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74ALVCH162244
16-bit buffer/line driver
with 30Ω termination resistor (3-State)
Product specification 1998 Jun 29
INTEGRATED CIRCUITS
IC24 Data Handbook
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
2
1998 Jun 29 853-2084 19638
FEATURES
•Wide supply voltage range of 1.2V to 3.6V
•Complies with JEDEC standard no. 8-1A
•CMOS low power consumption
•MULTIBYTETM flow-through standard pin-out architecture
•Low inductance multiple VCC and ground pins for minimum noise
and ground bounce
•Direct interface with TTL levels
•Bus hold on all data inputs
•Integrated 30Ω termination resistor
DESCRIPTION
The 74ALVCH162244 is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most advanced
CMOS compatible TTL families.
The 74ALVCH162244 is a 16-bit non-inverting buffer/line driver with
3-State outputs. The device can be used as four 4-bit buffers, two
8-bit buffers or one 16-bit buffer. The 3-State outputs are controlled
by the output enable inputs 1OE and 2OE. A HIGH on nOE causes
the outputs to assume a high impedance OFF-state. The
74ALVCH162244 is designed with 30Ω series resistors in both HIGH
and LOW output states.
The 74ALVCH162244 has active bus hold circuitry which is provided
to hold unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or pull-down
resistors.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20 29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
1OE
1Y0
1Y1
GND
1Y2
1Y3
VCC
2Y1
GND
2Y2
2Y3
3Y0
3Y1
GND
2Y0
3Y2
3Y3
VCC
4Y0
4Y1 4A1
4A0
VCC
3A3
3A2
GND
3A1
3A0
2A3
2A2
GND
2A1
2A0
VCC
1A3
1A2
GND
1A1
1A0
2OE
21
22
23
24 25
26
27
28
GND
4Y2
4Y3
4OE 3OE
4A3
4A2
GND
SW00194
QUICK REFERENCE DATA
GND = 0 V ; Tamb = 25°C; tr = tf ≤ 2.5 ns
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH Propagation delay
An to Yn VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF 3.0
2.7 ns
CIInput capacitance 5.0 pF
C
Power dissi
p
ation ca
p
acitance
p
er buffer
V = GND to VCC1
Outputs enabled 25 p
F
C
PD
Po
w
er
dissipation
capacitance
per
b
u
ffer
V
I =
GND
to
V
CC
1
Outputs disabled 4
pF
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V ; (CL × VCC2 × fo) = sum of the outputs.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
48-Pin Plastic SSOP Type III –40°C to +85°C74ALVCH162244 DL ACH162244 DL SOT370-1
48-Pin Plastic TSSOP Type II –40°C to +85°C74ALVCH162244 DGG ACH162244 DGG SOT362-1
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
1998 Jun 29 3
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
1 1OE Output enable input
(active LOW)
2, 3, 5, 6 1Y0 to 1Y3 Data outputs
4, 10, 15, 21,
28, 34, 39, 45 GND Ground (0V)
7, 18, 31, 42 VCC Positive supply voltage
8, 9, 11, 12 2Y0 to 2Y3
13, 14, 16, 17 3Y0 to 3Y3 Data outputs
19, 20, 22, 23 4Y0 to 4Y3
24 4OE Output enable input
(active LOW)
25 3OE Output enable input
(active LOW)
30, 29, 27, 26 4A0 to 4A3
36, 35, 33, 32 3A0 to 3A3
Data in
p
uts
41, 40, 38, 37 2A0 to 2A3
Data
inp
u
ts
47, 46, 44, 43 1A0 to 1A3
48 2OE Output enable input
(active LOW)
LOGIC SYMBOL
47
46
44
43
1
2
3
5
6
1A0
1A1
1A2
1A3
1OE
1Y0
1Y1
1Y2
1Y3
36
35
33
32
25
13
14
16
17
3A0
3A1
3A2
3A3
3OE
3Y0
3Y1
3Y2
3Y3
41
40
38
37
48
8
9
11
12
2A0
2A1
2A2
2A3
2OE
2Y0
2Y1
2Y2
