10 GHz to 20 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC554ALC3B
Rev. A Document Feedback
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FEATURES
Conversion loss: 8.5 dB
LO to RF isolation: 37 dB
Input IP3: 20 dBm
RoHS compliant, 2.90 mm × 2.90 mm, 12-terminal LCC package
APPLICATIONS
Microwave and very small aperture terminal ( VSAT) radios
Test equipment
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
HMC554ALC3B
13895-001
Figure 1.
GENERAL DESCRIPTION
The HMC554ALC3B is a general-purpose, double balanced
mixer in a leadless RoHS compliant leadless chip carrier (LCC)
package that can be used as an upconverter or downconverter
between 10 GHz and 20 GHz. This mixer is fabricated in a
gallium arsenide (GaAs) metal semiconductor field effect
transistor (MESFET) process and requires no external
components or matching circuitry. The HMC554ALC3B
provides excellent local oscillator (LO) to RF and LO to
intermediate frequency (IF) isolation due to optimized balun
structures. The RoHS compliant HMC554ALC3B eliminates the
need for wire bonding and is compatible with high volume
surface-mount manufacturing techniques.
HMC554ALC3B Data Sheet
Rev. A | Page 2 of 26
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance, IF = 100 MHz ........................... 6
Downconverter Performance, IF = 3000 MHz ...................... 10
Upconverter Performance, IFIN = 100 MHz ........................... 13
Upconverter Performance, IFIN = 3000 MHz ......................... 16
Isolation and Return Loss ......................................................... 19
IF Bandwidth—Downconverter ............................................... 21
Spurious and Harmonics Performance ................................... 23
Theory of Operation ...................................................................... 24
Applications Information .............................................................. 25
Typical Application Circuit ....................................................... 25
Evaluation PCB Information .................................................... 25
Outline Dimensions ....................................................................... 26
Ordering Guide .......................................................................... 26
REVISION HISTORY
10/2019—Rev. 0 to Rev. A
Changes to 10 GHz to 20 GHz Performance, Downconverter,
Input 1 dB Compression Point Parameter, Table 1 and 12 GHz to
16 GHz Performance, Downconverter, Input 1 dB Compression
Point Parameter, Table 1 .................................................................... 3
Changes to Figure 13 and Figure 15 ............................................... 7
Changes to Figure 27 and Figure 30 ............................................. 10
4/2018—Revision 0: Initial Version
Data Sheet HMC554ALC3B
Rev. A | Page 3 of 26
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the
evaluation printed circuit board (PCB).
Table 1.
Parameter Symbol Min Typ Max Unit
FREQUENCY
RF Pin 10 20 GHz
IF Pin DC 6 GHz
LO Pin 10 20 GHz
LO AMPLITUDE 9 13 15 dBm
10 GHz TO 20 GHz PERFORMANCE
Downconverter
8.5 11.5 dB
SSB NF 9.5 dB
IP3 19 20 dBm
P1dB 10 dBm
Conversion Loss
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept IP2 46 dBm
Upconverter IFIN
Conversion Loss 7 dB
Input Third-Order Intercept IP3 19.5 dBm
Input 1 dB Compression Point P1dB 10 dBm
Isolation
RF to IF 24 41 dB
LO to RF 25 37 dB
LO to IF 23 41 dB
12 GHz TO 16 GHz PERFORMANCE
Downconverter
Conversion Loss 8 dB
Single Sideband Noise Figure SSB NF 9 dB
Input Third-Order Intercept IP3 16 19.5 dBm
Input 1 dB Compression Point P1dB 9.5 dBm
Input Second-Order Intercept IP2 45 dBm
Upconverter IFIN
Conversion Loss 6.5 dB
Input Third-Order Intercept IP3 18 dBm
Input 1 dB Compression Point P1dB 10 dBm
HMC554ALC3B Data Sheet
Rev. A | Page 4 of 26
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 26 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Reflow Temperature 260°C
Maximum Junction Temperature 175°C
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 3.7 mW/°C Above 85°C)
333 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V; Class 0B
Field Induced Charged Device Model
(FICDM)
1250 V; Class IV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θJA θJC Unit
E-12-41 120 195 °C/W
1 Test Condition 1: JEDEC standard JESD51-2.
ESD CAUTION
Data Sheet HMC554ALC3B
Rev. A | Page 5 of 26
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7GND
8RF
9GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
NOTES
1. NOT INTERNAL LY CO NNE CTED. THESE P INS
CAN BE CONNE CTED TO RF/DC GROUND.
