MC1458, C Internally Compensated, High Performance DUAL OPERATIONAL AMPLIFIERS Dual Operational Amplifiers (DUAL MC1741) The MC1458, C was designed for use as a summing amplifier, integrator, or amplifier with operating characteristics as a function of the external feedback components. * No Frequency Compensation Required * * * * SEMICONDUCTOR TECHNICAL DATA Short Circuit Protection Wide Common Mode and Differential Voltage Ranges Low Power Consumption 8 No Latch-Up 1 P1 SUFFIX PLASTIC PACKAGE CASE 626 MAXIMUM RATINGS (TA = +25C, unless otherwise noted.) Rating Symbol Value Unit Power Supply Voltage VCC VEE +18 -18 Vdc Input Differential Voltage VID 30 V Input Common Mode Voltage (Note 1) VICM 15 V Output Short Circuit Duration (Note 2) tSC Continuous Operating Ambient Temperature Range TA 0 to +70 C Tstg -55 to +125 C TJ 150 C Storage Temperature Range Junction Temperature 8 1 D SUFFIX PLASTIC PACKAGE CASE 751 (SO-8) NOTES: 1. For supply voltages less than 15 V, the absolute maximum input voltage is equal to the supply voltage. 2. Supply voltage equal to or less than 15 V. PIN CONNECTIONS Output A 1 2 Inputs A Representative Schematic Diagram VEE 3 4 - + A B- + 8 VCC 7 Output B 6 5 Inputs B VCC (Top View) 4.5 k Noninverting Input 25 39 k 30 pF 7.5 k Output Inverting Input 1.0 k 50 50 k 1.0 k 50 k ORDERING INFORMATION 50 Device VEE MC1458CD, D MC1458CP1, P1 2-84 Operating Temperature Range Package SO-8 TA = 0 to +70C Plastic DIP MOTOROLA ANALOG IC DEVICE DATA MC1458, C ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = -15 V, TA = 25C, unless otherwise noted. (Note 3)) MC1458 Characteristic MC1458C Symbol Min Typ Max Min Typ Max Unit Input Offset Voltage (RS 10 k) VIO - 2.0 6.0 - 2.0 1.0 mV Input Offset Current IIO - 20 200 - 20 300 nA Input Bias Current IIB - 80 500 - 80 700 nA Input Resistance ri 0.3 2.0 - - 2.0 - M Input Capacitance Ci - 1.4 - - 1.4 - pF Offset Voltage Adjustment Range VIOR - 15 - - 15 - mV Common Mode Input Voltage Range VICR 12 13 - 11 13 - V Large Signal Voltage Gain (VO = 10 V, RL = 2.0 k) (VO = 10 V, RL = 10 k) AVOL 20 - 200 - - - - 20 - 200 - - V/mV ro - 75 - - 75 - Common Mode Rejection (RS 10 k) CMR 70 90 - 60 90 - dB Supply Voltage Rejection (RS 10 k) PSR - 30 150 - 30 - V/V 12 10 14 13 - - 11 9.0 14 13 - - Output Resistance Output Voltage Swing (RS 10 k) (RS 2.0 k) VO Output Short Circuit Current ISC - 20 - - 20 - mA Supply Currents (Both Amplifiers) ID - 2.3 5.6 - 2.3 8.0 mA Power Consumption PC - 70 170 - 70 240 mW tTLH os SR - - - 0.3 15 0.5 - - - - - - 0.3 15 0.5 - - - s % V/s Transient Response (Unity Gain) (VI = 20 mV, RL 2.0 k, CL 100 pF) Rise Time (VI = 20 mV, RL 2.0 k, CL 100 pF) Overshoot (VI = 10 V, RL 2.0 k, CL 100 pF) Slew Rate V ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = -15 V, TA = Thigh to Tlow, unless otherwise noted. (Note 3))* MC1458 Characteristic MC1458C Symbol Min Typ Max Min Typ Max Unit Input Offset Voltage (RS 10 k) VIO - - 7.5 - - 12 mV Input Offset Current (TA = 0 to +70C) IIO - - 300 - - 400 nA Input Bias Current (TA = 0 to +70C) IIB - - 800 - - 1000 nA Output Voltage Swing (Rs 10 k) (Rs 2 k) VO 12 10 14 13 - - - 9.0 - 13 - - 15 - - - - - - 15 - - - - Large Signal Voltage Gain (VO = 10 V, RL = 2 k) (VO = 10 V, RL = 10 k) *Tlow = 0C for MC1458, C NOTE: V AVOL V/mV Thigh = +70C for MC1458, C 3. Input pins of an unused amplifier must be grounded for split supply operation or biased at least 3.0 V above VEE for single supply operation. MOTOROLA ANALOG IC DEVICE DATA 2-85 MC1458, C Figure 1. Burst Noise versus Source Resistance Figure 2. RMS Noise versus Source Resistance 100 BW = 1.0 Hz to 1.0 kHz en, INPUT NOISE (peak) (V) en, INPUT NOISE (peak) (V) 1000 100 10 0 BW = 1.0 Hz to 1.0 kHz 10 1.0 0.1 10 100 1.0 k 10 k 100 k 10 1.0 M 100 RS, SOURCE RESISTANCE () 100 k 1.0 M Figure 4. Spectral Noise Density 140 en, INPUT NOISE ( nV/ Hz ) 10 en, OUTPUT NOISE (rms mV) 10 k RS, SOURCE RESISTANCE () Figure 3. Output Noise versus Source Resistance AV = 1000 1.0 100 10 0.1 0 1.0 1.0 10 100 1.0 k 10 k 100 k 120 AV = 10, RS = 100 k 100 80 60 40 20 0 1.0 M 10 100 1.0 k 10 k 100 k f, FREQUENCY (Hz) RS, SOURCE RESISTANCE () Figure 5. Burst Noise Test Circuit Positive Threshold Voltage 100 k + - - 100 k X 500 To Pass / Fail Indicator X2 + 1.0 k 100 k - Operational Amplifier Under Test Low Pass Filter 1.0 Hz to 1.0 kHz + Negative Threshold Voltage Unlike conventional peak reading or RMS meters, this system was especially designed to provide the quick response time essential to burst (popcorn) noise testing. 