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FEATURES
Seemechanicaldrawingsfordimensions.
NC – Nointernalconnection
DBVPACKAGE
(TOP VIEW)
34
GND
2
A
Y
VCC
5
1
NC
GND
DCKPACKAGE
(TOP VIEW)
34
2
A
Y
5
1
NC VCC
DRL PACKAGE
(TOP VIEW)
2
A
VCC
5
1
NC
34
GNDGND Y
DNU – Donotuse
YZP PACKAGE
(BOTTOMVIEW)
2
A
VCC
15
DNU
GND 4
3Y
DRY PACKAGE
(TOP VIEW)
A NC
NC 6
5
4
2
3
GND Y
VCC
1
PREVIEW
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G17SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
•Available in the Texas Instruments •Low Power Consumption, 10- µA Max I
CCNanoFree™ Package
• ± 8-mA Output Drive at 1.8 V•Optimized for 1.8-V Operation and Is 3.6-V I/O
•Latch-Up Performance Exceeds 100 mA PerTolerant to Support Mixed-Mode Signal
JESD 78, Class IIOperation
•ESD Protection Exceeds JESD 22•I
off
Supports Partial-Power-Down Mode
– 2000-V Human-Body Model (A114-A)Operation
– 200-V Machine Model (A115-A)•Sub 1-V Operable
– 1000-V Charged-Device Model (C101)•Max t
pd
of 2.4 ns at 1.8 V
This single Schmitt-trigger buffer is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to1.95-V V
CC
operation.
The SN74AUC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as anindependent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going(V
T+
) and negative-going (V
T–
) signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications ofTexas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2001–2007, Texas Instruments IncorporatedPRODUCTION DATA information current as of publication date.Products conform to specifications per the terms of TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
Absolute Maximum Ratings
(1)
SN74AUC1G17
SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC1G17YZPR _ _ _U7_0.23-mm Large Bump – YZP (Pb-free)SON – DRY Reel of 5000 SN74AUC1G17DRYR PREVIEW–40 °C to 85 °C
SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G17DBVR U17_SOT (SC-70) – DCK Reel of 3000 SN74AUC1G17DCKR U7_SOT (SOT-553) – DRL Reel of 4000 SN74AUC1G17DRLR U7_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
FUNCTION TABLE
INPUT OUTPUTA Y
H HL L
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 3.6 VV
I
Input voltage range
(2)
–0.5 3.6 VV
O
Voltage range applied to any output in the high impedance or power-off state
(2)
–0.5 3.6 VV
O
Output voltage range
(2)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±20 mAContinuous current through V
CC
or GND ±100 mADBV package 206DCK package 252θ
JA
Package thermal impedance
(3)
DRL package 142 °C/WDRY package 234YZP package 132T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
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Recommended Operating Conditions
(1)
SN74AUC1G17SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
MIN MAX UNIT
V
CC
Supply voltage 0.8 2.7 VV
I
Input voltage 0 3.6 VV
O
Output voltage 0 V
CC
VV
CC
= 0.8 V –0.7V
CC
= 1.1 V –3I
OH
High-level output current V
CC
= 1.4 V –5 mAV
CC
= 1.65 V –8V
CC
= 2.3 V –9V
CC
= 0.8 V 0.7V
CC
= 1.1 V 3I
OL
Low-level output current V
CC
= 1.4 V 5 mAV
CC
= 1.65 V 8V
CC
= 2.3 V 9T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Electrical Characteristics
SN74AUC1G17
SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
V
T+
0.8 V 0.51.1 V 0.51 0.861.4 V 0.65 1 VPositive-going inputthreshold voltage
1.65 V 0.79 1.162.3 V 1.11 1.560.8 V 0.3V
T–
1.1 V 0.22 0.531.4 V 0.3 0.58 VNegative-going input
1.65 V 0.39 0.62threshold voltage
2.3 V 0.58 0.870.8 V 0.21∆V
T
1.1 V 0.25 0.381.4 V 0.31 0.5 VHysteresis
1.65 V 0.37 0.62( V
T+
– V
T–
)
2.3 V 0.48 0.77I
OH
= –100 µA 0.8 V to 2.7 V V
CC
– 0.1I
OH
= –0.7 mA 0.8 V 0.55I
OH
= –3 mA 1.1 V 0.8V
OH
VI
OH
= –5 mA 1.4 V 1I
OH
= –8 mA 1.65 V 1.2I
OH
= –9 mA 2.3 V 1.8I
OL
= 100 µA 0.8 V to 2.7 V 0.2I
OL
= 0.7 mA 0.8 V 0.25I
OL
= 3 mA 1.1 V 0.3V
OL
VI
OL
= 5 mA 1.4 V 0.4I
OL
= 8 mA 1.65 V 0.45I
OL
= 9 mA 2.3 V 0.6I
I
A input V
I
= V
CC
or GND 0 to 2.7 V ±5µAI
off
V
I
or V
O
= 2.7 V 0 ±10 µAI
CC
V
I
= V
CC
or GND, I
O
= 0 0.8 V to 2.7 V 10 µAC
i
V
I
= V
CC
or GND 2.5 V 3 pF
(1) All typical values are at T
A
= 25 °C.
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Switching Characteristics
Switching Characteristics
Operating Characteristics
SN74AUC1G17SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
over recommended operating free-air temperature range, C
L
= 15 pF (unless otherwise noted) (see Figure 1 )
V
CC
= 1.2 V V
CC
= 1.5 V V
CC
= 1.8 V V
CC
= 2.5 VV
CC
= 0.8 VFROM TO
±0.1 V ±0.1 V ±0.15 V ±0.2 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX
t
pd
A Y 5.7 0.8 3.9 0.7 2.1 0.6 1.1 1.9 0.5 1.5 ns
over recommended operating free-air temperature range, C
L
= 30 pF (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 VFROM TO
±0.15 V ±0.2 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX
t
pd
A Y 0.8 1.4 2.4 0.7 2.5 ns
T
A
= 25 °C
V
CC
= 0.8 V V
CC
= 1.2 V V
CC
= 1.5 V V
CC
= 1.8 V V
CC
= 2.5 VTESTPARAMETER UNITCONDITIONS
TYP TYP TYP TYP TYP
Power dissipationC
pd
f = 10 MHz 15 15 16 16 20 pFcapacitance
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PARAMETER MEASUREMENT INFORMATION
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 ,
slewrate 1V/ns.
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
³
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
2×VCC
Open
GND
RL
RL
t /t
PLH PHL Open
TEST S1
2×VCC
t /t
PLZ PZL
GND
t /t
PHZ PZH
0V
tW
Input
0V
Input
Output
Output
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
VOLTAGEWAVEFORMS
PULSEDURATION
VCC/2
VCC/2 VCC/2
VCC/2
VOL
VOH
VCC
VCC
VOH
VOL
VCC/2
VCC/2
VCC/2
VCC/2
tPLH tPHL
tPLH
tPHL
th
tsu
DataInput
TimingInput
0V
0V
Output
Waveform1
S1at2×V
(seeNoteB)
CC
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Control
VCC/2
VCC/2 VCC/2
VCC/2
VCC/2
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VCC
VCC
VCC
VCC/2
VCC/2
VCC
tPZL tPLZ
tPHZ
tPZH
V – V
OH D
V +V
OL D
0.8V
1.2V 0.1V±
1.5V 0.1V±
1.8V 0.15V±
2.5V 0.2V±
1.8V 0.15V±
2.5V 0.2V±
VCC
2kW
2kW
2kW
2kW
2kW
1kW
500 W
RL
0.1V
0.1V
0.1V
0.15V
0.15V
0.15V
0.15V
VD
CL
15pF
15pF
15pF
15pF
15pF
30pF
30pF
SN74AUC1G17
SINGLE SCHMITT-TRIGGER BUFFER
SCES376N – SEPTEMBER 2001 – REVISED APRIL 2007
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74AUC1G17DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DRLR ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AUC1G17YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 22-Jul-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AUC1G17DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74AUC1G17DBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74AUC1G17DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74AUC1G17DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74AUC1G17DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74AUC1G17DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
SN74AUC1G17DRLR SOT DRL 5 4000 180.0 9.5 1.78 1.78 0.69 4.0 8.0 Q3
SN74AUC1G17YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jun-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AUC1G17DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74AUC1G17DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
SN74AUC1G17DCKR SC70 DCK 5 3000 205.0 200.0 33.0
SN74AUC1G17DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74AUC1G17DCKR SC70 DCK 5 3000 338.0 343.0 30.0
SN74AUC1G17DRLR SOT DRL 5 4000 202.0 201.0 28.0
SN74AUC1G17DRLR SOT DRL 5 4000 180.0 180.0 30.0
SN74AUC1G17YZPR DSBGA YZP 5 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jun-2012
Pack Materials-Page 2
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