Wik RICOG/COHE# A RCOGHAET ABABA, REASTRRE, SYRMERR,. BENRANSUMBY. AH = BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR HAF ABTRE. e Ft * RESMEASBEEA-55C ~125C [RBA SBRRRO+t3O0ppm/c, 0+60ppm/Tc. * BERARBAARA SE. * @RHKRRENMEE, BAF RAMEE. HEA * HATFSEaREFRR. e EmmBe RRA 0805 CG 101 J 500 N T TO oT TT. T. T T T ORt Oj HEE ORE AE (PF) OREM Hie | wat) | BaHMeH RB | seat RTA | BEM RR me 0402 | 0.04 0.02 | 1.00 x 0.50 CG |COGENPO 100 10x10 J | +5.00% 0603 | 0.06 x 0.03 | 1.60 x 0.80 CH COH 101 10x10 G | +2.00% 0805 | 0.08 x 0.05 | 2.00 x 1.25 102 | 10x10 C | +0.25PF 1206 | 0.12 x 0.06 | 3.20 x 1.60 B | +0.10PF D | +0.50PF OL(FEB Ommdaza al) COBRA RAK | BRB RADA Um BAAS} RMA ze 6R3 6.3V S Spee SRA Seer ae 100 10V Cc She T oie ze 250 25V N =p B Brame 500 50V ( SREtSH E/E ARB) BRT ge Rat( mm) RF) Al FeT L Ww T WB 0402 | 1005 | 1.00+0.05 |0.50+0.05 |0.50+ 0.05] 0.25 + 0.10 0603 1608 1.60+0.10 |0.80+0.10 |0.80+0.10]0.380+0.10 0805 2012 | 2.00+0.20 | 1.25+0.20]0.80+0.10|0.50+0.25 1.00+0.10 1.25+0.20 1206 3216 3.20+0.30 | 1.6040.20 |0.80+0.10)0.50+0.25 1.00+0.10 1.25+0.20 15Maze Hi COG/COH MLCC for general-use COG MLCC for General-use is class | high frequency capacitor, its capacitance is very stable, almost will not change along with the temperature, voltage and time. Specially be suitable for high frequency circuits. e Features * The capacitance is very stable, its operating temperature is -55C ~1257, within the range, the temperature coefficient is O+380ppm/C ,O+60pprn/TC. * It has multi-layer monolithic structure, has high reliability. * It has good solderability and soldering resistance, suitable for flow/reflow soldering. e Application * It is suitable for all kinds of high frequency circuits. @ Product Part Number Expression 0805 CG 101 J 500 N T To OT OT TO OT T T @ @ @ @Dimensions @Dielectric @Normal @Capacitance = Type Capacitance(PF) Tolerance Type] British Metric ; (Inch) (mm) Code] Dielectric Expression} Actual Code] Tolerance 0402]0.04 X0.02]1.00 0.50 Method Value J +5.00% lO CG |COG or NPO 100 | 10x 10 = 0603/0.06 x 0.03]1.60 x 0.80 CH GOH 101 10x10" G +2.00% 0805]0.08 X0.05]2.00X 1.25 102 410X102 Cc +0.25PF 1206]0.12X0.06/3.20 x 1.60 B +0.10PF D +0.50PF @Rated Voltage Termination Type @Package Method Expression} Actual Expression} Termination Material Expression| Packaging Method Value Method Method 500 50V S Pure Silver No Mark | Bulk Packaging in a Bag 250 25V C Pure Copper T Taping Packaging 101 100V N Three Layers Platin i Terminal Silver or 9 B Bulk Plastic . 