To [SPEC No. | ISSUE: Oct. 12. 2004 SPECIFICATIONS Product Type LZ9OF Series 7000 Gates Gate Array LZ9YFC2 3 Model No. This specifications contains 23 pages including the cover and appendix. If you have any objections, please contact us before issuing purchasing order. CUSTOMERS ACCEPTANCE DATA: BY: PRESENTED \, BY: Y Key kL Woy D-KATIKAAA Dept. General Manager REVIEWED BY: PREPARED .BY: K dabids, PB Nrhgew Product Development Dept. 3 System LSI Division Integrated Circuits Group SHARP CORPORATIONLZ9FC23 @ulandle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. @When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions (1) The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph (3). * Office electronics * Instrumentation and measuring equipment Machine tools * Audiovisual equipment Home appliances * Communication equipment other than for trunk lines (2) Those contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail~safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. Control and safety devices for airplanes, trains, automobiles, and other transportation equipment Mainframe computers Traffic control systems Gas leak detectors and automatic cutoff devices * Rescue and security equipment Other safety devices and safety equipment, etc. (3) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. + Aerospace equipment * Communications equipment for trunk lines Control equipment for the nuclear power industry * Medical equipment related to life support, etc. (4)Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales representative of the company @Please direct all queries regarding the products covered herein to a sales representative of the company.LZ9FC23 CONTENTS Introduction . Feature . Pin Assignments . Function of Input/Output signal . Absolute Maximum Ratings . Electrical Specifications . Timing Characteristics of Input/Output Signals Input/Output signal timing chart for above cases . Package and packing specification . Page 8~12 13~21LZ9FC23 1. Introduction This data sheet is to introduce the specification of LZ9FC23, which is designed by Mobile Liquid Crystal Display Group Sharp Corporation, Timing Control IC for TFT-LCD module. Applicable TFT-LCD module : QVGA (Portrait/Landscape) pixel type module Functions: Timing Control IC for TFT-LCD module (1) By inputting Clock signal, Horizontal sync. signal, Vertical sync. signal, the following signals synchronized with above signal are generated. (A) The signal for driving a source driver : CLK, SPL, SPR, LP, PS (B) The signal for driving a gate driver CLS, SPS (C) The signal for creating the voltage which applies to common electrode :REV (D) The signal for creating standard voltage :REVVO (2) Horizontal and Vertical reverse scanning function Input/Output signal timing chart for above cases : See Fig. 1. Fig. 2. Fig.3. Fig.4. Fig. 5. 2. Feature Process : CMOS Wafer substrate : P-type silicon substrate Package : 72QFP (0.5mm pin pitch) Materials : Plastics Operating Temperature > -30C ~ +85C Propagation delay time : 1. Ons/gate ( Condition : 2-input NAND, Fanout=2, wire length=2mm, supply voltage=3.3V, Operating temperature Topr=25C ) >* REMARK Not designed or rated as radiation hardened. You cannot rewrite the program.LZ9FC23 3. Pin Assignments Pin No. T/0 Signal Name | Pin No. 1/0 Signal Name ] Ic DCLK 37 03M CLK 2 ICU SETR 38 ~ GND 3 Ic RO 39 02M OB5 4 Ic Rl 40 02M OB4 5 Ic R2 41 02M OB3 6 IC R3 42 02M OB2 7 