MC74AC20N - ON Semiconductor - Datasheet.Directory

October, 2006 − Rev. 8

1Publication Order Number:

MC74AC20/D

MC74AC20, MC74ACT20

Dual 4−Input NAND Gate

Features

•Outputs Source/Sink 24 mA

•′ACT20 Has TTL Compatible Inputs

•Pb−Free Packages are Available

Figure 1. Pinout: 14-Lead Packages

(Top View)

GND

1314 12 11 10 9 8

21 34567

VCC A1B1NC C1D1O1

A0B0NC C0D0O0

PIN ASSIGNMENT

PIN FUNCTION

An, Bn, Cn,

Inputs

OnOutputs

MAXIMUM RATINGS

Rating Symbol Value Unit

DC Supply Voltage (Referenced to GND) VCC −0.5 to

+7.0

DC Input Voltage (Referenced to GND) Vin −0.5 to

VCC + 0.5

DC Output Voltage (Referenced to GND) Vout −0.5 to

VCC + 0.5

DC Input Current, per Pin Iin ±20 mA

DC Output Sink/Source Current, per Pin Iout ±50 mA

DC VCC or GND Current per Output Pin ICC ±50 mA

Storage Temperature Tstg −65 to

+150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

SOEIAJ−14

M SUFFIX

CASE 965

SOIC−14

D SUFFIX

CASE 751A

PDIP−14

N SUFFIX

CASE 646

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See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MC74AC20, MC74ACT20

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Min Unit

VCC Supply Voltage

′AC 2.0 5.0 6.0

′ACT 4.5 5.0 5.5

VREG DC Regulated Power Voltage (Ref. to GND) 0−VCC V

tr, tfInput Rise and Fall Time (Note 1)

′AC Devices except Schmitt Inputs

VCC @ 3.0 V −150 −

VCC @ 4.5 V −40 −ns/V

VCC @ 5.5 V −25 −

tr, tfInput Rise and Fall Time (Note 2)

′ACT Devices except Schmitt Inputs

VCC @ 4.5 V −10 −

ns/V

VCC @ 5.5 V −8.0 −

TJJunction Temperature (PDIP) − − 140 °C

TAOperating Ambient Temperature Range −40 25 85 °C

IOH Output Current − HIGH − − −24 mA

IOL Output Current − LOW − − 24 mA

1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74AC 74AC

Unit Conditions

TA = +25°C

TA =

−40°C to

+85°C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage

3.0 1.5 2.1 2.1 VOUT = 0.1 V

4.5 2.25 3.15 3.15 V or VCC − 0.1 V

5.5 2.75 3.85 3.85

VIL Maximum Low Level

Input Voltage

3.0 1.5 0.9 0.9 VOUT = 0.1 V

4.5 2.25 1.35 1.35 V or VCC − 0.1 V

5.5 2.75 1.65 1.65

VOH Minimum Low Level

Output Voltage

3.0 2.99 2.9 2.9 IOUT = −50 mA

4.5 4.49 4.4 4.4 V

5.5 5.49 5.4 5.4

*VIN = VIL or VIH

3.0 −2.56 2.46 −12 mA

4.5 −3.86 3.76 IOH −24 mA

5.5 −4.86 4.76 −24 mA

VOL Maximum Low Level

Output Voltage

3.0 0.002 0.1 0.1 IOUT = 50 mA

4.5 0.001 0.1 0.1 V

5.5 0.001 0.1 0.1

*VIN = VIL or VIH

3.0 −0.36 0.44 12 mA

4.5 −0.36 0.44 IOL 24 mA

5.5 −0.36 0.44 24 mA

IIN Maximum Input

Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND

IOLD †Minimum Dynamic

Output Current

5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 −4.0 40 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.

MC74AC20, MC74ACT20

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AC CHARACTERISTICS

Symbol Parameter VCC*

(V)

74AC 74AC

Unit

TA = +25°C

CL = 50 pF

TA = −40°C

to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay 3.3 2.0 6.0 8.5 1.5 10.0 ns

5.0 1.5 5.0 7.0 1.0 8.0

tPHL Propagation Delay 3.3 1.5 5.0 7.0 1.0 9.0 ns

5.0 1.5 4.0 6.0 1.0 7.0

*Voltage Range 3.3 V is 3.3 V ±0.3 V.

Voltage Range 5.0 V is 5.0 V ±0.5 V.

DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74ACT 74ACT

Unit Conditions

TA = +25°C

TA =

−40°C to

+85°C

Typ Guaranteed Limits

VIH Minimum High Level

Input Voltage

4.5 1.5 2.0 2.0 VVOUT = 0.1 V

5.5 1.5 2.0 2.0 or VCC − 0.1 V

VIL Maximum Low Level

Input Voltage

4.5 1.5 0.8 0.8 VVOUT = 0.1 V

5.5 1.5 0.8 0.8 or VCC − 0.1 V

VOH Minimum High Level

Output Voltage

4.5 4.49 4.4 4.4 VIOUT = −50 mA

5.5 5.49 5.4 5.4

*VIN = VIL or VIH

4.5 −3.86 3.76 V IOH

−24 mA

5.5 −4.86 4.76 −24 mA

VOL Maximum Low Level

Output Voltage

4.5 0.001 0.1 0.1 VIOUT = 50 mA

5.5 0.001 0.1 0.1

*VIN = VIL or VIH

4.5 −0.36 0.44 V IOH

24 mA

5.5 −0.36 0.44 24 mA

IIN Maximum Input

Leakage Current 5.5 −±0.1 ±1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 −1.5 mA VI = VCC −2.1 V

IOLD †Minimum Dynamic

Output Current

5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent

Supply Current 5.5 −4.0 40 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

MC74AC20, MC74ACT20

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AC CHARACTERISTICS

Symbol Parameter VCC*

(V)

74ACT 74ACT

Unit

TA = +25°C

CL = 50 pF

TA = −40°C

to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay 5.0 2.0 6.5 9.0 1.5 10.5 ns

tPHL Propagation Delay 5.0 2.0 5.5 9.0 1.5 10.5 ns

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter Value

Typ Unit Test Conditions

CIN Input Capacitance 4.5 pF VCC = 5.0 V

CPD Power Dissipation Capacitance 40 pF VCC = 5.0 V

ORDERING INFORMATION

Device Package Shipping†

MC74AC20N PDIP−14

25 Units/Rail

MC74AC20NG PDIP−14

(Pb−Free)

MC74ACT20N PDIP−14

MC74ACT20NG PDIP−14

(Pb−Free)

MC74AC20D SOIC−14

55 Units/Rail

MC74AC20DG SOIC−14

(Pb−Free)

MC74AC20DR2 SOIC−14

2500/Tape & Reel

MC74AC20DR2G SOIC−14

(Pb−Free)

MC74ACT20D SOIC−14

55 Units/Rail

MC74ACT20DG SOIC−14

(Pb−Free)

MC74ACT20DR2 SOIC−14

2500/Tape & Reel

MC74ACT20DR2G SOIC−14

(Pb−Free)

MC74AC20M SOEIAJ−14

50 Units/Rail

MC74AC20MG SOEIAJ−14

(Pb−Free)

MC74AC20MEL SOEIAJ−14

2000/Tape & Reel

MC74AC20MELG SOEIAJ−14

(Pb−Free)

MC74AC20, MC74ACT20

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MARKING DIAGRAMS

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G= Pb−Free Package

PDIP−14 SOIC−14

MC74AC20N

AWLYYWWG

MC74ACT20N

AWLYYWWG

74AC20

ALYW

SOEIAJ−14

74ACT20

ALYW

AC20G

AWLYWW

ACT20G

AWLYWW

MC74AC20, MC74ACT20

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PACKAGE DIMENSIONS

PDIP−14

CASE 646−06

ISSUE P

14 8

ADIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.715 0.770 18.16 19.56

B0.240 0.260 6.10 6.60

C0.145 0.185 3.69 4.69

D0.015 0.021 0.38 0.53

F0.040 0.070 1.02 1.78

G0.100 BSC 2.54 BSC

H0.052 0.095 1.32 2.41

J0.008 0.015 0.20 0.38

K0.115 0.135 2.92 3.43

M−−− 10 −−− 10

N0.015 0.039 0.38 1.01

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

HG D

SEATING

PLANE

−T−

14 PL

0.13 (0.005)

0.290 0.310 7.37 7.87

MC74AC20, MC74ACT20

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PACKAGE DIMENSIONS

SOIC−14

CASE 751A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

P7 PL

14 8

0.25 (0.010) B M

0.25 (0.010) A S

−T−

RX 45

SEATING

PLANE D14 PL K

_DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A8.55 8.75 0.337 0.344

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.228 0.244

R0.25 0.50 0.010 0.019

__ __

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC20, MC74ACT20

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PACKAGE DIMENSIONS

SOEIAJ−14

CASE 965−01

ISSUE A

DIM MIN MAX MIN MAX

INCHES

−−− 2.05 −−− 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.10 0.20 0.004 0.008

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0.70 0.90 0.028 0.035

−−− 1.42 −−− 0.056

_10 _0

_10 _

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

0.13 (0.005) M0.10 (0.004)

14 8

VIEW P

DETAIL P

0.50

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Phone: 81−3−5773−3850

MC74AC20/D

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