10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer HMC554ALC3B Data Sheet FUNCTIONAL BLOCK DIAGRAM NIC 10 GND 1 9 GND LO 2 8 RF GND 3 7 GND 4 5 6 PACKAGE BASE GND 13895-001 NIC 11 GND Microwave and very small aperture terminal (VSAT) radios Test equipment Military electronic warfare (EW); electronic countermeasure (ECM); and command, control, communications and intelligence (C3I) 12 IF APPLICATIONS NIC HMC554ALC3B Conversion loss: 8.5 dB LO to RF isolation: 37 dB Input IP3: 20 dBm RoHS compliant, 2.90 mm x 2.90 mm, 12-terminal LCC package GND FEATURES Figure 1. GENERAL DESCRIPTION The HMC554ALC3B is a general-purpose, double balanced mixer in a leadless RoHS compliant leadless chip carrier (LCC) package that can be used as an upconverter or downconverter between 10 GHz and 20 GHz. This mixer is fabricated in a gallium arsenide (GaAs) metal semiconductor field effect transistor (MESFET) process and requires no external Rev. A components or matching circuitry. The HMC554ALC3B provides excellent local oscillator (LO) to RF and LO to intermediate frequency (IF) isolation due to optimized balun structures. The RoHS compliant HMC554ALC3B eliminates the need for wire bonding and is compatible with high volume surface-mount manufacturing techniques. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2018-2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC554ALC3B Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Downconverter Performance, IF = 3000 MHz ...................... 10 Applications ....................................................................................... 1 Upconverter Performance, IFIN = 100 MHz ........................... 13 Functional Block Diagram .............................................................. 1 Upconverter Performance, IFIN = 3000 MHz ......................... 16 General Description ......................................................................... 1 Isolation and Return Loss ......................................................... 19 Revision History ............................................................................... 2 IF Bandwidth--Downconverter ............................................... 21 Specifications..................................................................................... 3 Spurious and Harmonics Performance ................................... 23 Absolute Maximum Ratings............................................................ 4 Theory of Operation ...................................................................... 24 Thermal Resistance ...................................................................... 4 Applications Information .............................................................. 25 ESD Caution .................................................................................. 4 Typical Application Circuit ....................................................... 25 Pin Configuration and Function Descriptions ............................. 5 Evaluation PCB Information .................................................... 25 Interface Schematics..................................................................... 5 Outline Dimensions ....................................................................... 26 Typical Performance Characteristics ............................................. 6 Ordering Guide .......................................................................... 26 Downconverter Performance, IF = 100 MHz ........................... 6 REVISION HISTORY 10/2019--Rev. 0 to Rev. A Changes to 10 GHz to 20 GHz Performance, Downconverter, Input 1 dB Compression Point Parameter, Table 1 and 12 GHz to 16 GHz Performance, Downconverter, Input 1 dB Compression Point Parameter, Table 1 .................................................................... 