IC R4 43 02M OB1 8 Ic RS 44 02M OBO 9 ~ GND 45 Vop 10 ICU SDRSEL 46 ~ GND il Ic GO 47 02M 0G5 12 IC G1 48 02M 0G4 13 IC G2 49 02M 0G3 14 IC G3 50 02M 0G2 15 IC G4 5l 02M OG1 16 IC G5 52 02M O0GO 17 TCU TEST 53 = GND 18 Ic BO 54 02M ORS 19 Ic Bl 55 02M OR4 20 Ic B2 56 02M ORS 21 IC B3 57 02M OR2 22 Ic B4 58 02M OR1 23 IC B5 59 02M ORO 24 Icu TEST 60 = GND 25 ICU HREV 61 TO2M CLS 26 ICD ENAB 62 TO2M SPS 27 7 Vop 63 - Vp 28 = GND 64 = GND 29 ICU TEST 65 TO2M UBL 30 02M REV 66 ICU VREV 31 02M REVVO 67 IC TEST 32 02M PS 68 IC SIZECO 33 TO2M SPR 69 02M MOD 34 02M LBR 70 IcU REM 35 TO2M SPL 71 IC HS 36 02M LP 72 IC VS Ic Input buffer CMOS level ICU Input buffer CMOS level with PULL UP resistance (R=300kQ) IcD Input buffer CMOS level with PULL DOWN resistance (R=300kQ) 02M Output buffer (1 ,=0. 8mA) 03M Output buffer (Ip.=1. 2mA) TO2M Tri-state Output buffer (Ig.=0. 8mA) Vpp Power supply pin GND Earth pinLZ9FC23 4, Function of Input/Output signal Pin No. [Signal NamelExplanation 1/0 1 DCLK Input terminal for data clock signal I SETR [Input terminal for control signal for PS(Effective only in SIZECO="L) I SETR="H :PS signal serves as operation for specific models SETR="L :PS signal is normal operation. 3 RO Input terminal for red data signal (LSB) I 4 Rl Input terminal for red data signal I 5 R2 Input terminal for red data signal I 6 R3 Input terminal for red data signal T 7 kR4 Input terminal for red data signal I 8 R5 Input terminal for red data signal (MSB) I 9 GND Ground - 10 SDRSEL [Input terminal for control signal for CLK and DATA output timing I SDRSEL="H :Normal (Effective only in SIZECO="L) SDRSEL="L :4clk delay mode ll GO Input terminal for green data signal (LSB) I 12 Gl Input terminal for green data signal I 13 G2 Input terminal for green data signal I 14 G3 Input terminal for green data signal I 15 G4 Input terminal for green data signal I 16 G5 Input terminal for green data signal (MSB) I 17 TEST [Input terminal for test mode (Connect this terminal to H) I 18 BO Input terminal for blue data signal (LSB) I 19 Bl Input terminal for blue data signal I 20 B2 Input terminal for blue data signal I 21 B3 Input terminal for blue data signal I 22 B4 Input terminal for blue data signal I 23 B5 Input terminal for blue data signal (MSB) I 24 TEST [input terminal for test mode (Connect this terminal to H) I 25 HREV jInput terminal for setting up horizontal scan direction I HREV="H :Normal scan HREV="L :Horizontal reversal scan 26 ENAB [Input terminal for signal to settle the Horizontal display position 27 Vop Input terminal for Power Supply voltage - 28 GND Ground - 29 TEST _|Input terminal for test mode (Connect this terminal to H) I 30 REV Signal output for common electrode preparation 0 31 REVVO {Signal output for standard voltage preparation 0 32 PS Control signal output for source driver 0 33 SPR Start signal output for source driver 0 When HREV="H :SPR output is High impedance When HREV="L :SPR output is valid. 34 LBR Output signal for source driver for setting up Horizontal scan direction 0 When HREV="H", LBR="H output. When HREV="L, LBR="L output. 