EC3245HSTA-27.000M RoHS EC32 45 HS T A Pb -27.000M Series RoHS Compliant (Pb-free) 3.3V 8 Pin DIP Metal Thru-Hole LVCMOS/TTL VCXO Nominal Frequency 27.000MHz Operating Temperature Range 0C to +70C Frequency Tolerance/Stability 50ppm Maximum Package Duty Cycle 50 5(%) Linearity 20% Maximum Frequency Deviation 100ppm Minimum ELECTRICAL SPECIFICATIONS Nominal Frequency 27.000MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range 0C to +70C Supply Voltage 3.3Vdc 10% Input Current 20mA Maximum Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, 2.7Vdc Minimum with LVCMOS Load Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load or with LVCMOS Load Rise/Fall Time 5nSec Maximum (Measured at 0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/LVCMOS Load) Duty Cycle 50 5(%) (Measured at 50% of waveform w/LVCMOS Load) Load Drive Capability 2TTL Load or 15pF LVCMOS Load Maximum Output Logic Type CMOS Control Voltage 1.65Vdc 1.65Vdc Frequency Deviation 100ppm Minimum Linearity 20% Maximum Transfer Function Positive Transfer Characteristic Absolute Clock Jitter 100pSec Maximum One Sigma Clock Period Jitter 25pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 1 of 7 EC3245HSTA-27.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.620 0.203 1 0.8 0.1 (X3) 4 7.620 0.203 8 DIA 0.457 0.1 (X4) 5 PIN CONNECTION 1 Control Voltage 4 Ground/Case Ground 5 Output 8 Supply Voltage LINE MARKING 5.08 MIN 1 ECLIPTEK 2 EC32 EC32=Product Series 3 27.000M 4 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year 5.6 MAX 13.2 MAX MARKING ORIENTATION 13.2 MAX CLOCK OUTPUT OUTPUT WAVEFORM VOH 80% or 2.4VDC 50% or 1.4VDC 20% or 0.4VDC VOL Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 2 of 7 EC3245HSTA-27.000M Test Circuit for TTL Output Output Load Drive Capability RL Value (Ohms) CL Value (pF) 10TTL 5TTL 2TTL 10LSTTL 1TTL 390 780 1100 2000 2200 15 15 6 15 3 Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability Supply Voltage (VDD) Current Meter Power Supply 0.01F (Note 1) Voltage Meter Frequency Counter Oscilloscope 0.1F (Note 1) Probe (Note 2) RL (Note 4) Output Ground CL (Note 3) Voltage Control Power Supply Power Supply Note 5 Voltage Meter Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 3 of 7 EC3245HSTA-27.000M Test Circuit for CMOS Output Oscilloscope Supply Voltage (VDD) Current Meter Power Supply 0.01F (Note 1) Voltage Meter 0.1F (Note 1) Frequency Counter Probe (Note 2) Output Ground CL (Note 3) Voltage Control Power Supply Voltage Meter Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 4 of 7 EC3245HSTA-27.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 5 of 7 EC3245HSTA-27.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 185C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 185C Maximum 185C Maximum 2 Times 10 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 6 of 7 EC3245HSTA-27.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 7 of 7