2-86 The test time employed is 10 sec and the 20 V peak limit refers to the operational amplifier input thus eliminating errors in the closed loop gain factor of the operational amplifier . MOTOROLA ANALOG IC DEVICE DATA MC1458, C Figure 7. Open Loop Frequency Response 28 120 24 100 A VOL , VOLTAGE GAIN (dB) VO, OUTPUT VOLTAGE (Vpp ) Figure 6. Power Bandwidth (Large Signal Swing versus Frequency) 20 16 12 (Voltage Follower) THD < 5% 8.0 4.0 80 60 40 20 0 -20 0 10 100 1.0 k f, FREQUENCY (Hz) 10 k 10 100 k VO , OUTPUT VOLTAGE SWING (V) VO , OUTPUT VOLTAGE SWING (V) 10 k 100 k 1.0 M 10 M -15 15 V Supplies 13 11 12 V 9.0 9.0 V 7.0 5.0 6.0 V 3.0 100 200 500 700 1.0 k 2.0 k 5.0 k 7.0 k 10 k -13 15 V Supplies -11 12 V -9.0 -7.0 9.0 V -5.0 6.0 V -3.0 -1.0 100 200 RL, LOAD RESISTANCE () 100 F +27 V VCC Vin +21 V 16 5.0 k 7.0 k 10 k 10 k 1.0 k +24 V 20 2.0 k Figure 11. Single Supply Inverting Amplifier 28 +30 V Supply 24 500 700 1.0 k RL, LOAD RESISTANCE () Figure 10. Output Voltage Swing versus Load Resistance (Single Supply Operation) VO, OUTPUT VOLTAGE SWING (Vpp ) 1.0 k Figure 9. Negative Output Voltage Swing versus Load Resistance 15 +18 V 200 k 12 +15 V 8.0 0 +9.0 V +6.0 V +5.0 V 1.0 2.0 50 k 2 200 k 3.0 4.0 5.0 6.0 7.0 RL, LOAD RESISTANCE (k) MOTOROLA ANALOG IC DEVICE DATA 8.0 9.0 7 - + 50 k +12 V 4.0 0 100 f, FREQUENCY (Hz) Figure 8. Positive Output Voltage Swing versus Load Resistance 1.0 10 3 100 F MC1558 4 RL 10 2-87 MC1458, C Figure 12. Noninverting Pulse Response 5.0 V/DIV Output Input 10 s/DIV Figure 13. Transient Response Test Circuit Figure 14. Unused OpAmp To Scope (Input) - - To Scope (Output) + RL + CL Figure 15. Open Loop Voltage Gain versus Supply Voltage 105 AV , VOLTAGE GAIN (dB) 100 95 90 85 80 75 70 0 2-88 2.0 4.0 6.0 8.0 10 12 14 16 VCC, |VEE|, SUPPLY VOLTAGES (V) 18 20 MOTOROLA ANALOG IC DEVICE DATA Tape and Reel Options In Brief . . . Motorola offers the convenience of Tape and Reel packaging for our growing family of standard integrated circuit products. Reels are available to support the requirements of both first and second generation pick-and-place equipment. The packaging fully conforms to the latest EIA-481A specification. The antistatic embossed tape provides a secure cavity, sealed with a peel-back cover tape. MOTOROLA ANALOG IC DEVICE DATA Page Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12-2 Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12-4 Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-5 12-1 Tape and Reel Configurations Mechanical Polarization SOIC and Micro-8 DEVICES PLCC DEVICES Typical Typical PIN 1 User Direction of Feed User Direction of Feed DPAK and D2PAK DEVICES Typical User Direction of Feed 12-2 SOT-23 (5 Pin) DEVICES SOT-89 (3 Pin) DEVICES SOT-89 (5 Pin) DEVICES Typical Typical Typical User Direction of Feed User Direction of Feed User Direction of Feed MOTOROLA ANALOG IC DEVICE DATA Tape and Reel Configurations (continued) TO-92 Reel Styles STYLE A (Preferred) STYLE E Carrier Strip Carrier Strip Rounded Side Adhesive Tape Flat Side Adhesive Tape EEEEEEE EEEEEEE Feed EEEEEEE EEEEEEE Feed Flat side of transistor and adhesive tape visible. Rounded side of transistor and adhesive tape visible. TO-92 Ammo Pack Styles STYLE P (Preferred) STYLE M Adhesive Tape On Top Side Adhesive Tape On Top Side EEEEEEEE EEEEEEEE EEEEEEEE EEEEEEEE Flat Side Carrier Strip Rounded side of transistor and adhesive tape visible. Label EEEEEEE EEEEEEE EEEEEEE EEEEEEE Feed Feed Rounded Side Carrier Strip Flat side of transistor and adhesive tape visible. Label Style M ammo pack is equivalent to Style E of reel pack dependent on feed orientation from box. Style P ammo pack is equivalent to Styles A and B of reel pack dependent on feed orientation from box. TO-92 EIA Radial Tape in Fan Fold Box or On Reel H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 P1 MOTOROLA ANALOG IC DEVICE DATA P2 D P 12-3 Tape and Reel Information Table Tape p Width (mm) Devices(1) per Reel Reel Size (inch) Device Suffix SO-8, SOP-8 SO-14 SO-16 12 16 16 2,500 2,500 2,500 13 13 13 R2 R2 R2 SO-16L, SO-8+8L WIDE SO-20L WIDE SO-24L WIDE SO-28L WIDE SO-28L WIDE 16 24 24 24 32 1,000 1,000 1,000 1,000 1,000 13 13 13 13 13 R2 R2 R2 R2 R3 Micro-8 12 2,500 13 R2 PLCC-20 PLCC-28 PLCC-44 16 24 32 1,000 500 500 13 13 13 R2 R2 R2 PLCC-52 PLCC-68 PLCC-84 32 44 44 500 250 250 13 13 13 R2 R2 R2 TO-226AA (TO-92)(2) 18 2,000 13 RA, RE, RP, or RM (Ammo Pack) only DPAK 16 2,500 13 RK D2PAK 24 800 13 R4 SOT-23 (5 Pin) 8 3,000 7 TR SOT-89 (3/5 Pin) 12 1,000 7 T1 Package (1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned. (2) Integrated circuits in TO-226AA packages are available in Styes A and E only, with optional "Ammo Pack" (Suffix RP or RM). The RA and RP configurations are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office. 12-4 MOTOROLA ANALOG IC DEVICE DATA Analog MPQ Table Tape/Reel and Ammo Pack Package Type Package Code MPQ Case 775 Case 776 Case 777 0802 0804 0801 1000/reel 500/reel 500/reel Case 751 Case 751A Case 751B Case 751G Case 751D Case 751E Case 751F 0095 0096 0097 2003 2005 2008 2009 2500/reel 2500/reel 2500/reel 1000/reel 1000/reel 1000/reel 1000/reel Case 846A - 2500/reel Case 29 Case 29 0031 0031 2000/reel 2000/Ammo Pack Case 369A - 2500/reel Case 936 - 800/reel - 3000/reel - 1000/reel - 1000/reel PLCC SOIC Micro-8 TO-92 DPAK D2PAK SOT-23 (5 Pin) Case 1212 SOT-89 (3 Pin) Case 1213 SOT-89 (5 Pin) Case 1214 MOTOROLA ANALOG IC DEVICE DATA 12-5 12-6 MOTOROLA ANALOG IC DEVICE DATA Packaging Information In Brief . . . The packaging availability for each