35 SPL Start signal output for source driver 0 When HREV="H" :SPL outout is valid When HREV="L :SPL outout is High impedance 36 LP Data transferring signal output for source driver 0LZ9FC23 Pin No, |Signal NamelExplanation 1/0 37 CLK Clock signal output for source driver 0 38 GND Ground - 39 OB5 Blue data signal output for source driver (MSB) 0 40 OB4 Blue data signal output for source driver 0 Al OB3 Blue data signal output for source driver 0 42 OB2 Blue data signal output for source driver 0 43 OBI Blue data signal output for source driver 0 44 OBO Blue data signal output for source driver (LSB) 0 45 Vop Power Supply voltage - 46 GND Ground _ 47 OG5 Green data signal output for source driver (MSB) 0 48 OG4 Green data signal output for source driver 0 49 0G3 Green data signal output for source driver 0 50 0G2 Green data signal output for source driver ) 51 OG1 Green data signal output for source driver 0 52 OGO Green data signal output for source driver (LSB) 0 53 GND Ground - 54 OR5 Red data signal output for source driver (MSB) 0 55 OR4 Red data signal output for source driver 0 56 OR3 Red data signal output for source driver 0 57 OR2 Red data signal output for source driver 0 58 ORL Red data signal output for source driver 0 59 ORO Red data signal output for source driver (LSB) 0 60 GND Ground - 61 CLS Clock signal output for source driver 0 62 SPS Start signal output for gate driver 0 63 Vop Power Supply voltage - 64 GND Ground - 65 UBL Output signal for gate driver for setting up Vertical scan direction 0 When VREV="H", UBL="H output When VREV="L, UBL="L output 66 VREV |Input terminal for setting up vertical scan direction I VREV="H" :Normal scan VREV="L :Vertical reversal scan 67 TEST (Input terminal for test mode (Connect this terminal to L) I 68 SIZECO |Input terminal for setting up display resolution I SIZECO="H :Portrait QVGA (240RGB X 320) SIZECO="L :Landscape QVGA (320RGB X 240) 69 MOD Output signal for gate driver 0 70 REM Input terminal for reset signal (Give the signal that becomes I H level fixation from the L level at the time of the power supply input. ) 71 HS Input terminal for Horizontal sync. signal I 72 VS Input terminal for Vertical sync. signalLZ9FC23 5. Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage Vop 0.3 ~ +6. 0 Vv Input voltage Vi 0.3 ~ Vppt0. 3 V Output voltage Vo 0.3 ~ Vopp +0. 3 Vv Operating temperature Topr 30 ~ +85 Cc Storage temperature Tstg 55 ~ +150 io 6. Electrical Specifications 6-1. Operating Conditions Parameter Symbol MIN. TYP. MAX. Unit Supply voltage V op +2.7 +3. 3 +3.6 V Operating temperature Topr -30 +85 C 6-2. Electrical Characteristics (Vpp=+t2. 7~+3. BV, Topr=-30~+85C) Parameter Symbol Test conditions MIN. TYP. MAX. Unit] # Input Low: voltage Vin 0.3XVpy | V Input High voltage Vin 0.7 XVpp viii Input High current | Lim | Vi=Vp 1.0 uA Input Low current | Tin | Vi=OV 1.0 wAl| 2 Input High current | Te | Vi=Vo 1.0 uA Input Low current | Toe Vi=OV 2.0 36. 0 pA 3 Input High current | T sus Vi=Vop 2.0 36. 0 uA InputLow current | Ins | Vi=OV 1.0 wAl 4 Output Low voltage Vou Ig= 0.8mA 0.4 Vv Output High voltage Von I g=0.4mA Vpp70. 5 Vid OutputLow voltage V ove I= 1.2mA 0.4 Vv Output High voltage V one I w=0.6mA Vpp-0. 5 Vv | 6 Output Leakage Current | I oz High-impedance state 1.0 upALT #1: Applied #2: Applied #3: Applied #4: Applied #5: Applied #6: Applied #7: Applied to Input pins (IC, IcU, ICD). to Input pins (IC). to Input pins (ICU). to Input pin (ICD). to Output pins (02M, TO2M). to Output pin (03M). to Output pins (TO2M).LZ9FC23 7. Timing Characteristics of Input/Output Signals Input Timing Characteristics (1) Portrait QVGA (240RGBx320) :SIZECO="H Parameter Symbol Min. Typ. Max Unit DCLK frequency foctx 4.5 6. 