vs Load Capacitance when Transmitting Data for the SP3222EU and the SP3232EU 6 200 4 Skew (nS) Transmitter Output Voltage (V) T1 at 1Mbps T2 at 62.5Kbps All TX loaded 3K // CLoad 100 2 T1 at 1Mbps T2 at 62.5Kbps 0 -2 150 100 T1 at 500Kbps T2 at 31.2Kbps All TX loaded 3K // CLoad 50 -4 0 -6 2.7 3 3.5 4 Supply Voltage (V) 4.5 0 5 Figure 5. Transmitter Output Voltage vs Supply Voltage for the SP3222EU and the SP3232EU Rev. A Date:12/11/03 250 500 1000 1500 Load Capacitance (pF) 2000 Figure 6. Transmitter Skew vs Load Capacitance for the SP3222EU and the SP3232EU SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 4 (c) Copyright 2003 Sipex Corporation PIN NUMBER NAME SP3222EU FUNCTION DIP/SO SSOP TSSOP SP3232EU EN Receiver Enable. Apply logic LOW for normal operation. Apply logic HIGH to disable the receiver outputs (high-Z state). 1 1 - C1+ Positive terminal of the voltage doubler charge-pump capacitor. 2 2 1 V+ +5.5V generated by the charge pump. 3 3 2 C1- Negative terminal of the voltage doubler charge-pump capacitor. 4 4 3 C2+ Positive terminal of the inverting charge-pump capacitor. 5 5 4 C2- Negative terminal of the inverting charge-pump capacitor. 6 6 5 V- -5.5V generated by the charge pump. 7 7 6 T1OUT RS-232 driver output. 15 17 14 T2OUT RS-232 driver output. 8 8 7 R1IN RS-232 receiver input. 14 16 13 R2IN RS-232 receiver input. 9 9 8 R1OUT TTL/CMOS reciever output. 13 15 12 R2OUT TTL/CMOS reciever output. 10 10 9 T1IN TTL/CMOS driver input. 12 13 11 T2IN TTL/CMOS driver input. 11 12 10 GND Ground. 16 18 15 +3.0V to +5.5V supply voltage 17 19 16 Shutdown Control Input. Drive HIGH for normal device operation. Drive LOW to shutdown the drivers (high-Z output) and the onboard power supply. 18 20 - - 11, 14 - VCC SHDN N.C. No Connect. Table 1. Device Pin Description Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 5 (c) Copyright 2003 Sipex Corporation EN 20 SHDN 1 C1+ 2 EN 19 VCC V+ 3 18 GND C1- 4 17 C2+ 5 SP3222EU 16 C2- 6 15 R1OUT V- 7 14 T2OUT 8 13 T1IN R2IN 9 12 T2IN R2OUT 10 11 18 SHDN 1 C1+ 2 T1OUT R1IN N.C. 17 VCC V+ 3 16 GND C1- 4 15 C2+ 5 SP3222EU 14 C2- 6 13 R1OUT V- 7 12 T1IN T2OUT 8 11 T2IN R2IN 9 10 T1OUT R1IN R2OUT N.C. DIP/SO SSOP/TSSOP Figure 7. Pinout Configurations for the SP3222EU 16 VCC C1+ 1 V+ 2 15 GND C1- 3 C2+ 4 C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 R2IN 8 9 14 T1OUT SP3232EU 13 R1IN T2IN R2OUT Figure 8. Pinout Configuration for the SP3232EU Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 6 (c) Copyright 2003 Sipex Corporation VCC C5 C1 + + VCC 19 VCC 0.1F V+ LOGIC INPUTS + 0.1F 6 C2- 0.1F + C1 2 C1+ V+ 3 0.1F *C3 4 C1- SP3222EU SSOP TSSOP V- 7 13 T1IN T1OUT 17 12 T2IN T2OUT 8 R1IN R2IN + 0.1F + C2 RS-232 OUTPUTS 0.1F LOGIC INPUTS 16 RS-232 INPUTS 9 C4 T1OUT 15 11 T2IN T2OUT 8 R1IN 14 R2IN 9 5k LOGIC OUTPUTS 10 R2OUT + 0.1F 7 12 T1IN 5k 1 EN V- 6 C2- 13 R1OUT 5k 10 R2OUT SP3222EU DIP/SO 5 C2+ C4 15 R1OUT LOGIC OUTPUTS + *C3 4 C1- C2 17 VCC 0.1F 3 0.1F 5 C2+ + C5 2 C1+ + 0.1F RS-232 OUTPUTS RS-232 INPUTS 5k SHDN 20 1 EN SHDN GND GND *can be returned to either VCC or GND 18 18 16 *can be returned to either VCC or GND Figure 9. SP3222EU Typical Operating Circuits VCC + C5 + C1 16 VCC 0.1F 1 C1+ V+ 2 0.1F *C3 3 C14 C2+ + C2 LOGIC INPUTS 0.1F SP3232EU C4 11 T1IN T1OUT 14 10 T2IN T2OUT 7 R1IN 13 R2IN 8 5k 9 R2OUT 0.1F 6 5 C2- 12 R1OUT LOGIC OUTPUTS V- + + 0.1F RS-232 OUTPUTS RS-232 INPUTS 5k GND 15 *can be returned to either VCC or GND Figure 10. SP3232EU Typical Operating Circuit Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 7 (c) Copyright 2003 Sipex Corporation DESCRIPTION Figure 11 shows a loopback test circuit used to the RS-232 drivers. Figure 12 shows the test results of the loopback circuit with all drivers active at 250kbps with RS-232 loads in parallel with 1000pF capacitors. Figure 13 shows the test results where one driver was active at 1000kbps and all drivers loaded with an RS-232 receiver in parallel with a 250pF capacitor. The SP3222EU and SP3232EU are 2 driver/ 2receiver devices ideal for portable or handheld applications. The SP3222EU features a 