201 200V Copper layer/ Nickel ox Packaging layer /Tin layer) e Outside Dimension Type Dimension (mm) British Metric E ; . L W T WB xpression}| Expression 0402 1005 1.00+0.05 | 0.50+0.05 |0.50+0.05/ 0.25+0.10 0603 1608 1.60+0.10 | 0.80+0.10 |0.80+0.10] 0.30+0.10 0805 2012 2.00+0.20 | 1.25+0.20 |0.80+0.10| 0.50+0.25 1.00+0.10 1.25+0.20 1206 3216 3.20+0.30 | 1.60+0.20 |}0.80+0.10) 0.50+0.25 1.00+0.10 1.25+0.20 16= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR EF Eh0 A 8 RBICOG/COHRS Rt 0402 0603 0805 1206 T/FEB |6.3V|10VH16V|25V|50V |6.3V] 10V}16V]25V |50V|6.3V 11 0V116V|25V |50V |6.3V] 10V]} 16V) 25V| 50V 22 O0.5PF 1PF 2PF 3PF APF 5PF 6PF 7PF 1OPF 22PF 33PF 47PF 68PF 1 00PF 120PF 150PF 180PF 220PF S330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF S300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 27nF 33nF 47nF 17Maze Hi Capacitance Range Item COG/COH MLCC for general-use DImension 0402 0603 0805 1206 ee 6.3V |1 0V 11 6V |25V|50V |6.3V] 10V}16V]25V |50V |6.3V 11 0V]16V|25V |50V |6.3V] 10V] 16V| 25V| 50V Capacitance O0.5PF 1PF 2PF 3PF APF 5PF 6PF 7PF 1OPF 22PF 33PF 47PF 68PF 1 00PF 120PF 150PF 180PF 220PF S330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF S300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 27nF 33nF 47nF 18= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR Mi ABYCOG,. COH, PH~SLAT Settle it HEHE sau GE EARICOG, JRRISIPA. AM, salto COHE# SH, TH, UJ, SLE 1 Tifa eee -55CT ~125C | -55C ~85C 1. Bae BE. 2. HA AG tie z. S.A Reo) se Sih, ZUR FLA. 2 | SNR 4 i ERIE, FLA, BIR E> 10 x 3b. LAURA PAR. RHALS. 5. ty BE A EPR EE (eB Se HE BOB EA. 3 Rt RERTHAA XEAFORRGEER. 4 Eas PERE AISRBSE-HP4278A Bt, HP4284 848. HR: 1 BIE: 25C +5C, 7RE:30% ~ 75%, Cr<5PF < 0.56% 2. Alt SB: 1.0 + 0.2V, 5 | #ARAR(D.F) | SPF<Cr<S0PF 1.5 [(150/Cr)+7]x 10 3. jRlpt9HZE:C <1 OOOPF, 1.0 + 0.1MHz; al Seve C>1000PF,1.0+0.1KHZ fs 0S C<10nF Riz5x100 Se Tt a ae A SS PRR G:SF25 1 1 aA) 6 (1LR) C>10nF Ri: Cr>500s XRT Be: MEU REE LEE, ZE6O + 5 PAE. 3 REINS SARE LEB, 60+1 #, z z 5 ai eS > Oxaise LIE RE EMO ELIESE, HM 6O+1 t, RHABFRRFAT B / MES SimkKT5OmMA, KM IETIRRE: 18(7 150+0/-10 CRAM 6015 SH, PIGZE a | eemacey | SLPRRRMAR ARS | SIRO Ni 2422 dv. SLEERWER KE -55~ 125 CRB-55~SoCRENHMESE, REAGENT 25 CHRENSURBEMERE A. XPBRRRECBRMMBAGH. ARIRA BH235 + 5C( e245 9 Aye 75% HERBS ; +5C) RIRGHS Wi 210.5. RARE: 25+2.5mm/*. Spi FRR A SETAE: 324 150+0/-10C aR 6O+5 3, RA aan < +5% SBR PME 2442 eR. Se | CUR | KREG RRBURRRE, HABA 260250 HBAS DFE maeiwe 10+1 H. BEBE TM l4 +2, ARETE. 10 | mIKEHER LR. ae RABE: 25+ 2.5mm/#. FRM EMT: PREZ ie Rei 1 |100c120c| 14348 2 |170c200C] 1448 45MbBBzei e General COG. COH, PH~SL MLCC reliability test method Standard Number| Item COG, COH | PH, RE, SH, Test Method MLCC for TH, UJ, SL MLCC for General-use | General-use Operating 1 Temperature -55CT~125T | -55C~85'C Range Appearance | 1.Good ceramic body color %Check by using microscope 210%. continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 2 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination wicth. 3 | Dimensions Within the specified Using micrometer or vernier calipers dimensions 4 Capacitance Within the specified Measuring Equipments:HP4278 capacitance meter,HP4284 tolerance capacitance, Measuring Conditions: Dissipation Cr<5PF < 0.56% 1.Measuring Temperature:25C +5C Humidity: 30%~75%. 