LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 D D D D D D D D - Max Rating . . . 2 V to 36 V - Tested to 30 V . . . Non-V Devices - Tested to 32 V . . . V-Suffix Devices Low Supply-Current Drain Independent of Supply Voltage . . . 0.4 mA Typ Per Comparator Low Input Bias Current . . . 25 nA Typ Low Input Offset Current . . . 3 nA Typ (LM193) Low Input Offset Voltage . . . 2 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS LM193 . . . D OR JG PACKAGE LM293 . . . D, DGK, OR P PACKAGE LM293A . . . D OR DGK PACKAGE LM393, LM393A . . . D, DGK, P, PS, OR PW PACKAGE LM2903 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN- 2IN+ LM193 . . . FK PACKAGE (TOP VIEW) NC 1OUT NC VCC NC D Single Supply or Dual Supplies D Wide Range of Supply Voltage NC 1IN- NC 1IN+ NC 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN- NC NC GND NC 2IN+ NC description/ordering information 4 These devices consist of two independent voltage comparators that are designed to operate from a NC - No internal connection single power supply over a wide range of voltages. Operation from dual supplies also is possible as long as the difference between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. The LM193 is characterized for operation from -55C to 125C. The LM293 and LM293A are characterized for operation from -25C to 85C. The LM393 and LM393A are characterized for operation from 0C to 70C. The LM2903 is characterized for operation from -40C to 125C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2010, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 ORDERING INFORMATION{ TA VIOmax AT 25C MAX VCC PDIP (P) 30 V LM393P Tube of 75 LM393D Reel of 2500 LM393DR Reel of 2500 LM393DRG3 Reel of 2000 LM393PSR Tube of 150 LM393PW Reel of 2000 LM393PWR Reel of 2000 LM393PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM393DGKR M9_ PDIP (P) Tube of 50 LM393AP LM393AP Tube of 75 LM393AD Reel of 2500 LM393ADR SOP (PS) Reel of 2000 LM393APSR L393A TSSOP (PW) Reel of 2000 LM393APWR L393A MSOP/VSSOP (DGK) Reel of 2500 LM393ADGKR M8_ PDIP (P) Tube of 50 LM293P LM293P Tube of 75 LM293D Reel of 2500 LM293DR Reel of 2500 LM293DRG3 Reel of 2500 LM293DGKR Tube of 75 LM293AD Reel of 2500 LM293ADR MSOP/VSSOP (DGK) Reel of 2500 LM293ADGKR MD_ PDIP (P) Tube of 50 LM2903P LM2903P Tube of 75 LM2903D Reel of 2500 LM2903DR Reel of 2500 LM2903DRG3 Reel of 2000 LM2903PSR Reel of 2000 LM2903PWR Reel of 2000 LM2903PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM2903DGKR MA_ SOIC (D) Reel of 2500 LM2903VQDR L2903V TSSOP (PW) Reel of 2000 LM2903VQPWR L2903V SOIC (D) Reel of 2500 LM2903AVQDR L2903AV TSSOP (PW) Reel of 2000 LM2903AVQPWR L2903AV CDIP (JG) Tube of 50 LM193JG LM193JG LCCC (FK) Tube of 55 LM193FK LM193FK SOIC (D) Reel of 2500 LM193DR LM193 SOP (PS) TSSOP (PW) 0C 70C 0 C to 70 C SOIC (D) 2 mV 5 mV 30 V 30 V -25C 25C to 85C SOIC (D) MSOP/VSSOP (DGK) 2 mV 30 V SOIC (D) SOIC (D) 7 mV V 30 V -55C to 125C SOP (PS) TSSOP (PW) -40C 40C to 125C 7 mV 32 V 2 mV 32 V 5 mV 30 V TOP-SIDE MARKING Tube of 50 SOIC (D) 5 mV ORDERABLE PART NUMBER PACKAGE} LM393P LM393 L393 L393 LM393A LM293 MC_ LM293A LM2903 L2903 L2903 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. The actual top-side marking has one additional character that designates the wafer fab/assembly site. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 symbol (each comparator) IN+ OUT IN- schematic (each comparator) VCC 80-A Current Regulator 10 A 60 A 10 A IN+ 80 A COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 2 30 IN- GND Current values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 36 V Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, JA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149C/W Package thermal impedance, JC (see Notes 6 and 7): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61C/W JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to GND. 2. Differential voltages are at IN+, with respect to IN-. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. Maximum power dissipation is a function of TJ(max), JC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) - TC)/JC. Operating at the absolute maximum TJ of 150C can affect reliability. 7. The package thermal impedance is calculated in accordance with MIL-STD-883. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER MIN VCC = 5 V to 30 V, VO = 1.4 1 4 V, V VIC = VIC(min) VIO Input offset voltage IIO Input offset current VO = 1.4 14V IIB Input bias current 14V VO = 1.4 VICR Common mode Common-mode input voltage range LM293 LM393 LM193 TA TEST CONDITIONS 25C TYP MAX 2 5 MIN UNIT TYP MAX 2 5 mV Full range 9 25C 3 Full range 25C Full range AVD Large-signal differential-voltage amplification VCC = 15 V, VO = 1.4 V to 11.4 V, RL 15 k to VCC High level High-level output current VOH = 5 V, VID = 1 V 25C IOH VOH = 30 V, VID = 1 V Full range VOL Low level Low-level output voltage IOL = 4 mA, mA VID = -1 1V IOL Low-level output current VOL = 1.5 V, VID = -1 V 25C ICC Supply current RL = VCC = 5 V 25C VCC = 30 V Full range 25C 25 5 100 -25 Full range 25C 9 -100 -25 -300 0 to VCC - 1.5 0 to VCC - 2 0 to VCC - 2 200 50 0.1 25C 150 200 0.1 400 150 700 6 V/mV 50 nA 1 A 400 700 6 0.8 1 2.5 nA V 1 Full range nA -250 -400 0 to VCC - 1.5 50 50 250 mV mA 0.8 1 2.5 mA Full range (MIN or MAX) for LM193 is -55C to 125C, for LM293 is 25C to 85C, and for LM393 is 0C to 70C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ - 1.5 V for the inverting input (-), and the non-inverting input (+) can exceed the VCC level; the comparator provides a proper output state. Either or both inputs can go to 30 V without damage. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS LM293A LM393A TA MIN VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) IIO Input offset current VO = 1.4 14V IIB Input bias current VO = 1.4 14V VICR Common mode input voltage Common-mode range 25C IOH High level output current High-level VOL IOL Full range -25 Full range Full range VCC = 15 V, VO = 1.4 V to 11.4 V, RL 15 k to VCC 25C VOH = 5 V, VID = 1 V 25C VOH = 30 V, VID = 1 V Full range Low level output voltage Low-level IOL = 4 mA, mA 1V VID = -1 Low-level output current VOL = 1.5 V, VID = -1 V 25C VCC = 5 V 25C VCC = 30 V Full range Supply current RL = nA -250 -400 0 to VCC - 1.5 nA V 0 to VCC - 2 50 mV 50 150 200 0.1 25C ICC 2 5 25C Large-signal differential-voltage amplification 1 4 25C AVD MAX Full range 25C UNIT TYP 150 V/mV 50 nA 1 A 400 700 Full range 6 mV mA 0.8 1 2.5 mA Full range (MIN or MAX) for LM293A is 25C to 85C, and for LM393A is 0C to 70C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ - 1.5 V, but either or both inputs can go to 30 V without damage. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 LM193, LM293, LM293A LM393, LM393A, LM2903, LM2903V DUAL DIFFERENTIAL COMPARATORS SLCS005W - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TA TEST CONDITIONS VCC = 5 V to MAX, VO = 1.4 1 4 V, V VIC = VIC(min) VIO Input offset voltage IIO Input offset current VO = 1.4 14V IIB Input bias current VO = 1.4 14V VICR Common mode Common-mode input voltage range LM2903 MIN 25C LM2903A TYP MAX 2 7 MIN TYP MAX 1 2 UNIT mV Full range 15 25C 5 Full range 25C 5 -25 -250 -25 -500 0 to VCC - 1.5 Full range 0 to VCC - 2 0 to VCC - 2 VCC = 15 V, VO = 1.4 V to 11.4 V, RL 15 k to VCC 25C High-level High level output current VOH = 5 V, 25C IOH VOL Low level Low-level output voltage IOL = 4 mA, mA VID = -1 1V IOL Low-level output current VOL = 1.5 V, VID = -1 V ICC Supply current RL = VID = 1 V 25 100 0.1 50 150 400 Full range VCC = 5 V 100 V/mV 0.1 50 nA 1 A 150 400 700 Full range 6 25C Full range 700 6 0.8 1 nA V 1 25C 25C 25 nA -250 -500 0 to VCC - 1.5 Large-signal differential-voltage amplification 50 200 25C AVD VCC = MAX 50 200 Full range VOH = VCC MAX, VID = 1 V 4 mV mA 0.8 2.5 1 2.5 mA Full range (MIN or MAX) for LM2903 is -40C to 125C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. V CC MAX = 30 V for non-V devices and 32 V for V-suffix devices. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ - 1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage. switching characteristics, VCC = 5 V, TA = 25C PARAMETER TEST CONDITIONS LM193 LM293, LM293A LM393, LM393A LM2903 UNIT TYP Response time RL connected to 5 V through 5.1 k, CL = 15 pF, See Note 8 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 C includes probe and jig capacitance. L NOTE 8: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 s PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) 5962-9452601Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 59629452601Q2A LM193FKB 5962-9452601QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI -55 to 125 9452601QPA LM193 JM38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510 /11202BPA LM193DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM193DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM193FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629452601Q2A LM193FKB LM193JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM193JG LM193JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9452601QPA LM193 LM2903AVQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM2903DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU) LM2903DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU CU SN Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P LM2903PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P LM2903PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 LM2903PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q