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IN MI LLIMETER
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: SnPb 2.0 ~ 4.0µm over 2.5 ~ 4.5µm Ni = S5
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *54 - *5 1
Part Number (Details)
ICP-100-5
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 100 Pins (25x25) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
27.00
15.30 x 15.30
27.00
13.20
15.40
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
N1
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
S = SnPb (for IC-socket Use)
B = Gold (for Adapter Use)
0 = without Screws 1 = with Screws
Detail C
Detail A
N3
Notice
*
*
This socket is the same as IC149-100-*25-S5, except
it is higher to enable an easier soldering by hand
YAMAICHI ELECTRONICS - Munich 089 / 45109-0
SPECIFICATION S ARE SUBJECT TO ALTERATION WITHOUT PR IOR NOTICE – DIM ENSIONS IN MILLIMETER
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700V eff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection =min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: SnPb 2.0 ~ 4.0µm over 2.5 ~ 4.5µm Ni = S5
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *25 - *5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
S = SnPb (for IC-socket Use)
B = Gold (for Adapter Use)
ICP-100-5
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 100 Pins (25x25) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
26.00
15.24 x 15.24
26.00
11.00
13.20
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
14mm x 14mm
14.0
16.0
0.5
16.0
14.0
2.9
max.
15.0 • 15.0
0.15
0.2 0.5
N1
N3 Detail C
Detail C
10.0 ±0.05
YAMAICHI ELECTRONICS - Munich 089 / 45109-0
SPECIFICATION S ARE SUBJECT TO ALTERATION WITHOUT PR IOR NOTICE – DIM ENSIONS IN MILLIMETER
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700V eff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection =min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: SnPb 2.0 ~ 4.0µm over 2.5 ~ 4.5µm Ni = S5
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *28 - S5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
S5 = SnPb
32.00
21.20 x 21.20
32.00
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
11.15
12.75
IC149 Series (SMT) BQFP - 100 Pins (25x25) 0.635mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N3: These holes are only necessary for use with positioning pins.
not available
Compatible Emulation-Adapter
Detail C
N3
19.13mm x
19.13mm
Detail C
Coding
YAMAICHI ELECTRONICS - Munich 089 / 45109-0
SPECIFICATION S ARE SUBJECT TO ALTERATION WITHOUT PR IOR NOTICE – DIM ENSIONS IN MILLIMETER
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700V eff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection =min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: SnPb 2.0 ~ 4.0µm over 2.5 ~ 4.5µm Ni = S5
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *14 - *5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
S = SnPb (for IC-socket Use)
B = Gold (for Adapter Use)
ICP-100-4-4 (with 4 x M2.0 -12.0mm)
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 100 Pins (20x30) 0.65mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
32.20
22.40 x 16.40
26.60
8.50
10.10
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
23.2
14mm x 20mm
21.8 • 15.8
3.5
max.
17.2
14.0
20.0
0.15
0.3
N2
Coding
Detail E
0.65
N4
Detail E N3
Notes
N2:These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
YAMAICHI ELECTRONICS - Munich 089 / 45109-0
SPECIFICATION S ARE SUBJECT TO ALTERATION WITHOUT PR IOR NOTICE – DIM ENSIONS IN MILLIMETER
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700V eff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: SnPb 2.0 ~ 4.0µm over 2.5 ~ 4.5µm Ni = S5
Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
Extra Feature: Clipped Cover
IC149 - 100 - *05 - S5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
S = SnPb
IC149 Series (SMT) QFP/TQFP - 100 Pins (20x30) 0.65mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
30.15
23.00 x 17.00
23.65
8.60
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N2:These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
0.15
23.6 ~ 26.1
14mm x 20mm
22.9 • 17.0
17.6 ~ 20.1
14.0
0.65
20.0
2.5
0.3
N3
Detail E
N2
Detail E
N4
N1
Part Numbers (for Adapter-use)
IC149-100-KS11113-0 (w/o pos. pins)
IC149-100-KS11113-1 (with pos. pins)
ICP-100-4-1 (with 2 x M2.5 -12.0mm)
Compatible Emulation-Adapter