device type is indicated on the individual data sheets and the Selector Guide. All of the outline dimensions for the packages are given in this section. The maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: PD(TA) = TJ(max) - TA RJA(Typ) where: PD(TA) = Power Dissipation allowable at a given operating ambient temperature. This must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. TJ(max) = Maximum operating Junction Temperature as listed in the Maximum Ratings Section. See individual data sheets for TJ(max) information. TA = Maximum desired operating Ambient Temperature RJA(Typ) = Typical Thermal Resistance Junction-toAmbient MOTOROLA ANALOG IC DEVICE DATA 13-1 Case Outline Dimensions LP, P, Z SUFFIX CASE 29-04 Plastic Package (TO-226AA/TO-92) ISSUE AD A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSION D AND J APPLY BETWEEN L AND K MINIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P 1 2 L F SEATING PLANE DIM A B C D F G H J K L N P R V K 3 D X X G J H V C SECTION X-X 1 N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.41 0.55 0.41 0.48 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 --- N KC, T SUFFIX CASE 221A-06 Plastic Package ISSUE Y -T- F -B- 4 SEATING PLANE C T S 4 Q A U 1 2 3 H -Y- 1 2 3 K R L J G D 3 PL 0.25 (0.010) M B M Y NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.020 0.045 0.139 0.155 0.100 BSC --- 0.280 0.012 0.045 0.500 0.580 0.045 0.070 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.51 1.14 3.53 3.93 2.54 BSC --- 7.11 0.31 1.14 12.70 14.73 1.15 1.77 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 N 13-2 MOTOROLA ANALOG IC DEVICE DATA TH SUFFIX CASE 314A-03 Plastic Package ISSUE D -T- B -P- Q SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C E OPTIONAL CHAMFER A U F L DIM A B C D E F G J K L Q S U K 1 5 G 5X S D 0.014 (0.356) T, TV SUFFIX CASE 314B-05 Plastic Package ISSUE J M T P M OPTIONAL CHAMFER E A U L S W V F 1 5 5X G 5X 0.24 (0.610) M J T H D 0.10 (0.254) M T P N M -T- T SUFFIX CASE 314C-01 Plastic Package ISSUE A -Q- B MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C B -P- Q K J 5X INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 -T- SEATING PLANE DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 --- 0.620 0.468 0.505 --- 0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 --- 15.748 11.888 12.827 --- 18.669 2.286 2.794 SEATING PLANE C E A 1 2 3 4 5 L 1 DIM A B C D E G J K L Q K 5 G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. INCHES MIN MAX 0.610 0.625 0.380 0.420 0.160 0.190 0.020 0.040 0.035 0.055 0.067 BSC 0.015 0.025 0.500 --- 0.355 0.370 0.139 0.147 MILLIMETERS MIN MAX 15.59 15.88 9.65 10.67 4.06 4.83 0.51 1.02 0.89 1.40 1.702 BSC 0.38 0.64 12.70 --- 9.02 9.40 3.53 3.73 5 PL 0.356 (0.014) M T Q MOTOROLA ANALOG IC DEVICE DATA M J 13-3 T, T1 SUFFIX CASE 314D-03 Plastic Package ISSUE D -T- SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C -Q- B E U A L DIM A B C D E G H J K L Q U S 1 2 3 4 5 K S 12 3 45 J G D H 5 PL 0.356 (0.014) DT-1 SUFFIX CASE 369-07 Plastic Package (DPAK) ISSUE K M T Q C E R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 DIM A B C D E F G H J K R S V 4 A 1 2 3 S 1 -T- 2 K SEATING PLANE 3 J F H D G DT SUFFIX CASE 369A-13 Plastic Package (DPAK) ISSUE Y 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE C B E R 4 Z A S 1 3 2 3 U K F J L H D G 13-4 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.46 1.27 2.28 0.77 1.27 T M 4 1 INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.175 0.215 0.050 0.090 0.030 0.050 3 PL -T- V MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.908 27.051 8.128 9.271 3.556 3.886 2.667 2.972 13.792 14.783 M B V INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 1.020 1.065 0.320 0.365 0.140 0.153 0.105 0.117 0.543 0.582 2 PL 0.13 (0.005) M DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 --- T MOTOROLA ANALOG IC DEVICE DATA DP1, N, P, P1 SUFFIX CASE 626-05 Plastic Package ISSUE K 8 5 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -B- 1 4 F DIM A B C D F G H J K L M N -A- NOTE 2 L 8 C 1 J -T- N SEATING PLANE D M K INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --- 10_ 0.030 0.040 G H 0.13 (0.005) M T A B M M N, P, N-14, P2 SUFFIX CASE 646-06 Plastic Package ISSUE L 14 8 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. B A F 14 DIM A B C D F G H J K L M N L 1 C J N H DP2, N, P, PC SUFFIX CASE 648-08 Plastic Package ISSUE R MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --- 10_ 0.76 1.01 G D SEATING PLANE K M 9 1 8 B F C 16 L S 1 -T- SEATING PLANE K H G D J 16 PL 0.25 (0.010) MOTOROLA ANALOG IC DEVICE DATA MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 M T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 13-5 B, P, P2, V SUFFIX CASE 648C-03 Plastic Package (DIP-16) ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. INTERNAL LEAD CONNECTION BETWEEN 4 AND 5, 12 AND 13. -A- 16 9 1 8 -B- L NOTE 5 16 C 1 -T- M N SEATING PLANE K E F J G D 16 PL 0.13 (0.005) 16 PL 0.13 (0.005) M T A M T B MILLIMETERS MIN MAX 18.80 21.34 6.10 6.60 3.69 4.69 0.38 0.53 1.27 BSC 1.02 1.78 2.54 BSC 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION A AND B DOES NOT INCLUDE MOLD PROTRUSION. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 (0.010). 6. ROUNDED CORNER OPTIONAL. R 16 9 1 8 -B- M P L F 16 J 1 C -T- SEATING PLANE S K H G D 13 PL 0.25 (0.010) P SUFFIX CASE 649-03 Plastic Package ISSUE D P M T B A S L B 1 12 J H F C N 1 K G D SEATING PLANE INCHES MIN MAX 0.740 0.760 0.245 0.260 0.145 0.175 0.015 0.021 0.050 0.070 0.100 BSC 0.050 BSC 0.008 0.015 0.120 0.140 0.295 0.305 0_ 10 _ 0.200 BSC 0.300 BSC 0.015 0.035 MILLIMETERS MIN MAX 18.80 19.30 6.23 6.60 3.69 4.44 0.39 0.53 1.27 1.77 2.54 BSC 1.27 BSC 0.21 0.38 3.05 3.55 7.50 7.74 0_ 10 _ 5.08 BSC 7.62 BSC 0.39 0.88 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 13 Q DIM A B C D F G H J K L M P R S S A 24 13-6 INCHES MIN MAX 0.740 0.840 0.240 0.260 0.145 0.185 0.015 0.021 0.050 BSC 0.040 0.70 0.100 BSC 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.040 -A- P SUFFIX CASE 648E-01 Plastic Package (DIP-16) ISSUE O 24 DIM A B C D E F G J K L M N M DIM A B C D F G H J K L M N P Q MILLIMETERS MIN MAX 31.50 32.13 13.21 13.72 4.70 5.21 0.38 0.51 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.30 2.92 3.43 14.99 15.49 --- 10 0.51 1.02 0.13 0.38 0.51 0.76 INCHES MIN MAX 1.240 1.265 0.520 0.540 0.185 0.205 0.015 0.020 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.012 0.115 0.135 0.590 0.610 --- 10 _ 0.020 0.040 0.005 0.015 0.020 0.030 MOTOROLA ANALOG IC DEVICE DATA A, B, N, P SUFFIX CASE 707-02 Plastic Package ISSUE C 18 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 10 B 1 9 A L C 18 DIM A B C D F G H J K L M N 1 K N F H D G J M SEATING PLANE P SUFFIX CASE 710-02 Plastic Package ISSUE B 1 28 DIM A B C D F G H J K L M N 15 B 14 1 L C A N G F D M K NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 1 40 21 B 1 20 L A C N J F MOTOROLA ANALOG IC DEVICE DATA INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 SEATING PLANE 40 G MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 J P SUFFIX CASE 711-03 Plastic Package ISSUE C H INCHES MIN MAX 0.875 0.915 0.240 0.260 0.140 0.180 0.014 0.022 0.050 0.070 0.100 BSC 0.040 0.060 0.008 0.012 0.115 0.135 0.300 BSC 0_ 15 _ 0.020 0.040 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 28 H MILLIMETERS MIN MAX 22.22 23.24 6.10 6.60 3.56 4.57 0.36 0.56 1.27 1.78 2.54 BSC 1.02 1.52 0.20 0.30 2.92 3.43 7.62 BSC 0_ 15_ 0.51 1.02 D K DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 M SEATING PLANE 13-7 F, P, P-3 SUFFIX CASE 724-03 Plastic Package (NDIP-24) ISSUE D NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 24 1 -A- 24 13 1 12 -B- L C -T- NOTE 1 K SEATING PLANE N E G M J F D 0.25 (0.010) H, P, DP SUFFIX CASE 738-03 Plastic Package ISSUE E 24 PL 0.25 (0.010) 24 PL T A M M INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 DIM A B C D E F G J K L M N T B M M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. -A- 20 11 1 10 B DIM A B C D E F G J K L M N L C 20 1 -T- K SEATING PLANE J F M T A C 0.25 H M B M 1 4 8 B 1 h e q SEATING PLANE 0.10 A1 B 0.25 13-8 X 45 _ A C M C B S A S M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. 5 E T B M M D 8 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 20 PL 0.25 (0.010) A INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 20 PL 0.25 (0.010) D D, D1, D2 SUFFIX CASE 751-05 Plastic Package (SO-8, SOP-8) ISSUE R M N E G MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 L DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751A-03 Plastic Package (SO-14) ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- 1 P 7 PL 0.25 (0.010) 7 M B M 14 1 R X 45 _ G F C -T- 0.25 (0.010) M J M K D 14 PL SEATING PLANE T B A S S DIM A B C D F G J K M P R 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G 16 1 K R F X 45 _ C SEATING PLANE D J M 16 PL 0.25 (0.010) DW, FP SUFFIX CASE 751D-04 Plastic Package (SO-20L, SO-20) ISSUE E INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 -A- D SUFFIX CASE 751B-05 Plastic Package (SO-16) ISSUE J -T- MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 T B M A S S -A- 20 10X P 0.010 (0.25) 1 M B M 10 20X J D 0.010 (0.25) M T A B S S 20 F 1 R C -T- 18X MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 G MOTOROLA ANALOG IC DEVICE DATA K SEATING PLANE INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 -B- DIM A B C D F G J K M P R X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 M 13-9 DW SUFFIX CASE 751E-04 Plastic Package (SO-24L, SOP (16+4+4)L) ISSUE E -A- 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 13 -B- 12X P 0.010 (0.25) 1 M B M 12 24X 24 D J 0.010 (0.25) 1 T A M B S S DIM A B C D F G J K M P R F R X 45 _ C -T- M SEATING PLANE DW SUFFIX CASE 751F-04 Plastic Package (SO-28L, SOIC-28) ISSUE E K G 22X 1 -A- 15 14X -B- 1 P 0.010 (0.25) M B M 14 M 28X D R 0.010 (0.25) M T A B S S X 45 _ C 26X -T- G F SEATING PLANE K DW SUFFIX CASE 751G-02 Plastic Package (SO-16L, SOP-16L, SOP-8+8L) ISSUE A -B- 8X P 0.010 (0.25) M B M 8 16X MILLIMETERS MIN MAX 17.80 18.05 