SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 WIDE SUPPLY RANGE RS-485 TRANSCEIVER FEATURES * * * * * * * Operates With a 3-V to 5.5-V Supply Consumes Less Than 90 mW Quiescent Power Open-Circuit, Short Circuit, and Idle-Bus Failsafe Receiver 1/8th Unit-Load (up to 256 nodes on the bus) Bus-Pin ESD Protection Exceeds 16 kV HBM Driver Output Voltage Slew-Rate Limited for Optimum Signal Quality at 10 Mbps Electrically Compatible With ANSI TIA/EIA-485 Standard The driver differential outputs and receiver differential inputs connect internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus whenever the driver is disabled or not powered. The drivers and receivers have active-high and active-low enables respectively, which can be externally connected together to function as a direction control. D or P PACKAGE (TOP VIEW) R RE DE D 1 8 2 7 3 6 4 5 VCC B A GND APPLICATIONS * * * * * Data Transmission With Remote Stations Powered From the Host Isolated Multipoint Data Buses Industrial Process Control Networks Point-of-Sale Networks Electric Utility Metering DESCRIPTION LOGIC DIAGRAM (Positive Logic) A D B DE RE R The SN65HVD08 combines a 3-state differential line driver and differential line receiver designed for balanced data transmission and interoperation with ANSI TIA/EIA-485-A and ISO-8482E standard-compliant devices. The wide supply voltage range and low quiescent current requirements allow the SN65HVD08s to operate from a 5-V power bus in the cable with as much as a 2-V line voltage drop. Busing power in the cable can alleviate the need for isolated power to be generated at each connection of a ground-isolated bus. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2002-2006, Texas Instruments Incorporated SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 Remote (One of n Shown) Host 5 V Power Isolation Barrier Direct Connection to Host SN65HVD08 5 V Return Power Bus and Return Resistance These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION SPECIFIED TEMPERATURE RANGE PACKAGE SN65HVD08D -40C to 85C SOIC VP08 SN65HVD08P -40C to 85C PDIP 65HVD08 SN75HVD08D 0C to 70C SOIC VN08 SN75HVD08P 0C to 70C PDIP 75HVD08 PART NUMBER PACKAGE MARKING PACKAGE DISSIPATION RATINGS TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 85C POWER RATING SOIC (D) 710 mW 5.7 mW/C 369 mW PDIP (P) 1000 mW 8 mW/C 520 mW PACKAGE ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) (2) UNIT Supply voltage, VCC -0.3 V to 6 V Voltage range at A or B -9 V to 14 V Input voltage range at D, DE, R or RE -0.5 V to VCC + 0.5 V Voltage input range, transient pulse, A and B, through 100 -25 V to 25 V Receiver ouput current, IO Electrostatic discharge -11 mA to 11 mA Human Body Model (3) Charged-Device Model (4) A, B, and GND 16 kV All pins 4 kV All pins Continuous total power dissipation (1) (2) (3) (4) 2 1 kV See Dissipation Rating Table Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-A. Tested in accordance with JEDEC Standard 22, Test Method C101. Submit Documentation Feedback SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 RECOMMENDED OPERATING CONDITIONS MIN Supply voltage, VCC Low-level input voltage, VIL Driver, driver enable, and receiver enable inputs Low-level output current, IOL Operating free-air temperature, TA (1) UNIT 3 5.5 V 12 V 2.25 VCC 0 0.8 -12 12 Differential input voltage, VID High-level output current, IOH MAX -7 Input voltage at any bus terminal (separately or common mode), VI (1) High-level input voltage, VIH NOM Driver -60 Receiver V mA -8 Driver 60 Receiver 8 SN75HVD08 0 70 SN65HVD08 -40 85 mA C The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet. ELECTRICAL CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER TEST CONDITIONS |VOD| Driver differential output voltage magnitude RL= 60 , 375 on each output to -7 V to 12 V, See Figure 1 |VOD| Change in magnitude of driver differential output voltage RL= 54 VOC(PP) Peak-to-peak driver common-mode output voltage Center of two 27- load resistors, See Figure 2 VIT+ Positive-going receiver differential input voltage threshold VIT- Negative-going receiver differential input voltage threshold Vhys Receiver differential input