ISL29003 Data Sheet November 17, 2011 Light-to-Digital Output Sensor with High Sensitivity, Gain Selection, Interrupt Function and I2C Interface The ISL29003 is an integrated light sensors with a 16-bit integrating type ADC, I2C user programmable lux range select for optimized counts/lux, and I2C multi-function control and monitoring capabilities. The internal ADC provides 16-bit resolution while rejecting 50Hz and 60Hz flicker caused by artificial light sources. FN7464.6 Features * Range select via I2C - Range 1 = 0 lux to 1000 lux - Range 2 = 0 lux to 4000 lux - Range 3 = 0 lux to 16,000 lux - Range 4 = 0 lux to 64,000 lux * Human eye response (540nm peak sensitivity) * Temperature compensated In normal operation, power consumption is less than 300A. Furthermore, an available software power-down mode controlled via the I2C interface reduces power consumption to less than 1A. * 16-bit resolution The ISL29003 supports a hardware interrupt that remains asserted low until the host clears it through I2C interface. * Simple output code, directly proportional to lux Designed to operate on supplies from 2.5V to 3.3V, the ISL29003 is specified for operation over the -40C to +85C ambient temperature range. * 50Hz/60Hz rejection Ordering Information PART NUMBER (Notes 1, 2, 3) PACKAGE (Pb-free) * Adjustable resolution: up to 65 counts per lux * User-programmable upper and lower threshold interrupt * IR + UV rejection * 2.5V to 3.3V supply * 6 Ld ODFN (2.1mmx2mm) * Pb-free (RoHS compliant) PKG. DWG. # ISL29003IROZ (Note 4) 6 Ld ODFN L6.2x2.1 ISL29003IROZ-T7 6 Ld ODFN L6.2x2.1 ISL29003IROZ-EVAL Evaluation Board Applications * Ambient light sensing * Backlight control NOTES: * Temperature control systems * Camera light meters * Lighting controls Block Diagram VDD 1 PHOTODIODE 1 MUX Pinout ISL29003 (6 LD ODFN) TOP VIEW GND 2 THERMAL PAD 4 INT REXT 3 1 DATA REGISTER I2C EXT TIMING IREF FOSC 5 SCL 6 SDA INT 216 COUNTER 5 SCL COMMAND REGISTER INTEGRATING ADC PHOTODIODE 2 6 SDA VDD 1 SHDN 4. Not recommended for new designs. INT TIME 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29003. For more information on MSL please see tech brief TB466. * Contrast control GAIN/RANGE 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. MODE 1. Please refer to TB347 for details on reel specifications. 3 2 REXT GND INTERRUPT 4 INT ISL29003 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2006-2008, 2011. All Rights Reserved I2C Bus is a registered trademark owned by NXP Semiconductors Netherlands, B.V Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL29003 Absolute Maximum Ratings (TA = +25C) Thermal Information VDD Supply Voltage between VDD and GND . . . . . . . . . . . . . 3.6V I2C Bus Pin Voltage (SCL, SDA) . . . . . . . . . . . . . . . . . -0.2V to 5.5V I2C Bus Pin Current (SCL, SDA) . . . . . . . . . . . . . . . . . . . . . . <10mA INT, REXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to VDD ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV Thermal Resistance (Typical, Note 5) JA (C/W) 6 Ld ODFN Package . . . . . . . . . . . . . . . . . . . . . . . . 88 Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +90C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-40C to +100C Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VDD = 3V, TA = +25C, REXT = 100k 1% tolerance, unless otherwise specified, Internal Timing Mode operation (See "Principles of Operation" on page 3). DESCRIPTION CONDITION MIN (Note 8) MAX (Note 8) UNIT 3.3 V 0.29 0.33 mA 0.1 1 A TYP VDD Power Supply Range 2.25 IDD Supply Current IDD1 Supply Current Disabled Software disabled fOSC1 Internal Oscillator Frequency Gain/Range = 1 or 2 290 327 360 kHz fOSC2 Internal Oscillator Frequency Gain/Range = 3 or 4 580 655 720 kHz FI2C I2C Clock Rate 400 kHz DATA0 Diode1 Dark ADC Code 5 Counts DATA1 Full Scale ADC Code 65535 Counts DATA2 Diode1 ADC Code Gain/Range = 1 Accuracy Mode1 24440 Counts DATA3 Diode2 ADC Code Gain/Range = 1 Accuracy Mode2 DATA4 Diode1 ADC Code Gain/Range = 2 Accuracy Mode1 DATA5 Diode2 ADC Code Gain/Range = 2 Accuracy Mode2 DATA6 Diode1 ADC Code Gain/Range = 3 Accuracy Mode1 DATA5 Diode2 ADC Code Gain/Range = 3 Accuracy Mode2 DATA6 Diode1 ADC Code Gain/Range = 4 Accuracy Mode1 DATA6 Diode2 ADC Code Gain/Range = 4 Accuracy Mode2 VREF Voltage of REXT Pin VTL SCL and SDA Threshold LO (Note 7) 1.05 V VTH SCL and SDA Threshold HI (Note 7) 1.95 V ISDA SDA Current Sinking Capability 3 5 mA IINT INT Current Sinking Capability 3 5 mA 1 E = 0 lux, Mode1, Gain/Range = 1 E = 300 lux, fluorescent light, Gain/Range = 1 (Note 6) 15760 20200 2020 Counts E = 300 lux, fluorescent light, Gain/Range = 2 (Note 6) 5050 Counts 505 Counts E = 300 lux, fluorescent light, Gain/Range = 3 (Note 6) 1262 Counts 126 Counts E = 300 lux, fluorescent light, Gain/Range = 4 (Note 6) 316 Counts 32 Counts 0.485 0.51 0.535 V NOTES: 6. Fluorescent light is substituted by a green ( = 540nm) LED during production. 