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.01 10.55 0.25 0.75 J D 16 1 0.010 (0.25) M T A S B S F R X 45 _ C -T- 14X 13-10 G INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 1 DIM A B C D F G J K M P R J -A- 16 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 28 28 MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 K SEATING PLANE M DIM A B C D F G J K M P R MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751K-01 Plastic Package (SO-16) ISSUE O 16 1 16 S -A- -B- 0.25 (0.010) M B 9 P 1 M_ F DIM A B C D F G J K M P R 8 G R X 45 _ C -T- K J 0.25 (0.010) DW SUFFIX CASE 751N-01 Plastic Package (SOP-16L) ISSUE O SEATING PLANE 14 X D M T A B S S -A- 9 -B- 1 0.010 (0.25) P M B M 8 16 13X 1 J D 0.010 (0.25) M T A S B S F R X 45 _ C -T- S K 9X MOTOROLA ANALOG IC DEVICE DATA SEATING PLANE M MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.368 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. T 16 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R S T MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 2.54 BSC 3.81 BSC INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 0.100 BSC 0.150 BSC G 13-11 CASE 762-01 Plastic Medium Power Package (SIP-9) ISSUE C 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. Q 0.25 (0.010) T A M 1 M -A- -C- U V M X S W E Y R B 9 1 -T- N SEATING PLANE K D M T C 9 PL 0.25 (0.010) FN SUFFIX CASE 775-02 Plastic Package (PLCC-20) ISSUE C 0.25 (0.010) J H G F M T A M Y BRK -N- 0.007 (0.180)M T L-M S N S 0.007 (0.180)M T L-M S N U S D -L- Z -M- W 20 D 1 V G1 X 0.010 (0.250)S T L-M S N S VIEW D-D A 0.007 (0.180)M T L-M S N S R 0.007 (0.180)M T L-M S N S Z H C 0.007 (0.180)M T L-M S N S E G 0.004 (0.100) J -T- SEATING PLANE VIEW S G1 0.010 (0.250)S T L-M S N 13-12 K1 K F S VIEW S 0.007 (0.180)M T L-M S N MILLIMETERS MIN MAX 22.40 23.00 6.40 6.60 3.45 3.65 0.40 0.55 9.35 9.60 1.40 1.60 2.54 BSC 1.51 1.71 0.360 0.400 3.95 4.20 30 _BSC 2.50 2.70 3.15 3.45 13.60 13.90 1.65 1.95 22.00 22.20 0.55 0.75 2.89 BSC 0.65 0.75 2.70 2.80 INCHES MIN MAX 0.873 0.897 0.252 0.260 0.135 1.143 0.015 0.021 0.368 0.377 0.055 0.062 0.100 BSC 0.059 0.067 0.014 0.015 0.155 0.165 30_BSC 0.099 0.106 0.124 0.135 0.535 0.547 0.064 0.076 0.866 0.874 0.021 0.029 0.113 BSC 0.025 0.029 0.106 0.110 NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 1 B M DIM A B C D E F G H J K M N Q R S U V W X Y S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 --- MOTOROLA ANALOG IC DEVICE DATA FN SUFFIX CASE 776-02 Plastic Package (PLCC-28) ISSUE D 1 0.007 (0.180) B T L-M M N S T L-M S S Y BRK -N- 0.007 (0.180) U M N S D Z -M- -L- W 28 D X G1 0.010 (0.250) T L-M S N S S V 1 VIEW D-D A 0.007 (0.180) R 0.007 (0.180) M T L-M S N S C M T L-M S N 0.007 (0.180) H Z M T L-M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) -T- T L-M S N S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA ANALOG IC DEVICE DATA 0.007 (0.180) M T L-M S N S VIEW S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 --- MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 --- 13-13 FN SUFFIX CASE 777-02 Plastic Package (PLCC) ISSUE C 0.007(0.180) M T B L-M 0.007(0.180) M T U N S L-M S S N S 1 -N- Y D BRK Z -M- -L- G1 0.010 (0.25) X VIEW D-D V 44 W 1 D 0.007(0.180) M T L-M S N S R 0.007(0.180) M T L-M S N S T 0.007(0.180) M T H A S L-M S L-M S N S N N S S K1 Z K J C F E 0.007(0.180) M T 0.004 (0.10) -T- SEATING G 0.010 (0.25) S T L-M S N NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. M SUFFIX CASE 803C PRELIMINARY Plastic Package DIM A B C E F G H J K R U V W X Y Z G1 K1 VIEW S S 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 11 K -B- 1 1 10 S 10 PL 0.13 (0.005) M B M N C E MILLIMETERS MIN MAX 17.40 17.65 17.40 17.65 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 16.51 16.66 16.51 16.66 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 15.50 16.00 1.02 --- J G 20 INCHES MIN MAX 0.685 0.695 0.685 0.695 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.650 0.656 0.650 0.656 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.610 0.630 0.040 --- NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER SIDE. 10 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- -F- 20 S VIEW S PLANE G1 L-M D 20 PL 0.13 (0.005) M T B 0.10 (0.004) L S -T- A S SEATING PLANE M DIM A B C D E F G H J K L M N S MILLIMETERS MIN MAX 12.35 12.80 5.10 5.45 1.95 2.05 0.35 0.50 --- 0.81 12.40* 1.15 1.39 0.59 0.81 0.18 0.27 1.10 1.50 0.05 0.20 0_ 10 _ 0.50 0.85 7.40 8.20 INCHES MIN MAX 0.486 0.504 0.201 0.215 0.077 0.081 0.014 0.020 --- 0.032 0.488* 0.045 0.055 0.023 0.032 0.007 0.011 0.043 0.059 0.001 0.008 0_ 10 _ 0.020 0.033 0.291 0.323 *APPROXIMATE 13-14 MOTOROLA ANALOG IC DEVICE DATA TV SUFFIX CASE 821C-04 Plastic Package (15-Pin ZIP) ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 15 SEATING PLANE -T- C E M -Q- B DIM A B C D E G H J K L M R S U V Y -P- U Y K V A R S H PIN 15 PIN 1 L G 15X D 15X 0.010 (0.254) T SUFFIX CASE 821D-03 Plastic Package ISSUE C T P Q M S J 0.024 (0.610) M T 15 SEATING PLANE -T- C B E -P- U DIM A B C D E F G H J K Q R U Y A R K