2Y3
30
29
27
26
24
19
20
22
23
4A0
4A1
4A2
4A3
4OE
4Y0
4Y1
4Y2
4Y3
SW00195
FUNCTION TABLE
INPUTS OUTPUT
nOE nAn nYn
L L L
L H H
H X Z
H = HIGH voltage level
L = LOW voltage level
X = don’t care
Z = high impedance OFF-state
LOGIC SYMBOL (IEEE/IEC)
SW00060
48 EN1
1 ∇
46
44
43
41
40
38
37
36
EN2
EN3
EN4
2 ∇
3 ∇
4 ∇
1
25
24
47
35
33
32
30
29
27
26
3
2
5
6
8
9
11
12
13
14
16
17
19
20
22
23
1OE
2OE
3OE
4OE
1A0
1A1
1A2
1A3
2A0
2A1
2A2
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y3
2A3
4Y1
4Y2
1
1
1
1
BUS HOLD CIRCUIT
To internal circuit
VCC
Data Input
SW00044
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
1998 Jun 29 4
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITIONS
MIN MAX
UNIT
VCC
DC supply voltage 2.5V range (for max. speed
performance @ 30 pF output load) 2.3 2.7
V
V
CC DC supply voltage 3.3V range (for max. speed
performance @ 50 pF output load) 3.0 3.6
V
VIDC Input voltage range 0 VCC V
VODC output voltage range 0 VCC V
Tamb Operating free-air temperature range –40 +85 °C
tr, tfInput rise and fall times VCC = 2.3 to 3.0V
VCC = 3.0 to 3.6V 0
020
10 ns/V
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +4.6 V
IIK DC input diode current VI 0 –50 mA
VI
DC in
p
ut voltage
For data inputs with bus hold1–0.5 to VCC +0.5
V
V
I
DC
in ut
voltage
For control pins1–0.5 to +4.6
V
IOK DC output diode current VO VCC or VO 0 50 mA
VODC output voltage Note 1 –0.5 to VCC +0.5 V
IODC output source or sink current VO = 0 to VCC 50 mA
IGND, ICC DC VCC or GND current 100 mA
Tstg Storage temperature range –65 to +150 °C
PTOT Power dissipation per package
–plastic medium-shrink (SSOP)
–plastic thin-medium-shrink (TSSOP)
For temperature range: –40 to +125 °C
above +55°C derate linearly with 11.3 mW/K
above +55°C derate linearly with 8 mW/K 850
600 mW
NOTE:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
1998 Jun 29 5
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V).
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C UNIT
MIN TYP1MAX
V
HIGH level In
p
ut voltage
VCC = 2.3 to 2.7V 1.7 1.2
V
V
IH
HIGH
le
v
el
Inp
u
t
v
oltage
VCC = 2.7 to 3.6V 2.0 1.5
V
V
LOW level In
p
ut voltage
VCC = 2.3 to 2.7V 1.2 0.7
V
V
IL
LOW
le
v
el
Inp
u
t
v
oltage
VCC = 2.7 to 3.6V 1.5 0.8
V
VCC =23to36V
;
V=V or V
;
IO= 100µA
VCC 02
VCC
V
CC =
2
.
3
to
3
.
6V
;
V
I =
V
IH
or
V
IL;
I
O = –
100
µ
A
V
CC
0
.
2
V
CC
VCC = 2.3V ; V I = VIH or VIL; IO = –4mA VCC0.4 VCC0.11
VCC = 2.3V ; V I = VIH or VIL; IO = –6mA VCC0.6 VCC0.17
VOH HIGH level output voltage VCC = 2.7V ; V I = VIH or VIL; IO = –4mA VCC0.5 VCC0.09 V
VCC = 2.7V ; V I = VIH or VIL; IO = –8mA VCC0.7 VCC0.19
VCC = 3.0V ; V I = VIH or VIL; IO = –6mA VCC0.6 VCC0.13
VCC = 3.0V ; V I = VIH or VIL; IO = –12mA VCC1.0 VCC0.27
V=23to36V
;
V=V or V
;
I = 100µA
GND
020
V
CC =
2
.
3
to
3
.
6V
;
V
I =
V
IH
or
V
IL;
I
O =
100
µ
A
GND
0
.
20
VCC = 2.3V ; V I = VIH or VIL; IO = 4mA 0.07 0.40
VCC = 2.3V ; V I = VIH or VIL; IO = 6mA 0.11 0.55
VOL LOW level output voltage VCC = 2.7V ; V I = VIH or VIL; IO = 4mA 0.06 0.40 V
VCC = 2.7V ; V I = VIH or VIL; IO = 8mA 0.13 0.60
VCC = 3.0V ; V I = VIH or VIL; IO = 6mA 0.09 0.55
VCC = 3.0V ; V I = VIH or VIL; IO = 12mA 0.19 0.80
VCC =23to36V
;
IIInput leaka
g
e current
V
CC =
2
.
3
to
3
.