voltage threshold hysteresis(VIT+ - VIT-) VOH Receiver high-level output voltage IOH = -8 mA VOL Receiver low-level output voltage IOL = 8 mA IIH Driver input, driver enable, and receiver enable high-level input current IIL Driver input, driver enable, and receiver enable low-level input current IOS Driver short-circuit output current MIN MAX UNIT 1.5 VCC V -0.2 0.2 V 0.5 Bus input current (disabled driver) -200 7 V < VO < 12 V VI = -7 V Supply current mV 2.4 V 0.4 V -100 100 A -100 100 A -265 265 mA 130 -100 VI = 12 V, VCC = 0 V 130 10 Driver enabled, receiver disabled, no load 16 Both enabled, no load Submit Documentation Feedback A -100 Receiver enabled, driver disabled, no load Both disabled mV mV 35 VI = -7 V. VCC = 0 V ICC V -10 VI = 12 V II TYP mA 5 A 16 mA 3 SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX tPHL Driver high-to-low propagation delay time 18 40 tPLH Driver low-to-high propagation delay time 18 40 tr Driver 10%-to-90% differential output rise time 10 55 tf Driver 90%-to-10% differential output fall time 10 55 tSK(P) Driver differential output pulse skew, |tPHL - tPLH| ten Driver enable time tdis Driver disable time RL = 54 , CL = 50 pF,See Figure 3 UNIT ns 2.5 Receiver enabled, See Figures 4 and 5 55 ns Receiver disabled, See Figures 4 and 5 6 s Receiver enabled, See Figures 4 and 5 90 ns RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX tPHL Receiver high-to-low propagation delay time 70 tPLH Receiver low-to-high propagation delay time 70 tr Receiver 10%-to-90% differential output rise time tf Receiver 90%-to-10% differential output fall time tSK(P) Receiver differential output pulse skew, |tPHL - tPLH| ten Receiver enable time tdis Receiver disable time CL = 15 pF, See Figure 6 5 UNIT ns 5 4.5 Driver enabled, See Figure 7 15 ns Driver disabled, See Figure 8 6 s Driver enabled, See Figure 7 20 ns PARAMETER MEASUREMENT INFORMATION 375 1% VCC DE D A VOD 0 or 3 V 60 1% + _ B -7 V < V(test) < 12 V 375 1% Figure 1. Driver VOD With Common-Mode Loading Test Circuit VCC DE Input D 27 1% A VA B VB VOC(PP) 27 1% B A CL = 50 pF 20% VOC VOC CL Includes Fixture and Instrumentation Capacitance Input: PRR = 500 kHz, 50% Duty Cycle,tr<6ns, tf<6ns, ZO = 50 Figure 2. Test Circuit and Definitions for the Driver Common-Mode Output Voltage 4 Submit Documentation Feedback VOC(SS) SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) 3V VCC DE D Input Generator VI VOD tPLH CL Includes Fixture and Instrumentation Capacitance RL = 54 1% B 50 1.5 V VI CL = 50 pF 20% A 1.5 V tPHL 90% VOD 2V 90% 0V 10% 0V 10% -2 V tr tf Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Figure 3. Driver Switching Test Circuit and Voltage Waveforms A 3V D 3V S1 VO VI 1.5 V 1.5 V B DE Input Generator VI 50 RL = 110 1% CL = 50 pF 20% CL Includes Fixture and Instrumentation Capacitance 0V 0.5 V tPZH VOH VO 2.3 V 0V tPHZ Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Figure 4. Driver High-Level Enable and Disable Time Test Circuit and Voltage Waveforms 3V A 3V D VI 3V 1.5 V VI S1 1.5 V VO DE Input Generator RL = 110 1% 50 0V B tPZL tPLZ 3V CL = 50 pF 20% CL Includes Fixture and Instrumentation Capacitance 0.5 V VO 2.3 V VOL Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Figure 5. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms Submit Documentation Feedback 5 SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) A R Input Generator 50 VI VO B 1.5 V CL = 15 pF 20% RE 0V CL Includes Fixture and Instrumentation Capacitance Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 3V 1.5 V VI 1.5 V 0V tPLH tPHL VOH 90% 90% VO 1.5 V 10% 1.5 V 10% V OL tr tf Figure 6. Receiver Switching Test Circuit and Voltage Waveforms 3V VCC A DE 0 V or 3 V R D B RE Input Generator VI A 1 k 1% VO S1 CL = 15 pF 20% B CL Includes Fixture and Instrumentation Capacitance 50 Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 3V VI 1.5 V 1.5 V 0V tPZH tPHZ VOH -0.5 V VOH D at 3 V S1 to B 1.5 V VO 0V tPZL tPLZ VCC VO 1.5 V VOL +0.5 V D at 0 V S1 to A VOL Figure 7. Receiver Enable and Disable Time Test Circuit and Voltage Waveforms With Drivers Enabled 6 Submit Documentation Feedback SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) VCC