PIN 1 Y PIN 15 G 7X 15X MILLIMETERS MIN MAX 17.374 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 1.270 BSC 4.293 BSC 0.458 0.609 17.780 18.034 5.080 BSC 3.760 3.835 10.567 10.820 3.988 4.242 2.667 2.921 22.047 REF 15.875 16.231 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DELETED 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 Q -L- INCHES MIN MAX 0.684 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.050 BSC 0.169 BSC 0.018 0.024 0.700 0.710 0.200 BSC 0.148 0.151 0.416 0.426 0.157 0.167 0.105 0.115 0.868 REF 0.625 0.639 H F D 0.010 (0.254) 15X M T P L MOTOROLA ANALOG IC DEVICE DATA S J 0.024 (0.610) M INCHES MIN MAX 0.681 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.016 0.023 0.050 BSC 0.110 BSC 0.018 0.024 1.078 1.086 0.148 0.151 0.416 0.426 0.110 BSC 0.503 REF MILLIMETERS MIN MAX 17.298 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 0.407 0.584 1.270 BSC 2.794 BSC 0.458 0.609 27.382 27.584 3.760 3.835 10.567 10.820 2.794 BSC 12.776 REF T 13-15 FTB SUFFIX CASE 824D-01 Plastic Package (TQFP-44) ISSUE O 1 L -T-, -U-, -Z- -Z- 44 34 11 T-U G AE DETAIL AA M V S AE PLATING F BASE METAL EEEE CCCC CCCC EEEE J 23 12 0.20 (0.008) DETAIL AA 0.05 (0.002) Z AC Z S T-U 0.20 (0.008) M B L S -U- AB Z -T- S 33 1 22 N D 0.20 (0.008) A 0.20 (0.008) AB T-U M S Z S S Z S M AC T-U S Z S SECTION AE-AE 0.05 (0.002) T-U S 0.20 (0.008) M AC T-U M C -AB- E 0.10 (0.004) -AC- H Y R K W X VIEW AD 13-16 DETAIL AD Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U- AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.300 0.450 E 1.350 1.450 F 0.300 0.400 G 0.800 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 L 8.000 BSC M 12_REF N 0.090 0.160 Q 1_ 5_ R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 W 0.200 REF X 1.000 REF Y 12_REF INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.315 BSC 12_REF 0.004 0.006 1_ 5_ 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12_REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 824E-02 Plastic Package (QFP) ISSUE A 44 1 S 0.20 (0.008) M -L-, -M-, -N- T L-M S N S H L-M S N S A 0.20 (0.008) M 0.05 (0.002) L-M PIN 1 IDENT J1 44 G J1 34 VIEW Y 33 1 G 11 40X S T L-M M J 0.20 (0.008) VIEW Y BASE METAL B1 D M T L-M S N S SECTION J1-J1 44 PL 22 -N- M VIEW P C E -H- W Y q1 R DATUM PLANE EEE CCC CCC EEE 0.20 (0.008) 23 12 F PLATING V S 0.20 (0.008) M B -M- 0.05 (0.002) N -L- H L-M N N S S 3 PL -H- R K A1 C1 VIEW P MOTOROLA ANALOG IC DEVICE DATA R1 R2 q2 DATUM PLANE 0.01 (0.004) -T- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). DIM A B C D E F G J K M S V W Y A1 B1 C1 R1 R2 q1 q2 MILLIMETERS INCHES MIN MAX MIN MAX 9.90 10.10 0.390 0.398 9.90 10.10 0.390 0.398 2.00 2.21 0.079 0.087 0.30 0.45 0.0118 0.0177 2.00 2.10 0.079 0.083 0.30 0.40 0.012 0.016 0.80 BSC 0.031 BSC 0.13 0.23 0.005 0.009 0.65 0.95 0.026 0.037 5_ 10 _ 5_ 10_ 12.95 13.45 0.510 0.530 12.95 13.45 0.510 0.530 0.000 0.210 0.000 0.008 5_ 10 _ 5_ 10 _ 0.450 REF 0.018 REF 0.130 0.005 0.170 0.007 1.600 REF 0.063 REF 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 5_ 10 _ 5_ 10 _ 0_ 7_ 0_ 7_ 13-17 FB SUFFIX CASE 840F-01 Plastic Package ISSUE O 64 1 L -Z- 64 49 S S T-U 48 T-U 1 -T-, -U-, -Z- -U- DETAIL AA S S AC Z M G DETAIL AA 33 S 16 AE V 0.20 (0.008) -T- AE 0.20 (0.008) M 0.050 (0.002) B Z L AB Z P 32 Z 17 S S Z S F M C SECTION AE-AE -AB- Y D J E H EEE CC EEE CC EEE CC EEE CC EEE N S Z AC T-U S AC T-U M S M 0.20 (0.008) BASE METAL 0.20 (0.008) A 0.20 (0.008) M AB T-U 0.050 (0.002) T-U 0.10 (0.004) -AC- DETAIL AD Q R K W X DETAIL AD 13-18 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U- AND -Z- TO BE DETERMINED AT DATUM PLANE -AC-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.170 0.270 E 1.350 1.450 F 0.170 0.230 G 0.500 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 7.500 BSC L M 12 REF N 0.090 0.160 0.250 BSC P Q 1 5 R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 0.200 REF W 1.000 REF X 12 REF Y INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.295 BSC 12 REF 0.004 0.006 0.010 BSC 5 1 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12 REF MOTOROLA ANALOG IC DEVICE DATA DM SUFFIX CASE 846A-02 Plastic Package (Micro-8) ISSUE C 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. -A- -B- K PIN 1 ID G D 8 PL 0.08 (0.003) -T- M T B S A S SEATING PLANE 0.038 (0.0015) C H MOTOROLA ANALOG IC DEVICE DATA J DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --- 1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 --- 0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 L 13-19 FB SUFFIX CASE 848B-04 Plastic Package (TQFP-52) ISSUE C 1 52 L 39 27 S D S V B -A-, -B-, -D- 0.20 (0.008) 0.20 (0.008) M L B M C A-B S S B H A-B -B- -A- 0.05 (0.002) A-B DETAIL A D 26 40 DETAIL A 14 52 1 13 -D- B 0.20 (0.008) M H A-B F S D S S D S 0.05 (0.002) A-B J V 0.20 (0.008) M C A-B N BASE METAL M_ C D DETAIL C 0.02 (0.008) E -H- M C A-B S D S SECTION B-B DATUM PLANE 0.10 (0.004) H M_ G U_ R Q_ K T W X DETAIL C 13-20 -C- SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N Q R S T U V W X MILLIMETERS MIN MAX 