PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 1 Green (RoHS & PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ5432J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS32DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0 SN74S32DR SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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