PERF ORMANCE IS NO T AFFECT E D.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
HMC554ALC3B
TOP VIEW
(No t t o Scal e)
13895-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottom must be connected to RF/dc ground.
2 LO LO Port. This pin is ac-coupled and matched to 50 Ω.
5 IF
IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port
externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source/sink more than 3 mA of current or die malfunction and
possible die failure may result.
8 RF RF Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
Figure 3. GND Interface Schematic
LO
13895-004
Figure 4. LO Interface Schematic
IF
13895-005
Figure 5. IF Interface Schematic
RF
13895-006
Figure 6. RF Interface Schematic
HMC554ALC3B Data Sheet
Rev. A | Page 6 of 26
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE, IF = 100 MHz
Upper Sideband (Low-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-011
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
14
0
2
4
6
8
10
12
10 11 12 13 14 15 16 17 18 19 20
NOISE FIGURE (dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-009
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–6
–7
CONVE RS IO N GAIN ( dB)
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-010
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
INPUT I P 3 ( dBm)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-008
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
14
0
2
4
6
8
10
12
NOISE FIGURE (dB)
13895-012
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 7 of 26
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
INPUT P1dB (d Bm)
13895-015
0
2
4
6
8
10
12
14
16
18
20
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-016
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
20
0
5
10
15
INPUT P1dB (d Bm)
13895-013
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-014
Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 8 of 26
Lower Sideband (High-Side LO)
–5
–14
–13
–12
–11
–10
–9
–7
–8
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-017
Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-018
Figure 18. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
14
0
2
4
6
8
10
12
10 11 12 13 14 15 16 17 18 19 20
NOISE FIGURE (dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-019
Figure 19. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
CONVE RS IO N GAIN ( dB)
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-020
Figure 20. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
INPUT I P 3 ( dBm)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-021
Figure 21. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
14
0
2
4
6
8
10
12
NOISE FIGURE (dB)
13895-022
Figure 22. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 9 of 26
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-023
Figure 23. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-024
Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 10 of 26
DOWNCONVERTER PERFORMANCE, IF = 3000 MHz
Upper Sideband (Low-Side LO)
–5
–14
–13
–12
–11
–10
–9
–7
–8
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-025
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-026
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
20
0
5
10
15
INPUT P1dB (d Bm)
13895-029
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
Figure 27. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-027
Figure 28. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
INPUT I P 3 ( dBm)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-028
Figure 29. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
20
0
5
10
15
INPUT P1dB (d Bm)
13895-031
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
Figure 30. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 11 of 26
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-030
Figure 31. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-032
Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 12 of 26
Lower Sideband (High-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-033
Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
INPUT I P 3 ( dBm)
13895-034
Figure 34. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
60
0
10
20
30
40
50
INPUT I P 2 ( dBm)
13895-035
Figure 35. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
CONVE RS IO N GAIN ( dB)
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-036
Figure 36. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
INPUT I P 3 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-037
Figure 37. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
70
60
0
10
20
30
40
50
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
INPUT I P 2 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-038
Figure 38. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 13 of 26
UPCONVERTER PERFORMANCE, IFIN = 100 MHz
Upper Sideband (Low-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-039
Figure 39. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-040
Figure 40. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
INPUT P1dB (d Bm)
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-043
Figure 41. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-041
Figure 42. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-042
Figure 43. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
INPUT P1dB (d Bm)
13895-045
30
25
0
5
10
15
20
Figure 44. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 14 of 26
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
60
0
10
20
30
40
50
INPUT I P 2 ( dBm)
13895-044
Figure 45. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
70
60
0
10
20
30
40
50
INPUT I P 2 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-046
Figure 46. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 15 of 26
Lower Sideband (High-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-047