9.90 10.10 9.90 10.10 2.10 2.45 0.22 0.38 2.00 2.10 0.22 0.33 0.65 BSC --- 0.25 0.13 0.23 0.65 0.95 7.80 REF 5_ 10_ 0.13 0.17 0_ 7_ 0.13 0.30 12.95 13.45 0.13 --- 0_ --- 12.95 13.45 0.35 0.45 1.6 REF INCHES MIN MAX 0.390 0.398 0.390 0.398 0.083 0.096 0.009 0.015 0.079 0.083 0.009 0.013 0.026 BSC --- 0.010 0.005 0.009 0.026 0.037 0.307 REF 5_ 10 _ 0.005 0.007 0_ 7_ 0.005 0.012 0.510 0.530 0.005 --- 0_ --- 0.510 0.530 0.014 0.018 0.063 REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 848D-03 Plastic Package ISSUE C 52 1 4X 4X TIPS 0.20 (0.008) H L-M N 0.20 (0.008) T L-M N 52 40 1 CL 39 3X VIEW -X- X=L, M, N AB Y -L- AB -M- B B1 VIEW Y V V1 27 14 26 J -N- A1 S1 EEE CCC EEE CCC EEE BASE METAL F PLATING 13 G 0.13 (0.005) M D T L-M U S N S A SECTION AB-AB S ROTATED 90_ CLOCKWISE 4X C 2 0.10 (0.004) T -H- -T- SEATING PLANE 4X 3 VIEW AA 0.05 (0.002) S W 1 2XR R1 0.25 (0.010) C2 GAGE PLANE K C1 E Z VIEW AA MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 (0.003). DIM A A1 B B1 C C1 C2 D E F G J K R1 S S1 U V V1 W Z 1 2 3 MILLIMETERS MIN MAX 10.00 BSC 5.00 BSC 10.00 BSC 5.00 BSC --- 1.70 0.05 0.20 1.30 1.50 0.20 0.40 0.75 0.45 0.22 0.35 0.65 BSC 0.07 0.20 0.50 REF 0.08 0.20 12.00 BSC 6.00 BSC 0.09 0.16 12.00 BSC 6.00 BSC 0.20 REF 1.00 REF 0_ 7_ --- 0_ 12 _ REF 5_ 13 _ INCHES MIN MAX 0.394 BSC 0.197 BSC 0.394 BSC 0.197 BSC --- 0.067 0.002 0.008 0.051 0.059 0.008 0.016 0.018 0.030 0.009 0.014 0.026 BSC 0.003 0.008 0.020 REF 0.003 0.008 0.472 BSC 0.236 BSC 0.004 0.006 0.472 BSC 0.236 BSC 0.008 REF 0.039 REF 0_ 7_ --- 0_ 12 _ REF 5_ 13 _ 13-21 B SUFFIX CASE 858-01 Plastic Package ISSUE O 42 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010). -A- 42 22 -B- 1 21 DIM A B C D F G H J K L M N L H C -T- SEATING PLANE N G F D 42 PL K 0.25 (0.010) M T A M J 42 PL 0.25 (0.010) S M T B INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S B SUFFIX CASE 859-01 Plastic Package (SDIP) ISSUE O 56 1 -A- 56 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010) 29 -B- 1 28 L H C -T- K SEATING PLANE G F D 56 PL 0.25 (0.010) 13-22 E M T A S N J M 56 PL 0.25 (0.010) M T B DIM A B C D E F G H J K L M N INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.035 BSC 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 0.89 BSC 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S MOTOROLA ANALOG IC DEVICE DATA FB, FTB SUFFIX CASE 873-01 Plastic Package (TQFP-32) ISSUE A 1 L S D S H A-B V P B M S D S 0.20 (0.008) B B 0.20 (0.008) L M -B- -A- 0.05 (0.002) A-B 16 C A-B 17 24 25 -A-, -B-, -D- DETAIL A DETAIL A 32 9 1 8 F BASE METAL -D- A 0.20 (0.008) C A-B M D S S 0.05 (0.002) A-B N J S 0.20 (0.008) M H A-B D S S D 0.20 (0.008) M M C A-B D S S DETAIL C SECTION B-B VIEW ROTATED 90 _CLOCKWISE C E -H- -C- SEATING PLANE H M G DATUM PLANE 0.01 (0.004) U T R -H- DATUM PLANE K X DETAIL C MOTOROLA ANALOG IC DEVICE DATA Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N P Q R S T U V X MILLIMETERS MIN MAX 6.95 7.10 6.95 7.10 1.40 1.60 0.273 0.373 1.30 1.50 0.273 --- 0.80 BSC --- 0.20 0.119 0.197 0.33 0.57 5.6 REF 6_ 8_ 0.119 0.135 0.40 BSC 5_ 10_ 0.15 0.25 8.85 9.15 0.15 0.25 5_ 11_ 8.85 9.15 1.00 REF INCHES MIN MAX 0.274 0.280 0.274 0.280 0.055 0.063 0.010 0.015 0.051 0.059 0.010 --- 0.031 BSC --- 0.008 0.005 0.008 0.013 0.022 0.220 REF 6_ 8_ 0.005 0.005 0.016 BSC 5_ 10_ 0.006 0.010 0.348 0.360 0.006 0.010 5_ 11_ 0.348 0.360 0.039 REF 13-23 T SUFFIX CASE 894-03 Plastic Package (23-Pin SZIP) ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 1 23 C E B -N- L U K Y P F V M S H A R W -T- 23X PIN 1 0.024 (0.610) PIN 23 G 23X D 0.010 (0.254) 13-24 M T Q J SEATING PLANE S N M T DIM A B C D E F G H J K L M N P R S U V W Y INCHES MIN MAX 0.684 0.694 1.183 1.193 0.175 0.179 0.026 0.031 0.058 0.062 0.165 0.175 0.050 BSC 0.169 BSC 0.014 0.020 0.625 0.639 0.770 0.790 0.148 0.152 0.148 0.152 0.390 BSC 0.416 0.424 0.157 0.167 0.105 0.115 0.868 REF 0.200 BSC 0.700 0.710 MILLIMETERS MIN MAX 17.374 17.627 30.048 30.302 4.445 4.547 0.660 0.787 1.473 1.574 4.191 4.445 1.270 BSC 4.293 BSC 0.356 0.508 15.875 16.231 19.558 20.066 3.760 3.861 3.760 3.861 9.906 BSC 10.566 10.770 3.988 4.242 2.667 2.921 22.047 REF 5.080 BSC 17.780 18.034 S MOTOROLA ANALOG IC DEVICE DATA FTA SUFFIX CASE 932-02 Plastic Package (TQFP-48) ISSUE D 1 48 P 4X 0.200 (0.008) AB T-U Z 9 DETAIL Y A A1 48 37 AE 1 AE 36 -T- -U- B V B1 12 25 13 V1 -T-, -U-, -Z- DETAIL Y 24 -Z- S1 M_ TOP & BOTTOM S R 4X 0.200 (0.008) AC T-U Z GAUGE PLANE 0.250 (0.010) C E 0.080 (0.003) AC G -AB- W H Q_ -AC- AD K DETAIL AD X CCC EEE CCC EEE CCC BASE METAL N J F D 0.080 (0.003) M AC T-U S Z S SECTION AE-AE MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BASIC 0.050 0.150 0.090 0.200 0.500 0.700 12 _REF 0.090 0.160 0.250 BASIC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BASIC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BASIC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF 13-25 D2T SUFFIX CASE 936-03 Plastic Package ISSUE B 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 3 TERMINAL 4 K U A S B V H F 1 2 3 DIM A B C D E F G H