5 Factor (DF) 5PF<Cr<50PF 1.5 [(150/Cr)+7]x 10] 2.Measuring Voltage: 1.0+0.2V. Cr>50PF 0.15% 3.Measuring Frequency:C<1000PF, 1.0+0.1MHz C21000PF, 1.0+0.1KHz Insulation ; 10 Measuring Equipment:Insulation resistance meter (such 6 | Resistance G<10nF Riz5x10" O as Sf2511 insulation resistance). C>10nF Ri- Cr2500s Measuring Method:Must measure at rated voltage, and measure the IR within GO+5 seconds. 7 Withstanding >8x rated continuous Must measure at 3 times rated voltage, Cwe' time: 60414 Voltage working voltage seconds, no short and the changing/discharging current less than 50mA. Capacitance Must meet the capacitor First, pre-heat: heat treat 60+5 minutes at 150+0/-107T, Temperature | Character temperature then set it for 24+2 hours at room temperature. 8 | Characteristic | COfficient requirements Measure the capacitance at -55~125C or -55~85C, the within the operating capacitance change ratio comparing to that of 25C must p ge. be within the specified range. Tin coverage should be %Dip the capacitor into ethanol or colophony solution, and then 9 | Solderability 75% of the outer slecto de dip it into 235+5'C( or 245+5C leadless eutedtic solder solution ) eutectic solder solution hanving lead for 2+0.5 seconds. Dipping speed: 25+2.5mm/second. Resistance to |Appearance No defects First pre-heat: heat treat for G(O+5 minutes at Soldering visible 150+0/-10C, then set it for 24+2 hours at room temperature. Cap. Change |<+5%ort0.5PF |>xThen pre-heat the capacitance according to the ratio (whichever is larger)| following chart. Dip the capacitor into 260+5C eutectic solder solution for 10+1 seconds. Then set it DF Same as for 24+2 hours at room temperature, then measure. 10 original Spec} Dipping speed: 25+2.5mm/second. IR Same as % Preheat conditions: original spec Stage | Temperature Time 1 100C120C | iminute 2 170C200C | iminute 46= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR ea Si JAA BRE Wate 11 in Ss ASW RIMS RA CR KEM RASS aS 1 PAR TMRRA( BS iE) -b. FURIGSTERA edn 10N B71. SR eee GARRET KET, THRBRIER, DERM ORREH RRM RSA RAR. [|- 10N, 10 1 HEE -1.O0mm/#b 5 RRS aR i 12 inte ME SB FRAA RAR BA ay Ih} tal RE SEA eRe KABA PREM ARR ( RSet) |. BASE T es), RMR 1.5mm, see 10-S5Hz ZH) SY. HAASE ( Ht 10 B SSHz Bike] 10Hz) BEM 1 DEA sok. IEEE S ABBE A BiEiT 2 )F( ABat 6 NE) . fi2 13 i at AWA AGRA. KERRA SRSA HEH S PART RRA( BS GH) b, UGE 4 RAIA. RRR Ae ABE RIET, THREES, URRY SAR RAREST RAR. 20.) SOfn Jy MEME: 1. Omm,#e NW Tz 100mm Fas esp LXW FSF (mm) (mm) a b c d .5%2.01 3.8 ~5X3. 213.8 7X6. 3 |: =~] So we [oo] co enfen}on Simi o nfo} bo on ola) = co o 14 im eee SB FERS AF >< AIEEE: 3277 150+0/-10C Same 60+5 548, AE FAZIO TMS 2442 sie. 2X FAR Re 3 LH AY IE RST UX ee. ZG TOME 2442 i, ARETE. 