7. The voltage threshold levels of the SDA and SCL pins are VDD dependent: VTL = 0.35*VDD. VTH = 0.65*VDD 8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 2 FN7464.6 November 17, 2011 ISL29003 Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 1 VDD Positive supply; connect this pin to a regulated 2.5V to 3.3V supply 2 GND Ground pin. The thermal pad is connected to the GND pin 3 REXT External resistor pin for ADC reference; connect this pin to ground through a (nominal) 100k resistor 4 INT Interrupt pin; LO for interrupt/alarming. The INT pin is an open drain. 5 SCL I2C serial clock 6 SDA I2C serial data Principles of Operation Photodiodes The ISL29003 contains two photodiodes. Diode1 is sensitive to both visible and infrared light, while Diode2 is mostly sensitive to infrared light. The spectral response of the two diodes are independent from one another. See Figure 7 Spectral Response vs Wavelength in the performance curves section. The photodiodes convert light to current. Then, the diodes' current outputs are converted to digital by a single built-in integrating type 16-bit Analog-to-Digital Converter (ADC). An I2C command mode determines which photodiode will be converted to a digital signal. Mode1 is Diode1 only. Mode2 is Diode2 only. Mode3 is a sequential Mode1 and Mode2 with an internal subtract function (Diode1 - Diode2). Analog-to-Digital Converter (ADC) The converter is a charge-balancing integrating type 16-bit ADC. The chosen method for conversion is best for converting small current signals in the presence of AC periodic noise. A 100ms integration time, for instance, highly rejects 50Hz and 60Hz power line noise simultaneously. See "Integration Time or Conversion Time" on page 8 and "Noise Rejection" on page 9. The built-in ADC offers the user flexibility in integration time or conversion time. Two timing modes are available; Internal Timing Mode and External Timing Mode. In Internal Timing Mode, integration time is determined by an internal dual speed oscillator (fOSC), and the n-bit (n = 4, 8, 12,16) counter inside the ADC. In External Timing Mode, integration time is determined by the time between two consecutive I2C External Timing Mode commands. See "External Timing Mode" on page 7. A good balancing act of integration time and resolution depending on the application is required for optimal results. The ADC has four I2C programmable range select to dynamically accommodate various lighting conditions. For very dim conditions, the ADC can be configured at its lowest range. For very bright conditions, the ADC can be configured at its highest range. The I2C bus lines can be pulled above VDD, 5.5V max. Interrupt Function The active low interrupt pin is an open drain pull-down configuration. The interrupt pin serves as an alarm or monitoring function to determine whether the ambient light exceeds the upper threshold or goes below the lower threshold. The user can also configure the persistency of the interrupt pin. This eliminates any false triggers, such as noise or sudden spikes in ambient light conditions. An unexpected camera flash, for example, can be ignored by setting the persistency to 8 integration cycles. I2C Interface There are eight (8) 8-bit registers available inside the ISL29003. The command and control registers define the operation of the device. The command and control registers do not change until the registers are overwritten.There are two 8-bit registers that set the high and low interrupt thresholds. There are four 8-bit data Read Only registers; two bytes for the sensor reading and another two bytes for the timer counts. The data registers contain the ADC's latest digital output, and the number of clock cycles in the previous integration period. The ISL29003's I2C interface slave address is hardwired internally as 1000100. When 1000100x with x as R or W is sent after the Start condition, this device compares the first seven bits of this byte to its address and matches. Figure 1 shows a sample one-byte read. Figure 2 shows a sample one-byte write. Figure 3 shows a sync_iic timing diagram sample for externally controlled integration time. The I2C bus master always drives the SCL (clock) line, while either the master or the slave can drive the SDA (data) line. Figure 2 shows a sample write. Every I2C transaction begins with the master asserting a start condition (SDA falling while SCL remains high). The following byte is driven by the master and includes the slave address and read/write bit. The receiving device is responsible for pulling SDA low during the acknowledgement period. Every I2C transaction ends with the master asserting a stop condition (SDA rising while SCL remains high). For more information about the I2C standard, please consult the Philips(R) I2C specification documents. 