44WR5KLFT7 - TT ELECTRONICS - Datasheet.Directory

MPX2053

Rev 8, 02/2009

Freescale Semiconductor

Pressure

50 kPa On-Chip Temperature

Compensated and Calibrated

Silicon Pressure Sensors

The MPX2053 series devices are silicon piezore s istive pressure sensors

that provide a highly accurate and linear voltage output directly proportional to the

applied pressure. A single, monolithic silicon diaphragm with the strain gauge and

an integrated thin-film resistor network. Precise span and offset calibration with

temperature compensation are achieved by laser trimming.

Features

• Temperature Compensated Over 0°C to +85°C

• Easy-to-Use Chip Carrier Package Options

• Ratiometric to Supply Voltage

• Gauge Ported and Non Ported Options

• Available in Easy-to-Use Tape & Reel

• Differential and Gauge Pressure Options

ORDERING INFORMATION

Device Name Case No. # of Ports Pressure Type Device Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXV2053 G Series)

MPXV2053GP 1369 • • MPXV2053GP

MPXV2053DP 1351 • • MPXV2053DP

MPXV2053GVP 1368 • • MPXV2053GV

Unibody Package (MPX2053 Ser ies)

MPX2053D 344 • • MPX2053D

MPX2053DP 344C • • MPX2053DP

MPX2053GP 344B • • MPX2053GP

MPAK Package (MPXM2053 Series)

MPXM2053D 1320 • • MPXM2053D

MPXM2053DT1 1320 • • MPXM2053D

MPXM2053GS 1320A • • MPXM2053GS

MPXM2053GST1 1320A • • MPXM2053GS

MPX2053

Series

0 to 50 kPa (0 to 7.25 psi)

40 mV Full Scale

(Typical)

Application Examples

• Pump/Motor Control

• Robotics

• Level Detectors

• Medical Diagnostics

• Pressure Switching

• Blood Pressure Measurement

MPX2053

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Pressure

SMALL OUTLINE PACKAGES

MPXV2053GP

CASE 1369-01 MPXV2053DP

CASE 1351-01

MPXM2053D/DT1

CASE 1320-02 MPXM2053GS/GST1

CASE 1320A-02

MPAK PACKAGES

UNIBODY PACKAGES

MPX2053D

CASE 344-15 MPX2053GP

CASE 344B-01 MPX2053DP

CASE 344C-01

MPXV2053GVP

CASE 1368-01

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Pressure

Operating Characteristics

Maximum Ratings

Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic Symbol Min Typ Max Units

Pressure Range(1)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

POP 0 — 50 kPa

Supply Voltage(2)

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

VS—10 16 VDC

Supply Current IO—6.0 —mAdc

Full Scale Span(3)

3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFS 38.5 40 41.5 mV

Offset(4)

4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

—–1.0 —1.0 mV

Sensitivity —ΔV/ΔP— 0.8 —

Non-Linearity —–0.6 —0.4 %VFS

Pressure Hysteresis (0 to 50 kPa) — — ±0.1 —%VFS

Temperature Hysteresis (-40° to 125°C) — — ±0.5 —%VFS

Temperature Coefficient of Full Scale TCVFS –2.0 —2.0 %VFS

Temperature Coefficient of Offset TCVOFF –1.0 —1.0 mV

Input Impedance ZIN 1000 —2500 Ω

Output Impedance ZOUT 1400 —3000 Ω

Response Time(5) (10% to 90%)

5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

tR—1.0 —ms

Warm-Up Time — — 20 —ms

Offset Stability(6)

6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

— — ±0.5 —%VFS

Table 2. Maximum Ratings(1)

Rating Max Value Unit

Supply Voltage 16 V

Pressure (P1 > P2) 200 kPa

Storage Temperature –40 to +125 °C

Operating Temperature Range –40 to +125 °C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

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Pressure

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Te mpe rature Compensated Pressure Sensor Schema ti c

Voltage Output versus Applied Differential Pressure

The differential voltage output of the sensor is directly

proportional to the differential pressure applied.

The output voltage of the differential or gauge sensor

increases with increasing pressure appl ied to the pressure

side relative to the vacuum side. Simila rly, output voltage

increases as increasing vacuum is applied to the vacuum

side relative to the pressure side.

On-Chip Temperature Compensation and Calibration

Figure 2 shows the minimum, maximum and typical output

characteristics of the MPX2053 series at 25°C. The output is

directly proportional to the differential pressure and is

essentially a straight line.

A silicone gel isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

Figure 2. Output vs. Pressure Differential

X-ducer

Sensing

Element

Thin Film

Temperature

Compensation

and

Calibration

Vout+

Vout-

GND

Output (mVdc)

kPa

PSI

-50 12.5

1.8 25

3.6 37.5

5.4 50

7.25

20 MAX

TYP

MIN

OFFSET

(TYP)

SPAN

RANGE

(TYP)

VS = 10 Vdc

TA = 25°C

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Pressure

LINEARITY

Linearity refers to how well a transducer's output follows

the equation: V out = Voff + sensitivity x P over the operating

pressure range. There are two basic methods for calculating

nonlinearity: (1) end poi nt straight line fit (see Figure 3) or

(2) a least squares best line fit. While a least squares fit gives

the “best case” linea ri ty err or (l ow e r nu me ri c al val u e), the

calculations required are burdensome.

Conversely , an end point fit will give the “worst case” error

(often more desirable in error budget calculation s ) and the

calculations are more straightforward for the user. The

specified pressure sensor linearities are based on the end

point straight line method me asured at the midrange

pressure.

Figure 3. Linea r ity Specification Comparison

Figure 4 illustrates the differential or gauge configuration

in the basic chip carrier (Case 344). A silicone gel isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPX2053 series pressure sensor operating

characteristics an d internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application.

Refer to application note AN3728, for more information

regarding media compatibility.

Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)

Relative Voltage Output

Pressure (% Full scale)

0 50 100

End Point

Straight Line Fit

Exaggerated

Performance

Least Squares Fit

Straight Line

OFFSET

Least

Square

Deviation

Silicone

Die Coat Die P1

Wire Bond

Lead Frame RTV Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

PACKAGE DIMENSIONS

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6Freescale Semiconductor

NOTES:

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

CONTROLLING DIMENSION: INCH.

DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

0.136 (0.005) T

1234

PIN 1

D4 PL

SEATING

PLANE

-T-

B-A-

DAMBAR TRIM ZONE:

THIS IS INCLUDED

WITHIN DIM. "F" 8 PL

123

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

STYLE 2:

PIN 1. VCC

2. - SUPPLY

3. + SUPPLY

4. GROUND

STYLE 3:

PIN 1. GND

2. -VOUT

3. VS

4. +VOUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.595 0.630 15.11 16.00

B0.514 0.534 13.06 13.56

C0.200 0.220 5.08 5.59

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

J0.014 0.016 0.36 0.40

L0.695 0.725 17.65 18.42

M30˚ NOM 30˚ NOM

N0.475 0.495 12.07 12.57

R0.430 0.450 10.92 11.43

Y0.048 0.052 1.22 1.32

Z0.106 0.118 2.68 3.00

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

D4 PL

PORT #1

POSITIVE

PRESSURE

(P1)

PIN 1

-A-

-Q-

-P-

0.25 (0.010) T

0.13 (0.005) QS

12 34

SEATING

PLANE

-T-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.305 0.325 7.75 8.26

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.230 0.250 5.84 6.35

U0.910 BSC 23.11 BSC

0.220 0.240 5.59 6.10

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

PACKAGE DIMENSIONS

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NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

PORT #2

PORT #1

PORT #2

VACUUM

(P2) (P1)

SEATING

PLANE SEATING

PLANE

D4 PL

PORT #1

POSITIVE PRESSURE

-Q-

12 43

PIN 1

-P-

-T- -T- S

0.25 (0.010) T

0.13 (0.005) Q S

-A-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.405 0.435 10.29 11.05

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.063 0.083 1.60 2.11

U0.910 BSC 23.11 BSC

V0.248 0.278 6.30 7.06

W0.310 0.330 7.87 8.38

0.220 0.240 5.59 6.10

CASE 344C-01

ISSUE B

UNIBODY PACKAGE

PACKAGE DIMENSIONS

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CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

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CASE 1369-01

ISSUE B

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CASE 1320-02

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CASE 1320-02

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CASE 1320A-02

ISSUE A

PIN 4

PIN 1

PAGE 1 OF 2

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CASE 1320A-02

ISSUE A

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CASE 1368-01

ISSUE B

SMALL OUTLINE PACKAGE

SURFACE MOUNT

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CASE 1368-01

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SMALL OUTLINE PACKAGE

SURFACE MOUNT

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PACKAGE DIMENSIONS

CASE 1368-01

ISSUE B

SMALL OUTLINE PACKAGE

SURFACE MOUNT

MPX2053

Rev. 8

02/2009

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