47MbBBzei Number Items Standard Test Method Adhesive No removal of the Solder the capacitor to the test jig (glass epoxy resin Strength of terminations or other board) shown in Fig.1 using a eutectic solder.Then Termination defect shall occur apply a 10N force inthe direction shown as the arrowhead.The aoldering shall be done either with an iron or using the reflow method and shall be conducted 44 with care so that an iron or using the refow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc. Pe 10N,10+1s aah Speed:1.Omm/s ~ Giss epoxy resinboard Fig.1 Vibration Appearance | No defects or} ><Solder tne capacitor to the test jig (glass epoxy resin Resistance abnormities board). The capacitor should be subjected to a simple Capacitance | Within the harmonic motion having a total amplitude of 1.5mm, the specified frequency being varied uniformly between the tolerance approximate limits of 10 and 55Hz, shall be traversed range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 12 DF Same as 1 minute.This motion shall be applied for a period of 2 original spec | hours in each 3 mutually perpendicular directions (total is 6 hours). Fif.2 Bending No cracks or other Solder the capacitor to the test jig (glass epoxy resin Resistance defects shall occur board) shown in Fig.3 using a eutectic solder. Then apply a 10N force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mm) Foree adding abl speed: 1. Omm/f | Force adding as 4.5mm R230 \ N SN E ) = . tT oe 13 ERS 9 Flexure:1 KS i" l N\ a 5mm 100mm Fig. 3 Fig. 4 LXW Dimension (mm) a b c d 4.5X2.0]3.5]7.0] 2.4 4.5X3.2]3.5|7.0]3.7]1.0 5. 7X6.3 | 4.5|8.0]5.6 Temperature | Appearance |No defects Pre-treatment: Heat-treat the capacitor for 60+ Cycle or 5minutes at 150+0/-10, then set it for 24 2 hours at Perform five cycles according to the four heat treatments listed in the following table. Set it for 24+2 hours at room temperature, then measure. 48 Same | standaSBAULHBESSE MULTILAYER CHIP CERAMIC CAPACITOR a 1B Be BatAe mee |< 12.5% RMT EMER: + eek ARRAN. BEES | SECC) BER ( 5728) D.F._| RATS 1 | BRT AFIE +9 | S0+8 14 | BER 2 Hin 2-3 LR. KF10000MQ 3 | BS LHBE+2 3043 4 in 23 Shi RRA KZ 40 + 2C Hl 90-95% HAAR RHE Bi 500+24/-O/) BF. RR BHS SR PME 24 + 2 oi, HET. BAe < + 5% + 0.5PF.EURN ShBAH. 15 | eG REECE) D.F Late LR. KF10000MQ Shi SRE KZE 40 + 20H 90-95% ABR TIE EE 500+24/-O.:\. SRA BE SR TRL 24+ 2 see, 77. aaa < + 5% +0.5PE. EW ShRAN. 16 | MEAT DE. DE LR. XKF10000MQ a RRS Ze _E DRIES TIN ROME LEE 1000+ 12), AMES FARBIASOMA, HABE SRE PWM 24 + 2 seh, THE. BAe < +5%B + O.5PF,RU RW ShRAW. 17 | Fear D.F lane I.R. KF10000MQ 49MbBBzei Number Item Standard Test Method 14 Temperature Cycle Cap. Change ratio S+2.5% or +0.25 PF (whichever is larger) D-F. Same as original spec * Heat-treatment: stage temperature (C) time Cmin.) lowest opeating temperaturet+3 |30+3 normal ternperature 23 IR. More than 10000M 2 high operating temperature+2 3023 A] OO] hM] + normal temperature 23 15 Humidity Steady State Appearance No defects or abnormities Cap. Change ratio =+5% or +0.5 PF (whichever is larger) D.F. Same as original spec IR. More than 10000M 2 Set the capacitor for 500+24/-0 hours at the condition of 40+2C and 90-95% humidity. Then remove and set it for 24+2 hours at room temperature, then measure. 16 Humidity Load Appearance No defects or abnormities Cap. Change ratio =+5% or +0.5 PF (whichever is larger) D.F. Same as original spec More than 10000M 2 Apply rated voltage to the capacitor for 500+24/-0 hours at the condition of 40+2C and 90-95% humidity. Remove and set it for 24+2 hours at room temperature, then measure. 17 Life Test Appearance No defects or abnormities Cap. Change ratio =+5% or +0.5 PF (whichever is larger) D.F. Same as original spec IR. More than 10000M Q * Apply two times rated voltage to the capacitor for 1000+12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24+2 hours at room temperature, then measure. 50= BAT MRSS se MULTILAYER CHIP CERAMIC CAPACITOR BAZ HASEHR e COG#IPH, RH, SH, TH, UHRSl : : X7Rig BEARE ii BE He HE 15% 10% 10% 5% 5% | 0% ht im = (O% SESE EH 7 -5% Re PSS 88 a -10% 5% > Lat co a -15% -10% -60T -40 -200 OC 20C 40 60T 80 100T 120c 55 -25C OT 25C 50C 75C 100C 125 me ne 25 Ui Be RHE Y5 Vili BEE 40% 0% 20% -20% 0% aa N HI -20% = 40% IN 2 -40% N ' -60% NX fg -60% a IN eS -80% Ht 60% 100% -55C -25C0 OC 250 50C 75C 1000 125 bee -26C OC 26C BOE THC 100 126 mE ik (Zee Reta AM: COG :1MHZ X7R,Z5U,Y5V:1KHZ 40% 20% | o hy -20% -40% = -60% Bt 80% YEV 6OV -100% 0 10 20 30 40 50 Bit fa [Vdc] EF RRB oBRRS HE HB: COG :1MHZ X7R,Z5U,Y5V:1 KHZ 10% 0% il -10% Tht -20% Hil -30% -40% x at 0 50 100 1000 10000 35 Hit [Vrms] Be [Hr] 57MbBBzei Mi GENEREL-USE MLCC CHARCCTER PROFILES COG and PH. RH, SH, TH. UH siries temperature coefficent 3 a & co} a a R -10% -60T -40T -20T OT 20C 40C GOT 80T 100T 120 Temperature oles eGHueyo souepoeden Z5U temperature character 20% O o DO 0% 9 2. 20% 4 5 S Q -40% NI @ N QO. 2 -60% IN nN oO -80% @ ~ M& -55C -25C OC 250 50C 75C 100C 125C Temperature DC Voltage Characteristics Measuring condition COG :1MHz X7R, Z5U. Y5V:1KHz O i 40% 8 20% = 0% 520% a- O_40% o 33-60% g Qe YBV 5OV D100% 3 0 10 20 30 40 50 S DC Voltage[Vdc] Capacitance-AC Voltage Characterics Measuring condition: COG :1MHz X7R,Z5U,Y5V:1 KHZ QO SB + 80% O. +60% s +40% O +20% g mR 0% @ -20% mm o 3 ACH AE[Vrms] oles SHueyo soueyoeden ones esGbueyo souryoedeg ones eBueyo eoueyoeden wm oe X7R tempreture characteristics 15% 10% 5% 0% -5% -10% -15% -55C =-25 oc 25 50 Temperature 75C 100C 125 Y5V temperature characteristics 40% 20% 0% -20% -40% -60% -80% -100% -55C -25C oc 250 50C 75C 100C 125 Temperature e Capacitance change aging 10% 0% -10% -20% -30% -40% 50 100 1000 10000 Time[Hr]Bek 0 ns Rae = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR * JAA 0402,0603, 0805, 12006 FH RTERHWRERT Kak * A B c D E F G H J T A AS 0402 0.65 | 115 | 8.00 | 350 | 1.75 | 2.00 | 2.00 | 4.00 | 1.50-0/ | (e+ +0.10 | +0.10 | +0.10 | 0.05 | +0.10 | +0.05 | +0.05 | +0.10 | +0.10 | 0.80 0603 1.10 | 1.90 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.20 | +0.20 | +0.20 | +0.05 | +0.10 | 0.10 | +0.10 | +0.10 | +0.10 1.10 0805 1.45 | 2.30 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.20 | +0.20 | +0.20 | +0.05 | +0.10 | 0.10 | +0.10 | +0.10 | +0.10 1.10 1006 1.80 | 3.40 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.20 | +0.20 | +0.20 | +0.05 | +0.10 | +0.10 | +0.10 | +0.10 | +0.10 1.10 137Maze Mi Package e Paper Tape Taping Top cover tape Carrier tape(paper) Polyatyrene reel an Cavity for chip Dimensions of paper take taping for0402,0603, 0805, 1206 Sprocket Hole J Cavity for chip Code * A B Cc D E F G H J T Paper size 0402 0.65 | 1.15 8.00 | 3.50 1.75 2.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.10 | +0.10 +0.10 +0.05 |} +0.10 +0.05 | +0.05 +0.10 +0.10 0.80 0603 1.10 | 1.90 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.20| +0.20 | +0.20] +0.05] +0.10}] +0.10] +0.10 | +0.10| +0.10 1.10 0805 1.45 | 2.30 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.20| +0.20 | +0.20] +0.05] +010] +0.10] +0.10 | +0.10| +0.10 1.10 1.80 | 3.40 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below 1206 +020] +0.20 | +0.20] +0.05] +010 | +010] +0.10 | +0.10] +0.10 1.10 138Bex 0 ns Rae = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR ait * A B c D E F G H J T AR Hs BA 0805 1.55 | 2.35 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (E+ 0.20 | 0.20 | +0.20 | +0.05 | +0.10 | 40.10 | +0.10 | +0.10 | +0.10 1.50 1206 1.95 | 3.60 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (e+ 0.20 | 40.20 | +0.20 | +0.05 | +0.10 | +0.10 | #0.10 | 0.10 | +0.10 1.85 1240 2.70 | 342 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.10 | 40.10 | 0.10 | +0.05 | +0.10 | 40.10 | 40.05 | +0.10 | +0.10 3.2 1808 2.20 | 4.95 | 12.00 | 5.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (R+ 0.10 | 40.10 | +0.10 | +0.05 | +0.10 | +0.10 | +0.05 | 0.10 | +0.10 3.0 4812 3.66 | 4.95 | 12.00 | 5.50 | 1.75 | 8.00 | 2.00 | 4.00 | 1.50-0/ | (e+ +0.10 | 40.10 | +0.10 | +0.05 | +0.10 | #0.10 | #0.05 | +0.10 | +0.10 4.0 HE RALRARY HERE 139Maze e Embossed Taping Top cover tape Carrier tape Polystyrene reel Cavity for chip * Dimensions of embossed taping for 0805, 1206, 1210, 1808, 1812 type Sprocket J Cavity for chip ain Code A B C D E F G H J T Tape size 0805 155 | 235 | 800 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-0/ | &F +0.20 | +0.20| +0.20| +0.05 | +0.10 | +0.10 | +0.10| +0.10| +010 | 1.50 495 | 360 | 800 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-0/ | 1206 +0.20 | +0.20| +0.20| +0.05 | +0.10 | +0.10 | +0.10 | +0.10 | +010 | 1.85 121 270 | 3.42 | 8.00 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-c0/ | EF 0 +0.10 | +0.10| +0.10 | +0.05 | +0.10 | +0.10 | +0.05 | +0.10 | +010 | 3.2 1 2.20 | 495 | 12.00 | 5.50 | 1.75 | 400 | 2.00 | 4.00 | 1.50-0/ | &F 808 +0.10 | +0.10| +0.10 | +0.05 | +0.10 | 0.10 | +0.05 | +0.10 | +010 | 3.0 4812 3.66 | 495 | 1209 | 5.50 | 1.75 | 8.00 | 2.00 | 4.00 | 1.50-0/ | RF +0.10 | +0.10 | +0.10 +0.05 |} +0.10 | +0.10 | 40.05 | 40.10 +0.10 4.0 Note:The place with "*" means where needs exactly dimensions. 140e BASH Ame EB( 3%) = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR aS | Se oR ( HB) 0 0 0000 | //0000 00 | JU 0 --\Al ET i KF200mm *F200mm KAF200mm PIAA e SH RY (Hf:mm) A E i F U G eRTRE A B Cc D E F G 178,00 + 2.00 3.00 | 13.00+0.50 21.00 + 0.80 D50.00RE A 10.00+1.50 |12MAXx 330.00 + 2.00 3.00 | 13.00+0.50 21.00 + 0.80 50.008 EA 10.00+1.50 |12MAX 141Maze e Structure of leader part and end part of the carrier paper End(Vacant position) | Chip carrier | Vacant position Leader part(covertape) QO 0 0000 | //0000 00 HU U UG HU Uv Over200mm e Reel Dimensions (unit: mm) Over200mm Over200mm Feeding direction E | FU G e Code A B Cc D E F G 178.004+2.00 | 3.00 13.00+0.50 21.00+0.80 | 50.00 ormax | 10.0041.50 |12MAX 330.004+2.00 | 3.00 13.00+0.50 21.00+0.80 | 50.00 ormax | 10.00+1.50 |12MAX 142Tea HS Rl mise (Aan wee si aie 5 i S BAT MRSS ss MULTILAYER CHIP CERAMIC CAPACITOR 7 C (B) Re Rafe: O.1N<RIRESEEE<O.7N; ZERIBER:, ARG REAARRE, MHA RETSTERE. EBL. e ER RMA 2a A B T C D E Rt 6.80+0.10 8.80 + 1.00 12.00+0.10 | 15.00+0.10/-0] 2.00+0/-0.10 | 4.70+0.10 =n F Ww G H L | R+| 31.50+0.20/-0 | 36.00+0/-0.2 | 19.00+0.35 7.00 + 0.35 110.00+0.70 | 5.00+0.35 gee eeeeeee nese ee eeeaeeeseseaeeeeseneeeeeeaees Lo (oe zy 1StSht E ee oe I F |w I L e ARS Rt BERANE AR he Base We Rae] APE 0402] 10000 20000 5000 0603! 4000 15000 5000 0805} 4000 | 3000 10000 5000 1206] 4000 | TS1.35mm 3000} 5000 5000 T>1. 35mm 2000 T<1. 80mm 2000 1210 TS 1, 80mm 1000 2000 1808 2000 2000 <1. 1812 TS Sean 500. 2000 2225 500 500 3035 500 He: BRACKET RR AHERRE. 143MbBBzei i TAPING SPECIFICATION e Top cover tape peeling strength (A)Paper Taping (6)Cover tape peeling direction . sO 4nd givect wad give" N \ erie 0 BE O ex ON Cover taps 5 Cove? FT 0-15 Carrier Standard: 0.1N<peeling forc<0.7N; No paper dirty remains on the scotch when peeling, and no sticks to top and bottom cover tape. Bulk Case Package Symbol A B T Cc D E Dimension} 6.80+0.10 8.8041.00 |12.00+0.10)15.00+0. 10/-1}2.00+0/-0.10} 4.70+0.10 Symol F WwW G H L | Dimension |31 .50+0.20/-0) 36.00+0/-0.2]19.0040.35} 7.00+0.35 | 110.00+0.70] 5.00+0.35 pretense escnscesseescesccsscescescosscessesconas Leo Pee l I zy = E oo, lI F Ww | L e Pack Quantity ; Pakaging method and quantity Size Note: W h ki Paper tape| Plastistic | |Bulkplastic | Normal bulk |INOl@: Ve can Choose packing taping embossed taping | box packaging] packaging style and quantity can be according to the 0402 10000 20000 5000 customer's requirement. 0603 4000 15000 5000 0805 4000 3000 10000 5000 1206 4000 TS 1. 35mm 3000 5000 5000 T>1. 35mm 2000 TS1. 80mm 2000 1210 T>1. 80mm 1000 2000 1808 2000 2000 <1. 1812 TS 85mm 500. 2000 2225 500 500 3035 500 144