3 FN7464.6 November 17, 2011 ISL29003 I2C DATA Start I2C SDA In DEVICE ADDRESS A6 I2C SDA Out I2C CLK A5 A4 A3 A2 A1 A0 W A W A SDA DRIVEN BY MASTER 1 2 3 4 5 6 REGISTER ADDRESS R7 8 9 R5 R4 R3 R2 R1 R0 SDA DRIVEN BY MASTER A 7 R6 A 1 2 3 4 5 6 7 8 STOP DEVICE ADDRESS START A A6 A5 A SDA DRIVEN BY MASTER 9 1 2 A4 3 A3 A2 4 A1 5 6 A0 7 W 8 A DATA BYTE0 A A SDA DRIVEN BY ISL29003 STOP NAK A D7 D6 D5 D4 D3 D2 D1 D0 A 9 1 2 3 4 5 6 7 8 9 FIGURE 1. I2C READ TIMING DIAGRAM SAMPLE I2C DATA Start I2C SDA In DEVICE ADDRESS W A A6 A5 A4 A3 A2 A1 A0 W A A I2C SDA Out SDA DRIVEN BY MASTER 1 I2C CLK In 2 3 4 5 6 7 8 REGISTER ADDRESS 9 A FUNCTIONS A R7 R6 R5 R4 R3 R2 R1 R0 A B7 B6 B5 B4 B3 B2 B1 B0 A SDA DRIVEN BY MASTER A SDA DRIVEN BY MASTER A 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 STOP 9 FIGURE 2. I2C WRITE TIMING DIAGRAM SAMPLE I2 C DA TA Start I2 C SDA In DEVICE ADDRESS A6 I2 C SDA Out A5 A4 A3 A2 A1 A0 W A W A SDA DRIV EN BY MA STER 1 I2 C CLK In 2 3 4 5 6 REGISTER ADDRESS R7 8 9 R5 R4 R3 R2 R1 R0 SDA DRIV EN BY MA STER A 7 R6 A Stop 1 2 3 4 5 6 7 A A 8 9 FIGURE 3. I2C sync_iic TIMING DIAGRAM SAMPLE 4 FN7464.6 November 17, 2011 ISL29003 Register Set There are eight registers that are available in the ISL29003. Table 1 summarizes the available registers and their functions. TABLE 1. REGISTER SET ADDR (HEX) REGISTER NAME BIT(S) FUNCTION NAME 00 Command 7 Enable 0: disable ADC-core 1: enable ADC-core 6 ADCPD 0: Normal operation 1: Power-down Mode 5 Timing_Mode 4 Reserved 3:2 Mode<1:0> Selects ADC work mode 0: Diode1's current to unsigned 16-bit data 1: Diode2's current to unsigned 16-bit data 2: Difference between diodes (I1 - I2) to signed 15-bit data 3: reserved 1:0 Width<1:0> Number of clock cycles; n-bit resolution 0: 216 cycles 1: 212 cycles 2: 28 cycles 3: 24 cycles 7 Ext_Mode Always set to logic 0. Factory use only. 6 Test_Mode Always set to logic 0 5 Int_Flag 4 Reserved Always set to logic 0. Factory use only. 3:2 Gain<1:0> Selects the gain so range is 0: 0 to 1000 lux 1: 0 to 4000 lux 2: 0 to 16000 lux 3: 0 to 64000 lux 1:0 Int_Persist <1:0> Interrupt is triggered after 0: 1 integration cycle 1: 4 integration cycles 2: 8 integration cycles 3: 16 integration cycles 01 Control FUNCTIONS/DESCRIPTION 0: Integration is internally timed 1: Integration is externally sync/controlled by I2C host 0: Interrupt is cleared or not yet triggered 1: Interrupt is triggered 02 Interrupt Threshold HI 7:0 Interrupt Threshold High byte of HI interrupt threshold. Default is 0xFF HI 03 Interrupt Threshold LO 7:0 Interrupt Threshold High byte of the LO interrupt threshold. Default is 0x00 LO 04 LSB_Sensor 7:0 LSB_Sensor Read-Only data register that contains the least significant byte of the latest sensor reading. 05 MSB_Sensor 7:0 MSB_Sensor Read-Only data register that contains the most significant byte of the latest sensor reading. 06 LSB_Timer 7:0 LSB_Timer Read-Only data register that contains the least significant byte of the timer counter value corresponding to the latest sensor reading. 07 MSB_Timer 7:0 MSB_Timer Read-Only data register that contains the most significant byte of the timer counter value corresponding to the latest sensor reading. 5 FN7464.6 November 17, 2011 ISL29003 TABLE 2. WRITE ONLY REGISTERS ADDRESS REGISTER NAME b1xxx_xxxx sync_iic bx1xx_xxxx clar_int FUNCTIONS/ DESCRIPTION At Mode2, the mux directs the current of Diode2 only to the ADC. Mode3 is a sequential Mode1 and Mode2 with an internal subtract function (Diode1 - Diode2). TABLE 6. PHOTODIODE SELECT MODE; BITS 2 AND 3 Writing a logic 1 to this address bit ends the current ADC-integration and starts another. Used only with External Timing Mode. BITS 3:2 0:0 MODE1. ADC integrates or converts Diode1 only. Current is converted to an n-bit unsigned data.* Writing a logic 1 to this address bit clears the interrupt. 0:1 MODE2. ADC integrates or coverts Diode2 only. Current is converted to an n-bit unsigned data.* 1:0 MODE3. A sequential MODE1 then MODE2 operation. The difference current is an (n-1) signed data.