8 MHz HS frequency fis foctn/ 330 foci /254 kHz 15 26 kHz VS frequency fys fus/440 fiys/332 Hz 50 80 Hz (2) Landscape QVGA (320RGBx240) :SIZECO="L Parameter Symbol] Min. Typ. Max. Unit DCLK frequency foctx 4.5 6.8 MHz HS frequency fus focix/440 fog ./334 kHz 12.5 20 kHz VS frequency fys fys/330 fys/248 Hz 50 82 HzLZ9FC23 131g U Yy OAAT | Aga Wf ' yoae <> y _ Sd WIDGOE : < i > eleleral : wave ee / \ & > ST9 u : NTO: 7 Vl D i < > dT tl spd! i Y <i> wdS* TdS WIG - ~oao s$~000 $~0u0 WU VITA GA kK ow \e Hf xaovz [7 \ S >] aVNA v4 IOI El Z1=9L > 5~09 5~09 s~ ou IIIS 020 ILO ALY OF Ll sugzi~ 0S yaparl SUQZI~ 05 ) Y 7 SH > MIOGOEE ~ (ZPZ + 2D) (PHBA : PYNG WH = OOTZIS) (OZE x AOUOvZ) VDAO OAL Hensog Burt] jewozHOH Seseo aAOge AOJ JAeYO ButwTy Teusrs yndyng/induy sgLZ9FC23 HE] z 314 ' on V/A wide Vv WY ea) Ay $< $#<___-> AWDae1 wpoadrz WIDA0E STO Uwodz dT UdS* IdS s~o#O s~0D0 5~0XO qt aN ATO Wal LL (paxty [249] .1,) dV NA wiodeL . s~ Od s~0o s~Oou UU x00 IL9O0~ 2160 : w sugzi~ 0S * sugzI~ 0S S L wari a SH ATDAGOEE ~ Ste A vv (poXt Ty, = PWN wH = OOAZIS) (OTE X COUOPZ) VOAO 244] emtog = Buturty peyuozOH10 LZ9FC23 <> W1Dd0 NTOdL91 Sly i WGI ATT Ss SS 190667 '$paze- < yioaey (.Ho=WLA8) Sd <_ OO : wipazt (1.2 ULOS) Sd S70 dI < wiodr UdS* Td GL FASUUs) $~0g0 $~050 $~OuO aTodal Wh 1asuds) MIO (Hu 14dSUds) ~ 080 S~000 S~NIO wWDd0t Nk TH.=Tasuas) ATO WToGeL~ aVNA S~ OE S~0D s~Ol wiodory ~ (276 +91) sUugTZ1~ OS HE S\ [roa Sugct~ 0S i ___ 19491 : ; SH (pyeA : AVNG aT. = OOAZIS) (OFZ X POUOZE) VODAY adh odeospuey] dutury ewozt0H{1 LZ9FC23 psy u j ATIGL9T Wodth: Ade : ! wiode sf OAARU Adu (H.-Y LOS) Sd be i 4 > : WIDE? Aa w1pazZ yqpaa9 (=e Las) a y \ Sd WIACE < aATdzI A NT 5 | ie 2662 sD ATIaz \___/ d1 WdS* TS yaar : y w190r Adal (.1.=T13Suds) S~08O $~0n0 s~ouo S\y (WT Tasuds) wioaot NTO (M=Tasuds) s~0dO s~oD0 s~0uo vay CH. T3SUds) whaol ATO (poxy jar 7.) aVNA oe NIGEL = 9b DUVALL 2200 219'0~9Lr0 | sugzI~ 08 wrap et 9s ,-_ \ y SH ATO ~ S6E (POXxt ,.1,, = {VN .T,, = OOAZIS) (OFZ X ADUOZE) WODAD edA] odesspueyT Buruny yewozioH12 LZ9FC23 < ~~ g BI VSN NIN INI NIN SNS NSN INN NP NS SS SN (Ty = ODAZIS) HOPZ (H = OOFZIS) HOZE STO ~ ~~ ~? EL. ss SS ~ HZ WV poued Aejdsip yeonse, IAI AE AE AEA AEE OE NEN XXXII XOXOXO EXO (T= OO8ZIS) HOLE ~ H8rz (aH, = OOAZIS) HObP ~ HZEE (aT = 0DHZIS) Ht? (4H. = OOUZIS) H8 x WLVd stp~ 1 (He'dAL) HOO! ~ HI adkyj, advaspury 2 adh yeniog BurUl yy [eaeLZ9FC23 13 9 Package and packing specification |Applicability] This specification applies to IC package of the LEAD-FREE delivered as a standard specification. L.Storage Conditions. 1-1. Storage conditions required before opening the dry packing. * Norinal temperature ; 5~40C * Normal humidity : 80%( Relative humidity) max. "Humidity" means "Relative humidity" 1-2.Storage conditions required after opening the dry packing. In order to prevent moisture absorption after opening, ensure the following storage conditions apply: (1) Storage conditions for one-time soldering. (Convection reflow, IR/Convection reflow.', or Manual soldering. ) * Temperature : 5~25C > Humidity : 60% max. * Period : 168 hours max. after opening. (2) Storage conditions for two-time soldering. (Convection reflow, IR/Convection reflow.') a. Storage conditions following opening and prior to performing the Ist reflow. * Temperature : 5~25C * Humidity : 60% max. * Period : 96 hours max. after opening. b. Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow. * Temperature : 5~25C * Humidity : 60% max. * Period : 96 hours max. after completion of the Ist reflow. "| Air or nitrogen environment. 