1A shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1 A supply current. The SP3222EU driver's output stages are tristated in shutdown mode. When the power is off, the SP3222EU device permits the outputs to be driven up to 12V. Because the driver's inputs do not have pull-up resistors, unused inputs should be connected to VCC or GND. The SP3222EU/3232EU transceivers meet the EIA/TIA-232 and V.28/V.24 communication protocols They feature Sipex's proprietary onboard charge pump circuitry that generates 2 x VCC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. The SP3222EU/3232EU drivers operate at a minimum data rate of 1000kbps. In the shutdown mode, the supply current is less than 1A, where SHDN = LOW. When the SP3222EU device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with V+ pulled down to VCC and V- pulled to GND. The time required to exit shutdown is typically 100s. Connect SHDN to VCC if the shutdown mode is not used. THEORY OF OPERATION The SP3222EU/3232EU series are made up of three basic circuit blocks: 1. Drivers, 2. Receivers, and 3. the Sipex proprietary charge pump. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to 5.0V EIA/TIA-232 levels inverted relative to the input logic levels. Typically, the RS-232 output voltage swing is 5.5V with no load and at least 5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA562 levels of 3.7V with supply voltages as low as 2.7V. Receivers The receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. The SP3222EU receivers have an inverting tri-state output. Receiver outputs (RxOUT) are tristated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222EU driver and receiver outputs can be found in Table 2. The drivers have a minimum data rate of 1000kbps fully loaded with 3K in parallel with 250pF, ensuring compatibility with PC-to-PC communication software. Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 8 (c) Copyright 2003 Sipex Corporation VCC C5 C1 + + 0.1F VCC C1+ V+ 0.1F + 0.1F C3 C1- C2 + C2+ 0.1F SP3222EU SP3232EU VC4 C2LOGIC INPUTS LOGIC OUTPUTS + 0.1F TxOUT TxIN RxIN RxOUT 5k EN *SHDN VCC GND 250pF or 1000pF * SP3222EB only Figure 11. SP3222EU/3232EU Driver Loopback Test Circuit Figure 12. Driver Loopback Test All Drivers at 250kbps Rev. A Date:12/11/03 Figure 13. Driver Loopback Test One Driver 1Mbps SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 9 (c) Copyright 2003 Sipex Corporation Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal and inject noise, the inputs have a typical hysteresis margin of 300mV. Should an input be left unconnected, a 5k pulldown resistor to ground will commit the output of the receiver to a HIGH state. output voltages are less than a magnitude of 5.5V, the charge pumps are enabled. If the output voltage exceed a magnitude of 5.5V, the charge pumps are disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. Phase 1 -- VSS charge storage -- During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1- is transferred to C2-. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. Charge Pump The charge pump is a Sipex-patented design (5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. Phase 2 -- VSS transfer -- Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. In most circumstances, decoupling the power supply can be achieved adequately using a 0.1F bypass capacitor at C5 (refer to Figures 9 and 10). In applications that are sensitive to power-supply noise, decouple VCC to ground with a capacitor of the same value as chargepump capacitor C1. Physically connect bypass capacitors as close to the IC as possible. Phase 3 -- VDD charge storage -- The third phase of the clock is identical to the first phase -- the charge transferred in C1 produces -VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. The charge pumps operate in a discontinuous mode using an internal oscillator. If the SHDN EN TxOUT RxOUT 0 0 Tri-state Active 0 1 Tri-state Tri-state 1 0 Active Active 1 1 Active Tri-state Phase 4 -- VDD transfer -- The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side Table 2. SP3222EU Truth Table Logic for Shutdown and Enable Control Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 10 (c) Copyright 2003 Sipex Corporation is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 21. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. Since both V+ and V- are separately generated from VCC; in a no-load condition V+ and V- will be symmetrical. Older charge pump approaches that generate V- from V+ will show a decrease in the magnitude of V- compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1F with a 16V breakdown voltage rating. ESD Tolerance The SP3222EU/3232EU series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electrostatic discharges and associated transients. The improved ESD tolerance is at least 15kV without damage nor latch-up. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body's potential to store electrostatic energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 20. This method will test the IC's capability to withstand an ESD transient during normal handling such as in Rev. A Date:12/11/03 The Contact Discharge Method applies the ESD current directly to the DUT. SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 11 (c) Copyright 2003 Sipex Corporation VCC = +5V C4 +5V + C1 C2 - -5V + - - + VDD Storage Capacitor + - VSS Storage Capacitor C3 -5V Figure 15. Charge Pump -- Phase 1 VCC = +5V C4 C1 + C2 - + - - + VDD Storage Capacitor + - VSS Storage Capacitor C3 -10V Figure 16. Charge Pump -- Phase 2 [ T ] +6V a) C2+ T GND 1 GND 2 b) C2- T -6V Ch1 2.00V Ch2 2.00V M 1.00s Ch1 5.48V Figure 17. Charge Pump Waveforms VCC = +5V +5V C4 + C1 + C2 - -5V - + - -5V + - VDD Storage Capacitor VSS Storage Capacitor C3 Figure 18. Charge Pump -- Phase 3 VCC = +5V C4 +10V + C1 + C2 - - + - - + VDD Storage Capacitor VSS Storage Capacitor C3 Figure 19. Charge Pump -- Phase 4 Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 12 (c) Copyright 2003 Sipex Corporation R RSS R RC C SW2 SW2 SW1 SW1 Device Under Test C CSS DC Power Source Figure 20. ESD Test Circuit for Human Body Model This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the airgap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. represent the typical ESD testing circuits used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. The circuit models in Figures 20 and 21 Contact-Discharge Module R RSS R RC C RV SW2 SW2 SW1 SW1 Device Under Test C CSS DC Power Source RS and RV add up to 330 for IEC1000-4-2. Figure 21. ESD Test Circuit for IEC1000-4-2 Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 13 (c) Copyright 2003 Sipex Corporation I For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5k an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330 an 150pF, respectively. 30A 15A The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. 0A t=0ns t t=30ns Figure 22. ESD Test Waveform for IEC1000-4-2 Device Pin Tested Human Body Model Air Discharge Driver Outputs Receiver Inputs 15kV 15kV 15kV 15kV IEC1000-4-2 Direct Contact 8kV 8kV Level 4 4 Table 3. Transceiver ESD Tolerance Levels Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 14 (c) Copyright 2003 Sipex Corporation PACKAGE: PLASTIC SHRINK SMALL OUTLINE (SSOP) E H D A O e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) Rev. A Date:12/11/03 16-PIN 20-PIN A 0.068/0.078 (1.73/1.99) 0.068/0.078 (1.73/1.99) A1 0.002/0.008 (0.05/0.21) 0.002/0.008 (0.05/0.21) B 0.010/0.015 (0.25/0.38) 0.010/0.015 (0.25/0.38) D 0.239/0.249 (6.07/6.33) 0.278/0.289 (7.07/7.33) E 0.205/0.212 (5.20/5.38) 0.205/0.212 (5.20/5.38) e 0.0256 BSC (0.65 BSC) 0.0256 BSC (0.65 BSC) H 0.301/0.311 (7.65/7.90) 0.301/0.311 (7.65/7.90) L 0.022/0.037 (0.55/0.95) 0.022/0.037 (0.55/0.95) O 0/8 (0/8) 0/8 (0/8) SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 15 (c) Copyright 2003 Sipex Corporation PACKAGE: PLASTIC DUAL-IN-LINE (NARROW) E1 E D1 = 0.005" min. (0.127 min.) A1 = 0.015" min. (0.381min.) D A = 0.210" max. (5.334 max). C A2 e = 0.100 BSC (2.540 BSC) B1 B O L eA = 0.300 BSC (7.620 BSC) ALTERNATE END PINS (BOTH ENDS) DIMENSIONS (Inches) Minimum/Maximum (mm) 16-PIN 18-PIN