* 1:1 No Operation. Command Register 00(hex) The Read/Write command register has five functions: 1. Enable; Bit 7. This function either resets the ADC or enables the ADC in normal operation. A logic 0 disables ADC to reset-mode. A logic 1 enables adc to normal operation. TABLE 3. ENABLE BIT 7 OPERATION 0 Disable ADC-Core to Reset-Mode (default) 1 Enable ADC-Core to Normal Operation 2. ADCPD; Bit 6. This function puts the device in a power-down mode. A logic 0 puts the device in normal operation. A logic 1 powers down the device. TABLE 4. ADCPD BIT 6 OPERATION MODE *n = 4, 8, 12,16 depending on the number of clock cycles function. 5. Width; Bits 1 and 0. This function determines the number of clock cycles per conversion. Changing the number of clock cycles does more than just change the resolution of the device; it also changes the integration time, which is the period the device's analog-to-digital (A/D) converter samples the photodiode current signal for a lux measurement. TABLE 7. WIDTH BITS 1:0 NUMBER OF CLOCK CYCLES 0:0 216 = 65,536 0:1 212 = 4,096 0 Normal Operation (default) 1:0 28 = 256 1 Power-Down 1:1 24 = 16 For proper shut down operation, it is recommended to disable ADC first then disable the chip. Specifically, the user should first send I2C command with Bit 7 = 0 and then send I2C command with Bit 6 = 1. 3. Timing Mode; Bit 5. This function determines whether the integration time is done internally or externally. In Internal Timing Mode, integration time is determined by an internal dual speed oscillator (fOSC), and the n-bit (n = 4, 8, 12,16) counter inside the ADC. In External Timing Mode, integration time is determined by the time between two consecutive external-sync sync_iic pulse commands. Control Register 01(hex) The Read/Write control register has three functions: 1. Interrupt flag; Bit 5. This is the status bit of the interrupt. The bit is set to logic high when the interrupt thresholds have been triggered, and logic low when not yet triggered. Writing a logic low clears/resets the status bit. TABLE 8. INTERRUPT FLAG BIT 5 OPERATION 0 Interrupt is cleared or not triggered yet 1 Interrupt is triggered TABLE 5. TIMING MODE BIT 5 OPERATION 0 Internal Timing Mode. Integration time is internally timed determined by fOSC, REXT, and number of clock cycles. 1 External Timing Mode. Integration time is externally timed by the I2C host. 2. Range/Gain; Bits 3 and 2. The Full Scale Range can be adjusted by an external resistor REXT and/or it can be adjusted via I2C using the Gain/Range function. Gain/Range has four possible values, Range(k) where k is 1 through 4. Table 9 lists the possible values of Range(k) and the resulting FSR for some typical value REXT resistors. 4. Photodiode Select Mode; Bits 3 and 2. This function controls the mux attached to the two photodiodes. At Mode1, the mux directs the current of Diode1 to the ADC. 6 FN7464.6 November 17, 2011 ISL29003 TABLE 9. RANGE/GAIN TYPICAL FSR LUX RANGES FSR LUX FSR LUX FSR LUX RANGE@ RANGE@ RANGE@ BITS 3:2 k RANGE (k) REXT = 100k REXT = 50k REXT = 500k TABLE 11. DATA REGISTERS ADDRESS (hex) CONTENTS 04 Least-significant byte of most recent sensor reading. 0:0 1 973 973 1946 195 05 Most-significant byte of most recent sensor reading. 0:1 2 3892 3892 7784 778 06 1:0 3 15,568 15,568 31,136 3114 Least-significant byte of timer counter value corresponding to most recent sensor reading. 1:1 4 62,272 62,272 124,544 12,454 07 Most-significant byte of timer counter value corresponding to most recent sensor reading. 3. Interrupt persist; Bits 1 and 0. The interrupt pin and the interrupt flag is triggered/set when the data sensor reading is out of the interrupt threshold window after m consecutive number of integration cycles. The interrupt persist bits determine m. TABLE 10. INTERRUPT PERSIST BITS 1:0 NUMBER OF INTEGRATION CYCLES 0:0 1 0:1 4 1:0 8 1:1 16 Interrupt Threshold HI Register 02(hex) This register sets the HI threshold for the interrupt pin and the interrupt flag. By default, the Interrupt threshold HI is FF(hex). The 8-bit data written to the register represents the upper MSB of a 16-bit value. The LSB is always 00(hex). Interrupt Threshold LO Register 03(hex) This register sets the LO threshold for the interrupt pin and the interrupt flag. By default, the Interrupt threshold LO is 00(hex). The 8-bit data written to the register represents the upper MSB of a 16-bit value. The LSB is always 00(hex). Sensor Data Register 04(hex) and 05(hex) When the device is configured to output a 16-bit data, the least significant byte is accessed at 04(hex), and the most significant