A 0 V or 1.5 V R B 1.5 V or 0 V VI S1 CL = 15 pF 20% RE Input Generator A 1 k 1% VO B CL Includes Fixture and Instrumentation Capacitance 50 Generator: PRR = 100 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 3V VI 1.5 V 0V tPZH VOH A at 1.5 V B at 0 V S1 to B 1.5 V VO GND tPZL VCC VO 1.5 V A at 0 V B at 1.5 V S1 to A VOL Figure 8. Receiver Enable Time From Standby (Driver Disabled) DEVICE INFORMATION Function Tables DRIVER INPUT ENABLE OUTPUTS D DE A H L X Open H H L H H L Z H B L H Z L RECEIVER (1) DIFFERENTIAL INPUTS ENABLE (1) OUTPUT (1) VID = VA - VB RE R VID -0.2 V -0.2 V < VID < -0.01 V -0.01 V VID X Open Circuit Short Circuit L L L H L L L ? H Z H H H = high level; L = low level; Z = high impedance; X = irrelevant; ? = indeterminate Submit Documentation Feedback 7 SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS D and RE Inputs DE Input VCC VCC 100 k 1 k 1 k Input Input 100 k 9V 9V A Input B Input VCC VCC 16 V 100 k 16 V 36 k 180 k 180 k Input Input 16 V 36 k 36 k 100 k 16 V A and B Outputs 36 k R Output VCC VCC 16 V 5 Output Output 9V 16 V 8 Submit Documentation Feedback SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 TYPICAL CHARACTERISTICS DIFFERENTIAL OUTPUT VOLTAGE vs SUPPLY VOLTAGE DRIVER OUTPUT CURRENT vs SUPPLY VOLTAGE 4 70 D and DE at VCC RL = 54 60 I O - Driver Output Current - mA 3.5 Differential Output Voltage - V TA = 25C DE at VCC D at VCC RL = 54 TA = -40C TA = 25C 3 TA = 85C 2.5 2 1.5 50 40 30 20 10 1 2.5 3 3.5 4 4.5 5 VCC - Supply Voltage - V 5.5 0 6 0 Figure 9. Logic Input Threshold Voltage - V I CC - RMS Supply Current - mA TA = 25C D, DE or RE input 80 60 40 2.5 5 5.4 2.5 100 0 4.8 LOGIC INPUT THRESHOLD VOLTAGE vs SUPPLY VOLTAGE RL = 54 CL = 50 pF VCC = 5 V TA = 25C RE at VCC DE at VCC 1.2 1.8 2.4 3 3.6 4.2 VCC - Supply Voltage - V Figure 10. RMS SUPPLY CURRENT vs SIGNALING RATE 120 0.6 7.5 10 2 Positive Going 1.5 Negative Going 1 0.5 0 2.5 Signaling Rate - Mbps Figure 11. 3.5 4.5 5.5 VCC - Supply Voltage - V 6.5 Figure 12. Submit Documentation Feedback 9 SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 TYPICAL CHARACTERISTICS (continued) ENABLE TIME vs COMMON-MODE VOLTAGE (SEE Figure 14) 500 450 400 Enable Time - ns 350 3.3 V 300 250 5V 200 150 100 50 0 -7 -2 3 8 13 V(TEST) - Common-Mode Voltage - V Figure 13. 375 W 1% Y D 0 or 3 V -7 V < V(TEST) < 12 V VOD 60 W 1% Z DE 375 W 1% Input Generator V 50 W 50% tpZH(diff) VOD (high) 1.5 V 0V tpZL(diff) -1.5 V VOD (low) Figure 14. Driver Enable Time From DE to VOD The time tpZL(x) is the measure from DE to VOD(x). VOD is valid when it is greater than 1.5 V. 10 Submit Documentation Feedback SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 APPLICATION INFORMATION As electrical loads are physically distanced from their power source, the effects of supply and return line impedance and the resultant voltage drop must be accounted. If the supply regulation at the load cannot be maintained to the circuit requirements, it forces the use of remote sensing, additional regulation at the load, bigger or shorter cables, or a combination of these. The SN65HVD08 eases this problem by relaxing the supply requirements to allow for more variation in the supply voltage over typical RS-485 transceivers. SUPPLY SOURCE IMPEDANCE In the steady state, the voltage drop from the source to the load is simply the wire resistance times the load current as modeled in Figure 15. RS IL + + RL VL = VS - 2RSIL VS - RS - Figure 15. Steady-State Circuit Model For example, if you were to provide 5-V 5% supply power to a remote circuit with a maximum load requirement of 0.1 A (one SN65HVD08), the voltage at the load would fall below the 4.5-V minimum of most 5-V circuits with as little as 5.8 m of 28-GA conductors. Table 1 summarizes wire resistance and the length for 4.5 V and 3 V at the load with 0.1 A of load current. The maximum lengths would scale linearly for higher or lower load currents. not be ignored and decoupling capacitance at the load is required. The amount depends upon the magnitude and frequency of the load current change but, if only powering the SN65HVD08, a 0.1 F ceramic capacitor is usually