3 Changes to Figure 13 and Figure 15 ............................................... 7 Changes to Figure 27 and Figure 30 ............................................. 10 4/2018--Revision 0: Initial Version Rev. A | Page 2 of 26 Data Sheet HMC554ALC3B SPECIFICATIONS TA = 25C, IF = 100 MHz, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the evaluation printed circuit board (PCB). Table 1. Parameter FREQUENCY RF Pin IF Pin LO Pin LO AMPLITUDE 10 GHz TO 20 GHz PERFORMANCE Downconverter Conversion Loss Single Sideband Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Isolation RF to IF LO to RF LO to IF 12 GHz TO 16 GHz PERFORMANCE Downconverter Conversion Loss Single Sideband Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Symbol Min 10 DC 10 9 SSB NF IP3 P1dB IP2 IFIN 19 IP3 P1dB Rev. A | Page 3 of 26 Max Unit 13 20 6 20 15 GHz GHz GHz dBm 11.5 dB dB dBm dBm dBm 8.5 9.5 20 10 46 7 19.5 10 dB dBm dBm 24 25 23 41 37 41 dB dB dB 16 8 9 19.5 9.5 45 dB dB dBm dBm dBm 6.5 18 10 dB dBm dBm IP3 P1dB SSB NF IP3 P1dB IP2 IFIN Typ HMC554ALC3B Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter RF Input Power LO Input Power IF Input Power IF Source/Sink Current Reflow Temperature Maximum Junction Temperature Continuous Power Dissipation, PDISS (TA = 85C, Derate 3.7 mW/C Above 85C) Operating Temperature Range Storage Temperature Range Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Field Induced Charged Device Model (FICDM) Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. Rating 25 dBm 26 dBm 25 dBm 3 mA 260C 175C 333 mW JA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. JC is the junction to case thermal resistance. Table 3. Thermal Resistance -40C to +85C -65C to +150C 250 V; Class 0B 1250 V; Class IV Package Type E-12-41 1 JA 120 Test Condition 1: JEDEC standard JESD51-2. ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 26 JC 195 Unit C/W Data Sheet HMC554ALC3B PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC554ALC3B NIC NIC NIC TOP VIEW (Not to Scale) 12 11 10 9 GND GND 1 LO 2 8 RF GND 3 5 6 IF GND PACKAGE BASE GND NOTES 1. NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF/DC GROUND. PERFORMANCE IS NOT AFFECTED. 2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 13895-002 4 GND 7 GND Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 3, 4, 6, 7, 9 2 5 Mnemonic GND LO IF 8 10, 11, 12 RF NIC EPAD Description Ground. These pins and package bottom must be connected to RF/dc ground. LO Port. This pin is ac-coupled and matched to 50 . IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source/sink more than 3 mA of current or die malfunction and possible die failure may result. RF Port. This pin is ac-coupled and matched to 50 . Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected. Exposed Pad. The exposed pad must be connected to RF/dc ground. INTERFACE SCHEMATICS IF 13895-005 13895-003 GND Figure 3. GND Interface Schematic Figure 5. IF Interface Schematic RF 13895-004 13895-006 LO Figure 6. RF Interface Schematic Figure 4. LO Interface Schematic Rev. A | Page 5 of 26 HMC554ALC3B Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE, IF = 100 MHz -5 -5 -6 -6 -7 -7 -8 -9 -10 -11 TA = +85C TA = +25C TA = -40C 13 14 15 16 17 18 19 20 -14 10 25 20 20 INPUT IP3 (dBm) 25 15 10 TA = +85C TA = +25C TA = -40C 12 13 14 15 16 17 18 19 20 RF FREQUENCY 12 10 10 NOISE FIGURE (dB) 12 8 6 TA = +85C TA = +25C TA = -40C 12 13 LO LO LO LO 11 14 15 16 17 18 19 17 18 19 20 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 8 6 4 LO LO LO LO 2 20 RF FREQUENCY 13895-009 11 16 Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 14 0 10 15 RF FREQUENCY 14 2 14 10 0 10 Figure 8. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 4 13 15 5 13895-011 11 12 Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 5 11 = 15dBm = 13dBm = 11dBm = 9dBm RF FREQUENCY 30 0 10 LO LO LO LO 13895-008 12 13895-007 11 Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm INPUT IP3 (dBm) -11 -13 RF FREQUENCY NOISE FIGURE (dB) -10 -12 -13 -14 10 -9 Figure 9. Noise Figure vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 RF FREQUENCY 17 18 19 20 13895-012 -12 -8 13895-010 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Upper Sideband (Low-Side LO) Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 6 of 26 Data Sheet HMC554ALC3B 20 20 18 16 12 10 8 TA = +85C TA = +25C TA = -40C 4 LO LO LO LO 5 2 10 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY 0 10 13895-015 0 60 50 50 INPUT IP2 (dBm) 60 40 30 11 12 13 15 16 17 18 19 20 RF FREQUENCY 15 16 17 18 19 20 30 LO LO LO LO 10 14 14 40 20 TA = +85C TA = +25C TA = -40C 13895-016 INPUT IP2 (dBm) 70 0 10 13 Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25C 70 10 12 RF FREQUENCY Figure 13. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 20 11 = 15dBm = 13dBm = 11dBm = 9dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Figure 14. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm Rev. A | Page 7 of 26 13895-014 6 10 13895-013 INPUT P1dB (dBm) INPUT P1dB (dBm) 15 14 HMC554ALC3B Data Sheet -5 -5 -6 -6 -7 -7 -9 -10 TA = +85C TA = +25C TA = -40C -12 12 13 14 15 16 17 18 19 20 -14 10 13895-017 11 Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 25 25 20 20 INPUT IP3 (dBm) 30 15 10 TA = +85C TA = +25C TA = -40C 5 11 12 13 14 15 16 17 18 19 20 12 10 10 NOISE FIGURE (dB) 12 8 6 TA = +85C TA = +25C TA = -40C 13 LO LO LO LO 11 14 15 16 17 18 19 16 17 18 19 20 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 8 6 4 LO LO LO LO 2 20 RF FREQUENCY 13895-019 12 15 Figure 21. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 14 11 14 RF FREQUENCY 14 0 10 13 10 0 10 Figure 18. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 2 12 15 5 RF FREQUENCY 4 11 = 15dBm = 13dBm = 11dBm = 9dBm Figure 20. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 0 10 LO LO LO LO RF FREQUENCY 13895-018 INPUT IP3 (dBm) -11 -13 RF FREQUENCY NOISE FIGURE (dB) -10 -12 -13 -14 10 -9 Figure 19. Noise Figure vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 RF FREQUENCY 17 18 19 20 13895-022 -11 -8 13895-021 -8 13895-020 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Lower Sideband (High-Side LO) Figure 22. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 8 of 26 HMC554ALC3B 70 60 60 50 50 40 30 20 0 10 11 12 13 30 20 TA = +85C TA = +25C TA = -40C 10 40 LO LO LO LO 10 14 15 16 17 18 19 RF FREQUENCY 20 Figure 23. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 9 of 26 13895-024 INPUT IP2 (dBm) 70 13895-023 INPUT IP2 (dBm) Data Sheet HMC554ALC3B Data Sheet DOWNCONVERTER PERFORMANCE, IF = 3000 MHz Upper Sideband (Low-Side LO) -5 TA = +85C TA = +25C TA = -40C CONVERSION GAIN (dB) -7 -8 -9 -10 -11 -11 -13 11 12 13 14 15 16 17 18 19 20 Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm -14 10 25 25 20 20 INPUT IP3 (dBm) 30 10 TA = +85C TA = +25C TA = -40C 5 0 10 11 12 13 15 16 17 18 19 20 RF FREQUENCY 13 14 15 16 17 18 19 20 15 10 LO LO LO LO 5 14 12 Figure 28. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 15 11 RF FREQUENCY 0 10 13895-026 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 26. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 29. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 20 20 15 INPUT P1dB (dBm) 15 LO LO LO LO 10 5 = 15dBm = 13dBm = 11dBm = 9dBm 10 5 0 10 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY 13895-029 TA = +85C TA = +25C TA = -40C Figure 27. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 30. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 10 of 26 13895-031 INPUT IP3 (dBm) -10 -13 RF FREQUENCY INPUT P1dB (dBm) -9 -12 -14 10 = 15dBm = 13dBm = 11dBm = 9dBm -8 -12 13895-025 CONVERSION GAIN (dB) -7 LO LO LO LO -6 13895-028 -6 13895-027 -5 HMC554ALC3B 70 60 60 50 50 40 30 20 0 10 11 12 13 30 20 TA = +85C TA = +25C TA = -40C 10 40 LO LO LO LO 10 14 15 16 17 18 19 RF FREQUENCY 20 Figure 31. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 11 of 26 13895-032 INPUT IP2 (dBm) 70 13895-030 INPUT IP2 (dBm) Data Sheet HMC554ALC3B Data Sheet Lower Sideband (High-Side LO) -5 TA = +85C TA = +25C TA = -40C CONVERSION GAIN (dB) -7 -9 -10 -11 -10 -11 -13 -13 11 12 13 14 15 16 17 18 19 20 Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm -14 10 25 25 20 20 INPUT IP3 (dBm) 30 10 TA = +85C TA = +25C TA = -40C 5 0 10 11 12 13 15 16 17 18 19 20 RF FREQUENCY 10 0 10 60 60 50 50 INPUT IP2 (dBm) 70 40 30 11 12 13 LO LO LO LO 11 15 16 17 18 19 17 18 19 20 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 30 LO LO LO LO 10 14 16 40 20 TA = +85C TA = +25C TA = -40C 20 RF FREQUENCY 13895-035 0 10 15 Figure 37. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 70 10 14 RF FREQUENCY Figure 34. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 20 13 15 5 14 12 Figure 36. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 15 11 RF FREQUENCY 13895-034 INPUT IP3 (dBm) -9 -12 RF FREQUENCY INPUT IP2 (dBm) -8 -12 -14 10 = 15dBm = 13dBm = 11dBm = 9dBm 13895-037 -8 13895-033 CONVERSION GAIN (dB) -7 LO LO LO LO -6 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 38. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Figure 35. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 12 of 26 13895-038 -6 13895-036 -5 Data Sheet HMC554ALC3B UPCONVERTER PERFORMANCE, IFIN = 100 MHz -5 -6 -6 -7 -7 -9 -10 TA = +85C TA = +25C TA = -40C -11 -10 -13 -13 11 12 13 14 15 16 17 18 19 20 Figure 39. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm -14 10 25 20 20 INPUT IP3 (dBm) 25 TA = +85C TA = +25C TA = -40C 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY 15 16 17 18 19 20 10 0 10 LO LO LO LO 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 40. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 43. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 30 30 TA = +85C TA = +25C TA = -40C LO LO LO LO 25 INPUT P1dB (dBm) 25 20 15 10 5 = 15dBm = 13dBm = 11dBm = 9dBm 20 15 10 5 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY 13895-043 0 10 14 Figure 41. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 44. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 13 of 26 13895-045 0 10 13 15 5 13895-040 5 12 Figure 42. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 10 11 = 15dBm = 13dBm = 11dBm = 9dBm RF FREQUENCY 30 15 LO LO LO LO -11 -12 RF FREQUENCY INPUT IP3 (dBm) -9 -12 -14 10 INPUT P1dB (dBm) -8 13895-042 -8 13895-041 CONVERSION GAIN (dB) -5 13895-039 CONVERSION GAIN (dB) Upper Sideband (Low-Side LO) Data Sheet 70 60 60 50 50 40 30 20 0 10 11 12 13 30 20 TA = +85C TA = +25C TA = -40C 10 40 LO LO LO LO 10 14 15 16 17 18 19 20 RF FREQUENCY Figure 45. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 46. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 14 of 26 13895-046 INPUT IP2 (dBm) 70 13895-044 INPUT IP2 (dBm) HMC554ALC3B Data Sheet HMC554ALC3B -5 -5 -6 -6 -7 -7 -9 -10 TA = +85C TA = +25C TA = -40C -12 12 13 14 15 16 17 18 19 20 -14 10 13895-047 11 Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 25 25 20 20 INPUT IP3 (dBm) 30 15 10 TA = +85C TA = +25C TA = -40C 5 11 12 13 14 15 16 17 18 19 20 60 50 50 INPUT IP2 (dBm) 60 40 30 11 14 15 16 17 18 19 20 RF FREQUENCY 16 17 18 19 20 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 40 30 LO LO LO LO 10 13895-049 13 LO LO LO LO 20 TA = +85C TA = +25C TA = -40C 12 15 Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 70 11 14 RF FREQUENCY 70 0 10 13 10 0 10 Figure 48. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 10 12 15 5 RF FREQUENCY 20 11 = 15dBm = 13dBm = 11dBm = 9dBm Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 0 10 LO LO LO LO RF FREQUENCY 13895-048 INPUT IP3 (dBm) -11 -13 RF FREQUENCY INPUT IP2 (dBm) -10 -12 -13 -14 10 -9 Figure 49. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 52. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 15 of 26 13895-052 -11 -8 13895-051 -8 13895-050 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Lower Sideband (High-Side LO) HMC554ALC3B Data Sheet UPCONVERTER PERFORMANCE, IFIN = 3000 MHz Upper Sideband (Low-Side LO) -5 TA = +85C TA = +25C TA = -40C CONVERSION GAIN (dB) -7 -8 -9 -10 -11 -11 -13 11 12 13 14 15 16 17 18 19 20 Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm -14 10 25 25 20 20 INPUT IP3 (dBm) 30 10 TA = +85C TA = +25C TA = -40C 5 11 12 13 14 15 16 17 14 15 16 17 18 19 20 18 19 20 15 10 LO LO LO LO 5 RF FREQUENCY 0 10 11 12 13 14 15 16 17 = 15dBm = 13dBm = 11dBm = 9dBm 18 19 20 RF FREQUENCY Figure 54. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 30 30 TA = +85C TA = +25C TA = -40C LO LO LO LO 25 INPUT P1dB (dBm) 25 20 15 10 5 = 15dBm = 13dBm = 11dBm = 9dBm 20 15 10 5 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY 13895-057 0 10 13 Figure 55. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 16 of 26 13895-059 0 10 12 Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 15 11 RF FREQUENCY 13895-054 INPUT IP3 (dBm) -10 -13 RF FREQUENCY INPUT P1dB (dBm) -9 -12 -14 10 = 15dBm = 13dBm = 11dBm = 9dBm -8 -12 13895-053 CONVERSION GAIN (dB) -7 LO LO LO LO -6 13895-056 -6 13895-055 -5 HMC554ALC3B 70 60 60 50 50 40 30 20 0 10 11 12 13 30 20 TA = +85C TA = +25C TA = -40C 10 40 LO LO LO LO 10 14 15 16 17 18 19 20 RF FREQUENCY Figure 59. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 60. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 17 of 26 13895-060 INPUT IP2 (dBm) 70 13895-058 INPUT IP2 (dBm) Data Sheet HMC554ALC3B Data Sheet Lower Sideband (High-Side LO) -5 -7 CONVERSION GAIN (dB) -8 -9 -10 -11 15 16 17 18 19 20 Figure 61. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 10 25 25 20 20 INPUT IP3 (dBm) 30 10 TA = +85C TA = +25C TA = -40C 5 0 10 11 12 13 15 16 17 18 19 20 RF FREQUENCY 60 50 50 INPUT IP2 (dBm) 60 40 30 13 11 14 15 16 17 18 19 20 RF FREQUENCY 19 20 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 40 30 LO LO LO LO 10 13895-063 12 LO LO LO LO 20 TA = +85C TA = +25C TA = -40C 11 18 Figure 65. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25C 70 0 10 17 RF FREQUENCY 70 10 16 10 0 10 Figure 62. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 20 15 15 5 14 14 Figure 64. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25C 30 15 11 RF FREQUENCY 13895-062 INPUT IP3 (dBm) -14 13895-061 14 RF FREQUENCY INPUT IP2 (dBm) -11 -13 13 13 -10 -13 12 12 -9 -12 11 = 15dBm = 13dBm = 11dBm = 9dBm -8 -12 -14 10 LO LO LO LO 13895-065 -7 CONVERSION GAIN (dB) -6 TA = +85C TA = +25C TA = -40C Figure 63. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 RF FREQUENCY Figure 66. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 18 of 26 13895-066 -6 13895-064 -5 Data Sheet HMC554ALC3B 70 60 60 50 40 30 20 TA = +85C TA = +25C TA = -40C 10 11 12 13 14 15 16 17 18 19 20 Figure 67. LO to RF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 17 18 19 20 Figure 70. LO to RF Isolation vs. RF Frequency at Various LO Power levels, TA = 25C 70 60 30 20 TA = +85C TA = +25C TA = -40C 11 12 13 40 30 20 14 15 16 17 18 19 20 RF FREQUENCY (GHz) Figure 68. LO to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 10 60 RF TO IF ISOLATION (dB) 60 40 30 TA = +85C TA = +25C TA = -40C 11 12 13 14 15 16 17 RF FREQUENCY (GHz) 18 