byte can be accessed at 05(hex). The sensor data register is refreshed after every integration cycle. Timer Data Register 06(hex) and 07(hex) Note that the timer counter value is only available when using the External Timing Mode. The 06(hex) and 07(hex) are the LSB and MSB respectively of a 16-bit timer counter value corresponding to the most recent sensor reading. Each clock cycle increments the counter. At the end of each integration period, the value of this counter is made available over the I2C. This value can be used to eliminate noise introduced by slight timing errors caused by imprecise external timing. Microcontrollers, for example, often cannot provide high-accuracy command-to-command timing, and the timer counter value can be used to eliminate the resulting noise. 7 Calculating Lux The ISL29003's output codes, DATA, are directly proportional to lux. E = x DATA (EQ. 1) The proportionality constant is determined by the Full Scale Range, FSR, and the n-bit ADC, which is user defined in the command register. The proportionality constant can also be viewed as the resolution; The smallest lux measurement the device can measure is . FSR = -----------n 2 (EQ. 2) Full Scale Range, FSR, is determined by the software programmable Range/Gain, Range(k), in the command register and an external scaling resistor REXT which is referenced to 100k. (EQ. 3) 100k FSR = Range ( k ) x -----------------R EXT The transfer function effectively for each timing mode becomes: INTERNAL TIMING MODE 100k Range ( k ) x -----------------R EXT E = ---------------------------------------------------- x DATA n 2 (EQ. 4) EXTERNAL TIMING MODE 100k Range ( k ) x -----------------R EXT E = ---------------------------------------------------- x DATA COUNTER (EQ. 5) n = 4, 8, 12, or 16. This is the number of clock cycles programmed in the command register. Range(k) is the user defined range in the Gain/Range bit in the command register. REXT is an external scaling resistor hardwired to the REXT pin. DATA is the output sensor reading in number of counts available at the data register. 2n represents the maximum number of counts possible in Internal Timing Mode. For the External Timing Mode, the maximum number of counts is stored in the data register named COUNTER. FN7464.6 November 17, 2011 ISL29003 COUNTER is the number increments accrued for between integration time for External Timing Mode. Gain/Range, Range (k) The Gain/Range can be programmed in the control register to give Range (k) determining the FSR. Note that Range(k) is not the FSR (see Equation 3). Range(k) provides four constants depending on programmed k that will be scaled by REXT (see Table 9). Unlike REXT, Range(k) dynamically adjusts the FSR. This function is especially useful when light conditions are varying drastically while maintaining excellent resolution. Number of Clock Cycles, n-bit ADC The number of clock cycles determines "n" in the n-bit ADC; 2n clock cycles is a n-bit ADC. n is programmable in the command register in the width function. Depending on the application, a good balance of speed and resolution has to be considered when deciding for n. For fast and quick measurement, choose the smallest n = 4. For maximum resolution without regard of time, choose n = 16. Table 12 compares the trade-off between integration time and resolution. See Equations 10 and 11 for the relation between integration time and n. See Equation 3 for the relation of n and resolution. n tINT (ms) (EQ. 8) 1 f OSC 1 = --- ( f OSC 2 ) 2 The automatic fOSC adjustment feature allows significant improvement of signal-to-noise ratio when detecting very low lux signals. Integration Time or Conversion Time Integration time is the period during which the device's analog-to-digital ADC converter samples the photodiode current signal for a lux measurement. Integration time, in other words, is the time to complete the conversion of analog photodiode current into a digital signal (number of counts). Integration time affects the measurement resolution. For better resolution, use a longer integration time. For short and fast conversions use a shorter integration time. The ISL29003 offers user flexibility in the integration time to balance resolution, speed and noise rejection. Integration time can be set internally or externally and can be programmed in the command register 00(hex) bit 5. INTEGRATION TIME IN INTERNAL TIMING MODE TABLE 12. RESOLUTION AND INTEGRATION TIME SELECTION RANGE1 fOSC = 327kHz When the Range/Gain bits are set to Range1 or Range2, fOSC runs at half speed compared to when Range/Gain bits are