Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series MLN SurgeArrayTM Suppressor RoHS Description SurgeArrayTM devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArrayTM devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. Size Table Metric EIA 3216 1206 The inherent capacitance of the SurgeArrayTM Suppressor permits it to function as a filter/suppressor, thereby replacing separate Zener/capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. Applications Features * Data, Diagnostic I/O Ports Communications/ Cellular Phones * Analog Signal/ Sensor Lines * Computer/DSP Products * Portable/HandHeld Products * Industrial Instruments Including Medical * Mobile * RoHS Compliant * Low leakage * Four individual devices in one chip * Operating voltage up to 18VM(DC) * ESD rated to IEC 61000-4-2 (Level 4) * -55C to 125C operating temp range * AC characterized for impedance and capacitance * Low-profile, PCMCIA compatible * Low adjacent channel crosstalk, -55dB at 10MHz (Typ) Absolute Maximum Ratings * For ratings of individual members of a series, see device ratings and specifications table. Continuous MLN Series Units 5.5 - 18 V Operating Ambient Temperature Range (TA) -55 to +125 C Storage Temperature Range (TSTG) -55 to +150 C Steady State Applied Voltage: DC Voltage Range (VM(DC)) (c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 MLN Series The MLN SurgeArrayTM Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series Device Ratings and Specifications Any Single Section Maximum Ratings (125C) Maximum Maximum Maximum Maximum NonNonClamping Continuous repetitive repetitive Voltage (at Working Surge Current Surge Energy Noted 8/20s) Voltage (8/20s) (10/1000s) Current Part Number VM(DC) I TM WTM Specifications (25C) Typical ESD Supression Voltage (Note1) Nominal Voltage at 1mA DC Test Current (Note 2) (Note 3) 8kV Contact 15kV Air VN(DC) Min Peak Clamp Peak VC Capacitance at 1 MHz (1V p-p) (Note 4) C TYP MAX VN(DC) Max (V) (A) (J) (V) (V) (V) (V) (V) (V) (pF) (pF) 5.5 30 0.10 15.5 at 2A 60 35 45 7.10 10.8 430 520 V9MLN41206 9.0 30 0.10 23.0 at 2A 95 50 75 11.0 16.0 250 300 V14MLN41206 14.0 30 0.10 30.0 at 2A 110 55 85 15.9 20.3 140 175 V18MLN41206 18.0 30 0.10 40.0 at 2A 165 63 100 22.0 28.0 100 125 V18MLN41206L 18.0 30 0.05 50.0 at 1A 200 95 130 25.0 35.0 45 75 V5.5MLN41206 NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. 2. Direct discharge to device terminals (IEC preffered test method). 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. Peak Current and Energy Derating Curve Peak Pulse Current Test Waveform for Clamping Voltage PERCENT OF PEAK VALUE For applications exceeding 125C ambient temperature, the peak surge current and energy ratings must be reduced. PERCENT OF RATED VALUE 100 90 80 70 60 50 40 100 90 50 10 O1 t t1 30 TIME t2 Figure 2 20 10 0 -55 50 60 70 80 90 100 110 120 Figure 1 Example: 01 = Virtual Origin of Wave T = Time from 10% to 90% of Peak T1 = Rise Time = 1.25 x T T2 = Decay Time (Impulse Duration) 130 140 150 AMBIENT TEMPERATURE ( oC) For an 8/20 s Current Waveform: 8s = T1 = Rise Time 20s = T2 = Virtual Time to Half Value Typical Performance Curves Impedance vs Frequency, 1206 Size Equivalent Series Resistance 10000 1000 1000 Impeance |Z| () OHMS 100 10 1 100 V5.5 V9 10 V14 V18 V18L 0.1 1MHz 10MHz 100MHz 1GHz 1 10GHz Frequency Figure 3 0.1 0.1 Figure 4 1 10 100 1000 Frequency (MHz) (c)2010 Littelfuse, Inc. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series Typical Performance Curves (continued) Nominal Voltage Stability to IEC 1000-4-2 (8kV Contact Method, One Section) 1206 Size Pulse Rating for Long Duration Surges (Any Single Section) 100 25 V18 NUMBER OF SURGES 1 100 V14 15 2 Surge Current (A) NOMINAL VOLTAGE VNOM (V) 20 V9 10 V5.5 10 103 10 1 5 104 106 0 10 Figure 5 100 1000 10000 0.1 10 NUMBER OF DISCHARGES 100 Figure 6 V-I Characteristic, 1206 size 1000 10000 Square Wave Impulse Duration (s) Capacitance vs Frequency, 1206 Size 500 100 V18L MAXIMUM CLAMP VOLTAGE V5.5 V18 MAXIMUM STANDBY 400 V14 V5.5 Capacitance (pF) Varistor Voltage (V) V9 V18L V18 V14 10 V9 300 V9 200 V5.5 V14 V18 100 V18L 1 10A 100A 1mA 10mA 100mA 1A 10A 100A 0 0.1 Current (A) Figure 7 Figure 8 1 10 100 1000 Frequency (MHz) Adjacent Channel Crosstalk 0 Crosstalk (dB) -20 -40 -60 V18L V14 V18 V9 -80 V5.5 VIN = 1VRMS Z = 50 -100 -120 0.001 Figure 9 0.01 0.1 1 10 100 1000 Frequency (MHz) (c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 MLN Series 105 0 Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. Reflow Solder Profile 250 The recommended solder for the MLN suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. MAXIMUM TEMPERATURE 230C TEMPERATURE C 200 Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. 40-80 SECONDS ABOVE 183C 150 RAMP RATE <2C/s 100 PREHEAT DWELL 50 PREHEAT ZONE 0 When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 0 0.5 1.0 1.5 Figure 10 2.0 2.5 3.0 3.5 4.0 TIME (MINUTES) Wave Solder Profile 300 Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50C before cleaning. MAXIMUM WAVE 260C TEMPERATURE C 250 200 150 SECOND PREHEAT 100 FIRST PREHEAT 50 Figure 11 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 TIME (MINUTES) 3.5 4.0 4.5 (c)2010 Littelfuse, Inc. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series Product Dimensions (mm) PAD LAYOUT DEMENSIONS CHIP LAYOUT DIMENSIONS W T E D X A P B L C BW S MLN Series BL 1206 Size Dimension IN MM A 0.890 0.035 B 1.650 0.065 C 2.540 0.100 D 0.460 0.018 E 0.790 0.030 L 0.126 -/+0.008 3.200 -/+0.200 W 0.063 -/+0.008 1.600 -/+0.200 T 0.053 Max 1.350 Max BW 0.016 -/+0.004 0.410 -/+0.100 BL 0.007 +0.01/- 0.002 0.180 +0.25/-0.050 P 0.030 Ref 0.760 Ref X 0.045 -/+0.004 1.140 -/+0.100 S 0.015 -/+0.004 0.380 -/+0.100 Part Numbering System V 18 ML N 4 1206 L W T PACKING OPTIONS* A: Bulk Pack, 2500 pieces H: 7in (178mm) Diameter Reel, 2500 pieces T: 13in (330mm) Diameter Reel, 10,000 pieces END TERMINATION W: Ag/Pd/Pt (Silver/Platinum/Palladium) CAPACITANCE OPTION (no letter): Standard L: Low Capacitance Version DEVICE FAMILY TVSS Device MAXIMUM DC WORKING VOLTAGE MULTILAYER DESIGNATOR SERIES DESIGNATOR N: Array NUMBER OF SECTIONS DEVICE SIZE: 1206: 120mil x 60mil Packaging* Quantity Device Size 13" Inch Reel ("T" Option) 7" Inch Reel ("H" Option) Bulk Pack ("A" Option) 1206 10,000 2,500 2,500 *(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. (c)2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLN Series Tape and Reel Specifications t1 D0 P0 PRODUCT IDENTIFYING LABEL P2 PLASTIC CARRIER TAPE E F K0 W B0 t2 D1 P1 Symbol EMBOSSMENT TOP TAPE A0 Description 8mm NOMINAL 178mm OR 330mm DIA. REEL Dimensions in Millimeters A0 Width of Cavity Dependent on Chip Size to Minimize Rotation. B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation. W Width of Tape F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.5 8 -/+0.2 1.75 -/+0.1 E Distance Between Drive Hole Centers and Tape Edge P1 Distance Between Cavity Center 4 -/+0.1 P2 Axial Distance Between Drive Hole Centers and Cavity Centers 2 -/+0.1 P0 Axial Distance Between Drive Hole Centers 4 -/+0.1 D0 Drive Hole Diameter 1.55 -/+0.05 D1 Diameter of Cavity Piercing 1.05 -/+0.05 T1 Embossed Tape Thickness 0.3 Max T2 Top Tape Thickness 0.1 Max Notes : * Conforms to EIA-481-1, Revision A * Can be supplied to IEC publication 286-3 (c)2010 Littelfuse, Inc. MLN SurgeArrayTM Suppressor Revision: August 10, 2010 Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information.