1-3. Temporary storage after opening. To re-store the devices before soldering, do so only once and use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using heat-sealing. The storage period, temperature and humidity must be as follows : (1) Storage temperature and humidity. *1 : External atmosphere temperature and humidity of the dry packing. First opening < X| > Re-sealing y > Reopening < X2. Mounting {> QD CF) O Y v 2X1 Temperature /5~d0C 5~25C 1 5~40 5~25C Humidity 80% max. 60% max. ' 80% max. 60% max. (2) Storage period. * XI+X2 : Refer to Section 1-2(1) and (2)a , depending on the mounting method. > Y > Two weeks max. 20040930LZ9FC23 4 2. Baking Condition. (1) Situations requiring baking before mounting. - Storage conditions exceed the limits specified in Section 1-2 or 1-3. * Humidity indicator in the desiccant was already red (pink) when opened. ( Also for re-opening. ) (2) Recommended baking conditions. + Baking temperature and period : 120C for 16~24 hours. The above baking conditions apply since the trays are heat-resistant. (3) Storage after baking. * After baking, store the devices in the environment specified in Section 1-2 and mount immediately. 3. Surface mount conditions. The following soldering condition are recommended to ensure device quality. 3-1. Soldering. (1) Convection reflow or IR/Convection. (one-time soldering or two-time soldering in air or nitrogen environment) > Temperature and period : A) Peak temperature. 250C max. B) Heating temperature. 40 to 60 seconds as 220C C) Preheat temperature. It is 150 to 200C, and is 120430 seconds D) Temperature increase rate. It is 1 to 3C/seconds * Measuring point : IC package surface. > Temperature profile: IC package surface temperature Time Wess?! 20040930LZ9FC23 (2) Manual soldering ( soldering iron ) ( one-time soldering only ) Soldering iron should only touch the ICs outer leads. * Temperature and period : 350C max. for 3 seconds / pin max. (Soldering iron should only touch the ICs outer leads.) * Measuring point : Soldering iron tip. 4. Condition for removal of residual flux. (1) Ultrasonic washing power : 25 watts / liter max. (2) Washing time : Total | minute max. (3) Solvent temperature : 15~40C 5. Package outline specification. Refer to the attached drawing. (Plastic body dimensions do not include burr of resin.) The contents of LEAD-FREE TYPE application of the specifications. (*2) 6. Markings. 6-1.Marking details. (The information on the package should be given as follows.) (1) Product name : LZ9FC23 (2) Company name : SHARP (3) Date code : (Example) YYWW XXX YY > Denotes the production year. (Last two digits of the year.) WwW -> Denotes the production week. (01 - 02 + ~ + 52 + 53) XXX - Denotes the production ref. code (1~~3 digits). (4) JAPAN indicates the country of origin. 6-2.Marking layout. The layout is shown in the attached drawing. (However, this layout does not specify the size of the marking character and marking position.) *2 The contents of LEAD-FREE TYPE application of the specifications. LEAD FINISH or LEAD-FREE TYPE BALL TYPE (Sn-Bi) DATE CODE They are those with an underline. The word of LEAD FREE is printed on the packing Printed label 20040930LZ9FC23 16 (Note)It is those with an underline printing in a date code because of a LEAD-FREE type, -EL9.08 P-O,STYP.. a2 0.15 3:8 54 uk 55 = 36 3 