set to Range3 and Range4. RANGE4 fOSC = 655kHz RESOLUTION RESOLUTION LUX/COUNT tINT (ms) (LUX/COUNT) This timing mode is programmed in the command register 00(hex) bit 5. Most applications will be using this timing mode. When using the Internal Timing Mode, fOSC and n-bits resolution determine the integration time. tint is a function of the number of clock cycles and fOSC. n 1 t int = 2 x ---------f osc 16 200 0.01 100 1 12 12.8 0.24 6.4 16 8 0.8 3.90 0.4 250 4 0.05 62.5 0.025 4000 REXT = 100k External Scaling Resistor REXT and fosc The ISL29003 uses an external resistor REXT to fix its internal oscillator frequency, fOSC. Consequently, REXT determines the fOSC, integration time and the FSR of the device. fOSC, a dual speed mode oscillator, is inversely proportional to REXT. For user simplicity, the proportionality constant is referenced to fixed constants 100k and 655kHz: 1 100k fosc1 = --- x ------------------ x 655 kHz 2 R EXT (EQ. 6) 100k fosc2 = ------------------ x 655 kHz R EXT (EQ. 7) fOSC1 is oscillator frequency when Range1 or Range2 are set. This is nominally 327kHz when REXT is 100k. for Internal Timing Mode only (EQ. 9) n = 4, 8, 12, and16. n is the number of bits of resolution. Therefore, 2n is the number of clock cycles. n can be programmed at the command register 00(hex) bits 1 and 0. Since fOSC is dual speed depending on the Gain/Range bit, tint is dual time. The integration time as a function of REXT and n is: R EXT n t int 1 = 2 x ---------------------------------------------327kHz x 100k (EQ. 10) tint1 is the integration time when the device is configured for Internal Timing Mode and Gain/Range is set to Range1 or Range2. R EXT n t int 2 = 2 x ---------------------------------------------655kHz x 100k (EQ. 11) tint2 is the integration time when the device is configured for Internal Timing Mode and Gain/Range is set to Range3 or Range4. fOSC2 is the oscillator frequency when Range3 or Range4 are set. This is nominally 655kHz when REXT is 100k. 8 FN7464.6 November 17, 2011 ISL29003 TABLE 13. INTEGRATION TIMES FOR TYPICAL REXT VALUES RANGE1 RANGE2 RANGE3 RANGE4 REXT (k) n = 16-BIT n = 12-BIT n = 12-BIT n=4 50 100 6.4 3.2 0.013 100** 200 13 6.5 0.025 200 400 26 13 0.050 500 1000 64 32 0.125 *Integration time in milliseconds **Recommended REXT resistor value INTEGRATION TIME IN EXTERNAL TIMING MODE This timing mode is programmed in the command register 00(hex) bit 5. External Timing Mode is recommended when integration time can be synchronized to an external signal (such as a PWM) to eliminate noise. For Mode1 or Mode2 operation, the integration starts when the sync_iic command is sent over the I2C lines. The device needs two sync_iic commands to complete a photodiode conversion. The integration then stops when another sync_iic command is received. Writing a logic 1 to the sync_iic bit ends the current ADC integration and starts another one. For Mode3, the operation is a sequential Mode1 and Mode2. The device needs three sync_iic commands to complete two photodiode measurements. The 1st sync_iic command starts the conversion of the Diode1. The 2nd sync_iic completes the conversion of Diode1 and starts the conversion of Diode2. The 3rd sync_iic pulse ends the conversion of Diode2 and starts over again to commence conversion of Diode1. The integration time, tint, is determined by Equation 12: iI 2 C t int = ---------fI 2 C (EQ. 12) iI2C is the number of I2C clock cycles to obtain the tint. fI2C is the I2C operating frequency. The internal oscillator, fOSC, operates identically in both the internal and external timing modes, with the same dependence on REXT. However, in External Timing Mode, the number of clock cycles per integration is no longer fixed at 2n. The number of clock cycles varies with the chosen integration time, and is limited to 216 = 65,536. In order to avoid erroneous lux readings, the integration time must be short enough not to allow an overflow in the counter register. 