A2 0.115/0.195 (2.921/4.953) 0.115/0.195 (2.921/4.953) B 0.014/0.022 (0.356/0.559) 0.014/0.022 (0.356/0.559) B1 0.045/0.070 (1.143/1.778) 0.045/0.070 (1.143/1.778) C 0.008/0.014 (0.203/0.356) 0.008/0.014 (0.203/0.356) 0.780/0.800 0.880/0.920 (19.812/20.320) (22.352/23.368) D Rev. A Date:12/11/03 E 0.300/0.325 (7.620/8.255) 0.300/0.325 (7.620/8.255) E1 0.240/0.280 (6.096/7.112) 0.240/0.280 (6.096/7.112) L 0.115/0.150 (2.921/3.810) 0.115/0.150 (2.921/3.810) O 0/ 15 (0/15) 0/ 15 (0/15) SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 16 (c) Copyright 2003 Sipex Corporation PACKAGE: PLASTIC SMALL OUTLINE (SOIC) (WIDE) E H D A O e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) Rev. A Date:12/11/03 16-PIN 18-PIN A 0.090/0.104 (2.29/2.649) 0.090/0.104 (2.29/2.649)) A1 0.004/0.012 (0.102/0.300) 0.004/0.012 (0.102/0.300) B 0.013/0.020 (0.330/0.508) 0.013/0.020 (0.330/0.508) D 0.398/0.413 (10.10/10.49) 0.447/0.463 (11.35/11.74) E 0.291/0.299 (7.402/7.600) 0.291/0.299 (7.402/7.600) e 0.050 BSC (1.270 BSC) 0.050 BSC (1.270 BSC) H 0.394/0.419 (10.00/10.64) 0.394/0.419 (10.00/10.64) L 0.016/0.050 (0.406/1.270) 0.016/0.050 (0.406/1.270) O 0/8 (0/8) 0/8 (0/8) SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 17 (c) Copyright 2003 Sipex Corporation PACKAGE: PLASTIC SMALL OUTLINE (SOIC) (NARROW) E H h x 45 D A O e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) Rev. A Date:12/11/03 16-PIN A 0.053/0.069 (1.346/1.748) A1 0.004/0.010 (0.102/0.249) B 0.013/0.020 (0.330/0.508) D 0.386/0.394 (9.802/10.000) E 0.150/0.157 (3.802/3.988) e 0.050 BSC (1.270 BSC) H 0.228/0.244 (5.801/6.198) h 0.010/0.020 (0.254/0.498) L 0.016/0.050 (0.406/1.270) O 0/8 (0/8) SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 18 (c) Copyright 2003 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) DIMENSIONS in inches (mm) Minimum/Maximum Symbol D e 14 Lead 16 Lead 20 Lead 24 Lead 28 Lead 38 Lead 0.193/0.201 0.193/0.201 0.252/0.260 0.303/0.311 0.378/0.386 0.378/0.386 (4.90/5.10) (4.90/5.10) (6.40/6.60) (7.70/7.90) (9.60/9.80) (9.60/9.80) 0.026 BSC (0.65 BSC) 0.026 BSC (0.65 BSC) 0.026 BSC (0.65 BSC) 0.026 BSC (0.65 BSC) 0.026 BSC 0.020 BSC (0.65 BSC) (0.50 BSC) e 0.126 BSC (3.2 BSC) 0.252 BSC (6.4 BSC) 1.0 OIA 0.169 (4.30) 0.177 (4.50) 0.039 (1.0) 0'-8' 12'REF e/2 0.039 (1.0) 0.043 (1.10) Max D 0.033 (0.85) 0.037 (0.95) 0.007 (0.19) 0.012 (0.30) 0.002 (0.05) 0.006 (0.15) (2) 0.008 (0.20) 0.004 (0.09) Min 0.004 (0.09) Min Gage Plane 0.010 (0.25) (3) 0.020 (0.50) 0.026 (0.75) (1) 1.0 REF Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000Kbps RS-232 Transceivers 19 (c) Copyright 2003 Sipex Corporation ORDERING INFORMATION Model SP3222EUCA SP3222EUCP SP3222EUCT SP3222EUCY Temperature Range Package Type .......................................... 0C to +70C .......................................... 20-Pin SSOP .......................................... 0C to +70C ............................................ 18-Pin PDIP .......................................... 0C to +70C ........................................ 18-Pin WSOIC .......................................... 0C to +70C ........................................ 20-Pin TSSOP SP3232EUCA .......................................... 0C to +70C .......................................... 16-Pin SSOP SP3232EUCP .......................................... 0C to +70C ............................................ 16-Pin PDIP SP3232EUCT .......................................... 0C to +70C ........................................ 16-Pin WSOIC SP3232EUCY .......................................... 0C to +70C ........................................ 16-Pin TSSOP SP3232EUCN........................................... 0C to +70C ......................................... 16-Pin nSOIC Please consult the factory for pricing and availability on a Tape-On-Reel option. Corporation SIGNAL PROCESSING EXCELLENCE Sipex Corporation Headquarters and Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Rev. A Date:12/11/03 SP3222EU/3232EU 3.3V, 1000kbps RS-232 Transceivers 20 (c) Copyright 2003 Sipex Corporation