J K L M N P R S U V J D G 0.010 (0.254) M T -T- OPTIONAL CHAMFER E C M L INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN P N R D2T SUFFIX CASE 936A-02 Plastic Package (D2PAK) ISSUE A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 5 TERMINAL 6 U A V S K B H 1 2 3 4 5 DIM A B C D E G H K L M N P R S U V D 0.010 (0.254) M T G -T- OPTIONAL CHAMFER E C M N INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN L P R 13-26 MOTOROLA ANALOG IC DEVICE DATA 20 DT, DTB SUFFIX CASE 948E-02 Plastic Package (TSSOP-20) ISSUE A 1 20X 0.15 (0.006) T U M 20 L/2 2X K REF 0.10 (0.004) S T U V S K K1 IIII IIII IIII S J J1 11 B L PIN 1 IDENT 0.25 (0.010) N 10 1 0.15 (0.006) T U SECTION N-N -U- M S A -V- N F DETAIL E C G D -W- H 0.100 (0.004) -T- SEATING DTB SUFFIX 16 CASE 948F-01 Plastic Package (TSSOP-16, TSSOP-16L) ISSUE O 1 16X K REF 0.10 (0.004) M T U S V S CCC EEE CCC EEE CCC S K K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. 8 1 S M A -V- N F DETAIL E C 0.10 (0.004) -T- SEATING PLANE MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ -W- H D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N 0.25 (0.010) 0.15 (0.006) T U DIM A B C D F G H J J1 K K1 L M DETAIL E PLANE 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. G DETAIL E MOTOROLA ANALOG IC DEVICE DATA 13-27 DTB SUFFIX CASE 948G-01 Plastic Package (TSSOP-14) ISSUE O 14 1 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A -V- EEE CCC CCC EEE K1 J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE 13-28 D G H DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MOTOROLA ANALOG IC DEVICE DATA DTB SUFFIX CASE 948H-01 Plastic Package ISSUE O 24 1 24X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S 2X 24 L/2 B -U- L PIN 1 IDENT. 12 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 13 S A -V- DIM A B C D F G H J J1 K K1 L M C 0.10 (0.004) -T- SEATING PLANE G D H MILLIMETERS MIN MAX 7.70 7.90 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.303 0.311 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ -W- DETAIL E N 0.25 (0.010) K EEE CCC CCC EEE M K1 J1 N F SECTION N-N J MOTOROLA ANALOG IC DEVICE DATA DETAIL E 13-29 DTB SUFFIX CASE 948J-01 Plastic Package (TSSOP-8) ISSUE O 8 1 0.15 (0.006) T U NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. K REF 8x 0.10 (0.004) S M T U V S S K 2X L/2 EE CCC CCC EE K1 8 5 J J1 B -U- L PIN 1 IDENT. SECTION N-N 4 1 N 0.25 (0.010) 0.15 (0.006) T U S A -V- M N F DETAIL E -W- C 0.10 (0.004) -T- SEATING PLANE G D SEE DETAIL E H M SUFFIX CASE 967-01 Plastic Package (EIAJ-20) ISSUE O INCHES MIN MAX 0.114 0.122 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 1 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) MILLIMETERS MIN MAX 2.90 3.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ 20 20 13-30 DIM A B C D F G H J J1 K K1 L M M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032 MOTOROLA ANALOG IC DEVICE DATA FTB SUFFIX CASE 976-01 Plastic Package (TQFP-20) ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T-U Z A A1 20 DETAIL Y 16 15 1 -T- -U- V B1 V1 11 5 6 10 -Z- S1 MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.650 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B S 4X 0.200 (0.008) AB T-U Z DETAIL AD CCCC EEEE EEEE CCCC EEEE CCCC J -AB- INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.026 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF -AC- N F D 0.080 (0.003) AC 0.080 (0.003) M_ S AC T-U S Z S SECTION AE-AE TOP & BOTTOM R -T-, -U-, -Z- C E AE W H K X DETAIL AD MOTOROLA ANALOG IC DEVICE DATA Q_ AE GAUGE PLANE 0.250 (0.010) G DETAIL Y 13-31 FTA SUFFIX CASE 977-01 Plastic Package ISSUE O 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT DATUM PLANE -AB-. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE -AC-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -AB-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T-U Z A A1 24 -T- DETAIL Y 19 18 1 -U- V DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B V1 13 6 B1 12 7 -Z- S1 S 4X 0.200 (0.008) AB T-U Z MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF DETAIL AD -T-, -U-, -Z- -AB- -AC- AE AE 0.080 (0.003) AC M_ TOP & BOTTOM R C E J W H K X Q_ CCCC EEEE EEEE CCCC EEEE CCCC P G DETAIL Y N F GAUGE PLANE D 0.250 (0.010) 0.080 (0.003) S AC T-U S Z S DETAIL AD SECTION AE-AE 13-32 MOTOROLA ANALOG IC DEVICE DATA N SUFFIX CASE 1212-01 Plastic Package (SOT-23) ISSUE O 1 A B D 5 E A2 0.05 S NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. A1 4 1 2 L 3 E1 L1 B C 5X 0.10 C B M A S C S e e1 H SUFFIX CASE 1213-01 Plastic Package (SOT-89) ISSUE O DIM A1 A2 B C D E E1 e e1 L L1 MILLIMETERS MIN MAX 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.80 3.00 2.50 3.10 1.50 1.80 0.95 BSC 1.90 BSC 0.20 --- 0.45 0.75 1 A D A2 C B D1 E1 E L1 B 0.10 B1 e M C B S A S 2X 0.10 M C B S A S C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. DIM A2 B B1 C D D1 E E1 e e1 L1 MILLIMETERS MIN MAX 1.40 1.60 0.37 0.57 0.32 0.52 0.30 0.50 4.40 4.60 1.50 1.70 --- 4.25 2.40 2.60 1.50 BSC 3.00 BSC 0.80 --- e1 MOTOROLA ANALOG IC DEVICE DATA 13-33