65,535 t int < -----------------f OSC (EQ. 13) Noise Rejection In general, integrating type ADC's have excellent noise-rejection characteristics for periodic noise sources whose frequency is an integer multiple of the integration time. For instance, a 60Hz AC unwanted signal's sum from 0ms to k*16.66ms (k = 1,2...ki) is zero. Similarly, setting the device's integration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presence of noise. DESIGN EXAMPLE 1 The ISL29003 will be designed in a portable system. The ambient light conditions that the device will be exposed to is at most 500 lux, which is a good office lighting. The light source has a 50/60Hz power line noise, which is not visible by the human eye. The I2C clock is 10kHz. Solution 1 Using Internal Timing Mode In order to achieve both 60Hz and 50Hz AC noise rejection, the integration time needs to be adjusted to coincide with an integer multiple of the AC noise cycle times. t int = i ( 1 60Hz ) = j ( 1 50Hz ) (EQ. 14) The first instance of integer values at which tint rejects both 60Hz and 50Hz is when i = 6, and j = 5. t int = 6 ( 1 60Hz ) = 5 ( 1 50Hz ) (EQ. 15) t int = 100ms Next, the Gain/Range needs to be determined. Based on the application condition given, lux(max) = 500 lux, a range of 1000 lux is desirable. This corresponds to a Gain/Range Range1 mode. Also impose a resolution of n = 16-bit. Hence, we choose Equation 10 to determine REXT. t int x 327kHz x 100 k R EXT = ------------------------------------------------------------n 2 (EQ. 16) R EXT = 50k for Internal Timing Mode and Gain/Range is set to Range3 or Range4 only The Full Scale Range, FSR, needs to be determined from Equation 3: 100k FSR = 1000 lux -----------------50k (EQ. 17) FSR = 2000 lux The effective transfer function becomes: data E = ------------- x 2000 lux 16 2 (EQ. 18) fOSC = 327kHz*100k/REXT. When Range/Gain is set to Range1 or Range2. fOSC = 655kHz*100k/REXT. When Range/Gain is set to Range3 or Range4. 9 FN7464.6 November 17, 2011 ISL29003 TABLE 14. SOLUTION1 SUMMARY TO EXAMPLE DESIGN PROBLEM DESIGN PARAMETER VALUE tint 100ms REXT 50k Gain/Range Mode Range1 = 1000 lux FSR 2000 lux # of clock cycles 216 Transfer Function DATA E = ----------------- x 2000 lux 16 2 Solution 2 IR Rejection Any filament type light source has a high presence of infrared component invisible to the human eye. A white fluorescent lamp, on the other hand has a low IR content. As a result, output sensitivity may vary depending on the light source. Maximum attenuation of IR can be achieved by properly scaling the readings of Diode1 and Diode2. The user obtains data reading from sensor Diode1 (D1), which is sensitive to visible and IR, then reading from sensor Diode2 (D2), which is mostly sensitive from IR. The graph in Figure 7 shows the effective spectral response after applying Equation 19 of the ISL29003 from 400nm to 1000nm. Equation 19 describes the method of cancelling IR in internal timing mode. D3 = n ( D1 - kD2 ) Using External Timing Mode From Solution 1, the desired integration time is 100ms. Note that the REXT resistor only determines the inter oscillator frequency when using external timing mode. Instead, the integration time is the time between two sync_iic commands sent through the I2C. The programmer determines how many I2C clock cycles to wait between two external timing commands. iI2C = fI2C*tint = number of I2C clock cycles iI2C = 10kHz *100ms iI2C = 1,000 I2C clock cycles. An external sync_iic command sent 1,000 cycles after another sync_iic command rejects both 60Hz and 50Hz AC noise signals. Next, is to pick an arbitrary REXT = 100k and to choose the Gain/Range Mode. For a maximum 500 lux, Range1 is adequate. From Equation 3: 100k FSR = 1000 lux -----------------100k FSR = 1000 lux The effective transfer function becomes: DATA E = -------------------------------- x 1000 lux COUNTER DATA is the sensor reading data located in data registers 04(hex) and 05(hex) (EQ. 19) Where: data = lux amount in number of counts less IR presence D1 = data reading of Diode1 D2 = data reading of Diode2 n = 1.85. This is a fudge factor to scale back the sensitivity up to ensure Equation 4 is valid. k = 7.5. This is a scaling factor for the IR sensitive Diode2. Flat Window Lens Design A window lens will surely limit the viewing angle of the ISL29003. The window lens should be placed directly on top of the device. The thickness of the lens should be kept at minimum to minimize loss of power due to reflection and also to minimize loss of loss due to absorption of energy in the plastic material. A thickness of t = 1mm is recommended for a window lens design. The bigger the diameter of the window lens, the wider the viewing angle is of the ISL29003. Table 16 shows the recommended dimensions of the optical window to ensure both 35 and 45 viewing angle. These dimensions are based on a window lens thickness of 1.0mm and a refractive index of 1.59. WINDOW LENS COUNTER is the timer counter value data located in data registers 06(hex) and 07(hex). In this sample problem, COUNTER = 1000. t DESIGN PARAMETER VALUE tint 100ms REXT 100k Gain/Range Mode Range1 = 1000 lux FSR 1000 lux # of clock cycles COUNTER = 1000 Transfer Function DATA E = -------------------------------- x 1000 lux COUNTER 10 DTOTAL TABLE 15. SOLUTION2 SUMMARY TO EXAMPLE DESIGN PROBLEM ISL29003 D1 DLENS = Viewing angle FIGURE 4. FLAT WINDOW LENS FN7464.6 November 17, 2011 ISL29003 Suggested PCB Footprint TABLE 16. RECOMMENDED DIMENSIONS FOR A FLAT WINDOW DESIGN DTOTAL D1 DLENS @ 35 VIEWING ANGLE 1.5 0.50 2.25 3.75 2.0 1.00 3.00 4.75 2.5 1.50 3.75 5.75 3.0 2.00 4.30 6.75 3.5 2.50 5.00 7.75 t=1 D1 DLENS DTOTAL DLENS @ 45 VIEWING ANGLE Footprint pads should be a nominal 1-to-1 correspondence with package pads. Since ambient light sensor devices do not dissipate high power, heat dissipation through the exposed pad is not important; instead, similar to DFN or QFN, the exposed pad provides robustness in board mount process. Intersil recommends mounting the exposed pad to the PCB, but this is not mandatory. Layout Considerations The ISL29003 is relatively insensitive to layout. Like other I2C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Thickness of lens Distance between ISL29001 and inner edge of lens Diameter of lens Distance constraint between the ISL29001 and lens outer edge Route the supply and I2C traces as far as possible from all sources of noise. Use two power-supply decoupling capacitors, 4.7F and 0.1F, placed close to the device. *All dimensions are in mm. 2.00mm SENSOR OFFSET 2.10mm Typical Circuit 1 6 2 5 A typical application for the ISL29003 is shown in Figure 6. The ISL29003's I2C address is internally hardwired as 1000100. The device can be tied onto a system's I2C bus together with other I2C compliant devices. 0.29mm Soldering Considerations 0.56mm 3 Convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. The plastic ODFN package does not require a custom reflow soldering profile, and is qualified to +260C. A standard reflow soldering profile with a +260C maximum is recommended. 4 0.46mm FIGURE 5. SENSOR LOCATION DRAWING 1.8V TO 5.5V R1 10k R2 10k I2C MASTER R3 RES1 MICROCONTROLLER SDA SCL 2.5V TO 3.3V I2C SLAVE_1 I2C SLAVE_0 1 2 C1 C2 4.7F 0.1F 3 VDD SDA GND SCL REXT INT REXT 100k I2C SLAVE_n 6 SDA SDA 5 SCL SCL 4 ISL29003 FIGURE 6. ISL29003 TYPICAL CIRCUIT 11 FN7464.6 November 17, 2011 ISL29003 Typical Performance Curves (REXT = 100k) NORMALIZED RESPONSE (%) 100 RADIATION PATTERN 90 ISL29003 D1 80 LUMINOSITY 30 ANGLE 40 70 60 ISL29003 D2 30 10 0 300 30 40 60 400 500 600 700 800 WAVELENGTH (nm) 70 900 80 80 90 90 0.2 0.4 0.6 0.8 1.0 RELATIVE SENSITIVITY 1k FIGURE 8. RADIATION PATTERN 320 10 TA = +27C COMMAND = 00H OUTPUT CODE (COUNTS) SUPPLY CURRENT (mA) 20 50 FIGURE 7. SPECTRAL RESPONSE 5000 lux 292 278 200 lux 264 2.3 2.6 2.9 3.2 3.5 8 TA = +27C COMMAND = 00H 0 lux 6 4 2 0 2.0 3.8 RANGE 2 2.3 SUPPLY VOLTAGE (V) 2.6 2.9 3.2 3.5 3.8 SUPPLY VOLTAGE (V) FIGURE 9. SUPPLY CURRENT vs SUPPLY VOLTAGE FIGURE 10. OUTPUT CODE FOR 0 LUX vs SUPPLY VOLTAGE 1.015 320.0 TA = +27C COMMAND = 00H 1.010 5000 lux 1.005 1.000 200 lux 0.995 2.3 2.6 2.9 3.2 3.5 SUPPLY VOLTAGE (V) FIGURE 11. OUTPUT CODE vs SUPPLY VOLTAGE 12 3.8 OSCILLATOR FREQUENCY (kHz) OUTPUT CODE RATIO (% FROM 3V) 10 70 20 0.990 2.0 0 60 40 250 2.0 10 50 50 306 20 TA = +27C 319.5 319.0 318.5 318.0 2.0 2.3 2.6 2.9 3.2 3.5 3.8 SUPPLY VOLTAGE (V) FIGURE 12. OSCILLATOR FREQUENCY vs SUPPLY VOLTAGE FN7464.6 November 17, 2011 ISL29003 Typical Performance Curves (REXT = 100k) (Continued) 305 10 VDD = 3V COMMAND = 00H OUTPUT CODE (COUNTS) SUPPLY CURRENT (A) 315 5000 lux 295 RANGE 3 285 200 lux RANGE 1 275 265 -60 -20 20 60 8 6 4 2 0 -60 100 VDD = 3V COMMAND = 00H 0 lux RANGE 2 -20 TEMPERATURE (C) FIGURE 13. SUPPLY CURRENT vs TEMPERATURE OSCILLATOR FREQUENCY (kHz) OUTPUT CODE RATIO (% FROM +25C) 1.048 5000 lux 200 lux RANGE 3 RANGE 1 0.952 0.920 -60 100 330 VDD = 3V COMMAND = 00H 0.984 60 FIGURE 14. OUTPUT CODE FOR 0 LUX vs TEMPERATURE 1.080 1.016 20 TEMPERATURE (C) -20 20 60 TEMPERATURE (C) FIGURE 15. OUTPUT CODE vs TEMPERATURE 100 VDD = 3V 329 328 327 326 325 -60 -20 20 TEMPERATURE (C) 60 100 FIGURE 16. OSCILLATOR FREQUENCY vs TEMPERATURE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 13 FN7464.6 November 17, 2011 ISL29003 Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 3, 5/11 2.10 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 1 0.65 1.35 2.00 1.30 REF 4 6X 0.300.05 (4X) 0.10 0.10 M C A B 0.65 TOP VIEW 6x0.35 0.05 BOTTOM VIEW 2.50 PACKAGE OUTLINE 2.10 SEE DETAIL "X" 0.65 (4x0.65) 0.10 C MAX 0.75 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW (1.35) (6x0.30) C (6x0.20) 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. (6x0.55) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 14 FN7464.6 November 17, 2011