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-048
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-049
Figure 49. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
CONVE RS IO N GAIN ( dB)
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-050
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-051
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-052
Figure 52. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 16 of 26
UPCONVERTER PERFORMANCE, IFIN = 3000 MHz
Upper Sideband (Low-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-053
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
13895-054
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
INPUT P1dB (d Bm)
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-057
Figure 55. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-055
Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
INPUT I P 3 ( dBm)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-056
Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
INPUT P1dB (d Bm)
13895-059
Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 17 of 26
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-058
Figure 59. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-060
Figure 60. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 18 of 26
Lower Sideband (High-Side LO)
–5
–14
–12
–13
–11
–10
–9
–8
–7
–6
CONVE RS IO N GAIN ( dB)
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13895-061
Figure 61. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
30
0
5
10
15
20
25
INPUT I P 3 ( dBm)
13895-062
Figure 62. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-063
Figure 63. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVE RS IO N GAIN ( dB)
RF FREQ UE NCY
13895-064
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
Figure 64. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
30
25
0
5
10
15
20
INPUT I P 3 ( dBm)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-065
Figure 65. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
70
0
10
20
30
40
50
60
INPUT I P 2 ( dBm)
13895-066
Figure 66. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 19 of 26
ISOLATION AND RETURN LOSS
70
60
0
10
20
30
40
50
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
LO TO RF ISOLATION (dB)
13895-067
Figure 67. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY ( GHz)
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
60
0
10
20
40
30
50
LO TO IF ISOLATION (dB)
13895-068
Figure 68. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY ( GHz)
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
70
60
0
10
20
40
30
50
RF TO IF ISOLATION (dB)
13895-069
Figure 69. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
70
60
0
10
20
30
40
50
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
LO TO RF ISOLATION (dB)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-070
Figure 70. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY ( GHz)
70
60
0
10
20
40
30
50
LO TO IF OSILATION (dB)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-071
Figure 71. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
70
60
0
10
20
30
40
50
10 11 12 13 14 15 16 17 18 19 20
RF FREQ UE NCY
RF TO IF ISOLATION (dB)
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-072
Figure 72. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 20 of 26
–35
–30
–25
–20
–15
–10
–5
0
10 11 12 13 14 15 16 17 18 19 20
LO RETURN LOSS (dB)
LO FREQUENCY (GHz)
13895-073
Figure 73. LO Return Loss vs. LO Frequency at LO = 13 dBm,
TA = 25°C
10 11 12 13 14 15 16 17 18 19 20
0
–35
–30
–25
–20
–15
–10
–5
RF RE TURN LOSS ( dB)
RF FREQ UE NCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-074
Figure 74. RF Return Loss vs. RF Frequency at LO Power Levels,
TA = 25°C, LO = 15 GHz
0
–35
–30
–25
–20
–15
–10
–5
0 1 2 3 4 5 6
IF RETURN LOSS (dB)
IF FRE QUENCY
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-075
Figure 75. IF Return Loss vs. IF Frequency at LO Power Levels,
TA = 25°C, LO = 15 GHz
Data Sheet HMC554ALC3B
Rev. A | Page 21 of 26
IF BANDWIDTH—DOWNCONVERTER
Upper Sideband, LO Frequency = 12 GHz
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
CONVE RS IO N GAIN ( dB)
IF BANDWIDTH
TA = +85°C
TA = +25°C
TA = –40° C
13895-076
Figure 76. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
30
25
0
5
10
15
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INP UT IP 3 ( dBm)
IF BANDWIDTH
TA = +85°C
TA = +25°C
TA = –40° C
13895-077
Figure 77. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
CONVE RS IO N GAIN ( dB)
IF BANDWIDTH
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-078
Figure 78. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INP UT IP 3 ( dBm)
IF BANDWIDTH
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-079
Figure 79. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
HMC554ALC3B Data Sheet
Rev. A | Page 22 of 26
Lower Sideband, LO Frequency = 19 GHz
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
CONVE RS IO N GAIN ( dB)
IF BANDWIDTH
TA = +85°C
TA = +25°C
TA = –40° C
13895-080
Figure 80. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
30
25
0
5
10
15
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INP UT IP 3 ( dBm)
IF BANDWIDTH
TA = +85°C
TA = +25°C
TA = –40° C
13895-081
Figure 81. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
CONVE RS IO N GAIN ( dB)
IF BANDWIDTH
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-082
Figure 82. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
0
5
10
15
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INP UT IP 3 ( dBm)
IF BANDWIDTH
LO = 15d Bm
LO = 13d Bm
LO = 11d Bm
LO = 9dBm
13895-083
Figure 83. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC554ALC3B
Rev. A | Page 23 of 26
SPURIOUS AND HARMONICS PERFORMANCE
Mixer spurious products are measured in dBc from the IF output
power level. N/A means not applicable.