L79FC23 BS G SHARP = a 9 w JAPAN eS Ie f 8 O Oy ; - : YYWW XXX Pe + = , [0.1] = : h 5 } 5 L ld dy 5 | MMT S- c.g) [ot 10.0 38:3 18} ci. 0.65/%3 12.0 *8:3 1 ASE 1g ud a << Qa Ud Wn <x @m ' oO \. SEE DETAIL A x DETAIL A N Oo H -,; wo PKG. BASE PLANE S _~ QFP072-P-1010-AA1034 Oo LEAD FINISH LEAD MATERIAL LEAD TYPE Sn-Bi PLATING 42 Alloy NAME QFP072-P-1010 NOTE : Plastic body dimensions do not include burr of resin. DRAWINGNO. | = AAL034 UNIT mm 20040930LZ9FC23 17 7.Packing Specifications (Dry packing for surface mount packages.) 7-1.Packing materials. Material name Material specifications Purpose Inner carton Cardboard (800 devices / inner carton Packing the devices. max.) (10 trays / inner carton) Tray Conductive plastic (80 devices / tray) Securing the devices. Upper cover tray Conductive plastic (1 tray / inner carton) Securing the devices. Laminated aluminum } Aluminum polyethylene Keeping the devices dry. bag Desiccant Silica gel Keeping the devices dry. Label Paper Indicates part number, quantity, and packed date. PP band | Polypropylene (3 pes. / inner carton ) Securing the devices. Outer carton Cardboard (3200 devices / outer carton Outer packing. max.) ( Devices must be placed on the tray in the same direction.) 7-2.Outline dimension of tray. Refer to the attached drawing. 7-3.Outline dimension of carton. Refer to the attached drawing. 8. Precautions for use. - (1) Opening must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. (2) The trays have undergone either conductive or anti-ESD treatment, If another tray is used, make sure it has also undergone conductive or anti-ESD treatment. (3) The devices should be mounted within one year of the date of delivery. 20040930LZ9FC23 5.8 4.3 z x a mf = +_t gs st cg tr T a x 2 a a > x = Pes | o,a 35.8 25.0x4=100.0 9:5 (TO aml rc 4 eee f 4 a Ae | HB NAME =! FPLOLOTCM-RH-N NOTE Nee | DRAWING NO. | CV830 | UNIT! mm 200409330LZ9FC23 19 (1) Banding device tray together. Banding by P-P tape. Device trays 10 sheets + a cover Isheet. (2) Vacuum seal by Al laminating bag. PTT My nh Al laminating bag Barcode label (3) Packing by Inner carton, Pad Barcode label NOTE There is a possibility different from this Packing specifications specification when the number of shipments i) i 1 t NAME ' i is fractions DRAWING NO. | BJ433c} UNIT* mm 20040930LZ9PC23 20 Inner carton Inner carton barcode label] Adhesive tape (H taping) Outer carton L& WX H Inner carton Outer dimensions : 36015095 Outer carton Outer dimensions : 390X335 x 230 NOTE There is a possibility different from this NAME Packing specifications specification when the number of shipments \ is fractions. DRAWING NO. | Bd433d} UNIT mm 20040030LZ9FC23 (Note) The <LEAD-FREE> display shows a lead-free article. Inner carton label Ww i ( Quantit eo tot 7 CLAAETNTA Company code iy LZ9FC23 Part No. (SHARP) HA rv A Packed date LZ9FC23 3N)1 Lz9FC23 3N) 2 800 XXXXXXXXXXXX SHARP MADE IN JAPAN 103120 < LEAD-FREE > <QUANTITY> Quantity 800 ELA 0-3 <RMK> XXXXXXXXXXXXXXKAX The country of origin (It displays, when the country of origin is Japan. ) Outer carton label Part No. F Assembly management No. The country of origin (It displays, when the of origin is Japan. ) country < LEAD-FREE > (SHARP) y (4S) PKG ID : LZ9FC23 Tn / (Q) QUANTITY : 3200 cc MADE IN JAPAN YYYY. MM. DD [Produc + name Shipment lot (P) CUST PROD ID : LZ9FC23 A A XXXXXXXXXXXX cal SHARP (Former) EIAJ B Standard conforming Packed date 20040930