6V
;
V V or GND
0.1 5
µ
A
I
g
V
I =
V
CC or
GND
µ
IOZ 3-State output OFF-state current VCC = 2.3 to 3.6V; VI = VIH or VIL;
VO = VCC or GND 0.1 10 µA
ICC Quiescent supply current VCC = 2.3 to 3.6V ; VI = VCC or GND; IO = 0 0.2 40 µA
∆ICC Additional quiescent supply current VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0 150 750 µA
I2
Bus hold LOW sustaining current
VCC = 2.3V ; V I = 0.7V 45 –
µA
I
BHL
2
B
u
s
hold
LOW
s
u
staining
c
u
rrent
VCC = 3.0V ; V I = 0.8V 75 150 µ
A
I2
Bus hold HIGH sustaining current
VCC = 2.3V ; V I = 1.7V –45
µA
I
BHH
2
B
u
s
hold
HIGH
s
u
staining
c
u
rrent
VCC = 3.0V ; V I = 2.0V –75 –175 µ
A
IBHLO2Bus hold LOW overdrive current VCC = 3.6V 500 µA
IBHHO2Bus hold HIGH overdrive current VCC = 3.6V –500 µA
NOTES:
1. All typical values are at Tamb = 25°C.
2. Valid for data inputs of bus hold parts.
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
1998 Jun 29 6
AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE AND VCC < 2.3V
GND = 0V ; tr = tf ≤ 2.0ns; C L = 30pF LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 2.3 to 2.7V UNIT
MIN TYP1MAX
tPHL/tPLH Propagation delay
nAn to nYn 1, 3 1.0 3.0 4.9 ns
tPZH/tPZL 3-State output enable time
nOE to nYn 2, 3 1.0 4.0 6.8 ns
tPHZ/tPLZ 3-State output disable time
nOE to nYn 2, 3 1.0 2.3 6.3 ns
NOTES:
1. All typical values are measured at Tamb = 25°C and VCC = 2.5V.
AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V
GND = 0V ; tr = tf ≤ 2.5ns; C L = 50pF LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3 ± 0.3V VCC = 2.7V UNIT
MIN TYP1, 2MAX MIN TYP1MAX
tPHL/tPLH Propagation delay
nAn to nYn 1, 3 1.0 2.7 4.2 1.0 3.3 4.7 ns
tPZH/tPZL 3-State output enable time
nOE to nYn 2, 3 1.0 3.5 5.6 1.0 4.6 6.7 ns
tPHZ/tPLZ 3-State output disable time
nOE to nYn 2, 3 1.0 2.9 5.5 1.0 3.2 5.7 ns
NOTES:
1. All typical values are measured at Tamb = 25°C.
2. Typical value is measured at VCC = 3.3V
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30 termination resistor
(3-State)
1998 Jun 29 7
AC WAVEFORMS FOR VCC = 2.3V TO 2.7V AND
VCC < 2.3V RANGE
VM = 0.5 VCC
VX = VOL + 0.15V
VY = VOH –0.15V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VI = VCC
AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND
VCC = 2.7V RANGE
VM = 1.5 V
VX = VOL + 0.3V
VY = VOH –0.3V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VI = 2.7V
SW00057
An INPUT VM
tPHL tPLH
VOL
VI
VM
GND
VOH
Yn OUTPUT
W aveform 1. Input (An) to output (Yn) propagation delay times
tPLZ tPZL
VI
nOE INPUT
GND
VCC
OUTPUT
LOW-to-OFF
OFF-to-LOW
VOL
VOH
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
GND outputs
enabled outputs
enabled
outputs
disabled
tPHZ
VM
VM
VM
tPZH
VX
VY
SW00058
W aveform 2. 3-State enable and disable times
TEST CIRCUIT
SWITCH POSITION
PULSE
GENERATOR
RT
VID.U.T.
VO
CL
VCC
RL = 500 Ω
Test Circuit for switching times
Open
GND
S1
DEFINITIONS
VCC VI
< 2.7V VCC
TEST S1
tPLH/tPHL Open
RL = Load resistor
CL = Load capacitance includes jig and probe capacitance
RT = Termination resistance should be equal to ZOUT of pulse generators.
2 VCC
tPLZ/tPZL 2.7V2.7–3.6V
tPHZ/tPZH GND
RL = 500 Ω
2 * VCC
SV00906
W aveform 3. Load circuitry for switching times
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30Ω termination resistor
(3-State)
1998 Jun 29 8
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30Ω termination resistor
(3-State)
1998 Jun 29 9
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30Ω termination resistor
(3-State)
1998 Jun 29 10
NOTES
Philips Semiconductors Product specification
74ALVCH162244
16-bit buffer/line driver with 30Ω termination resistor
(3-State)
yyyy mmm dd 11
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may af fect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Date of release: 06-98
Document order number: 9397-750-04537
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.