LO Harmonics
LO = 13 dBm, all values in dBc below input LO level and
measured at RF port.
Table 5. LO Harmonics at RF
N × LO Spur at RF Port
LO Frequency (GHz) 1 2 3 4
12 39 39 59 57
13 38 40 70 N/A
15 38 48 49 N/A
16 37 56 50 N/A
18 36 54 N/A N/A
19 36 53 N/A N/A
21
36
46
N/A
N/A
LO = 13 dBm, all values in dBc below input LO level and
measured at IF port.
Table 6. LO Harmonics at IF
N × LO Spur at IF Port
LO Frequency (GHz) 1 2 3 4
12 38 77 67 89
13 41 63 74 N/A
15 44 72 56 N/A
16 42 53 56 N/A
18 44 79 N/A N/A
19 53 70 N/A N/A
21 47 75 N/A N/A
M × N Spurious Outputs
Downconverter, Upper Sideband
Spur values are (M × RF) − (N × LO).
RF = 15.1 GHz at −10 dBm, LO = 15 GHz at 13 dBm.
N × LO
0 1 2 3 4 5
M × RF
0 N/A 14 47 27 N/A N/A
1 48 0 70 72 65 N/A
2 75 77 60 79 74 68
3
65 74 79 70 78 71
4 N/A 60 74 80 88 78
5 N/A N/A 56 72 81 88
Upconverter, Upper Sideband
Spur values are (M × IF) + (N × LO).
IFIN = 100 MHz at −10 dBm, LO = 15 GHz at 13 dBm.
N × LO
0 1 2 3
M × IF
−5 89 80 73 67
−4 88 79 73 68
−3 91 66 74 66
−2 91 67 74 66
−1 36 0 35 20
0 N/A 6 17 22
+1 36 0 35 19
+2 88 63 73 65
+3 90 63 74 66
+4 90 80 73 65
+5 88 78 72 66
HMC554ALC3B Data Sheet
Rev. A | Page 24 of 26
THEORY OF OPERATION
The HMC554ALC3B is a general-purpose, double balanced
mixer that can be used as an upconverter or a downconverter
from 10 GHz to 20 GHZ.
When used as a downconverter, the HMC554ALC3B downconverts
RF between 10 GHz and 20 GHz to IF between dc and 6 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 6 GHz to radio frequencies between
10 GHz and 20 GHz.
Data Sheet HMC554ALC3B
Rev. A | Page 25 of 26
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 84 shows the typical application circuit for the
HMC554ALC3B. The HMC554ALC3B is a passive device
and does not require any external components. The IF pin
is internally dc-coupled. The RF and LO pins are internally
ac-coupled. When IF operation to dc is not required, using an
external series capacitor is recommended, of a value chosen to
pass the necessary IF frequency range. When IF operation to dc
is required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
GND
GND
RF
GND
NIC
NIC
NIC
GND
LO
LO RF
IF
GND
IF
GND
HMC554ALC3B
1
7
8
9
101112
4
2
3
5 6
13895-084
Figure 84. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 84). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 85 is
available from Analog Devices, Inc., upon request.
Table 7. List of Materials for Evaluation PCB
EV1HMC554ALC3B
Item Description
J1, J2 PCB mount SRI 2.92 mm connectors
J3 PCB mount Johnson SMA connector
U1
HMC554ALC3B
PCB1 117611-1 evaluation board on Rogers 4350
1 117611-1 is the raw bare PCB identifier. Reference EV1HMC554ALC3B when
ordering complete evaluation PCB.
J1
J3
IF
LO RF
117611–1
U1
J2
554A
13895-085
Figure 85. Evaluation PCB Top Layer
HMC554ALC3B Data Sheet
Rev. A | Page 26 of 26
OUTLINE DIMENSIONS
03-02-2017-A
P
KG-004837
0.50
BSC
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
0.08
BSC
1
4
6
7
9
10 12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.36
0.30
0.24
PIN 1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
0.90
0.80
0.70
SEATING
PLANE
Figure 86. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range MSL Rating2 Package Description Package Option
HMC554ALC3B −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4
HMC554ALC3BTR −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4
HMC554ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4
EV1HMC554ALC3B Evaluation PCB Assembly
1 All models are RoHS compliant.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13895-0-10/19(A)