LM2903QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q LM2903QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q LM2903QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q LM2903QP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 125 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM2903VQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM293AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU) LM293ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU) LM293ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU) LM293DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU) LM293DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM293DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 LM293 LM293DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM293P LM293PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM293P LM393AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U) LM393ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U) LM393ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP LM393APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP LM393APSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM393APWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70 LM393APWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U) LM393DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U) LM393DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM393 LM393DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM393P LM393PE3 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 LM393P LM393PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM393P LM393PSLE OBSOLETE SO PS 8 TBD Call TI Call TI 0 to 70 LM393PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM393PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70 LM393PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393 M38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510 /11202BPA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM 11-Apr-2013 www.ti.com (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2903, LM293 : * Automotive: LM2903-Q1 * Enhanced Product: LM293-EP NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2903QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM193DR SOIC D 8 2500 367.0 367.0 35.0 LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2903DR SOIC D 8 2500 367.0 367.0 35.0 LM2903DR SOIC D 8 2500 340.5 338.1 20.6 LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2903PSR SO PS 8 2000 367.0 367.0 38.0 LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2903QDR SOIC D 8 2500 367.0 367.0 35.0 LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM293ADR SOIC D 8 2500 340.5 338.1 20.6 LM293ADR SOIC D 8 2500 367.0 367.0 35.0 LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM293DR SOIC D 8 2500 340.5 338.1 20.6 LM293DR SOIC D 8 2500 367.0 367.0 35.0 LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM393ADR SOIC D 8 2500 340.5 338.1 20.6 LM393ADR SOIC D 8 2500 367.0 367.0 35.0 LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM393APSR SO PS 8 2000 367.0 367.0 38.0 LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM393DR SOIC D 8 2500 340.5 338.1 20.6 LM393DR SOIC D 8 2500 367.0 367.0 35.0 LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM393PSR SO PS 8 2000 367.0 367.0 38.0 LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 Pack Materials-Page 3 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM293DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM193DR SOIC D 8 2500 367.0 367.0 35.0 LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2903DR SOIC D 8 2500 340.5 338.1 20.6 LM2903DR SOIC D 8 2500 367.0 367.0 35.0 LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2903PSR SO PS 8 2000 367.0 367.0 38.0 LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM2903PWR TSSOP PW 8 2000 367.0 367.0 35.0 LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM293ADR SOIC D 8 2500 367.0 367.0 35.0 LM293ADR SOIC D 8 2500 340.5 338.1 20.6 LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM293DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM293DR SOIC D 8 2500 367.0 367.0 35.0 LM293DR SOIC D 8 2500 364.0 364.0 27.0 LM293DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM393ADR SOIC D 8 2500 367.0 367.0 35.0 LM393ADR SOIC D 8 2500 340.5 338.1 20.6 LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393APSR SO PS 8 2000 367.0 367.0 38.0 LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM393DR SOIC D 8 2500 340.5 338.1 20.6 LM393DR SOIC D 8 2500 367.0 367.0 35.0 LM393DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM393PSR SO PS 8 2000 367.0 367.0 38.0 LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 Pack Materials-Page 4 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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