19 20 Figure 69. RF to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 13 14 15 16 17 18 19 20 50 40 30 20 LO LO LO LO 10 0 10 13895-069 10 12 Figure 71. LO to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25C 70 50 11 = 15dBm = 13dBm = 11dBm = 9dBm RF FREQUENCY (GHz) 70 20 LO LO LO LO 10 13895-068 10 50 13895-071 LO TO IF OSILATION (dB) 40 0 10 LO LO LO LO RF FREQUENCY 50 LO TO IF ISOLATION (dB) 20 0 10 60 RF TO IF ISOLATION (dB) 30 10 RF FREQUENCY 0 10 40 11 = 15dBm = 13dBm = 11dBm = 9dBm 12 13 14 15 16 RF FREQUENCY 17 18 19 20 13895-072 0 10 50 13895-070 LO TO RF ISOLATION (dB) 70 13895-067 LO TO RF ISOLATION (dB) ISOLATION AND RETURN LOSS Figure 72. RF to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 19 of 26 Data Sheet 0 0 -5 -5 -10 -10 IF RETURN LOSS (dB) -15 -20 -25 -20 LO LO LO LO -25 = 15dBm = 13dBm = 11dBm = 9dBm -30 -30 10 11 12 13 14 15 16 17 18 19 20 LO FREQUENCY (GHz) 13895-073 -35 -35 0 -5 -10 -15 -20 -25 LO LO LO LO = 15dBm = 13dBm = 11dBm = 9dBm 12 13 11 14 15 16 17 18 19 20 RF FREQUENCY 13895-074 -30 -35 10 0 1 2 3 4 5 6 IF FREQUENCY Figure 75. IF Return Loss vs. IF Frequency at LO Power Levels, TA = 25C, LO = 15 GHz Figure 73. LO Return Loss vs. LO Frequency at LO = 13 dBm, TA = 25C RF RETURN LOSS (dB) -15 Figure 74. RF Return Loss vs. RF Frequency at LO Power Levels, TA = 25C, LO = 15 GHz Rev. A | Page 20 of 26 13895-075 LO RETURN LOSS (dB) HMC554ALC3B Data Sheet HMC554ALC3B IF BANDWIDTH--DOWNCONVERTER Upper Sideband, LO Frequency = 12 GHz -5 -6 CONVERSION GAIN (dB) -7 -8 -9 -10 -11 -10 -11 -13 -13 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH Figure 76. Conversion Gain vs. IF Frequency at Various Temperatures, LO = 13 dBm -14 1.0 25 25 20 20 INPUT IP3 (dBm) 30 TA = +85C TA = +25C TA = -40C 10 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 15 LO LO LO LO 10 = 15dBm = 13dBm = 11dBm = 9dBm 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH Figure 77. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH Figure 79. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 21 of 26 13895-079 5 5 0 1.0 2.0 Figure 78. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 25C 30 15 1.5 IF BANDWIDTH 13895-077 INPUT IP3 (dBm) -9 -12 -14 1.0 = 15dBm = 13dBm = 11dBm = 9dBm -8 -12 13895-076 CONVERSION GAIN (dB) -7 LO LO LO LO -6 TA = +85C TA = +25C TA = -40C 13895-078 -5 HMC554ALC3B Data Sheet Lower Sideband, LO Frequency = 19 GHz -5 CONVERSION GAIN (dB) -7 -8 -9 -10 -11 -10 -11 -13 -13 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH Figure 80. Conversion Gain vs. IF Frequency at Various Temperatures, LO = 13 dBm -14 1.0 25 25 20 20 INPUT IP3 (dBm) 30 10 TA = +85C TA = +25C TA = -40C 5 0 1.0 1.5 2.0 2.5 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 15 10 LO LO LO LO 5 3.0 2.0 Figure 82. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 25C 30 15 1.5 IF BANDWIDTH 13895-081 INPUT IP3 (dBm) -9 -12 -14 1.0 = 15dBm = 13dBm = 11dBm = 9dBm -8 -12 13895-080 CONVERSION GAIN (dB) -7 LO LO LO LO -6 TA = +85C TA = +25C TA = -40C Figure 81. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm 0 1.0 1.5 = 15dBm = 13dBm = 11dBm = 9dBm 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF BANDWIDTH Figure 83. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25C Rev. A | Page 22 of 26 13895-083 -6 13895-082 -5 Data Sheet HMC554ALC3B SPURIOUS AND HARMONICS PERFORMANCE Mixer spurious products are measured in dBc from the IF output power level. N/A means not applicable. LO Harmonics M x N Spurious Outputs Downconverter, Upper Sideband Spur values are (M x RF) - (N x LO). RF = 15.1 GHz at -10 dBm, LO = 15 GHz at 13 dBm. LO = 13 dBm, all values in dBc below input LO level and measured at RF port. Table 5. LO Harmonics at RF LO Frequency (GHz) 12 13 15 16 18 19 21 N x LO Spur at RF