sufficient. OPTO-ISOLATED DATA BUSES Long RS-485 circuits can create large ground loops and pick up common-mode noise voltages in excess of the range tolerated by standard RS-485 circuits. A common remedy is to provide galvanic isolation of the data circuit from earth or local grounds. Transformers, capacitors, or phototransistors most often provide isolation of the bus and the local node. Transformers and capacitors require changing signals to transfer the information over the isolation barrier and phototransistors (opto-isolators) can pass steady-state signals. Each of these methods incurs additional costs and complexity, the former in clock encoding and decoding of the data stream and the latter in requiring an isolated power supply. Quite often, the cost of isolated power is repeated at each node connected to the bus as shown in Figure 16. The possibly lower-cost solution is to generate this supply once within the system and then distribute it along with the data line(s) as shown in Figure 17. DC-to-DC Converter Opto Isolators Local Power Source Rest of Board Table 1. Maximum Cable Lengths for Minimum Load Voltages at 0.1 A Load WIRE SIZE RESISTANCE 4.5 V LENGTH AT 0.1 A 3-v LENGTH AT 0.1 A 28 Gage 0.213 /m 5.8 m 41.1 m 24 Gage 0.079 /m 15.8 m 110.7 m 22 Gage 0.054 /m 23.1 m 162.0 m 20 Gage 0.034 /m 36.8 m 257.3 m 18 Gage 0.021 /m 59.5 m 416.7 m Under dynamic load requirements, the distributed inductance and capacitance of the power lines may DC-to-DC Converter Opto Isolators Local Power Source Rest of Board Figure 16. Isolated Power at Each Node Submit Documentation Feedback 11 SN75HVD08, SN65HVD08 www.ti.com SLLS550C - NOVEMBER 2002 - REVISED JULY 2006 The features of the SN65HVD08 are particularly good for the application of Figure 17. Due to added supply source impedance, the low quiescent current requirements and wide supply voltage tolerance allow for the poorer load regulation. Local Power Source Opto Isolators Rest of Board AN OPTO ALTERNATIVE The ISO150 is a two-channel, galvanically isolated data coupler capable of data rates of 80 Mbps. Each channel can be individually programmed to transmit data in either direction. SN65HVD08 Data is transmitted across the isolation barrier by coupling complementary pulses through high-voltage 0.4-pF capacitors. Receiver circuitry restores the pulses to standard logic levels. Differential signal transmission rejects isolation-mode voltage transients up to 1.6 kV/ms. Local Power Source Opto Isolators Rest of Board ISO150 avoids the problems commonly associated with opto-couplers. Optically-isolated couplers require high current pulses and allowance must be made for LED aging. The ISO150's Bi-CMOS circuitry operates at 25 mW per channel with supply voltage range matching that of the SN65HVD08 of 3 V to 5.5 V. Figure 17. Distribution of Isolated Power Figure 18 shows a typical circuit. -5 V +5 V Data (I/O) SN65HVD08 D D2A R/T2A GA ISO150 VSB R/T2B D2B DE Channel 1 RE R Side A Side B Channel 2 D1A R/T1A VSA GA R/T1B D1B DE/RE +5 V "1" +5 V Figure 18. Isolated RS-485 Interface 12 Submit Documentation Feedback A B Bus PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65HVD08D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65HVD08DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65HVD08DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65HVD08DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65HVD08P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN65HVD08PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75HVD08D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75HVD08DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75HVD08DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75HVD08DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75HVD08P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75HVD08PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2007 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65HVD08DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN75HVD08DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65HVD08DR SOIC D 8 2500 340.5 338.1 20.6 SN75HVD08DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated