HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
1
1
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DC-0008144
1
Features
Operates 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm CW Power Handling @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Solderable
Description
The MASW-003103-1364 is a SP3T, surmount,
broadband, monolithic switch using series and shunt
connected silicon PIN diodes. This device is
designed for use in broadband, moderate signal,
high performance, switch applications up to 20 GHz.
It is a surface mountable switch configured for
optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-004103-1365 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
To minimize the parasitics and achieve high
performance the MASW-003103-1364 is fabricated
using MACOMs’ patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process. This process
allows the silicon pedestals, which form the series
and shunt diodes or vias, to be imbeded in low loss,
low dispersion glass. The combination of low loss
glass and using tight spacing between elements
results in an HMIC device with low loss and high
isolation through low millimeter wave frequencies.
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
Pin Configuration
J1
J2
J3
J4
Pin Function
J1 RFC
J2 RF1
J3 RF2
J4 RF3
Functional Schematic
Ordering Information
Part # Package
MASW-003103-13640G 50 piece gel pack
MASW-003103-13645P 500 piece reel
MASW-003103-13640P 3000 piece reel
MASW-003103-001SMB Sample Test Board
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
2
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
2
Parameter Conditions Units Min. Typ. Max.
Insertion Loss
6 GHz
13 GHz
20 GHz
dB —
0.5
0.8
1.2
0.6
1.1
1.4
Isolation
6 GHz
13 GHz
20 GHz
dB
50
37
25
54
40
31
—
Input Return Loss
6 GHz
13 GHz
20 GHz
dB
19
14
14
25
22
21
—
Output to Output Isolation
6 GHz
13 GHz
20 GHz
dB —
57
42
30
—
Input 0.1 dB Compression Point 2 GHz dBm — 36 —
Switching Speed1 — ns — 20 —
Voltage Rating2 — V — — 80
Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20 mA, -10 V
1. Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers.
2. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 µA maximum @ -80 volts.
Parameter Absolute Maximum
RF CW Incident Power
2 GHz
20 GHz
38 dBm
33 dBm
Applied Reverse Voltage |-80 V|
Bias Current +25°C ± 50 mA
Junction Temperature +175°C
Operating Temperature -65°C to +125°C
Storage Temperature -65°C to +150°C
Absolute Maximum Ratings3,4,5
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near these
survivability limits.
5. Combined maximum operating conditions for RF power, DC
bias, & temperature: 33 dBm CW, 20 mA per diode, +85ºC.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these Class 1A HBM
devices.
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
3
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
3
-2.0
-1.5
-1.0
-0.5
0.0
0 5 10 15 20 25 30
Insertion Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
J1 TO J2
J1 TO J3
J1 TO J4
Insertion Loss (dB)
Frequency (GHz)
-40
-30
-20
-10
0
0 5 10 15 20 25 30
Output Return Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
J1 TO J2
J1 TO J3
J1 TO J4
Output Return Loss (dB)
Frequency (GHz)
-80
-60
-40
-20
0
0 5 10 15 20 25 30
Output to Output Isolation @ 20mA, -10V
J2 to J3 and J3 to J4
J2 TO J3
J3 TO J4
Output to Output Isolation (dB)
Frequency (GHz)
-40
-30
-20
-10
0
0 5 10 15 20 25 30
Input Return Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
J1 TO J2
J1 TO J3
J1 TO J4
Input Return Loss (dB)
Frequency (GHz)
-80
-60
-40
-20
0
0 5 10 15 20 25 30
Isolation @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
J1 TO J2
J1 TO J3
J1 TO J4
Isolation (dB)
Frequency (GHz)
MASW-003103-1364 Maximum Input Power Curve
Baseplate Temperature fixed @ 25degC
0
2
4
6
8
10
12
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Insertion Loss (dB)
Input Power (Watts)
2GHz, 5.8W
10GHz, 2.75W
20GHz, 2W
Typical Performance Curves: 20 mA, -10 V (On-Wafer Probed)
Input Return Loss
Insertion Loss
Output to Output Isolation Maximum Input Power,
Baseplate Temperature fixed @ +25°C
Isolation
Output Return Loss
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
4
4
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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For further information and support please visit:
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DC-0008144
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Control Level (DC Currents and Voltages) Condition of RF Output
B2 B3 B4 J1-J2 J1-J3 J1-J4
-15 V at -20 mA5 +6 V at +20 mA +6 V at +20 mA Low Loss Isolation Isolation
+6 V at +20 mA -15 V at -20 mA5 +6 V at +20 mA Isolation Low Loss Isolation
+6 V at +20 mA +6 V at +20 mA -15 V at -20 mA5 Isolation Isolation Low Loss
Bias Control
Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage
and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining
switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path.
In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased
with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse
biased with voltage.
Driver Connections
Application Circuit6,7,8,9,10
6. Assume VF ~ 1 V @ 20 mA
7. R1 = 5 V / 0.02 A = 250 Ω; R2 = 9 V / 0.02 A = 450 Ω
8. PR1 = 0.02 A x 0.02 A x 250 = 0.1 W
9. PR2 = 0.02 A x 0.02 A x 450 = 0.18 W
10. Inductors shown in the above schematic are RF bias chokes. The operating bandwidth of a broad-band PIN diode switch is often
dependent on the bias components, particularly the RF bias chokes. It is suggested that the response at the frequencies of interest be
measured with all the bias components in place prior to installing of MASW-003103-1364.
Example:
J1 to J2→ Low Loss
R1 = 250 Ω
R2 = 450 Ω
B2 = -15 V
B3, B4 = 6 V
5. The voltage applied to the off arm is allowed to vary provided a constant current is applied through the shunt diode on the off arm.
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
5
5
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
5
Outline Drawing and Footprint (All dimensions in µm)11,12,13,14
Top View Side View Backside View
125
J4
2065
1655
J1
J2
J3
200
200
684
200
680
200 285
200
J1
290
200
1960
1540
J3
680
200
J4
J2
200
200
200
290
285 200
200
200
Dim. Inches mm
Min. Max. Min. Max.
Width 0.06417 0.06614 1.630 1.680
Length 0.08031 0.08228 2.040 2.090
Thickness 0.00394 0.00591 0.100 0.150
Dimensions
11. Bottom view shows the back metal foot print and mounting pads.
12. All dimension are +/-0.5 µm.
13. Ground radius is 200 µm and centered on the I/O Pad.
14. The center pad shown on the chip bottom view must be connected to RF and DC ground.
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
6
6
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
6
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom surface of these devices and are removed from the active junction
locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W, con-
ductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1
hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up tool
and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recommended.
When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to
mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die so that its
mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be performed by caus-
ing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of
the mounting pads can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538,
“Surface Mounting Instructions“ and can viewed on the MACOM Technology Solutions website @
www.macom.com
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
7
7
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
7
Carrier Tape Dimensions
Chip Orientation in Tape
0.157 ±0.004
4.000 ±0.100
2.000 ±0.050
0.079 ±0.002
0.157 ±0.004
4.000 ±0.100
Ф 0.059 ±0.004 0.069 ±0.004
1.750 ±0.100
0.315
0.093 ±0.002
2.360 ±0.050 0.012 ±0.001
0.300 ±0.030
3.500 ±0.050
Ф 0.035 thru typ.
Ф 0.890
5° max. typ.
0.012 ±0.002
0.300 ±0.050
Pocket Depth
0.066 ±0.002
1.800 ±0.050
0.138 ±0.002
+0.012
-0.004
8.000 +0.30
-0.10
thru typ.
Ф 1.500 ±0.100
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
8
8
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
8
Reel Information
Dim. inches mm
Min. Max. Min. Max.
A 6.980 7.019 177.3 178.3
B 0.059 0.098 1.5 2.5
C 0.504 0.520 12.8 13.2
D 0.795 0.815 20.2 20.7
N 2.146 2.185 54.5 55.5
W1 0.331 0.337 8.4 8.55
W2 —- 0.567 —- 14.4
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V3
MASW-003103-1364
9
9
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008144
9
MACOM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