Port 2 3 4 39 59 57 40 70 N/A 48 49 N/A 56 50 N/A 54 N/A N/A 53 N/A N/A 46 N/A N/A 1 39 38 38 37 36 36 36 M x RF 0 N/A 48 75 65 N/A N/A 0 1 2 3 4 5 5 N/A N/A 68 71 78 88 Spur values are (M x IF) + (N x LO). IFIN = 100 MHz at -10 dBm, LO = 15 GHz at 13 dBm. Table 6. LO Harmonics at IF 1 38 41 44 42 44 53 47 4 N/A 65 74 78 88 81 Upconverter, Upper Sideband LO = 13 dBm, all values in dBc below input LO level and measured at IF port. LO Frequency (GHz) 12 13 15 16 18 19 21 1 14 0 77 74 60 N/A N x LO 2 3 47 27 70 72 60 79 79 70 74 80 56 72 N x LO Spur at IF Port 2 3 4 77 67 89 63 74 N/A 72 56 N/A 53 56 N/A 79 N/A N/A 70 N/A N/A 75 N/A N/A M x IF Rev. A | Page 23 of 26 -5 -4 0 89 88 N x LO 1 2 80 73 79 73 -3 91 66 74 66 -2 -1 91 36 67 0 74 35 66 20 0 N/A 6 17 22 +1 36 0 35 19 +2 88 63 73 65 +3 90 63 74 66 +4 90 80 73 65 +5 88 78 72 66 3 67 68 HMC554ALC3B Data Sheet THEORY OF OPERATION The HMC554ALC3B is a general-purpose, double balanced mixer that can be used as an upconverter or a downconverter from 10 GHz to 20 GHZ. When used as an upconverter, the mixer upconverts intermediate frequencies between dc and 6 GHz to radio frequencies between 10 GHz and 20 GHz. When used as a downconverter, the HMC554ALC3B downconverts RF between 10 GHz and 20 GHz to IF between dc and 6 GHz. Rev. A | Page 24 of 26 Data Sheet HMC554ALC3B APPLICATIONS INFORMATION Use RF circuit design techniques for the circuit board used in the application. Ensure that signal lines have 50 impedance and connect the package ground leads and the exposed pad directly to the ground plane (see Figure 84). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 85 is available from Analog Devices, Inc., upon request. NIC Figure 84 shows the typical application circuit for the HMC554ALC3B. The HMC554ALC3B is a passive device and does not require any external components. The IF pin is internally dc-coupled. The RF and LO pins are internally ac-coupled. When IF operation to dc is not required, using an external series capacitor is recommended, of a value chosen to pass the necessary IF frequency range. When IF operation to dc is required, do not exceed the IF source and sink current rating specified in the Absolute Maximum Ratings section. NIC EVALUATION PCB INFORMATION NIC TYPICAL APPLICATION CIRCUIT 12 11 10 Table 7. List of Materials for Evaluation PCB EV1HMC554ALC3B Item J1, J2 J3 U1 PCB1 HMC554ALC3B GND 9 2 8 GND 3 7 LO GND RF RF GND 1 6 117611-1 is the raw bare PCB identifier. Reference EV1HMC554ALC3B when ordering complete evaluation PCB. 13895-084 GND 5 IF 4 GND IF Figure 84. Typical Application Circuit LO RF 117611-1 J1 554A J2 IF U1 J3 Figure 85. Evaluation PCB Top Layer Rev. A | Page 25 of 26 13895-085 LO 1 Description PCB mount SRI 2.92 mm connectors PCB mount Johnson SMA connector HMC554ALC3B 117611-1 evaluation board on Rogers 4350 HMC554ALC3B Data Sheet OUTLINE DIMENSIONS 0.36 0.30 0.24 0.08 BSC 10 0.50 BSC PIN 1 12 1 9 EXPOSED PAD 3 7 6 TOP VIEW 0.90 0.80 0.70 0.32 BSC 1.60 1.50 SQ 1.40 4 BOTTOM VIEW 1.00 REF 2.10 BSC SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-004837 SEATING PLANE 03-02-2017-A PIN 1 INDICATOR 3.05 2.90 SQ 2.75 Figure 86. 12-Terminal Ceramic Leadless Chip Carrier (LCC) (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC554ALC3B HMC554ALC3BTR HMC554ALC3BTR-R5 EV1HMC554ALC3B 1 2 Temperature Range -40C to +85C -40C to +85C -40C to +85C MSL Rating2 MSL3 MSL3 MSL3 All models are RoHS compliant. The peak reflow temperature is 260C. See the Absolute Maximum Ratings section, Table 2. (c)2018-2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13895-0-10/19(A) Rev. A | Page 26 of 26 Package Description 12-Terminal Ceramic [LCC] 12-Terminal Ceramic [LCC] 12-Terminal Ceramic [LCC] Evaluation PCB Assembly Package Option E-12-4 E-12-4 E-12-4