Features
1 of 6
Optimum Technology
Matching® Applied
GaAs HBT
InGaP HBT
GaAs MESFET
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Product Description
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
InP HBT
LDMOS
RF MEMS
FMS2024
DC-20GHz MMIC LOW LOSS SPDT
ABSORPTIVE SWITCH
The FMS2024 is a low loss, high isolation broadband single-pole double-throw Gal-
lium Arsenide switch, designed on the FL05 0.5μm switch process from RFMD. It
offers absorptive properties from the output (50Ω termination). This process tech-
nology offers leading-edge performance optimized for switch applications.
The FMS2024 is developed for the broadband communications, instrumentation,
and electronic warfare markets.
V2 V1 RFO1
V3 V4 R FO2
RFIN
V11
V22
V33
V44
V2 V1 RFO1
V3 V4 R FO2
RFIN
V11
V22
V33
V44
Low Insertion Loss: 1.4dB at
20GHz
High Isolation: 37dB at
20GHz
All Reflective Design
Excellent Low Control Voltage
Performance
Applications
Broadband Communications
Test Instrumentation
Fiber Optics
Electronic Warfare (ECM,
ESM)
Rev A1 DS090612
9
Package Style: Bare Die
FMS2024
Parameter Specification Unit Condition
Min. Typ. Max.
Electrical Specifications
(Small-Signal Unless Noted)
TAMBIENT=25°C, VCTRL =0V/-5V, ZIN =ZOUT=50Ω
Insertion Loss -1 -0.7 dB DC
-1.25 -0.85 dB 5GHz
-1.6 -1.1 dB 10GHz
-1.6 -1.2 dB 15GHz
-1.8 -1.35 dB 20GHz
Isolation -37 -34 dB DC-20GHz
Input Return Loss -14 -11 dB DC-20GHz
Output Return Loss -15 -11 dB DC-20GHz
P1dB 23 28 dBm 2GHz
22 24 dBm 10GHz
22 24 dBm 20GHz
2 of 6 Rev A1 DS090612
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
FMS2024
Notes: -5V±0.2 V; -0V±0.2 V; V11, V22, V33, and V44 are alternative control lines to V1, V2, V3, and V4 respectively.
Pad Layout
Note: Coordinates are referenced from the bottom left hand
corner of the die to the center of the bond pad opening.
Absolute Maximum Ratings1
Parameter Rating Unit
Maximum Input Power (PIN)+27dBm
Control Voltage (VCTRL)+1/-10V
Operating Temperature (TOPER) -40 to 85 °C
Storage Temperature (TSTOR) -55 to 150 °C
Truth Table
Control Line RF Path
V1 or V11 V2 or V22 V3 or V33 V4 or V44 RFIN-RFO1 RFIN-RFO2
-5V 0V -5V 0V On Off
0V -5V 0V -5V Off On
0V -5V -5V 0V Off Off
Pad Description Pin Coordinates (μm)
RFIN RFIN 116, 1055
RFO1 RFOUT1 1408, 1929
RFO2 RFOUT2 1408, 181
V1 V1 645, 1929
V2 V2 395, 1929
V3 V3 395, 181
V4 V4 645, 181
V11 V11 1735, 1608
V22 V22 1753, 1408
V33 V33 1753, 702
V44 V44 1753, 502
Die Size (μm) Die Thickness (μm) Min. Bond Pad Pitch (μm) Min. Bond Pad Opening (μmxμm)
1910x 2110 100 150 116x116
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
3 of 6Rev A1 DS090612
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
FMS2024
Typical Measured Performance On Wafer
Measurement Conditions: VCTRL=5V (low) and 0V (high), TAMBIENT=25°C unless otherwise stated.
Insertion Loss
-1.40
-1.20
-1.00
-0.80
-0.60
-0.40
-0.20
0.00
02468101214161820
Frequency (GHz)
S21 (dB)
Isolation
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
02468101214161820
Frequency (GHz)
S21 (dB)
Inp ut Retur n L o ss
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
02468101214161820
F requency (GHz)
S11 (dB)
Out put Re tu r n Lo ss
-45.00
-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
0 2 4 6 8 101214161820
Fr equency (GHz)
S22 (dB)
4 of 6 Rev A1 DS090612
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
FMS2024
Typical Measured Performance On-Wafer Over Temperature
Measurement Conditions: VCTRL=-5V (low) and 0V (high).
TAMBIENT =25°C, TCOLD=-40°C, THOT=+85°C
Insertion Loss
-1.50
-1.30
-1.10
-0.90
-0.70
-0.50
-0.30
-0.10
0.10
02468101214161820
Frequency (GHz)
S21 (dB)
Input Return L o ss
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
02468101214161820
F requency (GHz)
S11 (dB)
5 of 6Rev A1 DS090612
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
FMS2024
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally
it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense
Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150°C for one hour in an oven
especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au
20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used depends on
the leadframe material used and the particular application. The maximum time at used should be kept to a minimum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. Bond force, time stage temperature and ultrasonics are all critical parameters and the settings are dependent on the
setup and application being used. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
Handling Precautions
To avoid damage to the devices, care should be exercised during handling. Proper Electro-
static Discharge (ESD) precautions should be observed at all stages of storage, handling,
assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No.
22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpack-
aged part and therefore no MSL rating applies.
Application Notes and Design Data
Application Notes and design data including S-parameters are available on request from www.rfmd.com.
Reliability
An MTTF of in excess of 9 million hours at a channel temperature of 150°C is achieved for the process used to manufacture
this device.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
Delivery Quantity Ordering Code
Full Pack (100) FMS2024-000
Small Quantity (25) FMS2024-000SQ
Small Quantity (3) FMS2024-000S3
6 of 6 Rev A1 DS090612
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
FMS2024