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CUI Inc │ SERIES: PQA30-D │ DESCRIPTION: DC-DC CONVERTER date 07/08/2014 │ page 3 of 7
SAFETY AND COMPLIANCE
parameter conditions/description min typ max units
isolation voltage input to output for 1 minute at 1 mA max. 1,500 Vdc
isolation resistance input to output at 500 Vdc 1,000 MΩ
EMI/EMC CE1
conducted emissions CISPR22/EN55022 class A (no circuit required); class B (external circuit required, see Figure 1-b)
radiated emissions CISPR22/EN55022 class A (no circuit required); class B (external circuit required, see Figure 1-b)
ESD IEC/EN61000-4-2 class B, contact ± 4kV
radiated immunity IEC/EN61000-4-3 class A, 10V/m
EFT/burst IEC/EN61000-4-4 class B, ± 2kV (external circuit required, see Figure 1-a)
surge IEC/EN61000-4-5 class B, ± 2kV (external circuit required, see Figure 1-a)
conducted immunity IEC/EN61000-4-6 class A, 3 Vr.m.s
voltage dips & interruptions IEC/EN61000-4-29 class B, 0%-70%
MTBF as per MIL-HDBK-217F @ 25°C 1,000,000 hours
RoHS 2011/65/EU
Note 1. CE mark is only on models without heatsink.
ENVIRONMENTAL
parameter conditions/description min typ max units
operating temperature see derating curves -40 85 °C
storage temperature -55 125 °C
storage humidity non-condensing 5 95 %
case temperature at full load, operating temperature curve range 105 °C
vibration 10~55Hz, 30 min. along x, y, and z axis 10 G
SOLDERABILITY
parameter conditions/description min typ max units
hand soldering 1.5 mm from case for 10 seconds 300 °C
wave soldering see wave soldering prole 260 °C
MECHANICAL
parameter conditions/description min typ max units
dimensions board mount: 50.80 x 25.40 x 11.80
board mount with heatsink: 50.80 x 25.40 x 16.30
mm
mm
case material aluminum alloy
weight board mount
board mount with heatsink
22
35
g
g
10 Sec. Max.
Wave Soldering Time
4 Sec. Max.
Peak Temp. 260°C Max.
Time (sec.)
Temperature (°C)
250
200
150
100
50
0
For more information, please visit the product page.